JP2011018915A5 - - Google Patents

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Publication number
JP2011018915A5
JP2011018915A5 JP2010187099A JP2010187099A JP2011018915A5 JP 2011018915 A5 JP2011018915 A5 JP 2011018915A5 JP 2010187099 A JP2010187099 A JP 2010187099A JP 2010187099 A JP2010187099 A JP 2010187099A JP 2011018915 A5 JP2011018915 A5 JP 2011018915A5
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JP
Japan
Prior art keywords
substrate
liquid
die
radiation
projection system
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2010187099A
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English (en)
Japanese (ja)
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JP5214678B2 (ja
JP2011018915A (ja
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Publication date
Priority claimed from US11/523,743 external-priority patent/US8330936B2/en
Application filed filed Critical
Publication of JP2011018915A publication Critical patent/JP2011018915A/ja
Publication of JP2011018915A5 publication Critical patent/JP2011018915A5/ja
Application granted granted Critical
Publication of JP5214678B2 publication Critical patent/JP5214678B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2010187099A 2006-09-20 2010-08-24 リソグラフィ装置およびデバイス製造方法 Expired - Fee Related JP5214678B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/523,743 2006-09-20
US11/523,743 US8330936B2 (en) 2006-09-20 2006-09-20 Lithographic apparatus and device manufacturing method

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2007237470A Division JP4839288B2 (ja) 2006-09-20 2007-09-13 リソグラフィ装置およびデバイス製造方法

Publications (3)

Publication Number Publication Date
JP2011018915A JP2011018915A (ja) 2011-01-27
JP2011018915A5 true JP2011018915A5 (enExample) 2011-03-24
JP5214678B2 JP5214678B2 (ja) 2013-06-19

Family

ID=38782682

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2007237470A Expired - Fee Related JP4839288B2 (ja) 2006-09-20 2007-09-13 リソグラフィ装置およびデバイス製造方法
JP2010187099A Expired - Fee Related JP5214678B2 (ja) 2006-09-20 2010-08-24 リソグラフィ装置およびデバイス製造方法

Family Applications Before (1)

Application Number Title Priority Date Filing Date
JP2007237470A Expired - Fee Related JP4839288B2 (ja) 2006-09-20 2007-09-13 リソグラフィ装置およびデバイス製造方法

Country Status (8)

Country Link
US (1) US8330936B2 (enExample)
EP (1) EP1903398B1 (enExample)
JP (2) JP4839288B2 (enExample)
KR (1) KR100933000B1 (enExample)
CN (1) CN101221363B (enExample)
DE (1) DE602007012032D1 (enExample)
SG (1) SG141385A1 (enExample)
TW (1) TWI375129B (enExample)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5089143B2 (ja) * 2006-11-20 2012-12-05 キヤノン株式会社 液浸露光装置
US8134685B2 (en) 2007-03-23 2012-03-13 Nikon Corporation Liquid recovery system, immersion exposure apparatus, immersion exposing method, and device fabricating method
US20090310115A1 (en) * 2008-06-12 2009-12-17 Nikon Corporation Apparatus and method for exposing adjacent sites on a substrate
EP2151717A1 (en) * 2008-08-05 2010-02-10 ASML Holding N.V. Full wafer width scanning using step and scan system
NL2003226A (en) * 2008-08-19 2010-03-09 Asml Netherlands Bv Lithographic apparatus, drying device, metrology apparatus and device manufacturing method.
JP5354339B2 (ja) * 2008-12-18 2013-11-27 株式会社ニコン 露光方法及び露光装置、並びにデバイス製造方法
US8953143B2 (en) * 2009-04-24 2015-02-10 Nikon Corporation Liquid immersion member
US8610878B2 (en) * 2010-03-04 2013-12-17 Asml Netherlands B.V. Lithographic apparatus and method
NL2006818A (en) 2010-07-02 2012-01-03 Asml Netherlands Bv A method of adjusting speed and/or routing of a table movement plan and a lithographic apparatus.
NL2008157A (en) * 2011-02-22 2012-08-24 Asml Netherlands Bv Lithographic apparatus and lithographic projection method.
US8906599B2 (en) 2012-05-17 2014-12-09 Taiwan Semiconductor Manufacturing Co., Ltd. Enhanced scanner throughput system and method
US9568828B2 (en) * 2012-10-12 2017-02-14 Nikon Corporation Exposure apparatus, exposing method, device manufacturing method, program, and recording medium
JP5986538B2 (ja) 2013-06-10 2016-09-06 キヤノン株式会社 露光装置および物品の製造方法
JP5960198B2 (ja) 2013-07-02 2016-08-02 キヤノン株式会社 パターン形成方法、リソグラフィ装置、リソグラフィシステムおよび物品製造方法
JP2016154241A (ja) * 2013-07-02 2016-08-25 キヤノン株式会社 パターン形成方法、リソグラフィ装置、リソグラフィシステムおよび物品製造方法
US9760027B2 (en) * 2013-10-17 2017-09-12 United Microelectronics Corp. Scanner routing method for particle removal
CN104793467B (zh) * 2014-01-20 2017-05-17 中芯国际集成电路制造(上海)有限公司 曝光装置、掩膜板及曝光方法
KR102224767B1 (ko) 2017-11-21 2021-03-08 누리온 케미칼즈 인터내셔널 비.브이. 생물-기반 단량체로부터 제조된 열팽창성 마이크로스피어
JP7504168B2 (ja) * 2022-08-10 2024-06-21 キヤノン株式会社 露光装置、露光方法及び物品の製造方法

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4509852A (en) 1980-10-06 1985-04-09 Werner Tabarelli Apparatus for the photolithographic manufacture of integrated circuit elements
US6118515A (en) * 1993-12-08 2000-09-12 Nikon Corporation Scanning exposure method
JPH10303126A (ja) * 1997-02-28 1998-11-13 Nikon Corp 移動シーケンスの決定方法
AU2746799A (en) * 1998-03-09 1999-09-27 Nikon Corporation Scanning exposure method, scanning exposure apparatus and its manufacturing method, and device and its manufacturing method
AU2747999A (en) 1998-03-26 1999-10-18 Nikon Corporation Projection exposure method and system
JP2000021702A (ja) 1998-06-30 2000-01-21 Canon Inc 露光装置ならびにデバイス製造方法
US6734117B2 (en) * 2002-03-12 2004-05-11 Nikon Corporation Periodic clamping method and apparatus to reduce thermal stress in a wafer
SG121822A1 (en) 2002-11-12 2006-05-26 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
EP1420299B1 (en) 2002-11-12 2011-01-05 ASML Netherlands B.V. Immersion lithographic apparatus and device manufacturing method
EP1420300B1 (en) 2002-11-12 2015-07-29 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
SG121818A1 (en) * 2002-11-12 2006-05-26 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
US7110081B2 (en) * 2002-11-12 2006-09-19 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
EP1571697A4 (en) * 2002-12-10 2007-07-04 Nikon Corp EXPOSURE SYSTEM AND DEVICE PRODUCTION METHOD
JP2005072132A (ja) 2003-08-21 2005-03-17 Nikon Corp 露光装置及びデバイス製造方法
DE60319087T2 (de) 2003-10-16 2009-02-05 Asml Netherlands B.V. Lithographische Methode zur Herstellung einer Vorrichtung
KR100585108B1 (ko) * 2003-11-14 2006-06-01 삼성전자주식회사 스캔 방식의 노광 장치를 이용한 웨이퍼 노광 방법
US7244534B2 (en) 2004-04-23 2007-07-17 Asml Netherlands B.V. Device manufacturing method
JPWO2005106930A1 (ja) 2004-04-27 2008-03-21 株式会社ニコン 露光方法、露光装置及びデバイス製造方法
US7701550B2 (en) 2004-08-19 2010-04-20 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP4003885B2 (ja) * 2004-08-23 2007-11-07 Tdk株式会社 露光方法および露光装置
JP4625673B2 (ja) 2004-10-15 2011-02-02 株式会社東芝 露光方法及び露光装置
SG124359A1 (en) 2005-01-14 2006-08-30 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
US7462429B2 (en) 2005-10-12 2008-12-09 Asml Netherlands B.V. Method and arrangement for correcting thermally-induced field deformations of a lithographically exposed substrate
US7864292B2 (en) 2005-11-16 2011-01-04 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7666576B2 (en) * 2006-06-07 2010-02-23 Taiwan Semiconductor Manufacturing Company, Ltd. Exposure scan and step direction optimization
US7656502B2 (en) 2006-06-22 2010-02-02 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method

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