JP2018117025A - 半導体装置 - Google Patents
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 183
- 239000000758 substrate Substances 0.000 claims abstract description 95
- 229910052751 metal Inorganic materials 0.000 description 29
- 239000002184 metal Substances 0.000 description 29
- 239000011229 interlayer Substances 0.000 description 15
- 239000012535 impurity Substances 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 6
- 229920005591 polysilicon Polymers 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 3
- 229910000676 Si alloy Inorganic materials 0.000 description 2
- CSDREXVUYHZDNP-UHFFFAOYSA-N alumanylidynesilicon Chemical compound [Al].[Si] CSDREXVUYHZDNP-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910002601 GaN Inorganic materials 0.000 description 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000009191 jumping Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 238000005121 nitriding Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000005368 silicate glass Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 230000002123 temporal effect Effects 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 150000003609 titanium compounds Chemical class 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
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- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0684—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape, relative sizes or dispositions of the semiconductor regions or junctions between the regions
- H01L29/0692—Surface layout
- H01L29/0696—Surface layout of cellular field-effect devices, e.g. multicellular DMOS transistors or IGBTs
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
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- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/10—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
- H01L29/1095—Body region, i.e. base region, of DMOS transistors or IGBTs
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- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
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- H01L29/407—Recessed field plates, e.g. trench field plates, buried field plates
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- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
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- H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
- H01L29/42312—Gate electrodes for field effect devices
- H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
- H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
- H01L29/42372—Gate electrodes for field effect devices for field-effect transistors with insulated gate characterised by the conducting layer, e.g. the length, the sectional shape or the lay-out
- H01L29/4238—Gate electrodes for field effect devices for field-effect transistors with insulated gate characterised by the conducting layer, e.g. the length, the sectional shape or the lay-out characterised by the surface lay-out
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- H01L29/66234—Bipolar junction transistors [BJT]
- H01L29/66325—Bipolar junction transistors [BJT] controlled by field-effect, e.g. insulated gate bipolar transistors [IGBT]
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- H01L29/72—Transistor-type devices, i.e. able to continuously respond to applied control signals
- H01L29/739—Transistor-type devices, i.e. able to continuously respond to applied control signals controlled by field-effect, e.g. bipolar static induction transistors [BSIT]
- H01L29/7393—Insulated gate bipolar mode transistors, i.e. IGBT; IGT; COMFET
- H01L29/7395—Vertical transistors, e.g. vertical IGBT
- H01L29/7396—Vertical transistors, e.g. vertical IGBT with a non planar surface, e.g. with a non planar gate or with a trench or recess or pillar in the surface of the emitter, base or collector region for improving current density or short circuiting the emitter and base regions
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
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- H01L29/70—Bipolar devices
- H01L29/72—Transistor-type devices, i.e. able to continuously respond to applied control signals
- H01L29/739—Transistor-type devices, i.e. able to continuously respond to applied control signals controlled by field-effect, e.g. bipolar static induction transistors [BSIT]
- H01L29/7393—Insulated gate bipolar mode transistors, i.e. IGBT; IGT; COMFET
- H01L29/7395—Vertical transistors, e.g. vertical IGBT
- H01L29/7396—Vertical transistors, e.g. vertical IGBT with a non planar surface, e.g. with a non planar gate or with a trench or recess or pillar in the surface of the emitter, base or collector region for improving current density or short circuiting the emitter and base regions
- H01L29/7397—Vertical transistors, e.g. vertical IGBT with a non planar surface, e.g. with a non planar gate or with a trench or recess or pillar in the surface of the emitter, base or collector region for improving current density or short circuiting the emitter and base regions and a gate structure lying on a slanted or vertical surface or formed in a groove, e.g. trench gate IGBT
Abstract
【解決手段】第1導電型のドリフト領域を有する半導体基板と、半導体基板において、半導体基板の上面とドリフト領域との間に形成された第2導電型のベース領域と、半導体基板において、半導体基板の上面とベース領域との間に設けられた第1導電型のエミッタ領域と、半導体基板の上面に形成され、エミッタ領域およびベース領域と接する第1ゲートトレンチ部と、半導体基板の上面に形成された第2ゲートトレンチ部と、第1ゲートトレンチ部と電気的に接続された第1電気素子と、第2ゲートトレンチ部と電気的に接続された第2電気素子とを備え、第2電気素子と第2ゲートトレンチ部とにより構成されるRC回路の時定数が、第1電気素子と第1ゲートトレンチ部とにより構成されるRC回路の時定数よりも大きい半導体装置を提供する。
【選択図】図1
Description
特許文献1 特開2006−210547号公報
Claims (6)
- 第1導電型のドリフト領域を有する半導体基板と、
前記半導体基板において、前記半導体基板の上面と前記ドリフト領域との間に形成された第2導電型のベース領域と、
前記半導体基板において、前記半導体基板の上面と前記ベース領域との間に設けられた第1導電型のエミッタ領域と、
前記半導体基板の上面に形成され、前記エミッタ領域および前記ベース領域と接する第1ゲートトレンチ部と、
前記半導体基板の上面に形成された第2ゲートトレンチ部と、
前記第1ゲートトレンチ部と電気的に接続された第1電気素子と、
前記第2ゲートトレンチ部と電気的に接続された第2電気素子と
を備え、
前記第2電気素子と前記第2ゲートトレンチ部とにより構成されるRC回路の時定数が、前記第1電気素子と前記第1ゲートトレンチ部とにより構成されるRC回路の時定数よりも大きい半導体装置。 - 前記第1ゲートトレンチ部に接して設けられた前記エミッタ領域は、前記第2ゲートトレンチ部に接する前記エミッタ領域と比べて、前記半導体基板の上面における面積が大きい
請求項1に記載の半導体装置。 - 前記第2ゲートトレンチ部は、前記エミッタ領域に接触していない
請求項1に記載の半導体装置。 - 前記第1電気素子は第1抵抗を有し、
前記第2電気素子は、前記第1抵抗より抵抗値の大きい第2抵抗を有する
請求項1から3のいずれか一項に記載の半導体装置。 - 前記半導体基板の上方に形成されたゲートパッドと、
前記半導体基板の上方に形成され、前記ゲートパッドと前記第1ゲートトレンチ部とを電気的に接続する第1電気経路と、
前記半導体基板の上方に形成され、前記ゲートパッドと前記第2ゲートトレンチ部とを電気的に接続する第2電気経路と
を更に備え、
前記第1電気素子は前記第1電気経路に設けられ、
前記第2電気素子は前記第2電気経路に設けられる
請求項1から4のいずれか一項に記載の半導体装置。 - 前記半導体基板を収容するパッケージ部と、
前記パッケージ部に収容され、前記第1ゲートトレンチ部および前記第2ゲートトレンチ部と電気的に接続する配線が設けられた配線基板と
を更に備え、
前記第1電気素子および前記第2電気素子は、前記配線基板に設けられる
請求項1から4のいずれか一項に記載の半導体装置。
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JP2017006254A JP6950186B2 (ja) | 2017-01-17 | 2017-01-17 | 半導体装置 |
US15/823,614 US10355083B2 (en) | 2017-01-17 | 2017-11-28 | Semiconductor device |
JP2021094585A JP7295162B2 (ja) | 2017-01-17 | 2021-06-04 | 半導体装置 |
JP2023002721A JP2023036996A (ja) | 2017-01-17 | 2023-01-11 | 半導体装置、半導体モジュールおよび半導体装置のターンオン方法 |
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JP2023002721A Pending JP2023036996A (ja) | 2017-01-17 | 2023-01-11 | 半導体装置、半導体モジュールおよび半導体装置のターンオン方法 |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2019057702A (ja) * | 2017-09-20 | 2019-04-11 | 株式会社東芝 | 半導体装置 |
JP2021002620A (ja) * | 2019-06-24 | 2021-01-07 | 富士電機株式会社 | 半導体装置 |
JPWO2021161681A1 (ja) * | 2020-02-14 | 2021-08-19 | ||
WO2021200543A1 (ja) * | 2020-03-30 | 2021-10-07 | 住友電気工業株式会社 | トランジスタおよび半導体装置 |
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JPH06350076A (ja) * | 1993-06-14 | 1994-12-22 | Toshiba Corp | 半導体装置およびその駆動方法 |
WO2013046578A1 (ja) * | 2011-09-27 | 2013-04-04 | 株式会社デンソー | 半導体装置 |
JP2013098415A (ja) * | 2011-11-02 | 2013-05-20 | Denso Corp | 半導体装置 |
JP2013239697A (ja) * | 2012-04-16 | 2013-11-28 | Fuji Electric Co Ltd | 半導体装置 |
JP2016154218A (ja) * | 2014-12-23 | 2016-08-25 | インフィネオン テクノロジーズ アーゲーInfineon Technologies Ag | トランジスタセルおよびエンハンスメントセルを有する半導体装置 |
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JP2019057702A (ja) * | 2017-09-20 | 2019-04-11 | 株式会社東芝 | 半導体装置 |
JP2021002620A (ja) * | 2019-06-24 | 2021-01-07 | 富士電機株式会社 | 半導体装置 |
US11469316B2 (en) | 2019-06-24 | 2022-10-11 | Fuji Electric Co., Ltd. | Semiconductor device |
JPWO2021161681A1 (ja) * | 2020-02-14 | 2021-08-19 | ||
WO2021161681A1 (ja) * | 2020-02-14 | 2021-08-19 | 富士電機株式会社 | 半導体回路装置 |
JP7248189B2 (ja) | 2020-02-14 | 2023-03-29 | 富士電機株式会社 | 半導体回路装置 |
WO2021200543A1 (ja) * | 2020-03-30 | 2021-10-07 | 住友電気工業株式会社 | トランジスタおよび半導体装置 |
Also Published As
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JP7295162B2 (ja) | 2023-06-20 |
US20180204910A1 (en) | 2018-07-19 |
JP2021122076A (ja) | 2021-08-26 |
JP2023036996A (ja) | 2023-03-14 |
JP6950186B2 (ja) | 2021-10-13 |
US10355083B2 (en) | 2019-07-16 |
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