JP2015533654A - ワークピースを加工するための方法及び装置 - Google Patents

ワークピースを加工するための方法及び装置 Download PDF

Info

Publication number
JP2015533654A
JP2015533654A JP2015533250A JP2015533250A JP2015533654A JP 2015533654 A JP2015533654 A JP 2015533654A JP 2015533250 A JP2015533250 A JP 2015533250A JP 2015533250 A JP2015533250 A JP 2015533250A JP 2015533654 A JP2015533654 A JP 2015533654A
Authority
JP
Japan
Prior art keywords
workpiece
region
laser
compressive stress
improvement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2015533250A
Other languages
English (en)
Japanese (ja)
Other versions
JP2015533654A5 (enExample
Inventor
チョウ，ハイビン
サイメンソン，グレン
Original Assignee
エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド
エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド, エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド filed Critical エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド
Publication of JP2015533654A publication Critical patent/JP2015533654A/ja
Publication of JP2015533654A5 publication Critical patent/JP2015533654A5/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/359—Working by laser beam, e.g. welding, cutting or boring for surface treatment by providing a line or line pattern, e.g. a dotted break initiation line
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/02—Iron or ferrous alloys
    • B23K2103/04—Steel or steel alloys
    • B23K2103/05—Stainless steel
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B23K2103/10—Aluminium or alloys thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B23K2103/14—Titanium or alloys thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/52—Ceramics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/54—Glass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/56—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Laser Beam Processing (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
JP2015533250A 2012-09-24 2013-09-23 ワークピースを加工するための方法及び装置 Pending JP2015533654A (ja)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US201261705038P 2012-09-24 2012-09-24
US61/705,038 2012-09-24
US201261705559P 2012-09-25 2012-09-25
US61/705,559 2012-09-25
US14/033,368 2013-09-20
US14/033,368 US10357850B2 (en) 2012-09-24 2013-09-20 Method and apparatus for machining a workpiece
PCT/US2013/061212 WO2014058606A1 (en) 2012-09-24 2013-09-23 Method and apparatus for machining a workpiece

Publications (2)

Publication Number Publication Date
JP2015533654A true JP2015533654A (ja) 2015-11-26
JP2015533654A5 JP2015533654A5 (enExample) 2016-11-10

Family

ID=50337865

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015533250A Pending JP2015533654A (ja) 2012-09-24 2013-09-23 ワークピースを加工するための方法及び装置

Country Status (7)

Country Link
US (1) US10357850B2 (enExample)
EP (1) EP2897760A4 (enExample)
JP (1) JP2015533654A (enExample)
KR (1) KR20150060826A (enExample)
CN (1) CN104703748B (enExample)
TW (1) TWI611856B (enExample)
WO (1) WO2014058606A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018181522A1 (ja) * 2017-03-31 2018-10-04 株式会社ジャパンディスプレイ 電子機器及びその製造方法

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5996260B2 (ja) * 2012-05-09 2016-09-21 株式会社ディスコ 被加工物の分割方法
EP2754524B1 (de) 2013-01-15 2015-11-25 Corning Laser Technologies GmbH Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie
EP2781296B1 (de) 2013-03-21 2020-10-21 Corning Laser Technologies GmbH Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser
US9328011B2 (en) * 2013-06-04 2016-05-03 Coherent, Inc. Laser-scribing of chemically strengthened glass
US10293436B2 (en) 2013-12-17 2019-05-21 Corning Incorporated Method for rapid laser drilling of holes in glass and products made therefrom
US11556039B2 (en) 2013-12-17 2023-01-17 Corning Incorporated Electrochromic coated glass articles and methods for laser processing the same
GB2527553B (en) * 2014-06-25 2017-08-23 Fianium Ltd Laser processing
EP3166895B1 (en) * 2014-07-08 2021-11-24 Corning Incorporated Methods and apparatuses for laser processing materials
EP3169477B1 (en) 2014-07-14 2020-01-29 Corning Incorporated System for and method of processing transparent materials using laser beam focal lines adjustable in length and diameter
HUE055461T2 (hu) 2015-03-24 2021-11-29 Corning Inc Kijelzõ üveg kompozíciók lézeres vágása és feldolgozása
JP6294378B2 (ja) 2016-03-30 2018-03-14 ファナック株式会社 前加工制御部を備えるレーザ加工装置及びレーザ加工方法
WO2018022441A1 (en) * 2016-07-28 2018-02-01 Electro Scientific Industries, Inc. Laser processing apparatus and methods of laser-processing workpieces
DE112017004557T5 (de) * 2016-09-09 2019-05-23 Mitsubishi Electric Corporation Laserbearbeitungsvorrichtung
CN113399816B (zh) 2016-09-30 2023-05-16 康宁股份有限公司 使用非轴对称束斑对透明工件进行激光加工的设备和方法
CN110167891A (zh) 2016-10-24 2019-08-23 康宁股份有限公司 用于对片状玻璃基材进行基于激光的机械加工的基材处理工位
JP6717758B2 (ja) * 2017-01-10 2020-07-01 ファナック株式会社 複合加工方法及び複合加工プログラム
US20190233321A1 (en) 2018-01-26 2019-08-01 Corning Incorporated Liquid-assisted laser micromachining of transparent dielectrics
TWI816897B (zh) 2018-10-08 2023-10-01 美商伊雷克托科學工業股份有限公司 用於在基板中形成穿孔的方法
DE102019121827A1 (de) * 2019-08-13 2021-02-18 Trumpf Laser- Und Systemtechnik Gmbh Laserätzen mit variierender Ätzselektivität
DE102020123146A1 (de) 2019-09-06 2021-03-11 Andreas Wienkamp Verfahren und Vorrichtung zum Einbringen eines Schnitts in ein Werkstück
KR102875674B1 (ko) * 2020-07-21 2025-10-23 삼성디스플레이 주식회사 레이저 장치 및 표시 장치의 제조 방법
CN113226632A (zh) * 2021-03-31 2021-08-06 长江存储科技有限责任公司 用于切割半导体结构的激光系统及其操作方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10128563A (ja) * 1996-10-24 1998-05-19 Nippon Sheet Glass Co Ltd マイクロレンズに対するレーザ加工方法
JP2003088976A (ja) * 2001-09-12 2003-03-25 Hamamatsu Photonics Kk レーザ加工方法
JP2005088023A (ja) * 2003-09-12 2005-04-07 Seiko Epson Corp 透明体の加工方法
JP2005144530A (ja) * 2003-11-19 2005-06-09 National Institute Of Advanced Industrial & Technology 透明媒体のレーザー精密加工法
JP2010142862A (ja) * 2008-12-22 2010-07-01 Cyber Laser Kk 誘電体材料表面のナノ周期構造形成方法
JP2012096257A (ja) * 2010-11-01 2012-05-24 Disco Corp 加工方法及び加工装置

Family Cites Families (175)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL298724A (enExample) 1962-10-04
US4702042A (en) 1984-09-27 1987-10-27 Libbey-Owens-Ford Co. Cutting strengthened glass
US4828900A (en) 1987-12-23 1989-05-09 Ppg Industries, Inc. Discrete glass cutting and edge shaping
JPS62248681A (ja) * 1986-04-21 1987-10-29 Kanzaki Paper Mfg Co Ltd レ−ザ−焼付画法
GB2227965B (en) 1988-10-12 1993-02-10 Rolls Royce Plc Apparatus for drilling a shaped hole in a workpiece
ATE199046T1 (de) 1990-05-09 2001-02-15 Canon Kk Erzeugung von mustern und herstellungsverfahren für halbleiteranordnungen mit diesem muster
RU2024441C1 (ru) 1992-04-02 1994-12-15 Владимир Степанович Кондратенко Способ резки неметаллических материалов
US5637244A (en) 1993-05-13 1997-06-10 Podarok International, Inc. Method and apparatus for creating an image by a pulsed laser beam inside a transparent material
FI103396B (fi) * 1994-03-24 1999-06-30 Laserplus Oy Menetelmä ja laite merkkausten tekemiseksi lasipintaan
US5656186A (en) 1994-04-08 1997-08-12 The Regents Of The University Of Michigan Method for controlling configuration of laser induced breakdown and ablation
US5543365A (en) 1994-12-02 1996-08-06 Texas Instruments Incorporated Wafer scribe technique using laser by forming polysilicon
US5665134A (en) 1995-06-07 1997-09-09 Hughes Missile Systems Company Laser machining of glass-ceramic materials
US6373026B1 (en) 1996-07-31 2002-04-16 Mitsubishi Denki Kabushiki Kaisha Laser beam machining method for wiring board, laser beam machining apparatus for wiring board, and carbonic acid gas laser oscillator for machining wiring board
WO1997007927A1 (en) 1995-08-31 1997-03-06 Corning Incorporated Method and apparatus for breaking brittle materials
JP3211683B2 (ja) * 1996-07-18 2001-09-25 株式会社日立製作所 情報記録ディスク用ガラス基板
US6820330B1 (en) 1996-12-13 2004-11-23 Tessera, Inc. Method for forming a multi-layer circuit assembly
US5973290A (en) 1997-02-26 1999-10-26 W. L. Gore & Associates, Inc. Laser apparatus having improved via processing rate
JP3957010B2 (ja) 1997-06-04 2007-08-08 日本板硝子株式会社 微細孔を有するガラス基材
US6577472B2 (en) 1997-07-24 2003-06-10 Hitachi, Ltd. Glass substrate for a magnetic disk, a magnetic disk which can be formed with a stable texture
DE19741329C1 (de) 1997-09-19 1998-10-22 Fraunhofer Ges Forschung Verfahren und Vorrichtung zur Materialbearbeitung mit Plasma induzierender Hochenergiestrahlung
JP3185869B2 (ja) 1997-10-21 2001-07-11 日本電気株式会社 レーザ加工方法
JPH11134645A (ja) 1997-10-30 1999-05-21 Hoya Corp 情報記録媒体用ガラス基板及びその製造方法
JP3449201B2 (ja) 1997-11-28 2003-09-22 日亜化学工業株式会社 窒化物半導体素子の製造方法
US6313435B1 (en) * 1998-11-20 2001-11-06 3M Innovative Properties Company Mask orbiting for laser ablated feature formation
US6211488B1 (en) 1998-12-01 2001-04-03 Accudyne Display And Semiconductor Systems, Inc. Method and apparatus for separating non-metallic substrates utilizing a laser initiated scribe
US6333485B1 (en) 1998-12-11 2001-12-25 International Business Machines Corporation Method for minimizing sample damage during the ablation of material using a focused ultrashort pulsed beam
DE10029110B4 (de) 1999-06-15 2006-05-18 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren für die Materialbearbeitung und Verwendung desselben
US6795274B1 (en) 1999-09-07 2004-09-21 Asahi Glass Company, Ltd. Method for manufacturing a substantially circular substrate by utilizing scribing
CA2397315C (en) 2000-01-27 2009-07-07 National Research Council Of Canada Method and apparatus for repair of defects in materials with short laser pulses
US6891997B2 (en) * 2000-02-17 2005-05-10 Xponent Photonics Inc. Fiber-ring optical resonators
JP2001274441A (ja) 2000-03-23 2001-10-05 Mitsubishi Heavy Ind Ltd 太陽電池パネルの一括切断処理方法
US20010035447A1 (en) 2000-05-05 2001-11-01 Andreas Gartner Methods for laser cut initiation
JP2001354439A (ja) 2000-06-12 2001-12-25 Matsushita Electric Ind Co Ltd ガラス基板の加工方法および高周波回路の製作方法
JP4786783B2 (ja) 2000-08-18 2011-10-05 日本板硝子株式会社 ガラス板の切断方法及び記録媒体用ガラス円盤
JP3722731B2 (ja) 2000-09-13 2005-11-30 浜松ホトニクス株式会社 レーザ加工方法
JP4659300B2 (ja) 2000-09-13 2011-03-30 浜松ホトニクス株式会社 レーザ加工方法及び半導体チップの製造方法
US20020033558A1 (en) 2000-09-20 2002-03-21 Fahey Kevin P. UV laser cutting or shape modification of brittle, high melting temperature target materials such as ceramics or glasses
JP4150155B2 (ja) 2000-10-10 2008-09-17 株式会社日立製作所 情報記録媒体、情報の記録方法、再生方法、記録記録装置及び情報再生装置
US6962279B1 (en) 2000-10-18 2005-11-08 Ge Medical Systems Global Technology Company, Llc Apparatus and method for glass separation for flat panel displays
JP4512786B2 (ja) 2000-11-17 2010-07-28 独立行政法人産業技術総合研究所 ガラス基板の加工方法
US6812430B2 (en) 2000-12-01 2004-11-02 Lg Electronics Inc. Glass cutting method and apparatus with controlled laser beam energy
US20030044539A1 (en) 2001-02-06 2003-03-06 Oswald Robert S. Process for producing photovoltaic devices
US20040128016A1 (en) * 2001-03-22 2004-07-01 Stewart David H. Method for manufacturing a near net-shape mold
WO2003002289A1 (en) 2001-06-28 2003-01-09 Electro Scientific Industries, Inc. Multistep laser processing of wafers supporting surface device layers
US6642476B2 (en) 2001-07-23 2003-11-04 Siemens Automative Corporation Apparatus and method of forming orifices and chamfers for uniform orifice coefficient and surface properties by laser
US6521862B1 (en) 2001-10-09 2003-02-18 International Business Machines Corporation Apparatus and method for improving chamfer quality of disk edge surfaces with laser treatment
SG122749A1 (en) * 2001-10-16 2006-06-29 Inst Data Storage Method of laser marking and apparatus therefor
US6642477B1 (en) 2001-10-23 2003-11-04 Imra America, Inc. Method for laser drilling a counter-tapered through-hole in a material
SG147307A1 (en) 2001-11-08 2008-11-28 Sharp Kk Method and apparatus for cutting apart a glass substrate, liquid crystal panel, and apparatus for fabricating a liquid crystal panel
JP2003160348A (ja) 2001-11-21 2003-06-03 Nippon Sheet Glass Co Ltd 情報記録媒体用ガラス基板及びその製造方法
US6720519B2 (en) 2001-11-30 2004-04-13 Matsushita Electric Industrial Co., Ltd. System and method of laser drilling
JP2003226551A (ja) 2002-02-05 2003-08-12 Nippon Sheet Glass Co Ltd 微細孔を有するガラス板およびその製造方法
US20030155328A1 (en) * 2002-02-15 2003-08-21 Huth Mark C. Laser micromachining and methods and systems of same
RU2226183C2 (ru) 2002-02-21 2004-03-27 Алексеев Андрей Михайлович Способ резки прозрачных неметаллических материалов
JP4267240B2 (ja) 2002-02-22 2009-05-27 日本板硝子株式会社 ガラス構造物の製造方法
US6756563B2 (en) 2002-03-07 2004-06-29 Orbotech Ltd. System and method for forming holes in substrates containing glass
FR2839508B1 (fr) 2002-05-07 2005-03-04 Saint Gobain Vitrage decoupe sans rompage
US6809291B1 (en) 2002-08-30 2004-10-26 Southeastern Universities Research Assn., Inc. Process for laser machining and surface treatment
JP2004160483A (ja) * 2002-11-12 2004-06-10 Disco Abrasive Syst Ltd レーザー加工方法およびレーザー加工装置
KR100497820B1 (ko) 2003-01-06 2005-07-01 로체 시스템즈(주) 유리판절단장치
US20050064137A1 (en) * 2003-01-29 2005-03-24 Hunt Alan J. Method for forming nanoscale features and structures produced thereby
KR20050094423A (ko) * 2003-02-04 2005-09-27 아사히 가라스 가부시키가이샤 유리기판 표면의 이물 제거방법
US7023001B2 (en) 2003-03-31 2006-04-04 Institut National D'optique Method for engraving materials using laser etched V-grooves
JP2004299969A (ja) 2003-03-31 2004-10-28 Toshiba Ceramics Co Ltd シリカガラスのスライス方法
JP2004343008A (ja) 2003-05-19 2004-12-02 Disco Abrasive Syst Ltd レーザ光線を利用した被加工物分割方法
US6949449B2 (en) 2003-07-11 2005-09-27 Electro Scientific Industries, Inc. Method of forming a scribe line on a ceramic substrate
EP2269765B1 (en) 2003-07-18 2014-10-15 Hamamatsu Photonics K.K. Cut semiconductor chip
US20050029240A1 (en) * 2003-08-07 2005-02-10 Translume, Inc. Dual light source machining method and system
JP2005081715A (ja) 2003-09-09 2005-03-31 Sony Corp レーザ加工装置およびレーザ加工方法
US20050087522A1 (en) 2003-10-24 2005-04-28 Yunlong Sun Laser processing of a locally heated target material
JP2005268752A (ja) 2004-02-19 2005-09-29 Canon Inc レーザ割断方法、被割断部材および半導体素子チップ
FI120082B (fi) 2004-03-18 2009-06-30 Antti Salminen Menetelmä materiaalin työstämiseksi suuritehotiheyksisellä sähkömagneettisella säteilyllä
US7057133B2 (en) * 2004-04-14 2006-06-06 Electro Scientific Industries, Inc. Methods of drilling through-holes in homogenous and non-homogenous substrates
DE102004020737A1 (de) 2004-04-27 2005-11-24 Lzh Laserzentrum Hannover E.V. Vorrichtung zum Durchtrennen von Bauteilen aus sprödbrüchigen Materialien mit spannungsfreier Bauteillagerung
DE102004024475A1 (de) 2004-05-14 2005-12-01 Lzh Laserzentrum Hannover E.V. Verfahren und Vorrichtung zum Trennen von Halbleitermaterialien
US7060933B2 (en) 2004-06-08 2006-06-13 Igor Troitski Method and laser system for production of laser-induced images inside and on the surface of transparent material
KR101193874B1 (ko) 2004-07-30 2012-10-26 미쓰보시 다이야몬도 고교 가부시키가이샤 기판의 수직크랙 형성방법 및 수직크랙 형성장치
US7598167B2 (en) 2004-08-24 2009-10-06 Micron Technology, Inc. Method of forming vias in semiconductor substrates without damaging active regions thereof and resulting structures
US7378342B2 (en) 2004-08-27 2008-05-27 Micron Technology, Inc. Methods for forming vias varying lateral dimensions
US7169687B2 (en) 2004-11-03 2007-01-30 Intel Corporation Laser micromachining method
CN100481337C (zh) 2004-12-08 2009-04-22 雷射先进科技株式会社 被分割体的分割起点形成方法、被分割体的分割方法
WO2006062017A1 (ja) 2004-12-08 2006-06-15 Laser Solutions Co., Ltd. 被分割体における分割起点形成方法、被分割体の分割方法、およびパルスレーザー光による被加工物の加工方法
US7528342B2 (en) 2005-02-03 2009-05-05 Laserfacturing, Inc. Method and apparatus for via drilling and selective material removal using an ultrafast pulse laser
US20070012665A1 (en) 2005-07-12 2007-01-18 Hewlett-Packard Development Company Lp Laser ablation
US9138913B2 (en) 2005-09-08 2015-09-22 Imra America, Inc. Transparent material processing with an ultrashort pulse laser
US7423821B2 (en) * 2006-03-24 2008-09-09 Gentex Corporation Vision system
US20070231542A1 (en) * 2006-04-03 2007-10-04 General Electric Company Articles having low wettability and high light transmission
WO2007145702A2 (en) * 2006-04-10 2007-12-21 Board Of Trustees Of Michigan State University Laser material processing systems and methods with, in particular, use of a hollow waveguide for broadening the bandwidth of the pulse above 20 nm
US20080160295A1 (en) * 2006-04-12 2008-07-03 Picodeon Ltd Oy Method for adjusting ablation threshold
JP2007283318A (ja) 2006-04-13 2007-11-01 Seiko Epson Corp 基体の製造方法、レーザ加工装置、表示装置、電気光学装置、電子機器
US8624157B2 (en) 2006-05-25 2014-01-07 Electro Scientific Industries, Inc. Ultrashort laser pulse wafer scribing
US20070272666A1 (en) 2006-05-25 2007-11-29 O'brien James N Infrared laser wafer scribing using short pulses
JP2007319881A (ja) 2006-05-31 2007-12-13 Seiko Epson Corp 基体の製造方法、レーザ加工装置、表示装置、電気光学装置、電子機器
US8394301B2 (en) 2006-06-02 2013-03-12 Electro Scientific Industries, Inc. Process for forming panel with an optically transmissive portion and products related thereto
US20100029459A1 (en) * 2006-07-26 2010-02-04 Josef Wilson Zwanziger Glasses having a reduced stress-optic coefficient
US20080029152A1 (en) * 2006-08-04 2008-02-07 Erel Milshtein Laser scribing apparatus, systems, and methods
US20080093775A1 (en) 2006-08-19 2008-04-24 Colorado State University Research Foundation Nanometer-scale ablation using focused, coherent extreme ultraviolet/soft x-ray light
US8168514B2 (en) 2006-08-24 2012-05-01 Corning Incorporated Laser separation of thin laminated glass substrates for flexible display applications
DE102006046313B3 (de) 2006-09-29 2008-01-24 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren und Anordnung zum Strukturieren einer lichtleitenden Faser entlang deren Längsachse (longitudinale Strukturierung) basierend auf der nicht-linearen Absorption von Laserstrahlung
US20080156780A1 (en) * 2006-12-29 2008-07-03 Sergei Voronov Substrate markings
US8530784B2 (en) 2007-02-01 2013-09-10 Orbotech Ltd. Method and system of machining using a beam of photons
DE102007009786B4 (de) 2007-02-27 2013-09-05 Schott Ag Beschichtetes vorgespanntes Glas, Verfahren zu dessen Herstellung und dessen Verwendung
TWI394731B (zh) 2007-03-02 2013-05-01 Nippon Electric Glass Co 強化板玻璃及其製造方法
US7982162B2 (en) 2007-05-15 2011-07-19 Corning Incorporated Method and apparatus for scoring and separating a brittle material with a single beam of radiation
US20080290077A1 (en) 2007-05-22 2008-11-27 Demeritt Jeffery Alan Separation of transparent glasses and systems and methods therefor
JP4959422B2 (ja) * 2007-05-30 2012-06-20 株式会社ディスコ ウエーハの分割方法
US8710402B2 (en) 2007-06-01 2014-04-29 Electro Scientific Industries, Inc. Method of and apparatus for laser drilling holes with improved taper
US20090020511A1 (en) 2007-07-17 2009-01-22 Kommera Swaroop K Ablation
JP4402708B2 (ja) * 2007-08-03 2010-01-20 浜松ホトニクス株式会社 レーザ加工方法、レーザ加工装置及びその製造方法
US20090045179A1 (en) 2007-08-15 2009-02-19 Ellen Marie Kosik Williams Method and system for cutting solid materials using short pulsed laser
JP2009061462A (ja) 2007-09-05 2009-03-26 Sumitomo Electric Ind Ltd 基板の製造方法および基板
KR100876502B1 (ko) 2007-09-21 2008-12-31 한국정보통신대학교 산학협력단 초단파 레이저 빔을 이용한 기판 절단장치 및 그 절단방법
CN101610870B (zh) 2007-10-16 2013-09-11 三星钻石工业股份有限公司 脆性材料基板的u形槽加工方法以及使用该方法的去除加工方法、打孔加工方法和倒角方法
US8722189B2 (en) 2007-12-18 2014-05-13 Hoya Corporation Cover glass for mobile terminals, manufacturing method of the same and mobile terminal device
US20090212030A1 (en) * 2008-02-25 2009-08-27 Optisolar, Inc., A Delaware Corporation Autofocus for Ablation Laser
ATE501404T1 (de) 2008-02-26 2011-03-15 Rioglass Solar Sa Reflektorelement für einen sonnenwärmereflektor und verfahren zu seiner herstellung
JP5826027B2 (ja) 2008-03-21 2015-12-02 イムラ アメリカ インコーポレイテッド レーザベースの材料加工方法及びシステム
US8093532B2 (en) 2008-03-31 2012-01-10 Electro Scientific Industries, Inc. Laser machining of fired ceramic and other hard and/or thick materials
JP2009280452A (ja) 2008-05-23 2009-12-03 Central Glass Co Ltd ガラス基板及び製造方法
US7931849B2 (en) * 2008-06-25 2011-04-26 Applied Micro Circuits Corporation Non-destructive laser optical integrated circuit package marking
WO2010006067A2 (en) * 2008-07-09 2010-01-14 Fei Company Method and apparatus for laser machining
WO2010016928A2 (en) 2008-08-08 2010-02-11 Corning Incorporated Strengthened glass articles and methods of making
KR101107859B1 (ko) 2008-09-12 2012-01-31 오므론 가부시키가이샤 할단용 스크라이브선의 형성 방법 및 장치
EP2377375B1 (en) 2008-12-13 2016-01-27 M-Solv Limited Method and apparatus for laser machining relatively narrow and relatively wide structures
US9346130B2 (en) 2008-12-17 2016-05-24 Electro Scientific Industries, Inc. Method for laser processing glass with a chamfered edge
RU2011130891A (ru) 2008-12-25 2013-01-27 Асахи Гласс Компани, Лимитед Способ и система для резки пластины из хрупкого материала, и оконное стекло для транспортного средства
GB0900036D0 (en) 2009-01-03 2009-02-11 M Solv Ltd Method and apparatus for forming grooves with complex shape in the surface of apolymer
US8347651B2 (en) 2009-02-19 2013-01-08 Corning Incorporated Method of separating strengthened glass
US8327666B2 (en) 2009-02-19 2012-12-11 Corning Incorporated Method of separating strengthened glass
US8341976B2 (en) 2009-02-19 2013-01-01 Corning Incorporated Method of separating strengthened glass
US9685186B2 (en) 2009-02-27 2017-06-20 Applied Materials, Inc. HDD pattern implant system
KR101041137B1 (ko) 2009-03-25 2011-06-13 삼성모바일디스플레이주식회사 기판 절단 장치 및 이를 이용한 기판 절단 방법
US8609512B2 (en) 2009-03-27 2013-12-17 Electro Scientific Industries, Inc. Method for laser singulation of chip scale packages on glass substrates
US8350187B2 (en) 2009-03-28 2013-01-08 Electro Scientific Industries, Inc. Method and apparatus for laser machining
US20100285272A1 (en) * 2009-05-06 2010-11-11 Shari Elizabeth Koval Multi-length scale textured glass substrates for anti-fingerprinting
TWI523720B (zh) 2009-05-28 2016-03-01 伊雷克托科學工業股份有限公司 應用於雷射處理工件中的特徵的聲光偏轉器及相關雷射處理方法
US8110419B2 (en) * 2009-08-20 2012-02-07 Integrated Photovoltaic, Inc. Process of manufacturing photovoltaic device
US8932510B2 (en) 2009-08-28 2015-01-13 Corning Incorporated Methods for laser cutting glass substrates
JP2013503105A (ja) 2009-08-28 2013-01-31 コーニング インコーポレイテッド 化学強化ガラス基板からガラス品をレーザ割断するための方法
JP5565659B2 (ja) 2009-10-22 2014-08-06 株式会社ブイ・テクノロジー レーザ加工装置
US20110127242A1 (en) 2009-11-30 2011-06-02 Xinghua Li Methods for laser scribing and separating glass substrates
US8946590B2 (en) 2009-11-30 2015-02-03 Corning Incorporated Methods for laser scribing and separating glass substrates
KR101758945B1 (ko) 2009-11-30 2017-07-17 코닝 인코포레이티드 레이저로 유리 기판을 스크라이빙하여 분리하는 방법
JP5031877B2 (ja) 2010-01-06 2012-09-26 キヤノン株式会社 画像処理装置及び画像処理方法
TWI438162B (zh) 2010-01-27 2014-05-21 Wintek Corp 強化玻璃切割方法及強化玻璃切割預置結構
JP5451443B2 (ja) 2010-02-15 2014-03-26 株式会社ジャパンディスプレイ 電気的固体装置の製造方法
WO2011106196A1 (en) * 2010-02-24 2011-09-01 Corning Incorporated Oleophobic glass substrates
US8743165B2 (en) 2010-03-05 2014-06-03 Micronic Laser Systems Ab Methods and device for laser processing
TWI494284B (zh) 2010-03-19 2015-08-01 Corning Inc 強化玻璃之機械劃割及分離
DE102010012265B4 (de) 2010-03-22 2012-09-06 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zum Heraustrennen von Einzelscheiben aus einer Verbundglastafel und Verwendung einer Vorrichtung dafür
EP2371778A1 (en) 2010-03-30 2011-10-05 Linde Aktiengesellschaft Method for producing toughened flat glass with anti-reflective properties
CN102905839B (zh) * 2010-03-30 2016-03-09 Imra美国公司 基于激光的材料加工装置和方法
US8383984B2 (en) 2010-04-02 2013-02-26 Electro Scientific Industries, Inc. Method and apparatus for laser singulation of brittle materials
JP2011230940A (ja) 2010-04-26 2011-11-17 Mitsuboshi Diamond Industrial Co Ltd 脆性材料基板の割断方法
JP2011251879A (ja) 2010-06-02 2011-12-15 Asahi Glass Co Ltd 化学強化ガラスの切断方法および切断装置
JP5664471B2 (ja) 2010-06-28 2015-02-04 信越化学工業株式会社 半導体用合成石英ガラス基板の製造方法
KR20120015366A (ko) 2010-07-19 2012-02-21 엘지디스플레이 주식회사 강화유리 절단방법 및 절단장치
JP2012031018A (ja) 2010-07-30 2012-02-16 Asahi Glass Co Ltd 強化ガラス基板及び強化ガラス基板の溝加工方法と強化ガラス基板の切断方法
US8393175B2 (en) 2010-08-26 2013-03-12 Corning Incorporated Methods for extracting strengthened glass substrates from glass sheets
US8584354B2 (en) 2010-08-26 2013-11-19 Corning Incorporated Method for making glass interposer panels
US8720228B2 (en) 2010-08-31 2014-05-13 Corning Incorporated Methods of separating strengthened glass substrates
JP5641835B2 (ja) * 2010-09-10 2014-12-17 株式会社ディスコ 分割方法
US8607590B2 (en) * 2010-11-30 2013-12-17 Corning Incorporated Methods for separating glass articles from strengthened glass substrate sheets
US8616024B2 (en) 2010-11-30 2013-12-31 Corning Incorporated Methods for forming grooves and separating strengthened glass substrate sheets
US20120168412A1 (en) 2011-01-05 2012-07-05 Electro Scientific Industries, Inc Apparatus and method for forming an aperture in a substrate
US8539794B2 (en) * 2011-02-01 2013-09-24 Corning Incorporated Strengthened glass substrate sheets and methods for fabricating glass panels from glass substrate sheets
US8584490B2 (en) 2011-02-18 2013-11-19 Corning Incorporated Laser cutting method
US8635887B2 (en) 2011-08-10 2014-01-28 Corning Incorporated Methods for separating glass substrate sheets by laser-formed grooves
JP2013043795A (ja) 2011-08-23 2013-03-04 Nippon Electric Glass Co Ltd 強化ガラス及びその製造方法
US20130129947A1 (en) 2011-11-18 2013-05-23 Daniel Ralph Harvey Glass article having high damage resistance
JP4932059B1 (ja) 2011-12-16 2012-05-16 株式会社ミクロ技術研究所 強化ガラス、タッチパネル、及び強化ガラスの製造方法
JP2015511571A (ja) 2012-02-28 2015-04-20 エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド 強化ガラスの分離のための方法及び装置並びにこれにより生成された製品
US9828278B2 (en) 2012-02-28 2017-11-28 Electro Scientific Industries, Inc. Method and apparatus for separation of strengthened glass and articles produced thereby
CN104125934A (zh) 2012-02-28 2014-10-29 伊雷克托科学工业股份有限公司 用于分离强化玻璃的方法及装置及由该强化玻璃生产的物品
US9938180B2 (en) 2012-06-05 2018-04-10 Corning Incorporated Methods of cutting glass using a laser

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10128563A (ja) * 1996-10-24 1998-05-19 Nippon Sheet Glass Co Ltd マイクロレンズに対するレーザ加工方法
JP2003088976A (ja) * 2001-09-12 2003-03-25 Hamamatsu Photonics Kk レーザ加工方法
JP2005088023A (ja) * 2003-09-12 2005-04-07 Seiko Epson Corp 透明体の加工方法
JP2005144530A (ja) * 2003-11-19 2005-06-09 National Institute Of Advanced Industrial & Technology 透明媒体のレーザー精密加工法
JP2010142862A (ja) * 2008-12-22 2010-07-01 Cyber Laser Kk 誘電体材料表面のナノ周期構造形成方法
JP2012096257A (ja) * 2010-11-01 2012-05-24 Disco Corp 加工方法及び加工装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018181522A1 (ja) * 2017-03-31 2018-10-04 株式会社ジャパンディスプレイ 電子機器及びその製造方法

Also Published As

Publication number Publication date
US10357850B2 (en) 2019-07-23
EP2897760A4 (en) 2016-07-20
KR20150060826A (ko) 2015-06-03
TWI611856B (zh) 2018-01-21
WO2014058606A1 (en) 2014-04-17
US20140083986A1 (en) 2014-03-27
TW201431635A (zh) 2014-08-16
EP2897760A1 (en) 2015-07-29
CN104703748B (zh) 2017-10-03
CN104703748A (zh) 2015-06-10

Similar Documents

Publication Publication Date Title
JP2015533654A (ja) ワークピースを加工するための方法及び装置
US9828278B2 (en) Method and apparatus for separation of strengthened glass and articles produced thereby
JP7313390B2 (ja) ディスプレイガラス組成物のレーザ切断及び加工
KR101998761B1 (ko) 투명 재료 내에 레이저 필라멘테이션을 형성하기 위한 방법 및 장치
US20210053160A1 (en) Method and System for Ultrafast Laser-based Material Removal, Figuring and Polishing
CN104684677B (zh) 用于工件分离的方法及装置及借此制造的物品
US9828277B2 (en) Methods for separation of strengthened glass
US10597321B2 (en) Edge chamfering methods
KR101839505B1 (ko) 버스트 초고속 레이저 펄스들의 필라멘테이션에 의한 실리콘의 레이저 가공을 위한 방법 및 장치
Dudutis et al. Glass dicing with elliptical Bessel beam
JP2015511572A (ja) 強化ガラスの分離のための方法及び装置並びにこれにより生成された製品
JP2015076115A (ja) 磁気記録媒体用円盤状ガラス基板、及び磁気記録媒体用円盤状ガラス基板の製造方法
CN108788482B (zh) 陶瓷制品表面的镭射加工方法及陶瓷制品
US20150059411A1 (en) Method of separating a glass sheet from a carrier
Stonyte et al. Nonthermal ablation of crystalline c-cut Sapphire using femtosecond deep UV laser pulses
CN116635342A (zh) 使用低强度艾里射束在透明工件中激光形成非方形边缘
Stolz et al. Engineering meter-scale laser resistant coatings for the near IR
WO2020056590A1 (zh) 一种超快激光组合脉冲序列的阵列微纳结构加工方法
CN117532506A (zh) 一种激光等离子体冲击波清洗堵塞砂轮的方法和装置
Shin et al. Glass scribing by a UV picosecond laser
Loeschner et al. Microprocessing of various materials using femtosecond laser pulses

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20160913

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20160913

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20160914

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20170619

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20170627

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20170926

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20171127

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20171212

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20180529

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20180927

A911 Transfer to examiner for re-examination before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20181005

A912 Re-examination (zenchi) completed and case transferred to appeal board

Free format text: JAPANESE INTERMEDIATE CODE: A912

Effective date: 20190104

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20190924