TW201237567A - An electrostatic clamp apparatus and lithographic apparatus - Google Patents

An electrostatic clamp apparatus and lithographic apparatus Download PDF

Info

Publication number
TW201237567A
TW201237567A TW101106095A TW101106095A TW201237567A TW 201237567 A TW201237567 A TW 201237567A TW 101106095 A TW101106095 A TW 101106095A TW 101106095 A TW101106095 A TW 101106095A TW 201237567 A TW201237567 A TW 201237567A
Authority
TW
Taiwan
Prior art keywords
patterned
array
reticle
sensor array
capacitive
Prior art date
Application number
TW101106095A
Other languages
English (en)
Chinese (zh)
Inventor
Vadim Yevgenyevich Banine
Erik Roelof Loopstra
Theodorus Petrus Maria Cadee
Johannes Antonius Gerardus Akkermans
Luigi Scaccabarozzi
Christiaan Louis Valentin
Original Assignee
Asml Netherlands Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asml Netherlands Bv filed Critical Asml Netherlands Bv
Publication of TW201237567A publication Critical patent/TW201237567A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G03F7/70708—Chucks, e.g. chucking or un-chucking operations or structural details being electrostatic; Electrostatically deformable vacuum chucks
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70783—Handling stress or warp of chucks, masks or workpieces, e.g. to compensate for imaging errors or considerations related to warpage of masks or workpieces due to their own weight
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7023—Aligning or positioning in direction perpendicular to substrate surface
    • G03F9/7034—Leveling

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW101106095A 2011-03-11 2012-02-23 An electrostatic clamp apparatus and lithographic apparatus TW201237567A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US201161451803P 2011-03-11 2011-03-11

Publications (1)

Publication Number Publication Date
TW201237567A true TW201237567A (en) 2012-09-16

Family

ID=45507693

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101106095A TW201237567A (en) 2011-03-11 2012-02-23 An electrostatic clamp apparatus and lithographic apparatus

Country Status (6)

Country Link
US (1) US20140002805A1 (enExample)
JP (1) JP2014507810A (enExample)
KR (1) KR20140023927A (enExample)
CN (1) CN103415811B (enExample)
TW (1) TW201237567A (enExample)
WO (1) WO2012123144A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI608303B (zh) * 2013-01-22 2017-12-11 Ａｓｍｌ荷蘭公司 靜電夾具
US12461452B2 (en) 2020-11-18 2025-11-04 Asml Netherlands B.V. Electrostatic clamp

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014167963A (ja) * 2013-02-28 2014-09-11 Toshiba Corp 静電チャック、レチクル、および静電チャック方法
US9505140B1 (en) 2015-06-02 2016-11-29 Irobot Corporation Contact sensors for a mobile robot
US9462920B1 (en) 2015-06-25 2016-10-11 Irobot Corporation Evacuation station
CN106933059B (zh) * 2015-12-31 2018-11-13 上海微电子装备（集团）股份有限公司 一种在线监测补偿掩膜版热变形的装置和方法
WO2019197128A2 (en) * 2018-04-12 2019-10-17 Asml Netherlands B.V. Apparatus and method
KR102233467B1 (ko) * 2018-09-12 2021-03-31 세메스 주식회사 기판 처리 장치 및 기판 처리 방법
WO2020094467A1 (en) * 2018-11-09 2020-05-14 Asml Holding N.V. Sensor array for real time detection of reticle position and forces
KR102829107B1 (ko) * 2019-05-02 2025-07-07 삼성전자주식회사 Euv 노광 장치 및 그를 이용한 반도체 소자의 제조 방법
JP7712269B2 (ja) * 2019-10-29 2025-07-23 エーエスエムエル ホールディング エヌ．ブイ． リソグラフィ装置および静電クランプの設計
KR102788879B1 (ko) * 2019-10-30 2025-04-01 삼성전자주식회사 극자외선 노광 시스템
WO2021130015A1 (en) * 2019-12-26 2021-07-01 Asml Holding N.V. Wafer clamp hard burl production and refurbishment
CN115917437A (zh) * 2020-06-23 2023-04-04 Asml控股股份有限公司 通过将可变电压施加到氧化晶片上来检测突节顶部上的亚微米颗粒
KR102504347B1 (ko) * 2020-12-23 2023-02-28 한국세라믹기술원 센서 칩이 장착된 정전척 및 이를 이용한 정전용량 및 척킹력 측정 방법
US11610800B2 (en) * 2021-03-22 2023-03-21 Applied Materials, Inc. Capacitive method of detecting wafer chucking and de-chucking
WO2025218972A1 (en) * 2024-04-16 2025-10-23 Asml Netherlands B.V. Module for a lithographic apparatus, lithographic apparatus and method for clamping a sensor member

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0890474A (ja) * 1994-09-27 1996-04-09 Fujitsu Ltd 静電チャックとそれを用いた異物検出方法
JP4365908B2 (ja) * 1998-09-04 2009-11-18 キヤノン株式会社 面位置検出装置、露光装置およびデバイス製造方法
JP2004342850A (ja) * 2003-05-15 2004-12-02 Sony Corp 露光方法、マスク、半導体装置の製造方法および半導体装置
JP3894562B2 (ja) * 2003-10-01 2007-03-22 キヤノン株式会社 基板吸着装置、露光装置およびデバイス製造方法
JP2005150527A (ja) * 2003-11-18 2005-06-09 Canon Inc 保持装置、それを用いた露光装置およびデバイス製造方法
JP2005191515A (ja) * 2003-12-01 2005-07-14 Nikon Corp 静電チャックおよび露光装置ならびに被吸着物の吸着方法
JP2005322671A (ja) * 2004-05-06 2005-11-17 Renesas Technology Corp レチクルステージ
KR100723483B1 (ko) * 2005-02-03 2007-05-31 삼성전자주식회사 레티클 로딩장치 및 로딩방법
US7643130B2 (en) * 2005-11-04 2010-01-05 Nuflare Technology, Inc. Position measuring apparatus and positional deviation measuring method
US7986146B2 (en) * 2006-11-29 2011-07-26 Globalfoundries Inc. Method and system for detecting existence of an undesirable particle during semiconductor fabrication
NL1036785A1 (nl) 2008-04-18 2009-10-20 Asml Netherlands Bv Rapid exchange device for lithography reticles.
NL2003266A1 (nl) * 2008-08-11 2010-02-15 Asml Holding Nv Multi nozzle proximity sensor employing common sensing and nozzle shaping.

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI608303B (zh) * 2013-01-22 2017-12-11 Ａｓｍｌ荷蘭公司 靜電夾具
US12461452B2 (en) 2020-11-18 2025-11-04 Asml Netherlands B.V. Electrostatic clamp

Also Published As

Publication number Publication date
KR20140023927A (ko) 2014-02-27
CN103415811B (zh) 2016-07-06
JP2014507810A (ja) 2014-03-27
WO2012123144A1 (en) 2012-09-20
CN103415811A (zh) 2013-11-27
US20140002805A1 (en) 2014-01-02

Similar Documents

Publication Publication Date Title
TW201237567A (en) An electrostatic clamp apparatus and lithographic apparatus
CN101490624B (zh) 通过控制激光光束对极紫外光源的空间不稳定性的校正
JP6145564B2 (ja) リソグラフィ装置における使用のための物体ホルダ、及び、物体ホルダを製造する方法
US8446562B2 (en) Actuator system using multiple piezoelectric actuators
TW201133154A (en) Lithographic apparatus and device manufacturing method
JP2015531890A (ja) 粘着性の表面を用いたレチクルクリーニング
JP6321777B2 (ja) ソースコレクタ装置、リソグラフィ装置及び方法
NL2014179A (en) Lithographic system.
TW201120582A (en) Image-compensating addressable electrostatic chuck system
WO2013083332A1 (en) Method for a patterning device support
TWI539242B (zh) 微影裝置及元件製造方法
KR20150097715A (ko) 리소그래피 장치를 위한 기판 지지체 및 리소그래피 장치
US20160035605A1 (en) Support Structure, Method of Controlling the Temperature Of The Same, and Apparatuses Including the Same
US8760625B2 (en) Lithographic apparatus, aberration detector and device manufacturing method
NL2013676A (en) A method of clamping articles for a lithographic apparatus, a controller for a lithographic apparatus, a chuck, a method of using a chuck and a device manufacturing method.
CN101911838A (zh) 极紫外辐射源和用于产生极紫外辐射的方法
US20120026480A1 (en) Image-Compensating Addressable Electrostatic Chuck System
US20160077442A1 (en) Optical component
US11422478B2 (en) Control of reticle placement for defectivity optimization
NL2006601A (en) An electrostatic clamp apparatus and lithographic apparatus.
WO2025218972A1 (en) Module for a lithographic apparatus, lithographic apparatus and method for clamping a sensor member
KR20230131225A (ko) 빠른 균일성 드리프트 보정
WO2015074816A1 (en) Apparatus, lithographic apparatus and device manufacturing method
WO2024104842A1 (en) A droplet stream alignment mechanism and method thereof
NL2009725A (en) Cleaning a support that holds a patterning device inside a lithography apparatus.