JP2012518900A5 - - Google Patents

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Publication number
JP2012518900A5
JP2012518900A5 JP2011550592A JP2011550592A JP2012518900A5 JP 2012518900 A5 JP2012518900 A5 JP 2012518900A5 JP 2011550592 A JP2011550592 A JP 2011550592A JP 2011550592 A JP2011550592 A JP 2011550592A JP 2012518900 A5 JP2012518900 A5 JP 2012518900A5
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JP
Japan
Prior art keywords
substrate support
support structure
substrate
liquid
capillary
Prior art date
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Application number
JP2011550592A
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English (en)
Japanese (ja)
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JP5596058B2 (ja
JP2012518900A (ja
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Priority claimed from PCT/EP2010/052217 external-priority patent/WO2010094800A1/en
Publication of JP2012518900A publication Critical patent/JP2012518900A/ja
Publication of JP2012518900A5 publication Critical patent/JP2012518900A5/ja
Application granted granted Critical
Publication of JP5596058B2 publication Critical patent/JP5596058B2/ja
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JP2011550592A 2009-02-22 2010-02-22 基板支持構造体、クランプ調整ユニット及び、リソグラフィシステム Active JP5596058B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US15441109P 2009-02-22 2009-02-22
US61/154,411 2009-02-22
US30619910P 2010-02-19 2010-02-19
US61/306,199 2010-02-19
PCT/EP2010/052217 WO2010094800A1 (en) 2009-02-22 2010-02-22 Substrate support structure, clamp preparation unit, and lithography system

Publications (3)

Publication Number Publication Date
JP2012518900A JP2012518900A (ja) 2012-08-16
JP2012518900A5 true JP2012518900A5 (enExample) 2013-04-11
JP5596058B2 JP5596058B2 (ja) 2014-09-24

Family

ID=42154511

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011550592A Active JP5596058B2 (ja) 2009-02-22 2010-02-22 基板支持構造体、クランプ調整ユニット及び、リソグラフィシステム

Country Status (7)

Country Link
US (1) US8991330B2 (enExample)
EP (1) EP2399279B1 (enExample)
JP (1) JP5596058B2 (enExample)
KR (1) KR101568652B1 (enExample)
CN (1) CN102414781B (enExample)
TW (1) TWI545682B (enExample)
WO (1) WO2010094800A1 (enExample)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2469112A (en) 2009-04-03 2010-10-06 Mapper Lithography Ip Bv Wafer support using controlled capillary liquid layer to hold and release wafer
NL1038213C2 (en) * 2010-03-04 2012-10-08 Mapper Lithography Ip Bv Substrate support structure, clamp preparation unit, and lithography system.
US8936994B2 (en) * 2011-04-28 2015-01-20 Mapper Lithography Ip B.V. Method of processing a substrate in a lithography system
WO2013052520A1 (en) * 2011-10-03 2013-04-11 Denton Vacuum, L.L.C. Semiconductor wafer treatment system
JP2013125792A (ja) * 2011-12-13 2013-06-24 Canon Inc 保持装置、描画装置、および、物品の製造方法
JP2013125791A (ja) * 2011-12-13 2013-06-24 Canon Inc 保持装置、描画装置、および、物品の製造方法
WO2014103714A1 (ja) 2012-12-25 2014-07-03 京セラ株式会社 吸着部材およびそれを用いた吸着装置
CN103928369B (zh) * 2014-04-04 2016-07-13 中国电子科技集团公司第十三研究所 磷化铟晶片退火盒
DE102014118830A1 (de) * 2014-12-17 2016-06-23 Mechatronic Systemtechnik Gmbh Vakuumspannvorrichtung zum Aufspannen von Werkstücken
JP6748737B2 (ja) * 2016-04-20 2020-09-02 エーエスエムエル ネザーランズ ビー．ブイ． 基板支持部、リソグラフィ装置、およびローディング方法
WO2019049588A1 (en) * 2017-09-07 2019-03-14 Mapper Lithography Ip B.V. METHODS AND SYSTEMS FOR COATING A SUBSTRATE
CN112424956B (zh) * 2018-04-06 2025-02-28 迈可晟太阳能有限公司 使用激光束对半导体基板进行局部金属化
DE112019006417B4 (de) * 2018-12-27 2024-03-21 Sumco Corporation Quarzglastiegel und herstellungsverfahren für einen silicium-einkristall
NL2024445B1 (en) * 2019-12-12 2021-09-01 Delmic Ip B V Method and manipulation device for handling samples
JP7256773B2 (ja) 2020-04-24 2023-04-12 信越化学工業株式会社 平坦性制御方法、塗膜の形成方法、平坦性制御装置、及び塗膜形成装置
CN114151881B (zh) * 2021-11-06 2023-10-17 奥佳华智能健康科技集团股份有限公司 一种湿帘分水器

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5088006A (en) * 1991-04-25 1992-02-11 International Business Machines Corporation Liquid film interface cooling system for semiconductor wafer processing
US6281128B1 (en) * 1999-06-14 2001-08-28 Agere Systems Guardian Corp. Wafer carrier modification for reduced extraction force
WO2002023597A2 (en) * 2000-09-15 2002-03-21 Applied Materials, Inc. Double dual slot load lock for process equipment
DE60319658T2 (de) * 2002-11-29 2009-04-02 Asml Netherlands B.V. Lithographischer Apparat und Verfahren zur Herstellung einer Vorrichtung
US7158211B2 (en) * 2003-09-29 2007-01-02 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP2005175016A (ja) * 2003-12-08 2005-06-30 Canon Inc 基板保持装置およびそれを用いた露光装置ならびにデバイス製造方法
JP2005310933A (ja) * 2004-04-20 2005-11-04 Nikon Corp 基板保持部材、露光装置及びデバイス製造方法
US20060005767A1 (en) 2004-06-28 2006-01-12 Applied Materials, Inc. Chamber component having knurled surface
JP4647401B2 (ja) * 2005-06-06 2011-03-09 東京エレクトロン株式会社 基板保持台、基板温度制御装置及び基板温度制御方法
CN101495922B (zh) * 2006-07-28 2012-12-12 迈普尔平版印刷Ip有限公司 光刻系统、热消散方法和框架
US8325321B2 (en) * 2006-07-28 2012-12-04 Mapper Lithography Ip B.V. Lithography system, method of heat dissipation and frame
US8705010B2 (en) * 2007-07-13 2014-04-22 Mapper Lithography Ip B.V. Lithography system, method of clamping and wafer table
TWI541615B (zh) 2007-07-13 2016-07-11 瑪波微影Ｉｐ公司 在微影裝置中交換晶圓的方法

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