CN102414781B - 基板支撑结构、箝制准备单元及微影系统 - Google Patents

基板支撑结构、箝制准备单元及微影系统 Download PDF

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Publication number
CN102414781B
CN102414781B CN201080017871.4A CN201080017871A CN102414781B CN 102414781 B CN102414781 B CN 102414781B CN 201080017871 A CN201080017871 A CN 201080017871A CN 102414781 B CN102414781 B CN 102414781B
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China
Prior art keywords
support structure
substrate support
substrate
liquid
strangulation
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CN201080017871.4A
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English (en)
Chinese (zh)
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CN102414781A (zh
Inventor
H.J.德琼
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ASML Netherlands BV
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Mapper Lithopraphy IP BV
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B27/00—Photographic printing apparatus
    • G03B27/32—Projection printing apparatus, e.g. enlarger, copying camera
    • G03B27/52—Details
    • G03B27/58—Baseboards, masking frames, or other holders for the sensitive material
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/20—Means for supporting or positioning the object or the material; Means for adjusting diaphragms or lenses associated with the support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
    • H01J37/3174—Particle-beam lithography, e.g. electron beam lithography
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/006—Details of gas supplies, e.g. in an ion source, to a beam line, to a specimen or to a workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/20—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
    • H01J2237/2005—Seal mechanisms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/20—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
    • H01J2237/2007—Holding mechanisms
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49998—Work holding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y10T428/249961—With gradual property change within a component

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Analytical Chemistry (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
CN201080017871.4A 2009-02-22 2010-02-22 基板支撑结构、箝制准备单元及微影系统 Active CN102414781B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US15441109P 2009-02-22 2009-02-22
US61/154,411 2009-02-22
US30619910P 2010-02-19 2010-02-19
US61/306,199 2010-02-19
PCT/EP2010/052217 WO2010094800A1 (en) 2009-02-22 2010-02-22 Substrate support structure, clamp preparation unit, and lithography system

Publications (2)

Publication Number Publication Date
CN102414781A CN102414781A (zh) 2012-04-11
CN102414781B true CN102414781B (zh) 2015-07-15

Family

ID=42154511

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201080017871.4A Active CN102414781B (zh) 2009-02-22 2010-02-22 基板支撑结构、箝制准备单元及微影系统

Country Status (7)

Country Link
US (1) US8991330B2 (enExample)
EP (1) EP2399279B1 (enExample)
JP (1) JP5596058B2 (enExample)
KR (1) KR101568652B1 (enExample)
CN (1) CN102414781B (enExample)
TW (1) TWI545682B (enExample)
WO (1) WO2010094800A1 (enExample)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2469112A (en) 2009-04-03 2010-10-06 Mapper Lithography Ip Bv Wafer support using controlled capillary liquid layer to hold and release wafer
NL1038213C2 (en) * 2010-03-04 2012-10-08 Mapper Lithography Ip Bv Substrate support structure, clamp preparation unit, and lithography system.
US8936994B2 (en) * 2011-04-28 2015-01-20 Mapper Lithography Ip B.V. Method of processing a substrate in a lithography system
WO2013052520A1 (en) * 2011-10-03 2013-04-11 Denton Vacuum, L.L.C. Semiconductor wafer treatment system
JP2013125792A (ja) * 2011-12-13 2013-06-24 Canon Inc 保持装置、描画装置、および、物品の製造方法
JP2013125791A (ja) * 2011-12-13 2013-06-24 Canon Inc 保持装置、描画装置、および、物品の製造方法
WO2014103714A1 (ja) 2012-12-25 2014-07-03 京セラ株式会社 吸着部材およびそれを用いた吸着装置
CN103928369B (zh) * 2014-04-04 2016-07-13 中国电子科技集团公司第十三研究所 磷化铟晶片退火盒
DE102014118830A1 (de) * 2014-12-17 2016-06-23 Mechatronic Systemtechnik Gmbh Vakuumspannvorrichtung zum Aufspannen von Werkstücken
JP6748737B2 (ja) * 2016-04-20 2020-09-02 エーエスエムエル ネザーランズ ビー．ブイ． 基板支持部、リソグラフィ装置、およびローディング方法
WO2019049588A1 (en) * 2017-09-07 2019-03-14 Mapper Lithography Ip B.V. METHODS AND SYSTEMS FOR COATING A SUBSTRATE
CN112424956B (zh) * 2018-04-06 2025-02-28 迈可晟太阳能有限公司 使用激光束对半导体基板进行局部金属化
DE112019006417B4 (de) * 2018-12-27 2024-03-21 Sumco Corporation Quarzglastiegel und herstellungsverfahren für einen silicium-einkristall
NL2024445B1 (en) * 2019-12-12 2021-09-01 Delmic Ip B V Method and manipulation device for handling samples
JP7256773B2 (ja) 2020-04-24 2023-04-12 信越化学工業株式会社 平坦性制御方法、塗膜の形成方法、平坦性制御装置、及び塗膜形成装置
CN114151881B (zh) * 2021-11-06 2023-10-17 奥佳华智能健康科技集团股份有限公司 一种湿帘分水器

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5088006A (en) * 1991-04-25 1992-02-11 International Business Machines Corporation Liquid film interface cooling system for semiconductor wafer processing
US20050259236A1 (en) * 2003-09-29 2005-11-24 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7105463B2 (en) * 2000-09-15 2006-09-12 Applied Materials, Inc. Load lock chamber having two dual slot regions
WO2009011574A1 (en) * 2007-07-13 2009-01-22 Mapper Lithography Ip B.V. Lithography system, method of clamping and wafer table

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US6281128B1 (en) * 1999-06-14 2001-08-28 Agere Systems Guardian Corp. Wafer carrier modification for reduced extraction force
DE60319658T2 (de) * 2002-11-29 2009-04-02 Asml Netherlands B.V. Lithographischer Apparat und Verfahren zur Herstellung einer Vorrichtung
JP2005175016A (ja) * 2003-12-08 2005-06-30 Canon Inc 基板保持装置およびそれを用いた露光装置ならびにデバイス製造方法
JP2005310933A (ja) * 2004-04-20 2005-11-04 Nikon Corp 基板保持部材、露光装置及びデバイス製造方法
US20060005767A1 (en) 2004-06-28 2006-01-12 Applied Materials, Inc. Chamber component having knurled surface
JP4647401B2 (ja) * 2005-06-06 2011-03-09 東京エレクトロン株式会社 基板保持台、基板温度制御装置及び基板温度制御方法
CN101495922B (zh) * 2006-07-28 2012-12-12 迈普尔平版印刷Ip有限公司 光刻系统、热消散方法和框架
US8325321B2 (en) * 2006-07-28 2012-12-04 Mapper Lithography Ip B.V. Lithography system, method of heat dissipation and frame
US8705010B2 (en) * 2007-07-13 2014-04-22 Mapper Lithography Ip B.V. Lithography system, method of clamping and wafer table

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5088006A (en) * 1991-04-25 1992-02-11 International Business Machines Corporation Liquid film interface cooling system for semiconductor wafer processing
US7105463B2 (en) * 2000-09-15 2006-09-12 Applied Materials, Inc. Load lock chamber having two dual slot regions
US20050259236A1 (en) * 2003-09-29 2005-11-24 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
WO2009011574A1 (en) * 2007-07-13 2009-01-22 Mapper Lithography Ip B.V. Lithography system, method of clamping and wafer table

Also Published As

Publication number Publication date
US8991330B2 (en) 2015-03-31
EP2399279B1 (en) 2018-10-31
US20100236476A1 (en) 2010-09-23
KR20110120333A (ko) 2011-11-03
JP5596058B2 (ja) 2014-09-24
KR101568652B1 (ko) 2015-11-12
WO2010094800A1 (en) 2010-08-26
JP2012518900A (ja) 2012-08-16
TW201106443A (en) 2011-02-16
TWI545682B (zh) 2016-08-11
EP2399279A1 (en) 2011-12-28
CN102414781A (zh) 2012-04-11

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SE01 Entry into force of request for substantive examination
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Effective date of registration: 20190505

Address after: Holland Weide Eindhoven

Patentee after: ASML Holland Co., Ltd.

Address before: About Holland

Patentee before: Mapper Lithography IP B. V.

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