CN103415811B - 静电夹具设备和光刻设备 - Google Patents

静电夹具设备和光刻设备 Download PDF

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Publication number
CN103415811B
CN103415811B CN201280011710.3A CN201280011710A CN103415811B CN 103415811 B CN103415811 B CN 103415811B CN 201280011710 A CN201280011710 A CN 201280011710A CN 103415811 B CN103415811 B CN 103415811B
Authority
CN
China
Prior art keywords
patterning device
electrostatic
electrostatic chuck
clamping
capacitive sensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201280011710.3A
Other languages
English (en)
Chinese (zh)
Other versions
CN103415811A (zh
Inventor
V·班尼恩
E·鲁普斯特拉
T·凯蒂
J·阿克曼斯
L·斯卡克卡巴拉兹
C·L·瓦伦汀
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ASML Netherlands BV
Original Assignee
ASML Netherlands BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ASML Netherlands BV filed Critical ASML Netherlands BV
Publication of CN103415811A publication Critical patent/CN103415811A/zh
Application granted granted Critical
Publication of CN103415811B publication Critical patent/CN103415811B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G03F7/70708—Chucks, e.g. chucking or un-chucking operations or structural details being electrostatic; Electrostatically deformable vacuum chucks
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70783—Handling stress or warp of chucks, masks or workpieces, e.g. to compensate for imaging errors or considerations related to warpage of masks or workpieces due to their own weight
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7023—Aligning or positioning in direction perpendicular to substrate surface
    • G03F9/7034—Leveling

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
CN201280011710.3A 2011-03-11 2012-01-18 静电夹具设备和光刻设备 Expired - Fee Related CN103415811B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201161451803P 2011-03-11 2011-03-11
US61/451,803 2011-03-11
PCT/EP2012/050727 WO2012123144A1 (en) 2011-03-11 2012-01-18 Electrostatic clamp apparatus and lithographic apparatus

Publications (2)

Publication Number Publication Date
CN103415811A CN103415811A (zh) 2013-11-27
CN103415811B true CN103415811B (zh) 2016-07-06

Family

ID=45507693

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201280011710.3A Expired - Fee Related CN103415811B (zh) 2011-03-11 2012-01-18 静电夹具设备和光刻设备

Country Status (6)

Country Link
US (1) US20140002805A1 (enExample)
JP (1) JP2014507810A (enExample)
KR (1) KR20140023927A (enExample)
CN (1) CN103415811B (enExample)
TW (1) TW201237567A (enExample)
WO (1) WO2012123144A1 (enExample)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6359565B2 (ja) * 2013-01-22 2018-07-18 エーエスエムエル ネザーランズ ビー．ブイ． 静電クランプ
JP2014167963A (ja) * 2013-02-28 2014-09-11 Toshiba Corp 静電チャック、レチクル、および静電チャック方法
US9505140B1 (en) 2015-06-02 2016-11-29 Irobot Corporation Contact sensors for a mobile robot
US9462920B1 (en) 2015-06-25 2016-10-11 Irobot Corporation Evacuation station
CN106933059B (zh) * 2015-12-31 2018-11-13 上海微电子装备（集团）股份有限公司 一种在线监测补偿掩膜版热变形的装置和方法
WO2019197128A2 (en) * 2018-04-12 2019-10-17 Asml Netherlands B.V. Apparatus and method
KR102233467B1 (ko) * 2018-09-12 2021-03-31 세메스 주식회사 기판 처리 장치 및 기판 처리 방법
WO2020094467A1 (en) * 2018-11-09 2020-05-14 Asml Holding N.V. Sensor array for real time detection of reticle position and forces
KR102829107B1 (ko) * 2019-05-02 2025-07-07 삼성전자주식회사 Euv 노광 장치 및 그를 이용한 반도체 소자의 제조 방법
JP7712269B2 (ja) * 2019-10-29 2025-07-23 エーエスエムエル ホールディング エヌ．ブイ． リソグラフィ装置および静電クランプの設計
KR102788879B1 (ko) * 2019-10-30 2025-04-01 삼성전자주식회사 극자외선 노광 시스템
WO2021130015A1 (en) * 2019-12-26 2021-07-01 Asml Holding N.V. Wafer clamp hard burl production and refurbishment
CN115917437A (zh) * 2020-06-23 2023-04-04 Asml控股股份有限公司 通过将可变电压施加到氧化晶片上来检测突节顶部上的亚微米颗粒
EP4002010A1 (en) 2020-11-18 2022-05-25 ASML Netherlands B.V. Electrostatic clamp
KR102504347B1 (ko) * 2020-12-23 2023-02-28 한국세라믹기술원 센서 칩이 장착된 정전척 및 이를 이용한 정전용량 및 척킹력 측정 방법
US11610800B2 (en) * 2021-03-22 2023-03-21 Applied Materials, Inc. Capacitive method of detecting wafer chucking and de-chucking
WO2025218972A1 (en) * 2024-04-16 2025-10-23 Asml Netherlands B.V. Module for a lithographic apparatus, lithographic apparatus and method for clamping a sensor member

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005191515A (ja) * 2003-12-01 2005-07-14 Nikon Corp 静電チャックおよび露光装置ならびに被吸着物の吸着方法

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JPH0890474A (ja) * 1994-09-27 1996-04-09 Fujitsu Ltd 静電チャックとそれを用いた異物検出方法
JP4365908B2 (ja) * 1998-09-04 2009-11-18 キヤノン株式会社 面位置検出装置、露光装置およびデバイス製造方法
JP2004342850A (ja) * 2003-05-15 2004-12-02 Sony Corp 露光方法、マスク、半導体装置の製造方法および半導体装置
JP3894562B2 (ja) * 2003-10-01 2007-03-22 キヤノン株式会社 基板吸着装置、露光装置およびデバイス製造方法
JP2005150527A (ja) * 2003-11-18 2005-06-09 Canon Inc 保持装置、それを用いた露光装置およびデバイス製造方法
JP2005322671A (ja) * 2004-05-06 2005-11-17 Renesas Technology Corp レチクルステージ
KR100723483B1 (ko) * 2005-02-03 2007-05-31 삼성전자주식회사 레티클 로딩장치 및 로딩방법
US7643130B2 (en) * 2005-11-04 2010-01-05 Nuflare Technology, Inc. Position measuring apparatus and positional deviation measuring method
US7986146B2 (en) * 2006-11-29 2011-07-26 Globalfoundries Inc. Method and system for detecting existence of an undesirable particle during semiconductor fabrication
NL1036785A1 (nl) 2008-04-18 2009-10-20 Asml Netherlands Bv Rapid exchange device for lithography reticles.
NL2003266A1 (nl) * 2008-08-11 2010-02-15 Asml Holding Nv Multi nozzle proximity sensor employing common sensing and nozzle shaping.

Patent Citations (1)

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Publication number Priority date Publication date Assignee Title
JP2005191515A (ja) * 2003-12-01 2005-07-14 Nikon Corp 静電チャックおよび露光装置ならびに被吸着物の吸着方法

Also Published As

Publication number Publication date
KR20140023927A (ko) 2014-02-27
JP2014507810A (ja) 2014-03-27
TW201237567A (en) 2012-09-16
WO2012123144A1 (en) 2012-09-20
CN103415811A (zh) 2013-11-27
US20140002805A1 (en) 2014-01-02

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PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
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CF01 Termination of patent right due to non-payment of annual fee
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Granted publication date: 20160706

Termination date: 20180118