JP2016110613A - タッチパネル - Google Patents
タッチパネル Download PDFInfo
- Publication number
- JP2016110613A JP2016110613A JP2015107033A JP2015107033A JP2016110613A JP 2016110613 A JP2016110613 A JP 2016110613A JP 2015107033 A JP2015107033 A JP 2015107033A JP 2015107033 A JP2015107033 A JP 2015107033A JP 2016110613 A JP2016110613 A JP 2016110613A
- Authority
- JP
- Japan
- Prior art keywords
- conductive layer
- layer
- touch panel
- substrate
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000000758 substrate Substances 0.000 claims abstract description 136
- 239000003990 capacitor Substances 0.000 claims description 37
- 238000001514 detection method Methods 0.000 abstract description 41
- 230000035945 sensitivity Effects 0.000 abstract description 14
- 239000010410 layer Substances 0.000 description 660
- 239000000463 material Substances 0.000 description 74
- 239000010408 film Substances 0.000 description 68
- 239000004065 semiconductor Substances 0.000 description 53
- 238000000034 method Methods 0.000 description 44
- 230000006870 function Effects 0.000 description 34
- 229920005989 resin Polymers 0.000 description 28
- 239000011347 resin Substances 0.000 description 28
- 238000005452 bending Methods 0.000 description 15
- 125000006850 spacer group Chemical group 0.000 description 15
- 229910052751 metal Inorganic materials 0.000 description 14
- 239000002184 metal Substances 0.000 description 14
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 13
- 239000012790 adhesive layer Substances 0.000 description 13
- 238000000926 separation method Methods 0.000 description 13
- 229910052710 silicon Inorganic materials 0.000 description 13
- 239000010703 silicon Substances 0.000 description 13
- 230000008859 change Effects 0.000 description 11
- 239000013078 crystal Substances 0.000 description 11
- 229910052782 aluminium Inorganic materials 0.000 description 10
- 239000010949 copper Substances 0.000 description 10
- 230000007423 decrease Effects 0.000 description 10
- 239000011521 glass Substances 0.000 description 10
- 239000011810 insulating material Substances 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 9
- 229910052802 copper Inorganic materials 0.000 description 9
- 239000000835 fiber Substances 0.000 description 9
- 230000003071 parasitic effect Effects 0.000 description 9
- 239000000126 substance Substances 0.000 description 9
- 239000004973 liquid crystal related substance Substances 0.000 description 8
- 230000003287 optical effect Effects 0.000 description 8
- 229910052719 titanium Inorganic materials 0.000 description 8
- 239000010936 titanium Substances 0.000 description 8
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 7
- 239000011159 matrix material Substances 0.000 description 7
- 239000007769 metal material Substances 0.000 description 7
- 238000002161 passivation Methods 0.000 description 7
- 238000012545 processing Methods 0.000 description 7
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 6
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 6
- 239000000956 alloy Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- 239000002070 nanowire Substances 0.000 description 6
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 5
- 239000003086 colorant Substances 0.000 description 5
- 238000004891 communication Methods 0.000 description 5
- -1 copper-magnesium-aluminum Chemical compound 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- 229910052750 molybdenum Inorganic materials 0.000 description 5
- 239000011733 molybdenum Substances 0.000 description 5
- 229910052709 silver Inorganic materials 0.000 description 5
- 239000004332 silver Substances 0.000 description 5
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 5
- 229910052721 tungsten Inorganic materials 0.000 description 5
- 239000010937 tungsten Substances 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 229910052581 Si3N4 Inorganic materials 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 4
- 238000004040 coloring Methods 0.000 description 4
- 239000004020 conductor Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- 238000012546 transfer Methods 0.000 description 4
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 description 3
- GPBUGPUPKAGMDK-UHFFFAOYSA-N azanylidynemolybdenum Chemical compound [Mo]#N GPBUGPUPKAGMDK-UHFFFAOYSA-N 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 239000003365 glass fiber Substances 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 229910001416 lithium ion Inorganic materials 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 150000004767 nitrides Chemical class 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 239000011787 zinc oxide Substances 0.000 description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 239000004962 Polyamide-imide Substances 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 229910021417 amorphous silicon Inorganic materials 0.000 description 2
- 238000013459 approach Methods 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 238000000295 emission spectrum Methods 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 230000005669 field effect Effects 0.000 description 2
- 229910052733 gallium Inorganic materials 0.000 description 2
- 229910052732 germanium Inorganic materials 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 2
- 229910003437 indium oxide Inorganic materials 0.000 description 2
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 2
- 150000002484 inorganic compounds Chemical class 0.000 description 2
- 229910010272 inorganic material Inorganic materials 0.000 description 2
- 239000011777 magnesium Substances 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 230000001151 other effect Effects 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 230000000737 periodic effect Effects 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 230000035699 permeability Effects 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229920002312 polyamide-imide Polymers 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 229920006393 polyether sulfone Polymers 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 230000003595 spectral effect Effects 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 229910052727 yttrium Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- 229910052726 zirconium Inorganic materials 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 229910052684 Cerium Inorganic materials 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- 229910000861 Mg alloy Inorganic materials 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- 239000011358 absorbing material Substances 0.000 description 1
- 229920006231 aramid fiber Polymers 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- OJIJEKBXJYRIBZ-UHFFFAOYSA-N cadmium nickel Chemical compound [Ni].[Cd] OJIJEKBXJYRIBZ-UHFFFAOYSA-N 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 229910052800 carbon group element Inorganic materials 0.000 description 1
- 230000001413 cellular effect Effects 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 150000001925 cycloalkenes Chemical class 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 238000001962 electrophoresis Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 230000005281 excited state Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000011245 gel electrolyte Substances 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910021389 graphene Inorganic materials 0.000 description 1
- 230000005525 hole transport Effects 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910052746 lanthanum Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000011572 manganese Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 229910052987 metal hydride Inorganic materials 0.000 description 1
- 239000013081 microcrystal Substances 0.000 description 1
- 229910021424 microcrystalline silicon Inorganic materials 0.000 description 1
- 239000002159 nanocrystal Substances 0.000 description 1
- 230000006855 networking Effects 0.000 description 1
- QELJHCBNGDEXLD-UHFFFAOYSA-N nickel zinc Chemical compound [Ni].[Zn] QELJHCBNGDEXLD-UHFFFAOYSA-N 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920006350 polyacrylonitrile resin Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920005990 polystyrene resin Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 239000003870 refractory metal Substances 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- BSWGGJHLVUUXTL-UHFFFAOYSA-N silver zinc Chemical compound [Zn].[Ag] BSWGGJHLVUUXTL-UHFFFAOYSA-N 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- 230000005236 sound signal Effects 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 1
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
- G06F1/1637—Details related to the display arrangement, including those related to the mounting of the display in the housing
- G06F1/1652—Details related to the display arrangement, including those related to the mounting of the display in the housing the display being flexible, e.g. mimicking a sheet of paper, or rollable
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F15/00—Digital computers in general; Data processing equipment in general
- G06F15/02—Digital computers in general; Data processing equipment in general manually operated with input through keyboard and computation using a built-in program, e.g. pocket calculators
- G06F15/0216—Constructional details or arrangements
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0416—Control or interface arrangements specially adapted for digitisers
- G06F3/04166—Details of scanning methods, e.g. sampling time, grouping of sub areas or time sharing with display driving
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/045—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using resistive elements, e.g. a single continuous surface or two parallel surfaces put in contact
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/048—Interaction techniques based on graphical user interfaces [GUI]
- G06F3/0487—Interaction techniques based on graphical user interfaces [GUI] using specific features provided by the input device, e.g. functions controlled by the rotation of a mouse with dual sensing arrangements, or of the nature of the input device, e.g. tap gestures based on pressure sensed by a digitiser
- G06F3/0488—Interaction techniques based on graphical user interfaces [GUI] using specific features provided by the input device, e.g. functions controlled by the rotation of a mouse with dual sensing arrangements, or of the nature of the input device, e.g. tap gestures based on pressure sensed by a digitiser using a touch-screen or digitiser, e.g. input of commands through traced gestures
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/40—OLEDs integrated with touch screens
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1615—Constructional details or arrangements for portable computers with several enclosures having relative motions, each enclosure supporting at least one I/O or computing function
- G06F1/1616—Constructional details or arrangements for portable computers with several enclosures having relative motions, each enclosure supporting at least one I/O or computing function with folding flat displays, e.g. laptop computers or notebooks having a clamshell configuration, with body parts pivoting to an open position around an axis parallel to the plane they define in closed position
- G06F1/1618—Constructional details or arrangements for portable computers with several enclosures having relative motions, each enclosure supporting at least one I/O or computing function with folding flat displays, e.g. laptop computers or notebooks having a clamshell configuration, with body parts pivoting to an open position around an axis parallel to the plane they define in closed position the display being foldable up to the back of the other housing with a single degree of freedom, e.g. by 360° rotation over the axis defined by the rear edge of the base enclosure
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
- G06F1/1675—Miscellaneous details related to the relative movement between the different enclosures or enclosure parts
- G06F1/1677—Miscellaneous details related to the relative movement between the different enclosures or enclosure parts for detecting open or closed state or particular intermediate positions assumed by movable parts of the enclosure, e.g. detection of display lid position with respect to main body in a laptop, detection of opening of the cover of battery compartment
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/16—Indexing scheme relating to G06F1/16 - G06F1/18
- G06F2200/163—Indexing scheme relating to constructional details of the computer
- G06F2200/1633—Protecting arrangement for the entire housing of the computer
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04101—2.5D-digitiser, i.e. digitiser detecting the X/Y position of the input means, finger or stylus, also when it does not touch, but is proximate to the digitiser's interaction surface and also measures the distance of the input means within a short range in the Z direction, possibly with a separate measurement setup
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04102—Flexible digitiser, i.e. constructional details for allowing the whole digitising part of a device to be flexed or rolled like a sheet of paper
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04104—Multi-touch detection in digitiser, i.e. details about the simultaneous detection of a plurality of touching locations, e.g. multiple fingers or pen and finger
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04111—Cross over in capacitive digitiser, i.e. details of structures for connecting electrodes of the sensing pattern where the connections cross each other, e.g. bridge structures comprising an insulating layer, or vias through substrate
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04112—Electrode mesh in capacitive digitiser: electrode for touch sensing is formed of a mesh of very fine, normally metallic, interconnected lines that are almost invisible to see. This provides a quite large but transparent electrode surface, without need for ITO or similar transparent conductive material
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/048—Indexing scheme relating to G06F3/048
- G06F2203/04808—Several contacts: gestures triggering a specific function, e.g. scrolling, zooming, right-click, when the user establishes several contacts with the surface simultaneously; e.g. using several fingers or a combination of fingers and pen
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Human Computer Interaction (AREA)
- Computer Hardware Design (AREA)
- Computing Systems (AREA)
- Position Input By Displaying (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Push-Button Switches (AREA)
- Thin Film Transistor (AREA)
Abstract
Description
本実施の形態では、本発明の一態様のタッチパネルの構成例について説明する。以下ではタッチパネルが備えるタッチセンサとして静電容量方式のタッチセンサを適用した場合について説明する。
図1(A)は、本発明の一態様のタッチパネルモジュール10の斜視概略図である。また、図1(B)は、タッチパネルモジュール10を展開した時の斜視概略図である。タッチパネルモジュールは、タッチセンサモジュール20と、表示パネル30とが重ねて配置された構成を有する。
図2(A)は、タッチセンサ22の一部を示す上面概略図(平面概略図)である。また図2(B)は、図2(A)中の一点鎖線で囲った領域を拡大した上面概略図である。
図7乃至図9は、表示面側から見たときの画素及び画素に含まれる副画素と、導電層23の位置関係を示す概略図である。なお、ここでは導電層23を例に挙げて説明するが、導電層24及び導電層25についても、同様の構成とすることができる。
図10(A)に、タッチパネルの一部を表示面側から見たときの上面概略図を示す。図10(A)では導電層23、導電層24、導電層25、遮光層53、着色層52R、52G、52B等を示している。
以下では、タッチパネルモジュール10の断面構成例について説明する。
図12(A)に、本発明の一態様のタッチパネルモジュールの断面概略図を示す。図12(A)に示すタッチパネルモジュールは、一対の基板間にタッチセンサを構成する容量素子と、表示素子とを有するため、薄型化を図ることができる。
以下では、上記に示す各構成要素について説明する。
ここで、可撓性を有するタッチパネルを作製する方法について説明する。
図15に、図12(A)とは構成の一部の異なる断面構成例を示す。なお、以下では上記と重複する部分については説明を省略し、相違点について説明する。
本実施の形態では、本発明の一態様のタッチパネルの駆動方法の例について、図面を参照して説明する。
図16(A)は、相互容量方式のタッチセンサの構成を示すブロック図である。図16(A)では、パルス電圧出力回路601、電流検出回路602を示している。なお図16(A)では、パルス電圧が与えられる電極621、電流の変化を検知する電極622をそれぞれ、X1−X6、Y1−Y6のそれぞれ6本の配線として示している。また図16(A)は、電極621および電極622が重畳することで形成される容量603を図示している。なお、電極621と電極622とはその機能を互いに置き換えてもよい。
本実施の形態では、本発明の一態様を適用して作製できる電子機器及び照明装置について、図18及び図19を用いて説明する。
本実施例では、可撓性を有する表示パネルの対向基板(表示面側の基板)にタッチセンサを作りこむ、インセル型のタッチパネルを作製した。さらに、タッチセンサの電極をメタルメッシュ形状にすることで、タッチセンサと表示パネルとの負荷容量を低減する構成とした。このような構成により、使用者によって自由に折り畳みが可能な程度に、タッチパネル全体の厚さを薄くすることができる。また、負荷容量が小さいことで表示パネルからタッチセンサへのノイズの影響が抑制され、誤検出や検出不可といった不具合が生じることを抑制することができる。
図21(A)乃至(C)に作製したタッチパネルの写真を示す。図21(A)は表示パネルを広げた状態、図21(B)は3つに折り畳んだ状態、図21(C)は、途中の状態でタッチ操作を行っている様子をそれぞれ示している。タッチパネルの表面が平面である部分、凸状である部分、及び凹状である部分のそれぞれで、正常に検出できることを確認した。
続いて、作製したタッチパネルの受信電極と、表示パネルとの間の寄生容量と寄生抵抗を、周波数ごとに測定した。測定は、LCRメータ(アジレント・テクノロジー株式会社製、4275A)を用いて行った。
続いて、作製したタッチパネルに対し、曲げ試験を行った結果について説明する。曲げ試験は、曲率半径5mmと、3mmの2条件について、それぞれ2秒間に1回の曲げ伸ばし動作を10万回行った。また曲げ伸ばし動作は、表示面が内側となる曲げと、表示面が外側になる曲げの2通りについて行った。10万回の曲げ伸ばし動作後でも、正常な表示と、正常なタッチ検出ができることを確認した。
11 容量素子
20 タッチセンサモジュール
21 基板
22 タッチセンサ
22a 開口
23 導電層
23a 開口
24 導電層
24a 開口
25 導電層
26 導電層
27 開口
28 絶縁層
29 配線
30 表示パネル
31 基板
32 表示部
33 画素
33B 副画素
33G 副画素
33R 副画素
33Y 副画素
34 回路
41 FPC
42 FPC
51 表示素子
52 着色層
52B 着色層
52G 着色層
52R 着色層
53 遮光層
201 トランジスタ
202 トランジスタ
203 トランジスタ
204 発光素子
205 コンタクト部
206 交差部
210 接続層
211 接着層
212 絶縁層
213 絶縁層
214 絶縁層
215 絶縁層
216 絶縁層
217 絶縁層
218 絶縁層
219 スペーサ
220 接着層
221 電極
222 EL層
223 電極
224 光学調整層
225 導電層
226 スペーサ
253 コンタクト部
260 接続層
261 接着層
262 絶縁層
264 絶縁層
266 絶縁層
267 オーバーコート
272 接続部
310 携帯情報端末
313 ヒンジ
315 筐体
316 表示パネル
320 携帯情報端末
322 表示部
325 非表示部
330 携帯情報端末
333 表示部
335 筐体
336 筐体
337 情報
339 操作ボタン
340 携帯情報端末
345 携帯情報端末
354 筐体
355 情報
356 情報
357 情報
358 表示部
601 パルス電圧出力回路
602 電流検出回路
603 容量
611 トランジスタ
612 トランジスタ
613 トランジスタ
621 電極
622 電極
7100 携帯情報端末
7101 筐体
7102 表示部
7103 バンド
7104 バックル
7105 操作ボタン
7106 入出力端子
7107 アイコン
7200 照明装置
7201 台部
7202 発光部
7203 操作スイッチ
7210 照明装置
7212 発光部
7220 照明装置
7222 発光部
7300 タッチパネル
7301 筐体
7302 表示部
7303 操作ボタン
7304 部材
7305 制御部
7400 携帯電話機
7401 筐体
7402 表示部
7403 操作ボタン
7404 外部接続ポート
7405 スピーカ
7406 マイク
Claims (11)
- 第1の基板と、第2の基板と、第1の導電層と、第2の導電層と、第1の発光素子と、第2の発光素子と、遮光層と、を有するタッチパネルであって、
前記第1の導電層は、第1の開口を有し、
前記第2の導電層は、第2の開口を有し、
前記第1の導電層と、前記第2の導電層とは、容量を形成し、
前記第1の開口と、前記第1の発光素子とは、互いに重なる領域を有し、
前記第2の開口と、前記第2の発光素子とは、互いに重なる領域を有し、
前記第1の導電層と、前記遮光層とは、互いに重なる領域を有し、
前記第2の導電層と、前記遮光層とは、互いに重なる領域を有し、
前記第1の発光素子及び前記第2の発光素子は、前記第1の基板と前記第2の基板の間に位置する領域を有し、
前記第1の導電層及び前記第2の導電層は、前記第1の発光素子または前記第2の発光素子と前記第2の基板との間に位置する領域を有し、
前記遮光層は、前記第1の導電層または前記第2の導電層と前記第2の基板との間に位置する領域を有する、
タッチパネル。 - 請求項1において、
前記第1の導電層、または前記第2の導電層は、CR値が0sec.より大きく1×10−4sec.以下である、
タッチパネル。 - 請求項1または請求項2において、
前記第1の導電層、または前記第2の導電層は、開口率が20%以上100%未満である領域を有する、
タッチパネル。 - 請求項1乃至請求項3のいずれか一において、
第3の導電層を有し、
前記第3の導電層は、前記第1の導電層または前記第2の導電層よりも第1の基板側に位置し、
前記第1の導電層と前記第3の導電層との距離、または前記第2の導電層と前記第3の導電層との距離が、25nm以上、50μm以下である領域を有する、
タッチパネル。 - 請求項1乃至請求項4のいずれか一において、
第3の発光素子を有し、
前記第3の発光素子は、前記第1の基板と前記第2の基板との間に位置する領域を有し、
前記第3の発光素子と、前記第1の開口とは、互いに重なる領域を有する、
タッチパネル。 - 請求項1乃至請求項5のいずれか一において、
第4の発光素子を有し、
前記第4の発光素子は、前記第1の基板と前記第2の基板との間に位置する領域を有し、
前記第4の発光素子と、前記第2の開口とは、互いに重なる領域を有する、
タッチパネル。 - 請求項1乃至請求項6のいずれか一において、
絶縁層を有し、
前記第1の導電層と、前記第2の導電層とは、互いに重なる領域を有し、
前記絶縁層は、前記第1の導電層と前記第2の導電層の間に位置する領域を有する、
タッチパネル。 - 請求項1乃至請求項6のいずれか一において、
第4の導電層、第5の導電層、及び絶縁層を有し、
前記第4の導電層と、前記遮光層とは、互いに重なる領域を有し、
前記第5の導電層と、前記遮光層とは、互いに重なる領域を有し、
前記第5の導電層と、前記第2の導電層とは、互いに重なる領域を有し、
前記絶縁層は、前記第1の導電層と前記第5の導電層との間に位置する領域を有し、
前記絶縁層は、前記第2の導電層と前記第5の導電層との間に位置する領域を有し、
前記絶縁層は、前記第4の導電層と前記第5の導電層との間に位置する領域を有し、
前記絶縁層は、第3の開口と、第4の開口と、を有し、
前記第1の導電層と、前記第5の導電層とは、前記第3の開口を介して電気的に接続し、
前記第4の導電層と、前記第5の導電層とは、前記第4の開口を介して電気的に接続する、
タッチパネル。 - 請求項8において、
第5の発光素子を有し、
前記第4の導電層は、第5の開口を有し、
前記第5の発光素子は、前記第1の基板と前記第2の基板との間に位置する領域を有し、
前記第5の開口と、前記第5の発光素子とは、互いに重なる領域を有する、
タッチパネル。 - 請求項1乃至請求項9のいずれか一に記載のタッチパネルと、
FPCまたはTCPと、
を有するモジュール。 - 請求項1乃至請求項9のいずれか一に記載のタッチパネル、または請求項10に記載のモジュールと、
電池、アンテナ、筐体、操作ボタン、外部接続ポート、スピーカ、またはマイクと、
を有する電子機器。
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014112316 | 2014-05-30 | ||
JP2014112316 | 2014-05-30 | ||
JP2014128409 | 2014-06-23 | ||
JP2014128409 | 2014-06-23 | ||
JP2014242912 | 2014-12-01 | ||
JP2014242912 | 2014-12-01 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2020020601A Division JP2020074239A (ja) | 2014-05-30 | 2020-02-10 | タッチパネル、モジュールおよび電子機器 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2016110613A true JP2016110613A (ja) | 2016-06-20 |
JP2016110613A5 JP2016110613A5 (ja) | 2018-07-05 |
Family
ID=54481743
Family Applications (4)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015107033A Withdrawn JP2016110613A (ja) | 2014-05-30 | 2015-05-27 | タッチパネル |
JP2020020601A Withdrawn JP2020074239A (ja) | 2014-05-30 | 2020-02-10 | タッチパネル、モジュールおよび電子機器 |
JP2021189939A Withdrawn JP2022020836A (ja) | 2014-05-30 | 2021-11-24 | タッチパネル、モジュールおよび電子機器 |
JP2023148331A Withdrawn JP2023171383A (ja) | 2014-05-30 | 2023-09-13 | 発光装置 |
Family Applications After (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2020020601A Withdrawn JP2020074239A (ja) | 2014-05-30 | 2020-02-10 | タッチパネル、モジュールおよび電子機器 |
JP2021189939A Withdrawn JP2022020836A (ja) | 2014-05-30 | 2021-11-24 | タッチパネル、モジュールおよび電子機器 |
JP2023148331A Withdrawn JP2023171383A (ja) | 2014-05-30 | 2023-09-13 | 発光装置 |
Country Status (6)
Country | Link |
---|---|
US (3) | US20150346866A1 (ja) |
JP (4) | JP2016110613A (ja) |
KR (3) | KR102404630B1 (ja) |
CN (2) | CN111443833B (ja) |
DE (1) | DE102015210047A1 (ja) |
TW (3) | TWI726843B (ja) |
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016062203A (ja) * | 2014-09-17 | 2016-04-25 | 三菱電機株式会社 | タッチスクリーン、タッチパネル、表示装置および電子機器 |
JP2018022322A (ja) * | 2016-08-03 | 2018-02-08 | 株式会社ジャパンディスプレイ | 表示装置 |
WO2018034244A1 (ja) * | 2016-08-18 | 2018-02-22 | シャープ株式会社 | 有機el表示装置 |
CN108242456A (zh) * | 2016-12-26 | 2018-07-03 | 乐金显示有限公司 | 具有集成式触摸屏的显示装置 |
JP2018109962A (ja) * | 2016-12-28 | 2018-07-12 | エルジー ディスプレイ カンパニー リミテッド | 表示装置 |
JP2018115871A (ja) * | 2017-01-16 | 2018-07-26 | 株式会社東海理化電機製作所 | タッチ検出装置及びタッチ検出方法 |
JP2018194571A (ja) * | 2017-05-12 | 2018-12-06 | 株式会社ジャパンディスプレイ | 表示装置 |
JP2018206390A (ja) * | 2017-06-01 | 2018-12-27 | エルジー ディスプレイ カンパニー リミテッド | タッチ表示装置及びタッチパネル |
KR20200029093A (ko) * | 2018-09-07 | 2020-03-18 | 삼성디스플레이 주식회사 | 전자 장치 |
JP2020068074A (ja) * | 2018-10-23 | 2020-04-30 | 株式会社ジャパンディスプレイ | 表示装置 |
JP2020091418A (ja) * | 2018-12-06 | 2020-06-11 | シャープ株式会社 | 表示装置および電子機器 |
JP2020537199A (ja) * | 2017-09-21 | 2020-12-17 | 京東方科技集團股▲ふん▼有限公司Boe Technology Group Co.,Ltd. | タッチパネル及びその作製方法、タッチ表示パネル |
WO2023120620A1 (ja) * | 2021-12-24 | 2023-06-29 | 株式会社レゾナック | タッチパネル及びタッチパネルの製造方法 |
WO2024116834A1 (ja) * | 2022-11-30 | 2024-06-06 | Toppanホールディングス株式会社 | 光学装置 |
Families Citing this family (66)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD353539S (en) * | 1990-07-20 | 1994-12-20 | Norden Pac Development Ab | Combined tube and cap |
US9259904B2 (en) | 2011-10-20 | 2016-02-16 | Apple Inc. | Opaque thin film passivation |
KR101944503B1 (ko) * | 2012-06-21 | 2019-04-18 | 삼성디스플레이 주식회사 | 센서 기판 및 이를 포함하는 센싱 표시 패널 |
JP6231432B2 (ja) * | 2014-05-02 | 2017-11-15 | 富士フイルム株式会社 | 導電性フイルム、それを備える表示装置及び導電性フイルムの評価方法 |
US9933903B2 (en) | 2014-10-02 | 2018-04-03 | Semiconductor Energy Laboratory Co., Ltd. | Input device and input/output device |
KR102254582B1 (ko) * | 2014-10-02 | 2021-05-24 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 및 그 제조 방법 |
KR102256461B1 (ko) * | 2014-10-10 | 2021-05-26 | 삼성디스플레이 주식회사 | 터치 센서 및 이를 포함하는 표시 장치 |
KR102439023B1 (ko) * | 2014-10-28 | 2022-08-31 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 표시 장치, 표시 장치의 제작 방법, 및 전자 기기 |
KR20160114510A (ko) * | 2015-03-24 | 2016-10-05 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 터치 패널 |
DE102016206922A1 (de) | 2015-05-08 | 2016-11-10 | Semiconductor Energy Laboratory Co., Ltd. | Touchscreen |
US10684500B2 (en) | 2015-05-27 | 2020-06-16 | Semiconductor Energy Laboratory Co., Ltd. | Touch panel |
US10168844B2 (en) * | 2015-06-26 | 2019-01-01 | Samsung Display Co., Ltd. | Flexible display device |
CN106339116B (zh) * | 2015-07-11 | 2023-07-14 | 宸新科技(厦门)有限公司 | 触控面板及其制作方法 |
US10691248B2 (en) | 2015-09-08 | 2020-06-23 | Lg Display Co., Ltd. | Driving circuit, touch display device, and method for driving the touch display device |
EP3141988B1 (en) * | 2015-09-08 | 2022-07-20 | LG Display Co., Ltd. | In-cell touch type display device |
KR102361247B1 (ko) | 2015-09-08 | 2022-02-11 | 엘지디스플레이 주식회사 | 인-셀 터치 타입 디스플레이 장치, 터치회로, 디스플레이 드라이버 및 인-셀 터치 타입 디스플레이 장치 구동방법 |
KR102543916B1 (ko) * | 2015-09-21 | 2023-06-16 | 삼성디스플레이 주식회사 | 플렉서블 전자 장치 |
KR102492215B1 (ko) * | 2015-11-27 | 2023-01-27 | 삼성디스플레이 주식회사 | 터치 센서 및 그 제작 방법 |
KR102415044B1 (ko) * | 2015-12-11 | 2022-07-01 | 삼성디스플레이 주식회사 | 터치 스크린 패널, 이의 제조 방법 및 터치 스크린 패널을 포함하는 터치 표시 장치 |
JP6311734B2 (ja) * | 2016-02-26 | 2018-04-18 | Smk株式会社 | タッチパネルセンサ及びタッチパネル |
CN105808002A (zh) * | 2016-03-11 | 2016-07-27 | 上海万寅安全环保科技有限公司 | 一种穿戴式载板 |
KR102458892B1 (ko) * | 2016-04-27 | 2022-10-26 | 삼성디스플레이 주식회사 | 플렉서블 표시장치 및 그의 제조방법 |
KR101866632B1 (ko) * | 2016-04-29 | 2018-06-11 | 동우 화인켐 주식회사 | 터치센서 일체형 컬러 필터 및 그 제조 방법 |
JP6664278B2 (ja) * | 2016-05-31 | 2020-03-13 | 株式会社ジャパンディスプレイ | 表示装置 |
KR102544532B1 (ko) | 2016-05-31 | 2023-06-20 | 삼성디스플레이 주식회사 | 표시 장치 |
CN106098735B (zh) * | 2016-06-20 | 2020-10-09 | 武汉华星光电技术有限公司 | Oled显示屏 |
KR101913395B1 (ko) * | 2016-07-29 | 2018-10-31 | 삼성디스플레이 주식회사 | 표시장치 |
TWI605369B (zh) * | 2016-08-31 | 2017-11-11 | 晨星半導體股份有限公司 | 互容式壓力感測器以及具有壓力感測功能之觸控顯示裝置與其壓力感測方法 |
CN114527893B (zh) | 2016-09-23 | 2023-11-10 | 苹果公司 | 具有顶部屏蔽和/或底部屏蔽的触摸传感器面板 |
JP2018054874A (ja) * | 2016-09-29 | 2018-04-05 | 株式会社ジャパンディスプレイ | 表示装置 |
CN111983850B (zh) * | 2016-11-02 | 2023-11-07 | 群创光电股份有限公司 | 显示装置 |
KR20180054232A (ko) * | 2016-11-15 | 2018-05-24 | 동우 화인켐 주식회사 | 터치 센서 및 이의 제조 방법 |
US10825839B2 (en) * | 2016-12-02 | 2020-11-03 | Innolux Corporation | Touch display device |
KR20180079055A (ko) | 2016-12-30 | 2018-07-10 | 엘지디스플레이 주식회사 | 스트레처블 터치 스크린, 이의 제조 방법 및 이를 이용한 표시 장치 |
KR101816134B1 (ko) * | 2017-03-31 | 2018-01-08 | 동우 화인켐 주식회사 | 터치 센서가 일체화된 플렉서블 컬러 필터와 이를 포함하는 유기발광표시장치 및 그 제조방법 |
JP2018180087A (ja) * | 2017-04-05 | 2018-11-15 | 株式会社ジャパンディスプレイ | 表示装置 |
US11166503B2 (en) * | 2017-04-17 | 2021-11-09 | Interactive Skin, Inc. | Interactive skin for wearable |
US20180331170A1 (en) * | 2017-05-10 | 2018-11-15 | Wuhan China Star Optoelectronics Technology Co., L td. | Connection component, connector, manufacturing method for the same and panel component |
JP2020522730A (ja) * | 2017-05-19 | 2020-07-30 | イー インク コーポレイション | デジタル化およびタッチ感知を含む折畳可能電気光学ディスプレイ |
CN107291294B (zh) * | 2017-06-21 | 2021-01-29 | 滁州学院 | 一种触控屏灵敏度的控制方法及移动终端 |
CN107515697B (zh) * | 2017-08-31 | 2022-01-07 | 京东方科技集团股份有限公司 | 金属网格、触控显示装置以及改善触控显示装置摩尔纹的方法 |
CN107634085B (zh) * | 2017-09-15 | 2020-11-17 | 业成科技(成都)有限公司 | 触控显示装置及其制造方法 |
USD893475S1 (en) * | 2017-10-11 | 2020-08-18 | Samsung Display Co., Ltd. | Display device |
USD885381S1 (en) * | 2017-10-11 | 2020-05-26 | Samsung Display Co., Ltd. | Display device |
JP2019091346A (ja) * | 2017-11-16 | 2019-06-13 | 株式会社ジャパンディスプレイ | 表示装置 |
KR102411682B1 (ko) * | 2017-11-16 | 2022-06-21 | 엘지디스플레이 주식회사 | 터치표시장치 및 패널 |
US11423855B2 (en) * | 2017-12-22 | 2022-08-23 | Semiconductor Energy Laboratory Co., Ltd. | Display panel, display device, input/output device, and data processing device |
CN108595055B (zh) * | 2018-05-10 | 2020-05-05 | 京东方科技集团股份有限公司 | 三维力识别传感器、其驱动方法及显示装置 |
US20190348473A1 (en) * | 2018-05-14 | 2019-11-14 | Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Flexible substrate, manufacturing method thereof and touch display panel |
US12033987B2 (en) * | 2018-09-07 | 2024-07-09 | Semiconductor Energy Laboratory Co., Ltd. | Display device, display module, and electronic device |
US11054948B2 (en) * | 2018-10-05 | 2021-07-06 | Apple Inc. | Light transmissivity-controlled touch sensor panel design |
CN109614017B (zh) * | 2018-11-27 | 2021-07-06 | 武汉华星光电半导体显示技术有限公司 | 触控面板及显示装置 |
KR20200082971A (ko) * | 2018-12-31 | 2020-07-08 | 엘지디스플레이 주식회사 | 폴더블 표시 장치 |
WO2020212800A1 (ja) | 2019-04-18 | 2020-10-22 | 株式会社半導体エネルギー研究所 | 半導体リレー、および半導体装置 |
KR20200145975A (ko) | 2019-06-21 | 2020-12-31 | 삼성디스플레이 주식회사 | 폴더블 표시 장치와 그의 음향 제공 방법 |
KR20210011560A (ko) * | 2019-07-22 | 2021-02-02 | 삼성디스플레이 주식회사 | 디스플레이 장치 |
KR20210045576A (ko) * | 2019-10-16 | 2021-04-27 | 삼성디스플레이 주식회사 | 터치 센서 및 이를 구비한 표시 장치 |
US12075668B2 (en) * | 2020-02-25 | 2024-08-27 | Chengdu Boe Optoelectronics Technology Co., Ltd. | Display substrate and display device |
CN111665993B (zh) * | 2020-06-17 | 2021-09-03 | 武汉华星光电半导体显示技术有限公司 | 显示模组及显示装置 |
CN111951697B (zh) | 2020-08-10 | 2022-02-01 | Tcl华星光电技术有限公司 | 拼接显示屏 |
CN114442829A (zh) * | 2020-10-30 | 2022-05-06 | 群创光电股份有限公司 | 触控面板及其触控面板操作方法 |
CN112968046B (zh) * | 2021-02-09 | 2022-11-29 | 湖北长江新型显示产业创新中心有限公司 | 一种显示面板和显示装置 |
TWI808413B (zh) * | 2021-04-29 | 2023-07-11 | 位元奈米科技股份有限公司 | 可用於熱壓成型之透明導電基板結構 |
KR20220162234A (ko) | 2021-05-31 | 2022-12-08 | 삼성디스플레이 주식회사 | 표시 장치용 지지 부재, 이를 포함하는 표시 장치 및 표시 장치용 지지 부재의 제조 방법 |
KR20220168215A (ko) * | 2021-06-15 | 2022-12-23 | 삼성디스플레이 주식회사 | 표시 패널 및 전자 기기 |
KR20230135213A (ko) * | 2022-03-15 | 2023-09-25 | 삼성디스플레이 주식회사 | 전자 장치 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010002958A (ja) * | 2008-06-18 | 2010-01-07 | Epson Imaging Devices Corp | 静電容量型入力装置および入力機能付き表示装置 |
JP2012083959A (ja) * | 2010-10-12 | 2012-04-26 | Toshiba Mobile Display Co Ltd | タッチパネル及び画像表示装置 |
JP2012181822A (ja) * | 2010-12-22 | 2012-09-20 | Apple Inc | 一体型タッチスクリーン |
WO2013141056A1 (ja) * | 2012-03-22 | 2013-09-26 | シャープ株式会社 | カラーフィルター一体型タッチパネル |
US20130341651A1 (en) * | 2012-06-21 | 2013-12-26 | Samsung Display Co., Ltd. | Sensor substrate and sensing display panel having the same |
JP2014063159A (ja) * | 2012-09-03 | 2014-04-10 | Semiconductor Energy Lab Co Ltd | 表示装置、電子機器 |
Family Cites Families (93)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW468283B (en) | 1999-10-12 | 2001-12-11 | Semiconductor Energy Lab | EL display device and a method of manufacturing the same |
TW471011B (en) | 1999-10-13 | 2002-01-01 | Semiconductor Energy Lab | Thin film forming apparatus |
JP3471692B2 (ja) * | 2000-01-21 | 2003-12-02 | Nec液晶テクノロジー株式会社 | カラー液晶表示パネル |
TW495808B (en) | 2000-02-04 | 2002-07-21 | Semiconductor Energy Lab | Thin film formation apparatus and method of manufacturing self-light-emitting device using thin film formation apparatus |
US6509616B2 (en) | 2000-09-29 | 2003-01-21 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and its manufacturing method |
JP4974427B2 (ja) * | 2000-09-29 | 2012-07-11 | 株式会社半導体エネルギー研究所 | 半導体装置及び電子装置 |
US6720198B2 (en) | 2001-02-19 | 2004-04-13 | Semiconductor Energy Laboratory Co., Ltd. | Light emitting device and manufacturing method thereof |
SG102681A1 (en) | 2001-02-19 | 2004-03-26 | Semiconductor Energy Lab | Light emitting device and method of manufacturing the same |
US6992439B2 (en) | 2001-02-22 | 2006-01-31 | Semiconductor Energy Laboratory Co., Ltd. | Display device with sealing structure for protecting organic light emitting element |
US7301279B2 (en) | 2001-03-19 | 2007-11-27 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting apparatus and method of manufacturing the same |
JP4801278B2 (ja) | 2001-04-23 | 2011-10-26 | 株式会社半導体エネルギー研究所 | 発光装置及びその作製方法 |
TW564471B (en) | 2001-07-16 | 2003-12-01 | Semiconductor Energy Lab | Semiconductor device and peeling off method and method of manufacturing semiconductor device |
JP4027740B2 (ja) | 2001-07-16 | 2007-12-26 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
CN101673508B (zh) | 2002-01-18 | 2013-01-09 | 株式会社半导体能源研究所 | 发光器件 |
SG143063A1 (en) | 2002-01-24 | 2008-06-27 | Semiconductor Energy Lab | Light emitting device and method of manufacturing the same |
TWI258317B (en) | 2002-01-25 | 2006-07-11 | Semiconductor Energy Lab | A display device and method for manufacturing thereof |
EP1343206B1 (en) | 2002-03-07 | 2016-10-26 | Semiconductor Energy Laboratory Co., Ltd. | Light emitting apparatus, electronic apparatus, illuminating device and method of fabricating the light emitting apparatus |
US7309269B2 (en) | 2002-04-15 | 2007-12-18 | Semiconductor Energy Laboratory Co., Ltd. | Method of fabricating light-emitting device and apparatus for manufacturing light-emitting device |
US7579771B2 (en) | 2002-04-23 | 2009-08-25 | Semiconductor Energy Laboratory Co., Ltd. | Light emitting device and method of manufacturing the same |
US7786496B2 (en) | 2002-04-24 | 2010-08-31 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method of manufacturing same |
JP2003317971A (ja) | 2002-04-26 | 2003-11-07 | Semiconductor Energy Lab Co Ltd | 発光装置およびその作製方法 |
JP4216008B2 (ja) | 2002-06-27 | 2009-01-28 | 株式会社半導体エネルギー研究所 | 発光装置およびその作製方法、ならびに前記発光装置を有するビデオカメラ、デジタルカメラ、ゴーグル型ディスプレイ、カーナビゲーション、パーソナルコンピュータ、dvdプレーヤー、電子遊技機器、または携帯情報端末 |
JP4823478B2 (ja) | 2003-09-19 | 2011-11-24 | 株式会社半導体エネルギー研究所 | 発光装置の作製方法 |
US7520790B2 (en) | 2003-09-19 | 2009-04-21 | Semiconductor Energy Laboratory Co., Ltd. | Display device and manufacturing method of display device |
US7314785B2 (en) | 2003-10-24 | 2008-01-01 | Semiconductor Energy Laboratory Co., Ltd. | Display device and manufacturing method thereof |
US7495257B2 (en) | 2003-12-26 | 2009-02-24 | Semiconductor Energy Laboratory Co., Ltd. | Light emitting device |
US7825021B2 (en) | 2004-01-16 | 2010-11-02 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing display device |
US7274044B2 (en) | 2004-01-26 | 2007-09-25 | Semiconductor Energy Laboratory Co., Ltd. | Light emitting device |
US7342256B2 (en) | 2004-07-16 | 2008-03-11 | Semiconductor Energy Laboratory Co., Ltd. | Display device mounted with read function and electric appliance |
US7755278B2 (en) | 2004-08-25 | 2010-07-13 | Semiconductor Energy Laboratory Co., Ltd. | Light emitting element provided with organic conductive and inorganic hole transport layers between an electrode and organic emissive layer |
US8772783B2 (en) | 2004-10-14 | 2014-07-08 | Semiconductor Energy Laboratory Co., Ltd. | Display device |
US7683532B2 (en) | 2004-11-02 | 2010-03-23 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and light emitting device |
JP4849876B2 (ja) * | 2004-11-24 | 2012-01-11 | 株式会社半導体エネルギー研究所 | 表示装置 |
US7570233B2 (en) * | 2004-11-24 | 2009-08-04 | Semiconductor Energy Laboratory Co., Ltd. | Display device |
US7838347B2 (en) | 2005-08-12 | 2010-11-23 | Semiconductor Energy Laboratory Co., Ltd. | Display device and manufacturing method of display device |
TWI460851B (zh) | 2005-10-17 | 2014-11-11 | Semiconductor Energy Lab | 半導體裝置及其製造方法 |
US20070287209A1 (en) | 2006-04-28 | 2007-12-13 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing light-emitting device |
KR101478045B1 (ko) * | 2007-11-26 | 2014-12-31 | 삼성디스플레이 주식회사 | 터치 스크린 |
JP4945483B2 (ja) | 2008-02-27 | 2012-06-06 | 株式会社 日立ディスプレイズ | 表示パネル |
TWI412980B (zh) * | 2008-03-14 | 2013-10-21 | Innolux Corp | 影像顯示系統 |
US20100045630A1 (en) * | 2008-08-19 | 2010-02-25 | Qualcomm Incorporated | Capacitive MEMS-Based Display with Touch Position Sensing |
US8866840B2 (en) | 2008-09-08 | 2014-10-21 | Qualcomm Incorporated | Sending a parameter based on screen size or screen resolution of a multi-panel electronic device to a server |
US9009984B2 (en) | 2008-09-08 | 2015-04-21 | Qualcomm Incorporated | Multi-panel electronic device |
US8933874B2 (en) | 2008-09-08 | 2015-01-13 | Patrik N. Lundqvist | Multi-panel electronic device |
US8863038B2 (en) | 2008-09-08 | 2014-10-14 | Qualcomm Incorporated | Multi-panel electronic device |
US8947320B2 (en) | 2008-09-08 | 2015-02-03 | Qualcomm Incorporated | Method for indicating location and direction of a graphical user interface element |
US8836611B2 (en) | 2008-09-08 | 2014-09-16 | Qualcomm Incorporated | Multi-panel device with configurable interface |
US8803816B2 (en) * | 2008-09-08 | 2014-08-12 | Qualcomm Incorporated | Multi-fold mobile device with configurable interface |
US8860765B2 (en) | 2008-09-08 | 2014-10-14 | Qualcomm Incorporated | Mobile device with an inclinometer |
US8860632B2 (en) | 2008-09-08 | 2014-10-14 | Qualcomm Incorporated | Multi-panel device with configurable interface |
TWI552123B (zh) * | 2009-01-28 | 2016-10-01 | 半導體能源研究所股份有限公司 | 顯示裝置 |
JP5545970B2 (ja) | 2009-03-26 | 2014-07-09 | 株式会社半導体エネルギー研究所 | 発光装置及びその作製方法 |
KR101800285B1 (ko) * | 2010-10-04 | 2017-12-21 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 및 그 제조 방법 |
DE112011104636B4 (de) | 2010-12-28 | 2023-12-28 | Semiconductor Energy Laboratory Co., Ltd. | Licht abstrahlende Baugruppe, Licht abstrahlende Vorrichtung, Beleuchtungsvorrichtung und Verfahren zum Herstellen einer Licht abstrahlenden Baugruppe |
KR101685019B1 (ko) * | 2011-01-04 | 2016-12-12 | 삼성디스플레이 주식회사 | 유기발광표시장치 |
JP5925511B2 (ja) | 2011-02-11 | 2016-05-25 | 株式会社半導体エネルギー研究所 | 発光ユニット、発光装置、照明装置 |
TWI562423B (en) | 2011-03-02 | 2016-12-11 | Semiconductor Energy Lab Co Ltd | Light-emitting device and lighting device |
KR101839615B1 (ko) * | 2011-04-14 | 2018-03-19 | 삼성전자주식회사 | 연성 표시부를 구비한 휴대용 통신 장치 |
KR101920374B1 (ko) | 2011-04-27 | 2018-11-20 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 발광 장치 및 그 제작 방법 |
JP2012238066A (ja) | 2011-05-10 | 2012-12-06 | Japan Display East Co Ltd | 静電容量方式のタッチパネル、および表示装置 |
KR102040242B1 (ko) | 2011-05-12 | 2019-11-05 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 발광 장치 및 발광 장치를 이용한 전자 기기 |
JP6205598B2 (ja) * | 2011-07-25 | 2017-10-04 | 株式会社Joled | 表示装置 |
US9292143B2 (en) * | 2011-07-29 | 2016-03-22 | Sharp Kabushiki Kaisha | Touch panel substrate and electro-optical device |
TWI479398B (zh) | 2011-09-30 | 2015-04-01 | Hannstar Display Corp | 觸控顯示裝置及其形成方法 |
US8666456B2 (en) * | 2011-10-12 | 2014-03-04 | Htc Corporation | Handheld electronic apparatus |
TWI456321B (zh) * | 2011-12-08 | 2014-10-11 | Au Optronics Corp | 觸控顯示面板 |
US9100021B2 (en) * | 2012-01-19 | 2015-08-04 | Texas Instruments Incorporated | Linear capacitively coupled touch sensor and method |
WO2013114945A1 (ja) * | 2012-01-31 | 2013-08-08 | 東レフィルム加工株式会社 | 透明導電性フィルム、タッチパネルおよび表示装置 |
WO2013145958A1 (ja) * | 2012-03-26 | 2013-10-03 | シャープ株式会社 | タッチパネル基板、表示パネル、および表示装置 |
KR101373044B1 (ko) * | 2012-04-19 | 2014-03-11 | 삼성디스플레이 주식회사 | 터치 스크린 패널 |
US8994891B2 (en) * | 2012-05-16 | 2015-03-31 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and touch panel |
US9916793B2 (en) | 2012-06-01 | 2018-03-13 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method of driving the same |
JP6065909B2 (ja) | 2012-07-11 | 2017-01-25 | コニカミノルタ株式会社 | タッチパネル用透明電極、タッチパネル、および表示装置 |
KR102173801B1 (ko) * | 2012-07-12 | 2020-11-04 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 표시 장치, 및 표시 장치의 제작 방법 |
JP6302186B2 (ja) | 2012-08-01 | 2018-03-28 | 株式会社半導体エネルギー研究所 | 表示装置 |
US8981372B2 (en) * | 2012-09-13 | 2015-03-17 | Semiconductor Energy Laboratory Co., Ltd. | Display device and electronic appliance |
CN102955635B (zh) * | 2012-10-15 | 2015-11-11 | 北京京东方光电科技有限公司 | 一种电容式内嵌触摸屏及显示装置 |
JP6204012B2 (ja) | 2012-10-17 | 2017-09-27 | 株式会社半導体エネルギー研究所 | 発光装置 |
JP6076683B2 (ja) | 2012-10-17 | 2017-02-08 | 株式会社半導体エネルギー研究所 | 発光装置 |
JP5871774B2 (ja) * | 2012-10-31 | 2016-03-01 | 富士フイルム株式会社 | 静電容量式タッチパネルおよびその製造方法、入力デバイス |
TWI820614B (zh) * | 2012-11-28 | 2023-11-01 | 日商半導體能源研究所股份有限公司 | 顯示裝置 |
JP6007088B2 (ja) | 2012-12-05 | 2016-10-12 | Kddi株式会社 | 大量のコメント文章を用いた質問回答プログラム、サーバ及び方法 |
JP6124584B2 (ja) | 2012-12-21 | 2017-05-10 | 株式会社半導体エネルギー研究所 | 発光装置及びその製造方法 |
JP5983399B2 (ja) | 2012-12-28 | 2016-08-31 | ブラザー工業株式会社 | 情報処理装置、情報処理方法及びプログラム |
JP6104649B2 (ja) | 2013-03-08 | 2017-03-29 | 株式会社半導体エネルギー研究所 | 発光装置 |
JP6174877B2 (ja) | 2013-03-21 | 2017-08-02 | 株式会社半導体エネルギー研究所 | 表示装置及び電子機器 |
US9246133B2 (en) | 2013-04-12 | 2016-01-26 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting module, light-emitting panel, and light-emitting device |
KR102250061B1 (ko) | 2013-04-15 | 2021-05-07 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 발광 장치 |
KR102076690B1 (ko) * | 2013-04-19 | 2020-02-13 | 삼성디스플레이 주식회사 | 표시 장치 |
KR102096622B1 (ko) * | 2013-08-19 | 2020-04-03 | 삼성디스플레이 주식회사 | 유기발광 표시장치 |
KR20240149986A (ko) | 2013-08-30 | 2024-10-15 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 표시 장치 |
TWM470315U (zh) | 2013-09-05 | 2014-01-11 | Wintek Corp | 觸控面板 |
JP6596224B2 (ja) | 2014-05-02 | 2019-10-23 | 株式会社半導体エネルギー研究所 | 発光装置及び入出力装置 |
-
2015
- 2015-05-15 TW TW104115620A patent/TWI726843B/zh active
- 2015-05-15 TW TW110115199A patent/TWI765679B/zh not_active IP Right Cessation
- 2015-05-15 TW TW111116711A patent/TWI790965B/zh active
- 2015-05-21 KR KR1020150071239A patent/KR102404630B1/ko active IP Right Grant
- 2015-05-27 JP JP2015107033A patent/JP2016110613A/ja not_active Withdrawn
- 2015-05-29 CN CN202010241196.9A patent/CN111443833B/zh active Active
- 2015-05-29 US US14/725,205 patent/US20150346866A1/en not_active Abandoned
- 2015-05-29 CN CN201510283845.0A patent/CN105138195B/zh active Active
- 2015-06-01 DE DE102015210047.2A patent/DE102015210047A1/de active Pending
-
2020
- 2020-02-10 JP JP2020020601A patent/JP2020074239A/ja not_active Withdrawn
- 2020-05-04 KR KR1020200053302A patent/KR102393086B1/ko active IP Right Grant
- 2020-05-27 US US16/884,154 patent/US11644869B2/en active Active
-
2021
- 2021-11-24 JP JP2021189939A patent/JP2022020836A/ja not_active Withdrawn
-
2022
- 2022-04-27 KR KR1020220051940A patent/KR20220058514A/ko not_active Application Discontinuation
-
2023
- 2023-04-19 US US18/136,384 patent/US20230376076A1/en active Pending
- 2023-09-13 JP JP2023148331A patent/JP2023171383A/ja not_active Withdrawn
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010002958A (ja) * | 2008-06-18 | 2010-01-07 | Epson Imaging Devices Corp | 静電容量型入力装置および入力機能付き表示装置 |
JP2012083959A (ja) * | 2010-10-12 | 2012-04-26 | Toshiba Mobile Display Co Ltd | タッチパネル及び画像表示装置 |
JP2012181822A (ja) * | 2010-12-22 | 2012-09-20 | Apple Inc | 一体型タッチスクリーン |
WO2013141056A1 (ja) * | 2012-03-22 | 2013-09-26 | シャープ株式会社 | カラーフィルター一体型タッチパネル |
US20130341651A1 (en) * | 2012-06-21 | 2013-12-26 | Samsung Display Co., Ltd. | Sensor substrate and sensing display panel having the same |
JP2014063159A (ja) * | 2012-09-03 | 2014-04-10 | Semiconductor Energy Lab Co Ltd | 表示装置、電子機器 |
Cited By (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016062203A (ja) * | 2014-09-17 | 2016-04-25 | 三菱電機株式会社 | タッチスクリーン、タッチパネル、表示装置および電子機器 |
JP2018022322A (ja) * | 2016-08-03 | 2018-02-08 | 株式会社ジャパンディスプレイ | 表示装置 |
US10826019B2 (en) | 2016-08-18 | 2020-11-03 | Sharp Kabushiki Kaisha | Organic EL display device |
WO2018034244A1 (ja) * | 2016-08-18 | 2018-02-22 | シャープ株式会社 | 有機el表示装置 |
US11329107B2 (en) | 2016-12-26 | 2022-05-10 | Lg Display Co., Ltd. | Display device with integrated touch screen |
US12029095B2 (en) | 2016-12-26 | 2024-07-02 | Lg Display Co., Ltd. | Display device with integrated touch screen |
CN108242456B (zh) * | 2016-12-26 | 2022-02-01 | 乐金显示有限公司 | 具有集成式触摸屏的显示装置 |
US10763312B2 (en) | 2016-12-26 | 2020-09-01 | Lg Display Co., Ltd. | Display device with integrated touch screen |
JP2018106699A (ja) * | 2016-12-26 | 2018-07-05 | エルジー ディスプレイ カンパニー リミテッド | タッチスクリーン一体型表示装置 |
CN108242456A (zh) * | 2016-12-26 | 2018-07-03 | 乐金显示有限公司 | 具有集成式触摸屏的显示装置 |
JP2018109962A (ja) * | 2016-12-28 | 2018-07-12 | エルジー ディスプレイ カンパニー リミテッド | 表示装置 |
US10490610B2 (en) | 2016-12-28 | 2019-11-26 | Lg Display Co., Ltd. | Display device |
JP2018115871A (ja) * | 2017-01-16 | 2018-07-26 | 株式会社東海理化電機製作所 | タッチ検出装置及びタッチ検出方法 |
JP2018194571A (ja) * | 2017-05-12 | 2018-12-06 | 株式会社ジャパンディスプレイ | 表示装置 |
JP2018206390A (ja) * | 2017-06-01 | 2018-12-27 | エルジー ディスプレイ カンパニー リミテッド | タッチ表示装置及びタッチパネル |
US11847274B2 (en) | 2017-06-01 | 2023-12-19 | Lg Display Co., Ltd. | Touch display device and touch panel |
JP2020537199A (ja) * | 2017-09-21 | 2020-12-17 | 京東方科技集團股▲ふん▼有限公司Boe Technology Group Co.,Ltd. | タッチパネル及びその作製方法、タッチ表示パネル |
KR102602739B1 (ko) * | 2018-09-07 | 2023-11-16 | 삼성디스플레이 주식회사 | 전자 장치 |
KR20200029093A (ko) * | 2018-09-07 | 2020-03-18 | 삼성디스플레이 주식회사 | 전자 장치 |
JP2020068074A (ja) * | 2018-10-23 | 2020-04-30 | 株式会社ジャパンディスプレイ | 表示装置 |
JP2020091418A (ja) * | 2018-12-06 | 2020-06-11 | シャープ株式会社 | 表示装置および電子機器 |
WO2023120620A1 (ja) * | 2021-12-24 | 2023-06-29 | 株式会社レゾナック | タッチパネル及びタッチパネルの製造方法 |
WO2024116834A1 (ja) * | 2022-11-30 | 2024-06-06 | Toppanホールディングス株式会社 | 光学装置 |
Also Published As
Publication number | Publication date |
---|---|
US11644869B2 (en) | 2023-05-09 |
US20230376076A1 (en) | 2023-11-23 |
TWI790965B (zh) | 2023-01-21 |
CN111443833A (zh) | 2020-07-24 |
US20200285334A1 (en) | 2020-09-10 |
JP2022020836A (ja) | 2022-02-01 |
CN105138195A (zh) | 2015-12-09 |
KR20220058514A (ko) | 2022-05-09 |
TWI765679B (zh) | 2022-05-21 |
KR102404630B1 (ko) | 2022-05-31 |
TW202131160A (zh) | 2021-08-16 |
JP2020074239A (ja) | 2020-05-14 |
CN111443833B (zh) | 2023-11-21 |
US20150346866A1 (en) | 2015-12-03 |
JP2023171383A (ja) | 2023-12-01 |
KR20150138030A (ko) | 2015-12-09 |
TW202234224A (zh) | 2022-09-01 |
DE102015210047A1 (de) | 2015-12-03 |
TWI726843B (zh) | 2021-05-11 |
TW201545038A (zh) | 2015-12-01 |
CN105138195B (zh) | 2020-04-28 |
KR20200050932A (ko) | 2020-05-12 |
KR102393086B1 (ko) | 2022-04-29 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US11644869B2 (en) | Touch panel comprising conductive layers having opening overlapping with light-emitting element | |
JP7472365B2 (ja) | 表示装置 | |
JP7499917B2 (ja) | El表示装置、電子機器 | |
JP7538296B2 (ja) | 表示装置 | |
US9455281B2 (en) | Touch sensor, touch panel, touch panel module, and display device | |
JP2015228210A (ja) | タッチセンサ、及びタッチパネル | |
JP6346782B2 (ja) | タッチパネル | |
JP6570700B2 (ja) | タッチパネル | |
JP2019204541A (ja) | タッチパネル | |
JP2024052752A (ja) | 表示装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20180522 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20180522 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20190116 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20190219 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20190418 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20190618 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20191119 |
|
A761 | Written withdrawal of application |
Free format text: JAPANESE INTERMEDIATE CODE: A761 Effective date: 20200211 |