TWI714010B - 光阻剝除劑 - Google Patents
光阻剝除劑 Download PDFInfo
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- TWI714010B TWI714010B TW108107567A TW108107567A TWI714010B TW I714010 B TWI714010 B TW I714010B TW 108107567 A TW108107567 A TW 108107567A TW 108107567 A TW108107567 A TW 108107567A TW I714010 B TWI714010 B TW I714010B
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- 229920002120 photoresistant polymer Polymers 0.000 title claims abstract description 65
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 claims abstract description 44
- 239000002904 solvent Substances 0.000 claims abstract description 34
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 claims abstract description 27
- 239000000758 substrate Substances 0.000 claims abstract description 24
- 238000000034 method Methods 0.000 claims abstract description 20
- 125000001453 quaternary ammonium group Chemical group 0.000 claims abstract description 18
- 239000000908 ammonium hydroxide Substances 0.000 claims abstract description 16
- 230000007797 corrosion Effects 0.000 claims description 29
- 238000005260 corrosion Methods 0.000 claims description 29
- 239000003112 inhibitor Substances 0.000 claims description 29
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 28
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 claims description 20
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 claims description 18
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 17
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 claims description 17
- XTVVROIMIGLXTD-UHFFFAOYSA-N copper(II) nitrate Chemical compound [Cu+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O XTVVROIMIGLXTD-UHFFFAOYSA-N 0.000 claims description 10
- GIAFURWZWWWBQT-UHFFFAOYSA-N 2-(2-aminoethoxy)ethanol Chemical compound NCCOCCO GIAFURWZWWWBQT-UHFFFAOYSA-N 0.000 claims description 8
- 230000008014 freezing Effects 0.000 claims description 8
- 238000007710 freezing Methods 0.000 claims description 8
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinyl group Chemical group C1(O)=CC(O)=CC=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 claims description 8
- 235000011187 glycerol Nutrition 0.000 claims description 7
- 229940073455 tetraethylammonium hydroxide Drugs 0.000 claims description 7
- LRGJRHZIDJQFCL-UHFFFAOYSA-M tetraethylazanium;hydroxide Chemical compound [OH-].CC[N+](CC)(CC)CC LRGJRHZIDJQFCL-UHFFFAOYSA-M 0.000 claims description 7
- MFKRHJVUCZRDTF-UHFFFAOYSA-N 3-methoxy-3-methylbutan-1-ol Chemical compound COC(C)(C)CCO MFKRHJVUCZRDTF-UHFFFAOYSA-N 0.000 claims description 6
- KVFVBPYVNUCWJX-UHFFFAOYSA-M ethyl(trimethyl)azanium;hydroxide Chemical compound [OH-].CC[N+](C)(C)C KVFVBPYVNUCWJX-UHFFFAOYSA-M 0.000 claims description 6
- HMBHAQMOBKLWRX-UHFFFAOYSA-N 2,3-dihydro-1,4-benzodioxine-3-carboxylic acid Chemical compound C1=CC=C2OC(C(=O)O)COC2=C1 HMBHAQMOBKLWRX-UHFFFAOYSA-N 0.000 claims description 5
- FBPFZTCFMRRESA-FSIIMWSLSA-N D-Glucitol Natural products OC[C@H](O)[C@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-FSIIMWSLSA-N 0.000 claims description 5
- FBPFZTCFMRRESA-JGWLITMVSA-N D-glucitol Chemical compound OC[C@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-JGWLITMVSA-N 0.000 claims description 5
- 229940075419 choline hydroxide Drugs 0.000 claims description 5
- 239000000600 sorbitol Substances 0.000 claims description 5
- 125000004209 (C1-C8) alkyl group Chemical group 0.000 claims description 4
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 claims description 4
- 239000003795 chemical substances by application Substances 0.000 claims description 4
- 125000001424 substituent group Chemical group 0.000 claims description 4
- 238000005406 washing Methods 0.000 claims description 4
- 125000003710 aryl alkyl group Chemical group 0.000 claims description 3
- OSSXLTCIVXOQNK-UHFFFAOYSA-M dimethyl(dipropyl)azanium;hydroxide Chemical compound [OH-].CCC[N+](C)(C)CCC OSSXLTCIVXOQNK-UHFFFAOYSA-M 0.000 claims description 3
- 150000004686 pentahydrates Chemical class 0.000 claims description 3
- IZDJJEMZQZQQQQ-UHFFFAOYSA-N dicopper;tetranitrate;pentahydrate Chemical compound O.O.O.O.O.[Cu+2].[Cu+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O IZDJJEMZQZQQQQ-UHFFFAOYSA-N 0.000 claims 1
- 239000000203 mixture Substances 0.000 abstract description 82
- 238000009472 formulation Methods 0.000 abstract description 22
- 125000004432 carbon atom Chemical group C* 0.000 abstract description 7
- 125000002887 hydroxy group Chemical group [H]O* 0.000 abstract description 6
- 238000011068 loading method Methods 0.000 abstract description 3
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 abstract 1
- 239000000243 solution Substances 0.000 description 42
- 229920001721 polyimide Polymers 0.000 description 24
- 239000004642 Polyimide Substances 0.000 description 23
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 21
- 150000001875 compounds Chemical class 0.000 description 20
- -1 dimethyl hydroxide Dipropylammonium Chemical compound 0.000 description 20
- 239000010410 layer Substances 0.000 description 18
- 235000012431 wafers Nutrition 0.000 description 18
- 229920002577 polybenzoxazole Polymers 0.000 description 13
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 12
- 235000011114 ammonium hydroxide Nutrition 0.000 description 11
- 239000004065 semiconductor Substances 0.000 description 9
- 238000007598 dipping method Methods 0.000 description 8
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- 150000001298 alcohols Chemical class 0.000 description 6
- 239000008367 deionised water Substances 0.000 description 6
- 229910021641 deionized water Inorganic materials 0.000 description 6
- 235000013772 propylene glycol Nutrition 0.000 description 6
- 238000005530 etching Methods 0.000 description 5
- 150000002334 glycols Chemical class 0.000 description 5
- 229920000642 polymer Polymers 0.000 description 5
- YPFDHNVEDLHUCE-UHFFFAOYSA-N 1,3-propanediol Substances OCCCO YPFDHNVEDLHUCE-UHFFFAOYSA-N 0.000 description 4
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 4
- FRDAATYAJDYRNW-UHFFFAOYSA-N 3-methyl-3-pentanol Chemical group CCC(C)(O)CC FRDAATYAJDYRNW-UHFFFAOYSA-N 0.000 description 4
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 4
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 4
- GOQYKNQRPGWPLP-UHFFFAOYSA-N heptadecan-1-ol Chemical compound CCCCCCCCCCCCCCCCCO GOQYKNQRPGWPLP-UHFFFAOYSA-N 0.000 description 4
- BXWNKGSJHAJOGX-UHFFFAOYSA-N hexadecan-1-ol Chemical compound CCCCCCCCCCCCCCCCO BXWNKGSJHAJOGX-UHFFFAOYSA-N 0.000 description 4
- BTFJIXJJCSYFAL-UHFFFAOYSA-N icosan-1-ol Chemical compound CCCCCCCCCCCCCCCCCCCCO BTFJIXJJCSYFAL-UHFFFAOYSA-N 0.000 description 4
- HEBKCHPVOIAQTA-UHFFFAOYSA-N meso ribitol Natural products OCC(O)C(O)C(O)CO HEBKCHPVOIAQTA-UHFFFAOYSA-N 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 238000003756 stirring Methods 0.000 description 4
- 238000003860 storage Methods 0.000 description 4
- 239000004094 surface-active agent Substances 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- WFDIJRYMOXRFFG-UHFFFAOYSA-N Acetic anhydride Chemical compound CC(=O)OC(C)=O WFDIJRYMOXRFFG-UHFFFAOYSA-N 0.000 description 3
- UNXHWFMMPAWVPI-UHFFFAOYSA-N Erythritol Natural products OCC(O)C(O)CO UNXHWFMMPAWVPI-UHFFFAOYSA-N 0.000 description 3
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 3
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- TVXBFESIOXBWNM-UHFFFAOYSA-N Xylitol Natural products OCCC(O)C(O)C(O)CCO TVXBFESIOXBWNM-UHFFFAOYSA-N 0.000 description 3
- 238000013019 agitation Methods 0.000 description 3
- 150000001412 amines Chemical class 0.000 description 3
- 125000003277 amino group Chemical group 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000001723 curing Methods 0.000 description 3
- 238000002474 experimental method Methods 0.000 description 3
- LNTHITQWFMADLM-UHFFFAOYSA-N gallic acid Chemical compound OC(=O)C1=CC(O)=C(O)C(O)=C1 LNTHITQWFMADLM-UHFFFAOYSA-N 0.000 description 3
- 229940102253 isopropanolamine Drugs 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000013035 low temperature curing Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
- 150000005846 sugar alcohols Chemical class 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 3
- 239000000811 xylitol Substances 0.000 description 3
- HEBKCHPVOIAQTA-SCDXWVJYSA-N xylitol Chemical compound OC[C@H](O)[C@@H](O)[C@H](O)CO HEBKCHPVOIAQTA-SCDXWVJYSA-N 0.000 description 3
- 235000010447 xylitol Nutrition 0.000 description 3
- 229960002675 xylitol Drugs 0.000 description 3
- DNIAPMSPPWPWGF-VKHMYHEASA-N (+)-propylene glycol Chemical compound C[C@H](O)CO DNIAPMSPPWPWGF-VKHMYHEASA-N 0.000 description 2
- DNIAPMSPPWPWGF-GSVOUGTGSA-N (R)-(-)-Propylene glycol Chemical compound C[C@@H](O)CO DNIAPMSPPWPWGF-GSVOUGTGSA-N 0.000 description 2
- ARXKVVRQIIOZGF-UHFFFAOYSA-N 1,2,4-butanetriol Chemical compound OCCC(O)CO ARXKVVRQIIOZGF-UHFFFAOYSA-N 0.000 description 2
- KBPLFHHGFOOTCA-UHFFFAOYSA-N 1-Octanol Chemical group CCCCCCCCO KBPLFHHGFOOTCA-UHFFFAOYSA-N 0.000 description 2
- RWNUSVWFHDHRCJ-UHFFFAOYSA-N 1-butoxypropan-2-ol Chemical compound CCCCOCC(C)O RWNUSVWFHDHRCJ-UHFFFAOYSA-N 0.000 description 2
- RRQYJINTUHWNHW-UHFFFAOYSA-N 1-ethoxy-2-(2-ethoxyethoxy)ethane Chemical compound CCOCCOCCOCC RRQYJINTUHWNHW-UHFFFAOYSA-N 0.000 description 2
- CNJRPYFBORAQAU-UHFFFAOYSA-N 1-ethoxy-2-(2-methoxyethoxy)ethane Chemical compound CCOCCOCCOC CNJRPYFBORAQAU-UHFFFAOYSA-N 0.000 description 2
- IBLKWZIFZMJLFL-UHFFFAOYSA-N 1-phenoxypropan-2-ol Chemical compound CC(O)COC1=CC=CC=C1 IBLKWZIFZMJLFL-UHFFFAOYSA-N 0.000 description 2
- FENFUOGYJVOCRY-UHFFFAOYSA-N 1-propoxypropan-2-ol Chemical compound CCCOCC(C)O FENFUOGYJVOCRY-UHFFFAOYSA-N 0.000 description 2
- WMDZKDKPYCNCDZ-UHFFFAOYSA-N 2-(2-butoxypropoxy)propan-1-ol Chemical compound CCCCOC(C)COC(C)CO WMDZKDKPYCNCDZ-UHFFFAOYSA-N 0.000 description 2
- SBASXUCJHJRPEV-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethanol Chemical compound COCCOCCO SBASXUCJHJRPEV-UHFFFAOYSA-N 0.000 description 2
- CUDYYMUUJHLCGZ-UHFFFAOYSA-N 2-(2-methoxypropoxy)propan-1-ol Chemical compound COC(C)COC(C)CO CUDYYMUUJHLCGZ-UHFFFAOYSA-N 0.000 description 2
- DJCYDDALXPHSHR-UHFFFAOYSA-N 2-(2-propoxyethoxy)ethanol Chemical compound CCCOCCOCCO DJCYDDALXPHSHR-UHFFFAOYSA-N 0.000 description 2
- XYVAYAJYLWYJJN-UHFFFAOYSA-N 2-(2-propoxypropoxy)propan-1-ol Chemical compound CCCOC(C)COC(C)CO XYVAYAJYLWYJJN-UHFFFAOYSA-N 0.000 description 2
- KZTWONRVIPPDKH-UHFFFAOYSA-N 2-(piperidin-1-yl)ethanol Chemical compound OCCN1CCCCC1 KZTWONRVIPPDKH-UHFFFAOYSA-N 0.000 description 2
- WAEVWDZKMBQDEJ-UHFFFAOYSA-N 2-[2-(2-methoxypropoxy)propoxy]propan-1-ol Chemical compound COC(C)COC(C)COC(C)CO WAEVWDZKMBQDEJ-UHFFFAOYSA-N 0.000 description 2
- ICSNLGPSRYBMBD-UHFFFAOYSA-N 2-aminopyridine Chemical compound NC1=CC=CC=N1 ICSNLGPSRYBMBD-UHFFFAOYSA-N 0.000 description 2
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 2
- SVTBMSDMJJWYQN-UHFFFAOYSA-N 2-methylpentane-2,4-diol Chemical compound CC(O)CC(C)(C)O SVTBMSDMJJWYQN-UHFFFAOYSA-N 0.000 description 2
- QCDWFXQBSFUVSP-UHFFFAOYSA-N 2-phenoxyethanol Chemical compound OCCOC1=CC=CC=C1 QCDWFXQBSFUVSP-UHFFFAOYSA-N 0.000 description 2
- YEYKMVJDLWJFOA-UHFFFAOYSA-N 2-propoxyethanol Chemical compound CCCOCCO YEYKMVJDLWJFOA-UHFFFAOYSA-N 0.000 description 2
- VATRWWPJWVCZTA-UHFFFAOYSA-N 3-oxo-n-[2-(trifluoromethyl)phenyl]butanamide Chemical compound CC(=O)CC(=O)NC1=CC=CC=C1C(F)(F)F VATRWWPJWVCZTA-UHFFFAOYSA-N 0.000 description 2
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Chemical compound CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 description 2
- 239000004381 Choline salt Substances 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 239000004386 Erythritol Substances 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- AEMRFAOFKBGASW-UHFFFAOYSA-N Glycolic acid Chemical compound OCC(O)=O AEMRFAOFKBGASW-UHFFFAOYSA-N 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 2
- AMQJEAYHLZJPGS-UHFFFAOYSA-N N-Pentanol Chemical group CCCCCO AMQJEAYHLZJPGS-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- ZTHYODDOHIVTJV-UHFFFAOYSA-N Propyl gallate Chemical compound CCCOC(=O)C1=CC(O)=C(O)C(O)=C1 ZTHYODDOHIVTJV-UHFFFAOYSA-N 0.000 description 2
- DKGAVHZHDRPRBM-UHFFFAOYSA-N Tert-Butanol Chemical compound CC(C)(C)O DKGAVHZHDRPRBM-UHFFFAOYSA-N 0.000 description 2
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- BMRWNKZVCUKKSR-UHFFFAOYSA-N butane-1,2-diol Chemical compound CCC(O)CO BMRWNKZVCUKKSR-UHFFFAOYSA-N 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 2
- 229960000541 cetyl alcohol Drugs 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000003989 dielectric material Substances 0.000 description 2
- 229940019778 diethylene glycol diethyl ether Drugs 0.000 description 2
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 description 2
- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 2
- NOPFSRXAKWQILS-UHFFFAOYSA-N docosan-1-ol Chemical compound CCCCCCCCCCCCCCCCCCCCCCO NOPFSRXAKWQILS-UHFFFAOYSA-N 0.000 description 2
- LQZZUXJYWNFBMV-UHFFFAOYSA-N dodecan-1-ol Chemical compound CCCCCCCCCCCCO LQZZUXJYWNFBMV-UHFFFAOYSA-N 0.000 description 2
- POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 description 2
- 238000001312 dry etching Methods 0.000 description 2
- UNXHWFMMPAWVPI-ZXZARUISSA-N erythritol Chemical compound OC[C@H](O)[C@H](O)CO UNXHWFMMPAWVPI-ZXZARUISSA-N 0.000 description 2
- 235000019414 erythritol Nutrition 0.000 description 2
- 229940009714 erythritol Drugs 0.000 description 2
- 239000001530 fumaric acid Substances 0.000 description 2
- XPFVYQJUAUNWIW-UHFFFAOYSA-N furfuryl alcohol Chemical compound OCC1=CC=CO1 XPFVYQJUAUNWIW-UHFFFAOYSA-N 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- KQNPFQTWMSNSAP-UHFFFAOYSA-N isobutyric acid Chemical compound CC(C)C(O)=O KQNPFQTWMSNSAP-UHFFFAOYSA-N 0.000 description 2
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- FBSFWRHWHYMIOG-UHFFFAOYSA-N methyl 3,4,5-trihydroxybenzoate Chemical compound COC(=O)C1=CC(O)=C(O)C(O)=C1 FBSFWRHWHYMIOG-UHFFFAOYSA-N 0.000 description 2
- CRVGTESFCCXCTH-UHFFFAOYSA-N methyl diethanolamine Chemical compound OCCN(C)CCO CRVGTESFCCXCTH-UHFFFAOYSA-N 0.000 description 2
- XGFDHKJUZCCPKQ-UHFFFAOYSA-N nonadecan-1-ol Chemical compound CCCCCCCCCCCCCCCCCCCO XGFDHKJUZCCPKQ-UHFFFAOYSA-N 0.000 description 2
- CNNRPFQICPFDPO-UHFFFAOYSA-N octacosan-1-ol Chemical compound CCCCCCCCCCCCCCCCCCCCCCCCCCCCO CNNRPFQICPFDPO-UHFFFAOYSA-N 0.000 description 2
- REIUXOLGHVXAEO-UHFFFAOYSA-N pentadecan-1-ol Chemical compound CCCCCCCCCCCCCCCO REIUXOLGHVXAEO-UHFFFAOYSA-N 0.000 description 2
- GLOBUAZSRIOKLN-UHFFFAOYSA-N pentane-1,4-diol Chemical compound CC(O)CCCO GLOBUAZSRIOKLN-UHFFFAOYSA-N 0.000 description 2
- XLMFDCKSFJWJTP-UHFFFAOYSA-N pentane-2,3-diol Chemical compound CCC(O)C(C)O XLMFDCKSFJWJTP-UHFFFAOYSA-N 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 229920005862 polyol Polymers 0.000 description 2
- 229920000166 polytrimethylene carbonate Polymers 0.000 description 2
- YGSDEFSMJLZEOE-UHFFFAOYSA-N salicylic acid Chemical compound OC(=O)C1=CC=CC=C1O YGSDEFSMJLZEOE-UHFFFAOYSA-N 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 235000010356 sorbitol Nutrition 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- TYWMIZZBOVGFOV-UHFFFAOYSA-N tetracosan-1-ol Chemical compound CCCCCCCCCCCCCCCCCCCCCCCCO TYWMIZZBOVGFOV-UHFFFAOYSA-N 0.000 description 2
- HLZKNKRTKFSKGZ-UHFFFAOYSA-N tetradecan-1-ol Chemical compound CCCCCCCCCCCCCCO HLZKNKRTKFSKGZ-UHFFFAOYSA-N 0.000 description 2
- BSYVTEYKTMYBMK-UHFFFAOYSA-N tetrahydrofurfuryl alcohol Chemical compound OCC1CCCO1 BSYVTEYKTMYBMK-UHFFFAOYSA-N 0.000 description 2
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- 230000003287 optical effect Effects 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
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- 239000001301 oxygen Substances 0.000 description 1
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- AALKGALVYCZETF-UHFFFAOYSA-N pentane-1,2,3-triol Chemical compound CCC(O)C(O)CO AALKGALVYCZETF-UHFFFAOYSA-N 0.000 description 1
- MOIOWCZVZKHQIC-UHFFFAOYSA-N pentane-1,2,4-triol Chemical compound CC(O)CC(O)CO MOIOWCZVZKHQIC-UHFFFAOYSA-N 0.000 description 1
- WEAYWASEBDOLRG-UHFFFAOYSA-N pentane-1,2,5-triol Chemical compound OCCCC(O)CO WEAYWASEBDOLRG-UHFFFAOYSA-N 0.000 description 1
- WCVRQHFDJLLWFE-UHFFFAOYSA-N pentane-1,2-diol Chemical compound CCCC(O)CO WCVRQHFDJLLWFE-UHFFFAOYSA-N 0.000 description 1
- RUOPINZRYMFPBF-UHFFFAOYSA-N pentane-1,3-diol Chemical compound CCC(O)CCO RUOPINZRYMFPBF-UHFFFAOYSA-N 0.000 description 1
- GTCCGKPBSJZVRZ-UHFFFAOYSA-N pentane-2,4-diol Chemical compound CC(O)CC(C)O GTCCGKPBSJZVRZ-UHFFFAOYSA-N 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 150000002989 phenols Chemical group 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 239000003504 photosensitizing agent Substances 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
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- 235000019260 propionic acid Nutrition 0.000 description 1
- 239000000473 propyl gallate Substances 0.000 description 1
- 235000010388 propyl gallate Nutrition 0.000 description 1
- 229940075579 propyl gallate Drugs 0.000 description 1
- AOHJOMMDDJHIJH-UHFFFAOYSA-N propylenediamine Chemical compound CC(N)CN AOHJOMMDDJHIJH-UHFFFAOYSA-N 0.000 description 1
- 150000003222 pyridines Chemical class 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- 238000012958 reprocessing Methods 0.000 description 1
- 229960004889 salicylic acid Drugs 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229960002920 sorbitol Drugs 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 229940014800 succinic anhydride Drugs 0.000 description 1
- YNHJECZULSZAQK-UHFFFAOYSA-N tetraphenylporphyrin Chemical compound C1=CC(C(=C2C=CC(N2)=C(C=2C=CC=CC=2)C=2C=CC(N=2)=C(C=2C=CC=CC=2)C2=CC=C3N2)C=2C=CC=CC=2)=NC1=C3C1=CC=CC=C1 YNHJECZULSZAQK-UHFFFAOYSA-N 0.000 description 1
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- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
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Abstract
本發明提供一種用於自基材去除光阻之改良剝除劑溶液,其通常具有高於約95℃的閃點(flash point)及高負載能力。該剝除劑溶液包含二乙二醇丁基醚(diethylene glycol butyl ether)、氫氧化季銨及具有至少二碳原子、至少一胺基取代基及至少一羥基取代基的烷醇胺,該胺基和羥基取代基附接於二不同的碳原子。有些配方可另外含有輔助溶劑。該配方不含DMSO。本發明另外提供一種用於使用該剝除溶液之方法。
Description
本案請求2018年3月7日申請的美國臨時專利申請案第62/639,962號在35 U.S.C. § 119(e)保護之下的優先權,在此以引用之方式將其全文併入本文。
本發明大體上關於具有能自基材上有效去除光阻的組合物及使用此組合物的方法。所揭示的組合物是用於去除光阻的剝除劑溶液,所述光阻能夠在低於正常室溫的溫度並且在運輸和倉儲中經常遇到的溫度下保持液體,具有遠高於正常加工溫度的閃點,並且附帶地與聚合性介電材料具有相容性。
於本發明之一態樣中,提供自基材上有效去除或剝除正型或負型光阻的光阻剝除劑溶液(也被稱作組合物)。本發明的剝除劑溶液對光阻材料具有特別高的負載能力,並且當經受低於運輸、倉儲及在一些製造設施中使用時經常遇到的正常室溫之溫度時保持液體的能力。該組合物具有高於95°C的閃點(flashpoint)。更佳的配方具有高於等於99℃的閃點。該組合物具有充分低於0°C的凍結點(freezing point)以使運輸和倉儲期間的固化現象減至最低。更佳的配方具有低於約-10℃的凍結點。
根據本揭示內容的組合物通常含有二乙二醇丁基醚(DB)、氫氧化季銨及烷醇胺或輔助溶劑或兩者。一較佳具體實例含有約30重量百分比至約97重量百分比的二乙二醇丁醚(DB)、約1重量百分比至約7重量百分比的氫氧化季銨及約1重量百分比至約75重量百分比的烷醇胺。較佳的季銨基係(C1
-C8
)烷基、苯甲基、芳烷基、(C1
-C5
)醇及其組合。特佳的氫氧化季銨包括氫氧化四甲基銨(TMAH)、氫氧化四乙基銨(TEAH)、氫氧化乙基三甲基銨(ETMAH)、氫氧化膽鹼及氫氧化二甲基二丙基銨。較佳的烷醇胺包括單乙醇胺(MEA)及(2-(2-胺基乙氧基)乙醇)(AEE)。該組合物基本上不含DMSO。根據本揭示內容的另一具體實例含有另外的或輔助溶劑。較佳的輔助溶劑包括二醇、二醇醚及多羥基化合物等。
根據本揭示內容的另一具體實例含有DB、氫氧化季銨、水及腐蝕抑制劑。此具體實例基本上不含烷醇胺、輔助溶劑及DMSO。
本揭示內容的第二態樣提供使用上述新型剝除劑溶液自基材上去除光阻及相關聚合性材料的方法。光阻可藉由使該基材與剝離溶液接觸足夠的時間以去除所需量的光阻,藉由自該剝離溶液去除該基材,用去離子水或溶劑自該基材上沖洗該剝除溶液並且乾燥該基材,而自其上具有光阻的選定基材去除光阻。
本揭示內容的第三態樣包括藉由所揭示的新穎方法所製造的電子裝置。
由以下更詳細的描述,結合藉由示例的方式舉例說明本發明原理之附圖將使本發明的其他特徵及優點將變得顯而易見。
為了達成促進對請求保護的內容的理解之目的,現在將參考所例示的具體實例並且將使用特定語言來描述該具體實例。然而,應該理解的是,從而無意限制所請求保護的範圍,這些變化及進一步的修飾以及如其中所例示的原理的這種進一步應用被認為是該揭示內容關聯的領域之習知技藝者通常會想到的。
於一具體實例中,根據本揭示內容的組合物包括二乙二醇丁基醚(DB)溶劑、氫氧化季銨、水、腐蝕抑制劑及輔助溶劑或具有至少二碳原子的烷醇胺、至少一胺基取代基及至少一羥基取代基,該胺基和羥基取代基附接於二不同的碳原子。較佳的四級取代基包括(C1
-C8
)烷基、苯甲基及其組合。具有增量烷醇胺的配方具有對碳鋼特別不具腐蝕性的優點,並且對典型的廢物處理系統及輔助裝備的損害小於其他剝除劑溶液。於一些具體實例中,該配方可另外包含輔助溶劑。於一具體實例中,該配方可含有約0.2重量百分比至約75重量百分比的輔助溶劑。特別有用的輔助溶劑包括二醇、二醇醚及以下更詳細地描述的多羥基化合物。於一些具體實例中,該輔助溶劑包括3-甲氧基-3-甲基-1-丁醇(MMB)或丙二醇(PG)。特別合適的配方具有充分低於0℃的凍結點以使運輸和儲存期間的固化最小化。更佳的配方的凍結點低於約-10℃、低於約-15℃或低於約-19℃。較佳的配方具有充分高於90℃的閃點以使使用期間的可燃性危險最小化。更佳的配方具有高於約95℃、高於約97℃、高於約99℃或高於約100℃的閃點。因為較佳的剝離劑溶液於低溫下保持液態,所以使在寒冷天氣期間接收或在該溶液可以使用之前儲存於沒加熱的倉庫中之剝離劑溶液的固化鼓液化的需求得以消除或最小化。使用鼓式加熱器將固化的剝除劑溶液熔化很耗時,需要額外的處理並且可能導致熔融溶液的組合物的不完全熔化及改質。於一些具體實例中,該組合物不含或基本上不含二甲基亞碸(DMSO)。於一些具體實例中,該組合物可以不含或基本上不含烷醇胺。於一些具體實例中,該組合物可以不含或基本上不含輔助溶劑。
於可供選擇的具體實例中、根據本揭示內容的組合物包括DB以外的溶劑、如二乙二醇甲基醚、二乙二醇乙基醚、二乙二醇丙基醚、丙二醇甲基醚、二丙二醇甲基醚、丙二醇丙基醚、二丙二醇丙基醚、丙二醇苯基醚、丙二醇正丁基醚、二丙二醇正丁基醚、乙二醇丙基醚、乙二醇丁基醚、乙二醇苯基醚、三丙二醇甲酯基醚、二丙二醇二甲基醚、二乙二醇甲基乙基醚、二乙二醇二甲基醚、二乙二醇二乙基醚、氫氧化季銨、水、腐蝕抑制劑及輔助溶劑或具有至少二碳原子的烷醇胺、至少一胺基取代基和至少一羥基取代基,該胺基和羥基取代基附接於二不同的碳原子。
此外,根據本揭示內容的組合物顯示高的負載能力,使得該組合物能去除更大量的光阻而沒有固體沉澱。該負載能力係定義為在材料重新沉積於晶片上之前或在殘留物留於晶片上之前,每公升剝離劑溶液可去除的光阻或雙層材料的cm3
數目。舉例來說,若20公升的剝除劑溶液在重新沉積或殘留物留於晶片上之前可去除300 cm3
的光阻,則該負載能力為300 cm3
/20升= 15cm3
/升。
根據本揭示內容的組合物顯現與聚合性介電材料如聚醯亞胺(PI)和聚苯并噁唑(PBO)的良好相容性。低蝕刻速率證明有良好的相容性。本揭示內容的組合物可顯現與PI的良好相容性,或與PBO的良好相容性,或與PI和PBO的良好相容性。PI的蝕刻速率可小於約20 nm/min,或小於約10 nm/min,或小於約5 nm/min,或小於約3 nm/min,或小於約2 nm/min。,或小於約1 nm/min。或者,PBO的蝕刻速率可小於約20 nm/min,或小於約10 nm/min,或小於約5 nm/min,或小於約3 nm/min,或小於約2 nm/min,或小於約1 nm/min。此外,PI和PBO的蝕刻速率可小於約20 nm/min,小於約10 nm/min,小於約5 nm/min,或小於約3 nm/min,或小於約2 nm/min,或小於約1 nm/min。
本發明的組合物中的二乙二醇丁基醚(DB)的重量百分比可為約30百分比重量至約97百分比重量。於其他具體實例中,該組合物可含有約40重量百分比至約97重量百分比、約50重量百分比至約97重量百分比的DB,或約60重量百分比至約97重量百分比的DB。於一些具體實例中,該組合物含有大於約30重量百分比、大於約40重量百分比、大於約50重量百分比或大於約60重量百分比的DB。前三句中任何方才描述的量皆可依任何組合用作端點以描述本發明的組合物中的DB重量百分比,舉例來說,約30至約60重量百分比的DB。於另一具體實例中,DB的量與溶液中的水量之比率大於約5、大於約9、大於約10、大於約15、大於約20、大於約50、大於約100、大於約1000、及/或大於約3000。於另一具體實例中,DB的量與水量之比率為約5至約10,000、或約9至約10,000、或約10至約10,000、或約15至約10,000、或約5至約6,000、或約9至約6,000、或約10至約6,000、或約15至約6,000。前兩句中任何方才描述的量皆可依任何組合用作端點,以描述DB的量與本發明的組合物中的水量之比率,舉例來說,約50至約6000。
本發明的組合物中二乙二醇丁基醚(DB)的重量百分比及烷醇胺的重量百分比之和可為約55重量百分比至約97重量百分比。於其他具體實例中,該組合物可含有約55重量百分比至約95重量百分比、約65重量百分比至約95重量百分比、約70重量百分比至約97重量百分比、約75重量百分比至約95重量百分比、約80重量百分比至約97重量百分比、約85重量百分比至約97重量百分比、約85重量百分比至約95重量百分比、約90重量百分比至約97重量百分比、75重量百分比至約90重量百分比、約75重量百分比至約85重量百分比的二乙二醇丁基醚(DB)和烷醇胺。前兩句中任何方才描述的量皆可依任何組合用作端點,以描述本發明的組合物中DB和烷醇胺的重量百分比,例如,約95至約97重量%的DB和烷醇胺。於一些具體實例中,二乙二醇丁基醚(DB)的重量百分比烷醇胺的重量百分比更多,並且二乙二醇丁基醚(DB)可以比存有的烷醇胺量多約20%至約90%、約20%至約40%、約70%至約90%、約10%至約50%、約40%至約90%、或約30%至約90%的量存於該組合物。於一些具體實例中、二乙二醇丁基醚(DB) 可以比存有的烷醇胺量多約20%、約30%、約35%、約40%、約50%、約70%、約75%、約80%、或約85%的量存於該組合物。前一句中任何方才描述的量皆可以任何組合用作端點以描述範圍,舉例來說,比存有的烷醇胺的量多約30%至約75%。
於其他組合物中,二乙二醇丁基醚 (DB)的重量百分比比烷醇胺的重量百分比小,而且二乙二醇丁基醚 (DB)可以比烷醇胺存有的量少5%至約30%、10%至約30%、10%至約25%、或10%至約20%的量存於該組合物中。
於一些具體實例中,烷醇胺的重量百分比可為約1重量百分比至約75重量百分比、約2重量百分比至約70重量百分比、約2重量百分比至約60重量百分比、約2重量百分比至約50重量百分比、約2重量百分比至約40重量百分比、約3重量百分比至約65重量百分比、約3重量百分比至約60重量百分比、約3重量百分比至約50重量百分比、約3重量百分比至約40重量百分比、約4重量百分比至約60重量百分比、約4重量百分比至約50重量百分比、約4重量百分比至約40重量百分比、約7重量百分比至約50重量百分比、約10重量百分比至約50重量百分比、約10重量百分比至約40重量百分比、約15重量百分比至約35重量百分比、約20重量百分比至約50重量百分比、約20重量百分比至約40重量百分比、約1重量百分比至約10重量百分比、約2重量百分比至約10重量百分比、或約3重量百分比至約10重量百分比。
該組合物可包含約0.1重量百分比至約10重量百分比、0.2重量百分比至約8重量百分比、0.3重量百分比至約6重量百分比、0.5重量百分比至約5重量百分比、1重量百分比至約4重量百分比、約1重量百分比至約6重量百分比、約1重量百分比 to 7重量百分比、約0.1重量百分比至約6重量百分比、或約1重量百分比至約5重量百分比的氫氧化季銨。較佳的四級取代基包括(C1
-C8
)烷基、苯甲基、芳烷基、(C1
-C5
)醇及其組合。於一些具體實例中,氫氧化季銨可包括氫氧化四甲基銨(TMAH)、氫氧化四乙基銨(TEAH)、氫氧化乙基三甲基銨(ETMAH)、氫氧化二甲基二丙基銨(DMDPAH)及/或氫氧化膽鹼(CH)。於一些具體實例中,該氫氧化季銨可不含或基本上不含氫氧化四甲基銨(TMAH)。
使用時,輔助溶劑可佔該組合物的約1重量百分比至約75重量百分比、約5重量百分比至約30重量百分比、約0.2重量百分比至約35重量百分比、約0.2重量百分比至約30重量百分比、約0.2重量百分比至約25重量百分比、約0.2重量百分比至約20重量百分比、約0.2重量百分比至約15重量百分比、約0.2重量百分比至約12重量百分比、約5重量百分比至約12重量百分比、或約5重量百分比至約15重量百分比。該剝除配方也含有視需要的表面活性劑,通常於約0.01重量百分比至約3重量百分比範圍中的水準。因為有些剝除劑溶液組分可以水溶液形態提供,所以該組合物可附帶地含有水。存有的話,水可佔該組合物的約0.01重量百分比至約50重量百分比、約0.01重量百分比至約40重量百分比、約0.01重量百分比至約30重量百分比、約0.01重量百分比至約25重量百分比、約0.01重量百分比至約20重量百分比、約0.01重量百分比至約15重量百分比、約0.01重量百分比至約10重量百分比、約0.01重量百分比至約7重量百分比、約0.01重量百分比至約5重量百分比、約0.01重量百分比至約3重量百分比、約0.01重量百分比至約1重量百分比、約0.1重量百分比至約20重量百分比、約0.1重量百分比至約10重量百分比、約0.1重量百分比至約7重量百分比、約1重量百分比至約15重量百分比、約1重量百分比至約7重量百分比、約2重量百分比至約10重量百分比、約2重量百分比至約7重量百分比、約3重量百分比至約10重量百分比、約3重量百分比至約7重量百分比、約0.001重量百分比至約7重量百分比、約0.001重量百分比至約10重量百分比、約1重量百分比至約10重量百分比。於其他具體實例中,水可佔該組合物的小於50重量百分比、小於40重量百分比、小於30重量百分比、小於25重量百分比、小於20重量百分比、小於15重量百分比、小於10重量百分比、小於7重量百分比、小於5重量百分比、小於3重量百分比、或小於1重量百分比。
合適的烷醇胺具有至少二碳原子並且具有在不同碳原子上的胺基和羥基取代基。合適的烷醇胺包括,但不限於,乙醇胺、N-甲基乙醇胺、N-乙基乙醇胺、N-丙基乙醇胺、N-丁基乙醇胺、二甲基乙醇胺、二乙基乙醇胺、二乙醇胺、三乙醇胺、N-甲基二乙醇胺、N-乙基二乙醇胺、異丙醇胺、二異丙醇胺、三異丙醇胺、N-甲基異丙醇胺、N-乙基異丙醇胺、N-丙基異丙醇胺、2-胺基丙-1-醇、N-甲基-2-胺基丙-1-醇、N-乙基-2-胺基丙-1-醇、1-胺基丙-3-醇、N-甲基-1-胺基丙-3-醇、N-乙基-1-胺基丙-3-醇、1-胺基丁-2-醇、N-甲基-1-胺基丁-2-醇、N-乙基-1-胺基丁-2-醇、2-胺基丁-1-醇、N-甲基-2-胺基丁-1-醇、N-乙基-2-胺基丁-1-醇、3-胺基丁-1-醇、N-甲基-3-胺基丁-1-醇、N-乙基-3-胺基丁-1-醇、1-胺基丁-4-醇、N-甲基-1-胺基丁-4-醇、N-乙基-1-胺基丁-4-醇、1-胺基-2-甲基丙-2-醇、2-胺基-2-甲基丙-1-醇、1-胺基戊-4-醇、2-胺基-4-甲基戊-1-醇、2-胺基己-1-醇、3-胺基庚-4-醇、1-胺基辛-2-醇、5-胺基辛-4-醇、1-胺基丙-2,3-二醇、2-胺基丙-1,3-二醇、叁(氧甲基)胺基甲烷、1,2-二胺基丙-3-醇、1,3-二胺基丙-2-醇、2-(2-胺基乙氧基)乙醇、4-(2-羥乙基)嗎啉、1-(2-羥乙基)六氫吡啶及1-(2-羥乙基)六氫吡啶。
該輔助溶劑可包括醇、二醇醚、二醇或多羥基化合物或這些中的二或多者之組合。
較佳的輔助溶劑醇、二醇醚、二醇及多羥基化合物不含酯或胺基。該醇、二醇醚、二醇或多羥基化合物可為脂族、脂環族、環狀或芳族,但是合宜地為脂族或脂環族。該醇、二醇醚、二醇或多羥基化合物可為飽和或不飽和,而且適宜地具有一或更少不飽和鍵,或沒有不飽和鍵。該該醇、二醇醚、二醇及多羥基化合物適宜地不含雜原子。該該醇、二醇醚、二醇及多羥基化合物適宜地僅含有碳、氧及氫原子。
至於輔助溶劑醇類的實例,可提及線性醇類及支鏈醇類及芳族醇類。舉例說明該溶液的醇可包括甲醇、乙醇、丙醇、異丙醇、丁醇、第三丁醇、第三戊醇、3-甲基-3-戊醇、1-辛醇、1-癸醇、1-十一烷醇、1-十二烷醇、1-十三烷醇、1-十四烷醇、1-十五烷醇、1-十六烷醇、9-十六碳烯-1-醇、1-十七烷醇、1-十八烷醇、1-十九烷醇、1-二十烷醇、1-二十一烷醇、1-二十二烷醇、13-二十二碳烯-1-醇、1-二十四烷醇、1-二十六烷醇、1-二十七烷醇、1-二十八烷醇、1-三十烷醇、1-三十二烷醇、1-三十四烷醇、鯨蠟硬脂醇、呋喃甲醇、四氫呋喃甲醇。於例示性實例中,該溶液可包括呋喃甲醇、四氫呋喃甲醇、第三丁醇或3-甲基-3-戊醇中的一或多者。
如上所述,該輔助溶劑可為具有二或更多羥基的多羥基化合物。該多羥基化合物理想上具有不大於500、或不大於400、或不大於350、或不大於300、或不大於275、或不大於250、或不大於225、或不超過200、或不大於175、或不大於150、或不大於125、或不大於100、或不大於75的分子量。
作為輔助溶劑的多羥基化合物可包括乙二醇;1,2-丙二醇(丙二醇);1,3-丙二醇;1,2,3-丙三醇;1,2-丁二醇;1,3-丙二醇;2,3-丁二醇;1,4-丁二醇;1,2,3-丁三醇;1,2,4-丁三醇;1,2-戊二醇;1,3-戊二醇;1,4-戊二醇;2,3-戊二醇;2,4-戊二醇;3,4-戊二醇;1,2,3-戊三醇;1,2,4-戊三醇;1,2,5-戊三醇;1,3,5-戊三醇;驅蚊醇(etohexadiol);對-甲烷-3,8-多羥基化合物;2-甲基-2,4-戊二醇;2,2-二甲基-1,3-丙二醇;甘油;三羥甲基丙烷;木糖醇;阿拉伯糖醇;1,2-或1,3-環戊二醇;1,2-或1,3-環己二醇;2,3-降冰片烷二醇;1,8-辛二醇;1,2-環己烷二甲醇;1,3-環己烷二甲醇;1,4-環己烷二甲醇;2,2,4-三甲基-1,3-戊二醇;羥基新戊醯羥基新戊酸酯(hydroxypivalyl hydroxypivalate);2-甲基-1,3-丙二醇;2-丁基-2-乙基-1,3-丙二醇;2-乙基-2-異丁基-1,3-丙二醇;1,6-己二醇;2,2,4,4-四甲基-1,6-己二醇;1,10-癸二醇;1,4-苯二甲醇;氫化雙酚A;1,1,1-三羥甲基丙烷;1,1,1-三羥甲基乙烷;季戊四醇;赤蘚糖醇;蘇糖醇;二季戊四醇;山梨糖醇;甘油;及木糖醇等,以及上述多羥基化合物和多羥基化合物中的二或更多之組合。
於例示性實例中,該溶液可包括乙二醇、1,2-丙二醇(丙二醇)、1,3-丙二醇、1,4-戊二醇、1,2-丁二醇或1,3-丁二醇的二級多羥基溶劑中之一或多者。
作為輔助溶劑的二醇醚化合物可包括3-甲氧基-3-甲基-1-丁醇、二乙二醇甲醚、二乙二醇乙醚、二乙二醇丙醚、丙二醇甲醚、二丙二醇甲醚、丙二醇 丙醚、二丙二醇丙醚、丙二醇苯醚、丙二醇正丁醚、二丙二醇正丁醚、乙二醇丙醚、乙二醇丁醚、乙二醇苯醚、三丙二醇甲醚、二丙二醇二甲醚 醚、二乙二醇甲基乙醚、二乙二醇二甲醚或二乙二醇二乙醚。
該組合物也可視需要地含有一或更多腐蝕抑制劑。合適的腐蝕抑制劑包括,但不限於,芳族羥基化合物,例如鄰苯二酚和間苯二酚;烷基鄰苯二酚類,例如甲基鄰苯二酚、乙基鄰苯二酚和第三丁基鄰苯二酚、苯酚類及五倍子酚(pyrogallol);芳香三唑類例如苯并三唑;烷基苯并三唑類;糖醇類例如甘油、山梨糖醇、赤蘚糖醇、木糖醇;羧酸類例如甲酸、乙酸、丙酸、丁酸、異丁酸、草酸、丙二酸、丁二酸、癸二酸、十二烷酸、十一烷酸、戊二酸、馬來酸、富馬酸、苯甲酸、鄰苯二甲酸、1,2,3-苯三甲酸、乙醇酸、乳酸、蘋果酸、檸檬酸、乙酸酐、鄰苯二甲酸酐、反丁烯二酸酐、丁二酸酐、水楊酸、沒食子酸及沒食子酸酯類例如沒食子酸甲酯、沒食子酸丙酯;金屬鹽類例如硝酸銅(II)的水合物例如硝酸銅(II)半(五水合物);上述含有羧基的有機化合物的有機鹽、鹼性物質例如三甲基胺、二乙基胺及吡啶類例如2-胺基吡啶等;及螯合化合物例如磷酸系螯合化合物(包括1,2-丙二胺四亞甲基膦酸和羥基乙烷膦酸在內)、羧酸系螯合化合物(例如乙二胺四醋酸及其鈉鹽和銨鹽、二羥基乙基甘胺酸及次氮基三乙酸(nitrilotriacetic acid)、胺系螯合化合物(例如聯吡啶、四苯基卟啉及菲啉)以及肟系螯合化合物(例如二甲基乙二肟及二苯基乙二肟)。可以使用單一腐蝕抑制劑,或者可以使用腐蝕抑制劑的組合。已證明腐蝕抑制劑的用量介於約1 ppm至約10%。於一具體實例中,該溶液可含有約0.001重量百分比至約3重量百分比的第一腐蝕抑制劑。於一具體實例中,該第一腐蝕抑制劑係硝酸銅(II)的水合物。於一具體實例中,該溶液可另外含有約0.05重量百分比至約7重量百分比的第二腐蝕抑制劑。於其他具體實例中,該溶液可含有約0.001重量百分比至約2重量百分比、約0.001重量百分比至約1重量百分比, 0.001重量百分比至約0.1重量百分比、約0.01重量百分比至約3重量百分比、約0.01重量百分比至約2重量百分比、約0.01重量百分比至約1重量百分比、至少0.001重量百分比、至少0.01重量百分比、至少0.1重量百分比、小於約0.05重量百分比、小於約0.1重量百分比、小於約0.5重量百分比、小於約1重量百分比、小於約2重量百分比及/或小於約3重量百分比的第一腐蝕抑制劑。於其他具體實例中,該溶液可含有約0.05重量百分比至約5重量百分比、約0.05重量百分比至約3重量百分比、約0.05重量百分比至約2重量百分比、約0.05重量百分比至約1重量百分比、約0.1重量百分比至約7重量百分比、約0.1重量百分比至約5重量百分比、約0.1重量百分比至約3重量百分比、約0.1重量百分比至約2重量百分比、約0.1重量百分比至約1重量百分比、至少0.05重量百分比、至少0.1重量百分比、至少1重量百分比、小於1重量百分比、小於2重量百分比、小於約3重量百分比、小於約5重量百分比及/或小於約7重量百分比的第二腐蝕抑制劑。該第一和第二腐蝕抑制劑不相同。在其他具體實施例中,該第一腐蝕抑制劑和該第二腐蝕抑制劑皆可選自上述腐蝕抑制劑。於一些具體實例中,該組合物可基本上不含金屬鹽。於一些具體實例中,該組合物可基本上不含糖醇。
較佳之視需要的表面活性劑包括氟表面活性劑。較佳的氟表面活性劑之一實例係DuPont FSO (含有聚乙二醇(50%)、乙二醇(25%)、1,4-二噁烷(<0.1%)、水25%的氟化調聚物B單醚)。較佳的氟表面活性劑之另一實例係DuPont,Capstone,FS-10 (水中30%全氟烷基磺酸)。
本發明進一步提供一種去除至少一光阻層之方法,其包含以下步驟:使包含至少一光阻層的基材與本發明的任何剝離劑溶液於一溫度下接觸一段時間以至少部分地去除前述至少一光阻層;及在前述接觸步驟之後沖洗前述基材。該接觸時間通常介於10分鐘至120分鐘之間;然而,其取決於層、材料、被去除的殘留物及其厚度、剝除劑溶液的溫度以及接觸步驟的類型(例如浸漬、噴塗或兩者的組合)以及介於基材與清潔溶液之間的任何相對運動。
接觸該基材較佳為至少50℃的較佳溫度,而對於大多數應用,更佳為約50℃至約80℃的溫度。於另一具體實例中,較佳的溫度比該溶液的閃點低至少5°C,或比該溶液的閃點低至少10°C,或比該溶液的閃點低至少20°C點。或者,較佳的溫度低於101℃或低於96℃或低於86℃。對於該基材敏感或需要更長的去除時間之特定應用,較低的接觸溫度是合適的。舉例來說,當將基材再加工時,將該剝離劑溶液保持於至少20℃的溫度下較長時間以去除光阻並且避免損及該基材可能是合適的。
當浸漬基材時,該組合物的攪動附帶地促進光阻的去除。攪動可藉由機械攪拌、循環或藉由使惰性氣體起泡通過該組合物達到。當去除所需量的光阻時,該基材與該剝除劑溶液接觸並且用水或醇或含水醇溶液沖洗而移除。去離子水是水的較佳形式而且異丙醇是較佳的醇。對於具有經受氧化的組分之基材,沖洗較佳在惰性氣氛作用之下進行。根據本揭示內容的較佳剝除劑溶液與現有的商業產品相比具有改進的光阻材料負載能力,並且能夠用特定體積的剝除劑溶液處理更大數量的基材。
此揭示內容提供的剝除劑溶液可用以去除存於單層或某些類型的雙層光阻中之正型或負型聚合性光阻材料。舉例來說,雙層阻劑通常具有被第二聚合性層覆蓋的第一無機層或可具有二聚合性層。利用下文教導的方法,可自具有單一聚合物層的標準晶圓有效地去除單層聚合性光阻單層。該方法也可用以自具有由第一無機層和第二或外側聚合物層所構成之雙層的晶圓去除單一聚合物層。最後,可自具有由二聚合性層所構成之雙層的晶圓有效地去除二聚合物層。
該配方可用於去除可能是薄或厚光阻之任何厚度的正型和負型光阻,較佳為正型光阻。該光阻的厚度可介於1 µm 至150 µm或1 µm至100 µm或 2 µm至70 µm或10 µm至100 µm。正型光阻的實例包括來自AZ Electronic Materials的AZ®6130及來自Tokyo Ohka Kogyo的TOK PC0421、TOK PW1000及TOK CR4000。可使用本發明的組合物去除的負型光阻之實例包括來自JSR Micro的JSR-THB光阻。典型的正型光阻由酚醛樹脂及光酸產生劑構成。典型的負型光阻由多官能性丙烯酸酯、丙烯酸樹脂及光敏劑構成。
本揭示內容描述用於半導體裝置的先進封裝應用中去除厚光阻的化學溶液。於一具體實例中,所述的溶液含有二乙二醇丁基醚(DB)、烷醇胺及/或輔助溶劑、水、氫氧化季銨及至少一腐蝕抑制劑。該溶液基本上不含DMSO。於一些具體實例中,該烷醇胺係單乙醇胺或2-(2-胺基乙氧基)乙醇。於一些具體實例中,該輔助溶劑係3-甲基-3-甲氧基-1-丁醇或丙二醇。於一些具體實例中,該氫氧化季銨可為TMAH、TEAH、ETMAH、氫氧化膽鹼或氫氧化二甲基二丙基銨。基本上不含意指小於1百分比,或者小於0.1百分比,或者小於0.01百分比或小於0.001百分比。基本上不含也包括不含DMSO。該溶液也視需要地含有表面活性劑。該溶液含有小於約10重量百分比的水。於一具體實例中,該溶液含有介於約0.001重量百分比至約10重量百分比的水。於一些具體實例中,該組合物可基本上不含烷醇胺或輔助溶劑或烷醇胺和輔助溶劑兩者。
本發明組合物的一些具體實例可基本上不含,或者不含(如前面定義的那些措辭)下列一或多者:含氮溶劑、雙-膽鹼鹽、三-膽鹼鹽、氧代銨化合物、羥胺類及其衍生物、甲基二乙醇胺類、胺基乙基乙醇胺類、過氧化氫、氧化劑、無機酸類、有機酸類、酸類、無機鹼類、氫氧化鉀、吡唑、金屬氫氧化物、二醇類、多元醇類、NMP、表面活性劑、含金屬化合物、糖醇類和芳族羥基化合物、含氟-、溴-、氯-或碘-化合物;含磷化合物、鈣及研磨材料及其任何組合。
關於下文所述的實驗,有觀察到光阻去除現象並且相應地記下來。若自該晶圓試樣表面去除所有光阻,則將光阻去除定義為“清潔”;若自該表面去除至少95%的光阻而不是所有的光阻,則定義為“大概清潔”;而且若自該表面去除至少約80%的光阻但是少於95%的光阻,則定義為“局部清潔”。
將下列縮寫應用於下面列出的各種組合物:DB = 二乙二醇丁基醚;DMSO =二甲基亞碸;MEA =單乙醇胺;MMB = 3-甲氧基-3-甲基-1-丁醇;TMAH =氫氧化四甲基銨;TEAH = 氫氧化四乙基銨;DMDPAH = 氫氧化二甲基二丙基銨;AEE = 2-(2-胺基乙氧基乙醇。
表1中列出各種獨創性及比較性剝除組合物。
表1. 配方
(所有百分比係以該配方的總重量為基準計的重量百分比)
實施例1
表2列出實施例1使用浸漬製程及具有60μm至70μm厚的JSR THB-151N負型旋塗光阻及帶有Sn /Ag焊料蓋的電鍍Cu柱之半導體晶圓進行測試的剝除組合物。關於該浸漬製程,於燒杯中處理切成試樣尺寸的半導體晶圓樣品。在燒杯中裝入100 mL剝除組合物並且加熱至70℃的目標溫度。當該剝除組合物處於目標溫度時,將試樣放入試樣座的燒杯中,並且藉由攪拌棒稍微攪拌。於整個製程中將溫度保持於70℃的目標溫度。經過15分鐘的總處理時間之後,將該試樣自該燒杯取出,用去離子水和IPA沖洗,並且用空氣流乾燥。表1中所有組合物的加工溫度為70℃。
關於上述實驗,有觀察到光阻去除現象並且相應地記下來。若自該晶圓試樣表面去除所有光阻,則將光阻去除定義為“清潔”;若自該表面去除至少95%的光阻則為“大概清潔”;若自該表面去除至少約80%的光阻則為“局部清潔”。含有DB溶劑及僅4.5% MEA的配方1不能完全去除負型光阻。所有其他測試的配方含有30% MEA並且能夠完全去除負型光阻。
表2. Cu柱晶圓的光阻去除結果
實施例2
表3列出實施例2使用浸漬製程及具有已經藉由電漿乾式蝕刻處理過的正型光阻之半導體晶圓進行測試的剝除組合物。關於該浸漬製程,於燒杯中處理切成試樣尺寸的半導體晶圓樣品。在燒杯中裝入100 mL剝除組合物並且加熱至60℃的目標溫度。當該剝除組合物處於目標溫度時,將試樣放入試樣座的燒杯中,並且藉由攪拌棒稍微攪拌。於整個製程中將溫度保持於60℃的目標溫度。經過15分鐘的總處理時間之後,將該試樣自該燒杯取出,用去離子水和IPA沖洗,並且用空氣流乾燥。表3中所有組合物的加工溫度為60℃。
關於上述實驗,有觀察到光阻去除現象並且相應地記下來。若自該晶圓試樣表面去除所有光阻,則將光阻去除定義為“清潔”;若自該表面去除至少95%的光阻則為“大概清潔”;若自該表面去除至少約80%的光阻則為“局部清潔”。所有測試的配方皆完全去除經電漿處理的正型光阻。
表3. 經過乾式蝕刻之後的正型光阻之光阻去除結果
實施例3
表4列出實施例3使用浸漬製程測量固化聚醯亞胺(PI)膜及固化聚苯并噁唑(PBO)膜進行測試的剝除組合物。測試係利用塗佈著固化空白PI膜或固化空白PBO膜的半導體晶圓進行。關於該浸漬製程,於燒杯中處理切成試樣尺寸的半導體晶圓樣品。在燒杯中裝入100 mL剝除組合物並且加熱至60℃的目標溫度。當該剝除組合物處於目標溫度時,將試樣放入試樣座的燒杯中,並且藉由攪拌棒稍微攪拌。於整個製程中將溫度保持於60℃的目標溫度。經過15分鐘的總處理時間之後,將該試樣自該燒杯取出,用去離子水和IPA沖洗,並且用空氣流乾燥。
對於所測試的各試樣,在處理之前和之後測量聚醯亞胺膜的厚度。各試樣的厚度係兩個點的平均值。用厚度變化來計算平均蝕刻速率。影響PI和PBO相容性的因素包括溶劑、烷醇胺和水量。含有> 3%水的配方9和比較性配方2顯現對PBO的最低蝕刻速率。含有DMSO的比較性配方1和2顯現對PI的最高蝕刻速率。含有4.5% MEA的配方1具有比含有30% MEA的配方2更低的PI蝕刻速率。由於使用DB溶劑、AEE及> 3%水,只有配方9同時對PI和PBO具有低蝕刻速率。
表4. PI和PBO於60°C下的蝕刻速率
實施例4
表5列出實施例3使用浸漬製程觀察與含有圖案化低溫固化PI膜的相容性進行測試的剝除組合物。測試係利用塗佈著圖案化低溫固化PI膜的半導體晶圓進行。關於該浸漬製程,於燒杯中處理切成試樣尺寸的半導體晶圓樣品。在燒杯中裝入100 mL剝除組合物並且加熱至60℃的目標溫度。當該剝除組合物處於目標溫度時,將試樣放入試樣座的燒杯中,並且藉由攪拌棒稍微攪拌。於整個製程中將溫度保持於60℃的目標溫度。經過指定處理時間之後,將該試樣自該燒杯取出,用去離子水和IPA沖洗,並且用空氣流乾燥。
在浸漬處理之前和之後藉由光學顯微鏡觀察圖案化PI膜。若與處理之前的觀察結果相比,處理之後的圖案化PI膜的外觀沒有可觀察到的差異,則將觀察結果記錄為“無變化”。若在處理之後觀察到處理之前沒出現的圖案化PI膜中的裂縫,則將觀察結果記錄為“有裂縫形成”。裂縫的形成表示該配方使PI膜降解。
儘管本發明已經參照一或更多實施例來描述,但是該領域之習知技藝者將理解,在不悖離本發明範圍的情況下,可進行各種改變,並且可用等效物取代其構成成分。此外,在不悖離本發明基本範圍的情況下,可進行許多修飾以使特定情況或材料適應本發明的教導。因此,其意指本發明不限於作為實施本發明的最佳方式揭示的特定具體實例,而是本發明將包括落入後附申請專利範圍的範疇以內的所有具體實例。此外,於詳細描述中標記的所有數值應被解釋成精確和近似值皆經明確標記。再者,於說明書及申請專利範圍中對“具有”、“包含”或“含有”等的任何使用包括更窄的敘詞:“基本上由.....組成”及“由.....組成”,如同其明確地寫在“具有”、“包含”或“含有”等之後的替代方案。此外,用以描述剝除劑組合物的任何組分的冠詞“一”或“該”的使用應解釋為無論其出現於說明書及申請專利範圍的任何地方皆得視為其被替換為“一或更多“。若沒有另行指明,所有百分比均以重量計。
Claims (17)
- 一種用於自基材去除光阻之剝除劑溶液,其包含:約30重量百分比至約97重量百分比的二乙二醇丁基醚;約1重量百分比至約7重量百分比的氫氧化季銨;約1重量百分比至約75重量百分比的的(2-(2-胺基乙氧基)乙醇)或(2-(2-胺基乙氧基)乙醇)及輔助溶劑;約0.001重量百分比至約7重量百分比的腐蝕抑制劑;及約0.1重量百分比至約20重量百分比水;而且其中該溶液基本上不含DMSO。
- 如申請專利範圍第1項之溶液,其中該氫氧化季銨具有取代基,該取代基係(C1-C8)烷基、芳烷基、苯甲基、(C1-C5)醇及其組合。
- 如申請專利範圍第2項之溶液,其中該氫氧化季銨包括氫氧化四甲基銨、氫氧化四乙基銨、氫氧化乙基三甲基銨、氫氧化二甲基二丙基銨或氫氧化膽鹼中的至少一者。
- 如申請專利範圍第1項之溶液,其中該(2-(2-胺基乙氧基)乙醇)存有約3重量百分比至約50重量百分比的量。
- 如申請專利範圍第1項之溶液,其中該輔助溶劑存有約5重量百分比至約30重量百分比的量。
- 如申請專利範圍第5項之溶液,其中該輔助溶劑包括3-甲氧基-3-甲基-1-丁醇或丙二醇。
- 如申請專利範圍第1項之溶液,其中該二乙二醇丁基醚存有約50重量百分比至約97重量百分比的量;其中該氫氧化季銨存有約1重量百分比至約6重量百分比的量; 其中該(2-(2-胺基乙氧基)乙醇)存有約3重量百分比至約40重量百分比的量;其中該水存有約0.1重量百分比至約7重量百分比的量;而且其中該腐蝕抑制劑存有約0.001重量百分比至約3重量百分比的量。
- 如申請專利範圍第7項之溶液,其中該腐蝕抑制劑係選自由間苯二酚、甘油、山梨糖醇及硝酸銅(II)半(五水合物)所組成的群組。
- 如申請專利範圍第8項之溶液,其中該腐蝕抑制劑包含硝酸銅(II)半(五水合物)。
- 如申請專利範圍第9項之溶液,其中該腐蝕抑制劑存有介於約0.001重量百分比至約0.1重量百分比之間的量。
- 如申請專利範圍第1項之溶液,其中該腐蝕抑制劑包括選自由間苯二酚、甘油、山梨糖醇及硝酸銅(II)衍生物所組成的群組之第一腐蝕抑制劑。
- 如申請專利範圍第11項之溶液,其另外包含約0.05重量百分比至約7重量百分比的第二腐蝕抑制劑。
- 如申請專利範圍第12項之溶液,其中該第二腐蝕抑制劑與該第一腐蝕抑制劑不同而且係選自由間苯二酚、甘油、山梨糖醇及硝酸銅(II)半(五水合物)所組成的群組。
- 如申請專利範圍第1項之溶液,其中該溶液具有低於約-15℃的凍結點及高於約97℃的閃點。
- 如申請專利範圍第14項之溶液,其中該凍結點係低於約-19℃。
- 一種用於自基材去除光阻之剝除劑溶液,其包含:約50重量百分比至約97重量百分比二乙二醇丁基醚;約1重量百分比至約5重量百分比的氫氧化季銨; 約3重量百分比至約40重量百分比的(2-(2-胺基乙氧基)乙醇);約0.001重量百分比至約1重量百分比的腐蝕抑制劑;及約1重量百分比至約10重量百分比的水;其中二乙二醇丁基醚的量與水的量之比率大於約5;其中該溶液顯現高於約95℃的閃點;而且其中該溶液基本上不含DMSO。
- 一種去除至少一光阻層之方法,其包含以下步驟:使包含至少一光阻層的基材與申請專利範圍第1至16項中任一項之剝離劑溶液於一溫度下接觸一段時間以至少部分地去除前述至少一光阻層;及在前述接觸步驟之後沖洗前述基材。
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