JP2014507810A5 - - Google Patents
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- Publication number
- JP2014507810A5 JP2014507810A5 JP2013557017A JP2013557017A JP2014507810A5 JP 2014507810 A5 JP2014507810 A5 JP 2014507810A5 JP 2013557017 A JP2013557017 A JP 2013557017A JP 2013557017 A JP2013557017 A JP 2013557017A JP 2014507810 A5 JP2014507810 A5 JP 2014507810A5
- Authority
- JP
- Japan
- Prior art keywords
- patterning device
- sensor array
- operable
- relative
- capacitive sensor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 238000000059 patterning Methods 0.000 claims 20
- 238000005259 measurement Methods 0.000 claims 8
- 230000005855 radiation Effects 0.000 claims 4
- 239000000758 substrate Substances 0.000 claims 3
- 238000005286 illumination Methods 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201161451803P | 2011-03-11 | 2011-03-11 | |
| US61/451,803 | 2011-03-11 | ||
| PCT/EP2012/050727 WO2012123144A1 (en) | 2011-03-11 | 2012-01-18 | Electrostatic clamp apparatus and lithographic apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2014507810A JP2014507810A (ja) | 2014-03-27 |
| JP2014507810A5 true JP2014507810A5 (enExample) | 2015-03-05 |
Family
ID=45507693
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013557017A Ceased JP2014507810A (ja) | 2011-03-11 | 2012-01-18 | 静電クランプ装置およびリソグラフィ装置 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20140002805A1 (enExample) |
| JP (1) | JP2014507810A (enExample) |
| KR (1) | KR20140023927A (enExample) |
| CN (1) | CN103415811B (enExample) |
| TW (1) | TW201237567A (enExample) |
| WO (1) | WO2012123144A1 (enExample) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6359565B2 (ja) * | 2013-01-22 | 2018-07-18 | エーエスエムエル ネザーランズ ビー．ブイ． | 静電クランプ |
| JP2014167963A (ja) * | 2013-02-28 | 2014-09-11 | Toshiba Corp | 静電チャック、レチクル、および静電チャック方法 |
| US9505140B1 (en) | 2015-06-02 | 2016-11-29 | Irobot Corporation | Contact sensors for a mobile robot |
| US9462920B1 (en) | 2015-06-25 | 2016-10-11 | Irobot Corporation | Evacuation station |
| CN106933059B (zh) * | 2015-12-31 | 2018-11-13 | 上海微电子装备（集团）股份有限公司 | 一种在线监测补偿掩膜版热变形的装置和方法 |
| WO2019197128A2 (en) * | 2018-04-12 | 2019-10-17 | Asml Netherlands B.V. | Apparatus and method |
| KR102233467B1 (ko) * | 2018-09-12 | 2021-03-31 | 세메스 주식회사 | 기판 처리 장치 및 기판 처리 방법 |
| WO2020094467A1 (en) * | 2018-11-09 | 2020-05-14 | Asml Holding N.V. | Sensor array for real time detection of reticle position and forces |
| KR102829107B1 (ko) * | 2019-05-02 | 2025-07-07 | 삼성전자주식회사 | Euv 노광 장치 및 그를 이용한 반도체 소자의 제조 방법 |
| JP7712269B2 (ja) * | 2019-10-29 | 2025-07-23 | エーエスエムエル ホールディング エヌ．ブイ． | リソグラフィ装置および静電クランプの設計 |
| KR102788879B1 (ko) * | 2019-10-30 | 2025-04-01 | 삼성전자주식회사 | 극자외선 노광 시스템 |
| WO2021130015A1 (en) * | 2019-12-26 | 2021-07-01 | Asml Holding N.V. | Wafer clamp hard burl production and refurbishment |
| CN115917437A (zh) * | 2020-06-23 | 2023-04-04 | Asml控股股份有限公司 | 通过将可变电压施加到氧化晶片上来检测突节顶部上的亚微米颗粒 |
| EP4002010A1 (en) | 2020-11-18 | 2022-05-25 | ASML Netherlands B.V. | Electrostatic clamp |
| KR102504347B1 (ko) * | 2020-12-23 | 2023-02-28 | 한국세라믹기술원 | 센서 칩이 장착된 정전척 및 이를 이용한 정전용량 및 척킹력 측정 방법 |
| US11610800B2 (en) * | 2021-03-22 | 2023-03-21 | Applied Materials, Inc. | Capacitive method of detecting wafer chucking and de-chucking |
| WO2025218972A1 (en) * | 2024-04-16 | 2025-10-23 | Asml Netherlands B.V. | Module for a lithographic apparatus, lithographic apparatus and method for clamping a sensor member |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0890474A (ja) * | 1994-09-27 | 1996-04-09 | Fujitsu Ltd | 静電チャックとそれを用いた異物検出方法 |
| JP4365908B2 (ja) * | 1998-09-04 | 2009-11-18 | キヤノン株式会社 | 面位置検出装置、露光装置およびデバイス製造方法 |
| JP2004342850A (ja) * | 2003-05-15 | 2004-12-02 | Sony Corp | 露光方法、マスク、半導体装置の製造方法および半導体装置 |
| JP3894562B2 (ja) * | 2003-10-01 | 2007-03-22 | キヤノン株式会社 | 基板吸着装置、露光装置およびデバイス製造方法 |
| JP2005150527A (ja) * | 2003-11-18 | 2005-06-09 | Canon Inc | 保持装置、それを用いた露光装置およびデバイス製造方法 |
| JP2005191515A (ja) * | 2003-12-01 | 2005-07-14 | Nikon Corp | 静電チャックおよび露光装置ならびに被吸着物の吸着方法 |
| JP2005322671A (ja) * | 2004-05-06 | 2005-11-17 | Renesas Technology Corp | レチクルステージ |
| KR100723483B1 (ko) * | 2005-02-03 | 2007-05-31 | 삼성전자주식회사 | 레티클 로딩장치 및 로딩방법 |
| US7643130B2 (en) * | 2005-11-04 | 2010-01-05 | Nuflare Technology, Inc. | Position measuring apparatus and positional deviation measuring method |
| US7986146B2 (en) * | 2006-11-29 | 2011-07-26 | Globalfoundries Inc. | Method and system for detecting existence of an undesirable particle during semiconductor fabrication |
| NL1036785A1 (nl) | 2008-04-18 | 2009-10-20 | Asml Netherlands Bv | Rapid exchange device for lithography reticles. |
| NL2003266A1 (nl) * | 2008-08-11 | 2010-02-15 | Asml Holding Nv | Multi nozzle proximity sensor employing common sensing and nozzle shaping. |
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2012
- 2012-01-18 US US14/004,199 patent/US20140002805A1/en not_active Abandoned
- 2012-01-18 KR KR1020137026780A patent/KR20140023927A/ko not_active Ceased
- 2012-01-18 CN CN201280011710.3A patent/CN103415811B/zh not_active Expired - Fee Related
- 2012-01-18 WO PCT/EP2012/050727 patent/WO2012123144A1/en not_active Ceased
- 2012-01-18 JP JP2013557017A patent/JP2014507810A/ja not_active Ceased
- 2012-02-23 TW TW101106095A patent/TW201237567A/zh unknown