JP2015008287A5 - - Google Patents

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Publication number
JP2015008287A5
JP2015008287A5 JP2014114039A JP2014114039A JP2015008287A5 JP 2015008287 A5 JP2015008287 A5 JP 2015008287A5 JP 2014114039 A JP2014114039 A JP 2014114039A JP 2014114039 A JP2014114039 A JP 2014114039A JP 2015008287 A5 JP2015008287 A5 JP 2015008287A5
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JP
Japan
Prior art keywords
support assembly
substrate support
temperature
base plate
temperature controlled
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JP2014114039A
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English (en)
Japanese (ja)
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JP6364244B2 (ja
JP2015008287A (ja
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Priority claimed from US13/908,676 external-priority patent/US20140356985A1/en
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Publication of JP2015008287A5 publication Critical patent/JP2015008287A5/ja
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Publication of JP6364244B2 publication Critical patent/JP6364244B2/ja
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JP2014114039A 2013-06-03 2014-06-02 温度制御された基板支持アセンブリ Active JP6364244B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/908,676 2013-06-03
US13/908,676 US20140356985A1 (en) 2013-06-03 2013-06-03 Temperature controlled substrate support assembly

Publications (3)

Publication Number Publication Date
JP2015008287A JP2015008287A (ja) 2015-01-15
JP2015008287A5 true JP2015008287A5 (enExample) 2017-07-13
JP6364244B2 JP6364244B2 (ja) 2018-07-25

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JP2014114039A Active JP6364244B2 (ja) 2013-06-03 2014-06-02 温度制御された基板支持アセンブリ

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US (2) US20140356985A1 (enExample)
JP (1) JP6364244B2 (enExample)
KR (1) KR20140142177A (enExample)
TW (1) TWI633622B (enExample)

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