JP2015508229A - 基板ホルダ、リソグラフィ装置、デバイス製造方法及び基板ホルダの製造方法 - Google Patents
基板ホルダ、リソグラフィ装置、デバイス製造方法及び基板ホルダの製造方法 Download PDFInfo
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- JP2015508229A JP2015508229A JP2014555139A JP2014555139A JP2015508229A JP 2015508229 A JP2015508229 A JP 2015508229A JP 2014555139 A JP2014555139 A JP 2014555139A JP 2014555139 A JP2014555139 A JP 2014555139A JP 2015508229 A JP2015508229 A JP 2015508229A
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-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/20—Direct sintering or melting
- B22F10/25—Direct deposition of metal particles, e.g. direct metal deposition [DMD] or laser engineered net shaping [LENS]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/20—Direct sintering or melting
- B22F10/28—Powder bed fusion, e.g. selective laser melting [SLM] or electron beam melting [EBM]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/60—Treatment of workpieces or articles after build-up
- B22F10/66—Treatment of workpieces or articles after build-up by mechanical means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/25—Process efficiency
Abstract
Description
[0001] 本出願は、2012年2月3日出願の米国仮出願第61/594,857号、2012年4月9日出願の米国仮出願第61/621,648号及び2012年4月9日出願の米国仮出願第61/621,660号の利益を主張し、その全体を参照により本明細書に組み込むものとする。
[0033] −放射ビームB(例えばUV放射、DUV放射又はEUV放射)を調節するように構成された照明システム(イルミネータ)ILと、
[0034] −パターニングデバイス(例えばマスク)MAを支持するように構築され、特定のパラメータに従ってパターニングデバイスを正確に位置決めするように構成された第1のポジショナPMに接続された支持構造(例えばマスクテーブル)MTと、
[0035] −基板(例えばレジストコートウェーハ)Wを保持するように構築され、特定のパラメータに従って基板を正確に位置決めするように構成された第2のポジショナPWに接続された基板テーブル(例えばウェーハテーブル)WTと、
[0036] −パターニングデバイスMAによって放射ビームBに与えられたパターンを基板Wの目標部分C(例えば1つ以上のダイを含む)に投影するように構成された投影システム(例えば屈折投影レンズシステム)PSと、を備える。
−放射ビームB(例えばEUV放射)を調節するように構成された照明システム(イルミネータ)EILと、
−パターニングデバイス(例えばマスク又はレチクル)MAを支持するように構築され、パターニングデバイスを正確に位置決めするように構成された第1のポジショナPMに接続された支持構造(例えばマスクテーブル)MTと、
−基板(例えばレジストコートウェーハ)Wを保持するように構築され、基板を正確に位置決めするように構成された第2のポジショナPWに接続された基板テーブル(例えばウェーハテーブル)WTと、
−パターニングデバイスMAによって放射ビームBに与えられたパターンを基板Wのターゲット部分C(例えば1つ以上のダイを含む)に投影するように構成された投影システム(例えば反射投影システム)PSと、を備える。
Claims (15)
- リソグラフィ装置で使用する基板ホルダであって、
表面を有する本体と、
前記表面上に設けられ電気コンポーネントを形成する薄膜スタックと、
前記薄膜スタック上に設けられ基板を支持する端面を有する複数のバールと、を備える基板ホルダ。 - 前記本体が、前記バールとは異なる材料から形成される、請求項1に記載の基板ホルダ。
- 前記バールが、
堆積及び選択的エッチング、
パターニングされたレジスト層を通したスパッタリング、
ハードマスクを介した堆積、及び、
レーザ焼結、
からなる群から選択されるプロセスによって形成される、請求項1又は2に記載の基板ホルダ。 - 少なくとも1つのバールが、第1の材料の第1の層と、前記第1の材料とは異なる第2の材料の第2の層と、を備える、請求項1〜3のいずれか一項に記載の基板ホルダ。
- 前記薄膜スタックが、バールに電気的に接触する少なくとも1つのバイアを含む、請求項1〜4のいずれか一項に記載の基板ホルダ。
- 前記薄膜スタックが、複数の電気コンポーネントを形成する、請求項1〜5のいずれか一項に記載の基板ホルダ。
- 前記複数の電気コンポーネントの第1の電気コンポーネントと、第2の電気コンポーネントと、が前記薄膜スタックの単一の層内に配置される、請求項6に記載の基板ホルダ。
- 前記複数の電気コンポーネントの第1の電気コンポーネントと、第2の電気コンポーネントと、が前記薄膜スタックの別個の2つの層内に配置される、請求項6に記載の基板ホルダ。
- 前記コンポーネントが、電極、ヒータ、センサ、トランジスタ及び論理デバイスからなる群から選択されるコンポーネントである、請求項1〜8のいずれか一項に記載の基板ホルダ。
- リソグラフィ装置で使用する基板ホルダであって、
前記基板ホルダが、
表面を有する本体と、
前記表面上に設けられ電子又は電気コンポーネントを形成する薄膜スタックであって、複数のアパーチャが内部に形成された、薄膜スタックと、
各々の突起部が前記薄膜スタックのアパーチャ内に設けられ基板を支持する複数の突起部と、を備える基板ホルダ。 - パターニングデバイスを支持する支持構造と、
前記パターニングデバイスによってパターニングされたビームを基板に投影する投影システムと、
基板を保持する請求項1〜10のいずれか一項に記載の基板ホルダと、
を備えるリソグラフィ装置。 - リソグラフィ装置を使用したデバイス製造方法であって、
基板を基板ホルダに保持しながら、パターニングデバイスによってパターニングされたビームを前記基板に投影するステップを含み、
前記基板ホルダが、
表面を有する本体と、
前記表面上に設けられ電子又は電気コンポーネントを形成する薄膜スタックと、
前記薄膜スタック上に設けられ前記基板を支持する端面を有する複数のバールと、を備える方法。 - リソグラフィ装置で使用する基板ホルダの製造方法であって、
表面を有する本体を提供するステップと、
前記本体の表面上に薄膜スタックを形成するステップと、
前記スタックから突出し基板を支持する端面を有する複数のバールを、前記薄膜スタック上に形成するステップと、を含む方法。 - 前記複数のバールを形成するステップが、
前記薄膜スタック上にバール形成材料層を形成するステップと、
前記バール形成材料層上にマスクを形成するステップと、
前記マスクを介してバール形成材料をエッチングするステップと、
前記マスクを除去するステップと、を含む、請求項13に記載の方法。 - リソグラフィ装置で使用する基板ホルダの製造方法であって、
表面を有する本体を提供するステップと、
前記本体の表面上に薄膜スタックを形成するステップと、
前記薄膜スタック内に複数のアパーチャを形成するステップと、
前記スタックから突出し基板を支持する端面を有する複数のバールを、前記薄膜スタックの前記アパーチャ内に形成するステップと、を含む方法。
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US201261621648P | 2012-04-09 | 2012-04-09 | |
US201261621660P | 2012-04-09 | 2012-04-09 | |
US61/621,648 | 2012-04-09 | ||
US61/621,660 | 2012-04-09 | ||
PCT/EP2013/050818 WO2013113568A2 (en) | 2012-02-03 | 2013-01-17 | Substrate holder, lithographic apparatus, device manufacturing method, and method of manufacturing a substrate holder |
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