JP2016040382A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2016040382A5 JP2016040382A5 JP2015237884A JP2015237884A JP2016040382A5 JP 2016040382 A5 JP2016040382 A5 JP 2016040382A5 JP 2015237884 A JP2015237884 A JP 2015237884A JP 2015237884 A JP2015237884 A JP 2015237884A JP 2016040382 A5 JP2016040382 A5 JP 2016040382A5
- Authority
- JP
- Japan
- Prior art keywords
- composition
- weight
- water
- group
- miscible organic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000203 mixture Substances 0.000 claims 53
- -1 amine compound Chemical class 0.000 claims 16
- 239000003960 organic solvent Substances 0.000 claims 16
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 16
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims 12
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 claims 12
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 claims 12
- 239000004065 semiconductor Substances 0.000 claims 12
- 239000000758 substrate Substances 0.000 claims 12
- 238000004140 cleaning Methods 0.000 claims 11
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 claims 10
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 claims 6
- UIKUBYKUYUSRSM-UHFFFAOYSA-N 3-morpholinopropylamine Chemical compound NCCCN1CCOCC1 UIKUBYKUYUSRSM-UHFFFAOYSA-N 0.000 claims 6
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims 6
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 claims 6
- 239000003989 dielectric material Substances 0.000 claims 6
- 229920001174 Diethylhydroxylamine Polymers 0.000 claims 5
- FVCOIAYSJZGECG-UHFFFAOYSA-N diethylhydroxylamine Chemical compound CCN(O)CC FVCOIAYSJZGECG-UHFFFAOYSA-N 0.000 claims 5
- 238000000034 method Methods 0.000 claims 5
- GIAFURWZWWWBQT-UHFFFAOYSA-N 2-(2-aminoethoxy)ethanol Chemical compound NCCOCCO GIAFURWZWWWBQT-UHFFFAOYSA-N 0.000 claims 4
- SVTBMSDMJJWYQN-UHFFFAOYSA-N 2-methylpentane-2,4-diol Chemical compound CC(O)CC(C)(C)O SVTBMSDMJJWYQN-UHFFFAOYSA-N 0.000 claims 4
- DDFHBQSCUXNBSA-UHFFFAOYSA-N 5-(5-carboxythiophen-2-yl)thiophene-2-carboxylic acid Chemical compound S1C(C(=O)O)=CC=C1C1=CC=C(C(O)=O)S1 DDFHBQSCUXNBSA-UHFFFAOYSA-N 0.000 claims 4
- CIWBSHSKHKDKBQ-JLAZNSOCSA-N Ascorbic acid Chemical compound OC[C@H](O)[C@H]1OC(=O)C(O)=C1O CIWBSHSKHKDKBQ-JLAZNSOCSA-N 0.000 claims 4
- YNAVUWVOSKDBBP-UHFFFAOYSA-N Morpholine Chemical compound C1COCCN1 YNAVUWVOSKDBBP-UHFFFAOYSA-N 0.000 claims 4
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 claims 4
- OPKOKAMJFNKNAS-UHFFFAOYSA-N N-methylethanolamine Chemical compound CNCCO OPKOKAMJFNKNAS-UHFFFAOYSA-N 0.000 claims 4
- 238000001035 drying Methods 0.000 claims 4
- LNTHITQWFMADLM-UHFFFAOYSA-N gallic acid Chemical compound OC(=O)C1=CC(O)=C(O)C(O)=C1 LNTHITQWFMADLM-UHFFFAOYSA-N 0.000 claims 4
- 150000007524 organic acids Chemical class 0.000 claims 4
- 150000003856 quaternary ammonium compounds Chemical class 0.000 claims 4
- FPGGTKZVZWFYPV-UHFFFAOYSA-M tetrabutylammonium fluoride Chemical compound [F-].CCCC[N+](CCCC)(CCCC)CCCC FPGGTKZVZWFYPV-UHFFFAOYSA-M 0.000 claims 4
- 239000013589 supplement Substances 0.000 claims 3
- HXKKHQJGJAFBHI-UHFFFAOYSA-N 1-aminopropan-2-ol Chemical compound CC(O)CN HXKKHQJGJAFBHI-UHFFFAOYSA-N 0.000 claims 2
- MIJDSYMOBYNHOT-UHFFFAOYSA-N 2-(ethylamino)ethanol Chemical compound CCNCCO MIJDSYMOBYNHOT-UHFFFAOYSA-N 0.000 claims 2
- HHPDFYDITNAMAM-UHFFFAOYSA-N 2-[cyclohexyl(2-hydroxyethyl)amino]ethanol Chemical compound OCCN(CCO)C1CCCCC1 HHPDFYDITNAMAM-UHFFFAOYSA-N 0.000 claims 2
- BFSVOASYOCHEOV-UHFFFAOYSA-N 2-diethylaminoethanol Chemical compound CCN(CC)CCO BFSVOASYOCHEOV-UHFFFAOYSA-N 0.000 claims 2
- ZDWPBMJZDNXTPG-UHFFFAOYSA-N 2h-benzotriazol-4-amine Chemical compound NC1=CC=CC2=C1NN=N2 ZDWPBMJZDNXTPG-UHFFFAOYSA-N 0.000 claims 2
- 239000002211 L-ascorbic acid Substances 0.000 claims 2
- 235000000069 L-ascorbic acid Nutrition 0.000 claims 2
- UEEJHVSXFDXPFK-UHFFFAOYSA-N N-dimethylaminoethanol Chemical compound CN(C)CCO UEEJHVSXFDXPFK-UHFFFAOYSA-N 0.000 claims 2
- AKNUHUCEWALCOI-UHFFFAOYSA-N N-ethyldiethanolamine Chemical compound OCCN(CC)CCO AKNUHUCEWALCOI-UHFFFAOYSA-N 0.000 claims 2
- SLINHMUFWFWBMU-UHFFFAOYSA-N Triisopropanolamine Chemical compound CC(O)CN(CC(C)O)CC(C)O SLINHMUFWFWBMU-UHFFFAOYSA-N 0.000 claims 2
- 239000001089 [(2R)-oxolan-2-yl]methanol Substances 0.000 claims 2
- LHIJANUOQQMGNT-UHFFFAOYSA-N aminoethylethanolamine Chemical compound NCCNCCO LHIJANUOQQMGNT-UHFFFAOYSA-N 0.000 claims 2
- 229960005070 ascorbic acid Drugs 0.000 claims 2
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 claims 2
- 239000012964 benzotriazole Substances 0.000 claims 2
- 238000005260 corrosion Methods 0.000 claims 2
- 230000007797 corrosion Effects 0.000 claims 2
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 claims 2
- LVTYICIALWPMFW-UHFFFAOYSA-N diisopropanolamine Chemical compound CC(O)CNCC(C)O LVTYICIALWPMFW-UHFFFAOYSA-N 0.000 claims 2
- 229940043276 diisopropanolamine Drugs 0.000 claims 2
- 229940074391 gallic acid Drugs 0.000 claims 2
- 235000004515 gallic acid Nutrition 0.000 claims 2
- 229940051250 hexylene glycol Drugs 0.000 claims 2
- 239000003112 inhibitor Substances 0.000 claims 2
- MOVBJUGHBJJKOW-UHFFFAOYSA-N methyl 2-amino-5-methoxybenzoate Chemical compound COC(=O)C1=CC(OC)=CC=C1N MOVBJUGHBJJKOW-UHFFFAOYSA-N 0.000 claims 2
- CRVGTESFCCXCTH-UHFFFAOYSA-N methyl diethanolamine Chemical compound OCCN(C)CCO CRVGTESFCCXCTH-UHFFFAOYSA-N 0.000 claims 2
- BSYVTEYKTMYBMK-UHFFFAOYSA-N tetrahydrofurfuryl alcohol Chemical compound OCC1CCCO1 BSYVTEYKTMYBMK-UHFFFAOYSA-N 0.000 claims 2
- MWOOGOJBHIARFG-UHFFFAOYSA-N vanillin Chemical compound COC1=CC(C=O)=CC=C1O MWOOGOJBHIARFG-UHFFFAOYSA-N 0.000 claims 2
- 235000012141 vanillin Nutrition 0.000 claims 2
- FGQOOHJZONJGDT-UHFFFAOYSA-N vanillin Natural products COC1=CC(O)=CC(C=O)=C1 FGQOOHJZONJGDT-UHFFFAOYSA-N 0.000 claims 2
- 229940117960 vanillin Drugs 0.000 claims 2
- 238000005406 washing Methods 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 150000001412 amines Chemical class 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 235000021384 green leafy vegetables Nutrition 0.000 claims 1
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201261717152P | 2012-10-23 | 2012-10-23 | |
| US61/717,152 | 2012-10-23 | ||
| US201361817134P | 2013-04-29 | 2013-04-29 | |
| US61/817,134 | 2013-04-29 | ||
| US14/010,748 US9536730B2 (en) | 2012-10-23 | 2013-08-27 | Cleaning formulations |
| US14/010,748 | 2013-08-27 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013219489A Division JP2014084464A (ja) | 2012-10-23 | 2013-10-22 | クリーニング用組成物 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018098635A Division JP2018164091A (ja) | 2012-10-23 | 2018-05-23 | クリーニング用組成物 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016040382A JP2016040382A (ja) | 2016-03-24 |
| JP2016040382A5 true JP2016040382A5 (https=) | 2016-10-06 |
| JP6546080B2 JP6546080B2 (ja) | 2019-07-17 |
Family
ID=50484217
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013219489A Pending JP2014084464A (ja) | 2012-10-23 | 2013-10-22 | クリーニング用組成物 |
| JP2015237884A Expired - Fee Related JP6546080B2 (ja) | 2012-10-23 | 2015-12-04 | クリーニング用組成物 |
| JP2018098635A Pending JP2018164091A (ja) | 2012-10-23 | 2018-05-23 | クリーニング用組成物 |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013219489A Pending JP2014084464A (ja) | 2012-10-23 | 2013-10-22 | クリーニング用組成物 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018098635A Pending JP2018164091A (ja) | 2012-10-23 | 2018-05-23 | クリーニング用組成物 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US9536730B2 (https=) |
| JP (3) | JP2014084464A (https=) |
| KR (1) | KR101557979B1 (https=) |
| CN (1) | CN103777475B (https=) |
| MY (1) | MY163132A (https=) |
| SG (1) | SG2013076922A (https=) |
| TW (1) | TWI563077B (https=) |
Families Citing this family (32)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20140139565A (ko) * | 2012-03-18 | 2014-12-05 | 인티그리스, 인코포레이티드 | 개선된 장벽층 상용성 및 세정 성능을 가진 cmp-후 배합물 |
| TWI572711B (zh) * | 2012-10-16 | 2017-03-01 | 盟智科技股份有限公司 | 半導體製程用的清洗組成物及清洗方法 |
| JP6599322B2 (ja) * | 2013-10-21 | 2019-10-30 | フジフイルム エレクトロニック マテリアルズ ユー．エス．エー．， インコーポレイテッド | 表面の残留物を除去するための洗浄配合物 |
| EP3104398B1 (en) | 2013-12-06 | 2020-03-11 | Fujifilm Electronic Materials USA, Inc. | Cleaning formulation and method for removing residues on surfaces |
| US20150203753A1 (en) * | 2014-01-17 | 2015-07-23 | Nanya Technology Corporation | Liquid etchant composition, and etching process in capacitor process of dram using the same |
| US9957469B2 (en) * | 2014-07-14 | 2018-05-01 | Versum Materials Us, Llc | Copper corrosion inhibition system |
| JP6501492B2 (ja) | 2014-10-31 | 2019-04-17 | 関東化學株式会社 | フォトレジスト残渣および／またはポリマー残渣を除去するための組成物 |
| KR102347656B1 (ko) * | 2014-12-11 | 2022-01-07 | 동우 화인켐 주식회사 | 포토레지스트 애싱 후 잔류물 제거를 위한 세정제 조성물 |
| CN104570629B (zh) * | 2015-02-14 | 2016-04-13 | 江阴江化微电子材料股份有限公司 | —种液晶面板铜膜光阻水系剥离液 |
| CN113214920A (zh) * | 2015-03-31 | 2021-08-06 | 弗萨姆材料美国有限责任公司 | 清洁制剂 |
| TWI818893B (zh) * | 2015-07-14 | 2023-10-21 | 美商富士軟片電子材料美國股份有限公司 | 清潔組成物及其使用方法 |
| US10233413B2 (en) * | 2015-09-23 | 2019-03-19 | Versum Materials Us, Llc | Cleaning formulations |
| US10400167B2 (en) | 2015-11-25 | 2019-09-03 | Versum Materials Us, Llc | Etching compositions and methods for using same |
| US11035044B2 (en) * | 2017-01-23 | 2021-06-15 | Versum Materials Us, Llc | Etching solution for tungsten and GST films |
| KR102417180B1 (ko) * | 2017-09-29 | 2022-07-05 | 삼성전자주식회사 | Duv용 포토레지스트 조성물, 패턴 형성 방법 및 반도체 소자의 제조 방법 |
| EP3480288A1 (en) * | 2017-11-07 | 2019-05-08 | Henkel AG & Co. KGaA | Fluoride based cleaning composition |
| IL274877B2 (en) * | 2017-12-08 | 2024-03-01 | Basf Se | Cleaning composition for post-etch or post ash residue removal from a semiconductor substrate and corresponding manufacturing process |
| CN109976108A (zh) * | 2017-12-27 | 2019-07-05 | 安集微电子（上海）有限公司 | 一种用于半导体的清洗液 |
| TWI838356B (zh) * | 2018-01-25 | 2024-04-11 | 德商馬克專利公司 | 光阻移除劑組合物 |
| SG11202008828VA (en) | 2018-03-28 | 2020-10-29 | Fujifilm Electronic Materials Usa Inc | Cleaning compositions |
| KR102952187B1 (ko) | 2019-06-19 | 2026-04-14 | 버슘머트리얼즈 유에스, 엘엘씨 | 반도체 기판용 세정 조성물 |
| EP3999621A4 (en) * | 2019-07-15 | 2023-08-16 | Versum Materials US, LLC | ETCH RESIDUE REMOVER COMPOSITIONS, METHOD OF USE THEREOF, AND USE THEREOF |
| JP7541014B2 (ja) * | 2019-09-18 | 2024-08-27 | 富士フイルム株式会社 | 洗浄液、洗浄方法 |
| WO2021061922A1 (en) * | 2019-09-27 | 2021-04-01 | Versum Materials Us, Llc | Compositions for removing etch residues, methods of using and use thereof |
| JP7419905B2 (ja) * | 2020-03-19 | 2024-01-23 | 日油株式会社 | 回路基板用樹脂膜剥離剤 |
| EP4130217A4 (en) * | 2020-03-31 | 2024-04-17 | Nissan Chemical Corporation | Cleaning agent composition and method for producing processed semiconductor substrate |
| KR20220012521A (ko) | 2020-07-23 | 2022-02-04 | 주식회사 케이씨텍 | 세정액 조성물 및 이를 이용한 세정 방법 |
| KR102780997B1 (ko) | 2020-07-30 | 2025-03-14 | 후지필름 가부시키가이샤 | 처리액, 기판의 세정 방법 |
| KR102782910B1 (ko) * | 2020-12-10 | 2025-03-14 | 동우 화인켐 주식회사 | 금속 함유 레지스트용 신너 조성물 |
| TWI800025B (zh) * | 2021-10-07 | 2023-04-21 | 德揚科技股份有限公司 | 清洗水溶液 |
| KR20240122816A (ko) | 2022-01-17 | 2024-08-13 | 후지필름 가부시키가이샤 | 약액, 수식 기판의 제조 방법, 적층체의 제조 방법 |
| CN117903887A (zh) * | 2023-12-07 | 2024-04-19 | 湖北兴福电子材料股份有限公司 | 一种蚀刻后清洗液 |
Family Cites Families (54)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040018949A1 (en) | 1990-11-05 | 2004-01-29 | Wai Mun Lee | Semiconductor process residue removal composition and process |
| US5279771A (en) | 1990-11-05 | 1994-01-18 | Ekc Technology, Inc. | Stripping compositions comprising hydroxylamine and alkanolamine |
| JP3160344B2 (ja) | 1991-01-25 | 2001-04-25 | アシュランド インコーポレーテッド | 有機ストリッピング組成物 |
| US5746837A (en) | 1992-05-27 | 1998-05-05 | Ppg Industries, Inc. | Process for treating an aluminum can using a mobility enhancer |
| US6825156B2 (en) | 2002-06-06 | 2004-11-30 | Ekc Technology, Inc. | Semiconductor process residue removal composition and process |
| US6326130B1 (en) | 1993-10-07 | 2001-12-04 | Mallinckrodt Baker, Inc. | Photoresist strippers containing reducing agents to reduce metal corrosion |
| EP0852615B1 (en) | 1996-07-25 | 2005-12-14 | DuPont Air Products NanoMaterials L.L.C. | Chemical mechanical polishing composition and process |
| US6896826B2 (en) | 1997-01-09 | 2005-05-24 | Advanced Technology Materials, Inc. | Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate |
| US6755989B2 (en) | 1997-01-09 | 2004-06-29 | Advanced Technology Materials, Inc. | Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate |
| US6248704B1 (en) | 1999-05-03 | 2001-06-19 | Ekc Technology, Inc. | Compositions for cleaning organic and plasma etched residues for semiconductors devices |
| US20030022800A1 (en) * | 2001-06-14 | 2003-01-30 | Peters Darryl W. | Aqueous buffered fluoride-containing etch residue removers and cleaners |
| MY143399A (en) * | 2001-07-09 | 2011-05-13 | Avantor Performance Mat Inc | Microelectronic cleaning compositons containing ammonia-free fluoride salts for selective photoresist stripping and plasma ash residue cleaning |
| MY131912A (en) | 2001-07-09 | 2007-09-28 | Avantor Performance Mat Inc | Ammonia-free alkaline microelectronic cleaning compositions with improved substrate compatibility |
| CN100403169C (zh) * | 2001-07-13 | 2008-07-16 | Ekc技术公司 | 亚砜吡咯烷酮链烷醇胺剥离和清洗组合物 |
| JP2003241400A (ja) * | 2002-02-22 | 2003-08-27 | Nippon Zeon Co Ltd | 剥離液及びそれを用いたレジスト剥離方法 |
| JP4252758B2 (ja) | 2002-03-22 | 2009-04-08 | 関東化学株式会社 | フォトレジスト残渣除去液組成物 |
| US6773873B2 (en) * | 2002-03-25 | 2004-08-10 | Advanced Technology Materials, Inc. | pH buffered compositions useful for cleaning residue from semiconductor substrates |
| AU2003225178A1 (en) * | 2002-04-24 | 2003-11-10 | Ekc Technology, Inc. | Oxalic acid as a cleaning product for aluminium, copper and dielectric surfaces |
| US8003587B2 (en) * | 2002-06-06 | 2011-08-23 | Ekc Technology, Inc. | Semiconductor process residue removal composition and process |
| US6677286B1 (en) | 2002-07-10 | 2004-01-13 | Air Products And Chemicals, Inc. | Compositions for removing etching residue and use thereof |
| JP4443864B2 (ja) | 2002-07-12 | 2010-03-31 | 株式会社ルネサステクノロジ | レジストまたはエッチング残さ物除去用洗浄液および半導体装置の製造方法 |
| JP2004277576A (ja) | 2003-03-17 | 2004-10-07 | Daikin Ind Ltd | エッチング用又は洗浄用の溶液の製造法 |
| WO2004094581A1 (en) | 2003-04-18 | 2004-11-04 | Ekc Technology, Inc. | Aqueous fluoride compositions for cleaning semiconductor devices |
| KR20060014388A (ko) | 2003-05-02 | 2006-02-15 | 이케이씨 테크놀로지, 인코포레이티드 | 반도체 공정에서의 에칭후 잔류물의 제거 방법 |
| JP2005209953A (ja) * | 2004-01-23 | 2005-08-04 | Tokyo Ohka Kogyo Co Ltd | 剥離洗浄液、該剥離洗浄液を用いた半導体基板洗浄方法および金属配線形成方法 |
| WO2005076332A1 (ja) | 2004-02-09 | 2005-08-18 | Mitsubishi Chemical Corporation | 半導体デバイス用基板洗浄液及び洗浄方法 |
| BRPI0508291A (pt) * | 2004-03-01 | 2007-07-31 | Mallinckrodt Baker Inc | composições e processo de limpeza para substratos nanoeletrÈnicas e microeletrÈnicas para limpeza |
| US9217929B2 (en) | 2004-07-22 | 2015-12-22 | Air Products And Chemicals, Inc. | Composition for removing photoresist and/or etching residue from a substrate and use thereof |
| JP4463054B2 (ja) * | 2004-09-17 | 2010-05-12 | 東京応化工業株式会社 | ホトレジスト用剥離液およびこれを用いた基板の処理方法 |
| EP1701218A3 (en) | 2005-03-11 | 2008-10-15 | Rohm and Haas Electronic Materials LLC | Polymer remover |
| JP2006261432A (ja) * | 2005-03-17 | 2006-09-28 | Nissan Chem Ind Ltd | ヒドラジンを含む半導体用洗浄液組成物及び洗浄方法 |
| WO2006110645A2 (en) | 2005-04-11 | 2006-10-19 | Advanced Technology Materials, Inc. | Fluoride liquid cleaners with polar and non-polar solvent mixtures for cleaning low-k-containing microelectronic devices |
| WO2006129549A1 (ja) | 2005-06-01 | 2006-12-07 | Nissan Chemical Industries, Ltd. | ホスホン酸及びアスコルビン酸を含む半導体用洗浄液組成物及び洗浄方法 |
| CN101233456B (zh) * | 2005-06-07 | 2013-01-02 | 高级技术材料公司 | 金属和电介质相容的牺牲性抗反射涂层清洗及去除组合物 |
| US7700533B2 (en) * | 2005-06-23 | 2010-04-20 | Air Products And Chemicals, Inc. | Composition for removal of residue comprising cationic salts and methods using same |
| TWI339780B (en) | 2005-07-28 | 2011-04-01 | Rohm & Haas Elect Mat | Stripper |
| TW200722505A (en) | 2005-09-30 | 2007-06-16 | Rohm & Haas Elect Mat | Stripper |
| JP2009512195A (ja) * | 2005-10-05 | 2009-03-19 | アドバンスド テクノロジー マテリアルズ，インコーポレイテッド | ゲートスペーサ酸化物材料を選択的にエッチするための組成物および方法 |
| US8772214B2 (en) * | 2005-10-14 | 2014-07-08 | Air Products And Chemicals, Inc. | Aqueous cleaning composition for removing residues and method using same |
| WO2007120259A2 (en) | 2005-11-08 | 2007-10-25 | Advanced Technology Materials, Inc. | Formulations for removing copper-containing post-etch residue from microelectronic devices |
| US7534753B2 (en) * | 2006-01-12 | 2009-05-19 | Air Products And Chemicals, Inc. | pH buffered aqueous cleaning composition and method for removing photoresist residue |
| JP2007200944A (ja) * | 2006-01-23 | 2007-08-09 | Tokuyama Corp | 基板洗浄液 |
| US20070179072A1 (en) | 2006-01-30 | 2007-08-02 | Rao Madhukar B | Cleaning formulations |
| US20080139436A1 (en) * | 2006-09-18 | 2008-06-12 | Chris Reid | Two step cleaning process to remove resist, etch residue, and copper oxide from substrates having copper and low-K dielectric material |
| SG177915A1 (en) | 2006-12-21 | 2012-02-28 | Advanced Tech Materials | Liquid cleaner for the removal of post-etch residues |
| US7879783B2 (en) * | 2007-01-11 | 2011-02-01 | Air Products And Chemicals, Inc. | Cleaning composition for semiconductor substrates |
| JP5203637B2 (ja) | 2007-05-07 | 2013-06-05 | イー．ケー．シー．テクノロジー．インコーポレーテッド | レジスト、エッチング残渣、及び金属酸化物をアルミニウム及びアルミニウム銅合金を有する基板から除去する方法及び組成物 |
| WO2009058278A1 (en) * | 2007-10-29 | 2009-05-07 | Ekc Technology, Inc | Methods of cleaning semiconductor devices at the back end of line using amidoxime compositions |
| TW200925268A (en) | 2007-12-06 | 2009-06-16 | Mallinckrodt Baker Inc | Fluoride-containing photoresist stripper or residue removing cleaning compositions containing conjugate oligomeric or polymeric material of alpha-hydroxycarbonyl compound/amine or ammonia reaction |
| EP2268765A4 (en) | 2008-03-07 | 2011-10-26 | Advanced Tech Materials | UNSELECTIVE OXIDIZE WET CLEANING AGENT AND USE |
| US7687447B2 (en) * | 2008-03-13 | 2010-03-30 | Air Products And Chemicals, Inc. | Semi-aqueous stripping and cleaning composition containing aminobenzenesulfonic acid |
| US8361237B2 (en) | 2008-12-17 | 2013-01-29 | Air Products And Chemicals, Inc. | Wet clean compositions for CoWP and porous dielectrics |
| WO2010104816A1 (en) * | 2009-03-11 | 2010-09-16 | Fujifilm Electronic Materials U.S.A., Inc. | Cleaning formulation for removing residues on surfaces |
| US8889609B2 (en) | 2011-03-16 | 2014-11-18 | Air Products And Chemicals, Inc. | Cleaning formulations and method of using the cleaning formulations |
-
2013
- 2013-08-27 US US14/010,748 patent/US9536730B2/en not_active Expired - Fee Related
- 2013-10-16 SG SG2013076922A patent/SG2013076922A/en unknown
- 2013-10-18 TW TW102137823A patent/TWI563077B/zh not_active IP Right Cessation
- 2013-10-21 MY MYPI2013701982A patent/MY163132A/en unknown
- 2013-10-22 JP JP2013219489A patent/JP2014084464A/ja active Pending
- 2013-10-22 KR KR1020130125968A patent/KR101557979B1/ko not_active Expired - Fee Related
- 2013-10-23 CN CN201310504991.2A patent/CN103777475B/zh not_active Expired - Fee Related
-
2015
- 2015-12-04 JP JP2015237884A patent/JP6546080B2/ja not_active Expired - Fee Related
-
2018
- 2018-05-23 JP JP2018098635A patent/JP2018164091A/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2016040382A5 (https=) | ||
| TWI726300B (zh) | 光阻剝除劑 | |
| JP6612891B2 (ja) | 洗浄配合 | |
| TWI714010B (zh) | 光阻剝除劑 | |
| JP6006711B2 (ja) | １級アルカノールアミンを含むｌｃｄ製造用フォトレジスト剥離液組成物 | |
| JP2011080042A5 (https=) | ||
| TWI617902B (zh) | 光阻剝離液組成物以及使用該組成物的光阻剝離方法 | |
| IL273542B2 (en) | Stripper solutions and methods of using stripper solutions | |
| JP2018164091A (ja) | クリーニング用組成物 | |
| MY162416A (en) | Cleaning formulations and method of using the cleaning formulations | |
| MY158089A (en) | Stripper for dry film removal | |
| CN106547178A (zh) | 清洁制剂 | |
| CN110597024B (zh) | 防止污渍的光刻胶剥离剂组合物及平板显示器基板的制法 | |
| JP2006350325A5 (https=) | ||
| TW201623599A (zh) | 光阻殘留物清洗液 | |
| JP2014048667A (ja) | 厚膜のネガ型フォトレジスト用剥離液組成物｛ｓｔｒｉｐｐｅｒｃｏｍｐｏｓｉｔｉｏｎｆｏｒｔｈｉｃｋｎｅｇａｔｉｖｅｐｈｏｔｏｒｅｓｉｓｔ｝ | |
| JP2008509554A5 (https=) | ||
| WO2020022491A1 (ja) | 洗浄方法 | |
| TW201536912A (zh) | 低蝕刻的去除光阻蝕刻殘留物的清洗液以及低蝕刻的去除光阻蝕刻殘留物的清洗液應用 | |
| JP6497668B2 (ja) | フォトレジスト除去用ストリッパー組成物およびこれを用いたフォトレジストの剥離方法 | |
| JP2011227448A5 (https=) | ||
| KR101733729B1 (ko) | 포토레지스트 박리액 조성물 및 이를 이용한 포토레지스트 박리 방법 | |
| CN106468861B (zh) | 抗蚀剂剥离液组合物及使用其的抗蚀剂剥离方法 | |
| CN109164686A (zh) | 一种正性光刻胶去胶清洗组合物及其应用 | |
| CN103773626B (zh) | 一种低蚀刻的去除光阻蚀刻残留物的清洗液 |