JP2013506291A5 - - Google Patents
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- Publication number
- JP2013506291A5 JP2013506291A5 JP2012530914A JP2012530914A JP2013506291A5 JP 2013506291 A5 JP2013506291 A5 JP 2013506291A5 JP 2012530914 A JP2012530914 A JP 2012530914A JP 2012530914 A JP2012530914 A JP 2012530914A JP 2013506291 A5 JP2013506291 A5 JP 2013506291A5
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor
- semiconductor material
- semiconductor structure
- epitaxy
- epitaxial
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims 36
- 239000000463 material Substances 0.000 claims 15
- 238000000407 epitaxy Methods 0.000 claims 8
- 239000000758 substrate Substances 0.000 claims 6
- 125000006850 spacer group Chemical group 0.000 claims 4
- 238000009792 diffusion process Methods 0.000 claims 3
- 239000002019 doping agent Substances 0.000 claims 3
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims 3
- 125000004429 atom Chemical group 0.000 claims 2
- 125000005843 halogen group Chemical group 0.000 claims 2
- 238000005468 ion implantation Methods 0.000 claims 2
- 229910000577 Silicon-germanium Inorganic materials 0.000 claims 1
- 239000000956 alloy Substances 0.000 claims 1
- 229910045601 alloy Inorganic materials 0.000 claims 1
- 239000007943 implant Substances 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/566,004 | 2009-09-24 | ||
| US12/566,004 US8022488B2 (en) | 2009-09-24 | 2009-09-24 | High-performance FETs with embedded stressors |
| PCT/US2010/048039 WO2011037743A2 (en) | 2009-09-24 | 2010-09-08 | Method and structure for forming high-performance fets with embedded stressors |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013506291A JP2013506291A (ja) | 2013-02-21 |
| JP2013506291A5 true JP2013506291A5 (enExample) | 2014-08-14 |
| JP5689470B2 JP5689470B2 (ja) | 2015-03-25 |
Family
ID=43755874
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012530914A Expired - Fee Related JP5689470B2 (ja) | 2009-09-24 | 2010-09-08 | 埋め込みストレッサを有する高性能fetを形成するための方法および構造 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US8022488B2 (enExample) |
| JP (1) | JP5689470B2 (enExample) |
| CN (1) | CN102511081B (enExample) |
| DE (1) | DE112010002895B4 (enExample) |
| GB (1) | GB2486839B (enExample) |
| TW (1) | TW201125124A (enExample) |
| WO (1) | WO2011037743A2 (enExample) |
Families Citing this family (48)
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|---|---|---|---|---|
| JP2011086728A (ja) * | 2009-10-14 | 2011-04-28 | Renesas Electronics Corp | 半導体装置およびその製造方法 |
| US8236660B2 (en) | 2010-04-21 | 2012-08-07 | International Business Machines Corporation | Monolayer dopant embedded stressor for advanced CMOS |
| US8299535B2 (en) * | 2010-06-25 | 2012-10-30 | International Business Machines Corporation | Delta monolayer dopants epitaxy for embedded source/drain silicide |
| KR101721036B1 (ko) * | 2010-09-02 | 2017-03-29 | 삼성전자주식회사 | 반도체 소자 및 그 제조 방법 |
| US9698054B2 (en) | 2010-10-19 | 2017-07-04 | Taiwan Semiconductor Manufacturing Company, Ltd. | Strained structure of a p-type field effect transistor |
| US8946064B2 (en) * | 2011-06-16 | 2015-02-03 | International Business Machines Corporation | Transistor with buried silicon germanium for improved proximity control and optimized recess shape |
| DE102011080438B3 (de) * | 2011-08-04 | 2013-01-31 | Globalfoundries Inc. | Herstellverfahren für einen N-Kanaltransistor mit einer Metallgateelektrodenstruktur mit großem ε und einem reduzierten Reihenwiderstand durch epitaktisch hergestelltes Halbleitermaterial in den Drain- und Sourcebereichen und N-Kanaltransistor |
| US9064892B2 (en) * | 2011-08-30 | 2015-06-23 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor devices utilizing partially doped stressor film portions and methods for forming the same |
| CN102280379B (zh) * | 2011-09-05 | 2016-06-01 | 上海集成电路研发中心有限公司 | 一种应变硅nmos器件的制造方法 |
| CN103137480B (zh) * | 2011-11-25 | 2015-07-08 | 中芯国际集成电路制造(上海)有限公司 | Mos器件的形成方法及其形成的mos器件 |
| US8658505B2 (en) * | 2011-12-14 | 2014-02-25 | International Business Machines Corporation | Embedded stressors for multigate transistor devices |
| US9006069B2 (en) * | 2011-12-19 | 2015-04-14 | Intel Corporation | Pulsed laser anneal process for transistors with partial melt of a raised source-drain |
| CN103187299B (zh) * | 2011-12-31 | 2015-08-05 | 中芯国际集成电路制造(上海)有限公司 | 晶体管的形成方法 |
| US9012277B2 (en) * | 2012-01-09 | 2015-04-21 | Globalfoundries Inc. | In situ doping and diffusionless annealing of embedded stressor regions in PMOS and NMOS devices |
| US8828831B2 (en) | 2012-01-23 | 2014-09-09 | International Business Machines Corporation | Epitaxial replacement of a raised source/drain |
| US9142642B2 (en) * | 2012-02-10 | 2015-09-22 | Taiwan Semiconductor Manufacturing Company, Ltd. | Methods and apparatus for doped SiGe source/drain stressor deposition |
| US8592916B2 (en) | 2012-03-20 | 2013-11-26 | International Business Machines Corporation | Selectively raised source/drain transistor |
| CN103325684B (zh) | 2012-03-23 | 2016-03-02 | 中国科学院微电子研究所 | 一种半导体结构及其制造方法 |
| US8853750B2 (en) | 2012-04-27 | 2014-10-07 | International Business Machines Corporation | FinFET with enhanced embedded stressor |
| US8674447B2 (en) * | 2012-04-27 | 2014-03-18 | International Business Machines Corporation | Transistor with improved sigma-shaped embedded stressor and method of formation |
| US8936977B2 (en) * | 2012-05-29 | 2015-01-20 | Globalfoundries Singapore Pte. Ltd. | Late in-situ doped SiGe junctions for PMOS devices on 28 nm low power/high performance technologies using a silicon oxide encapsulation, early halo and extension implantations |
| US20130328135A1 (en) * | 2012-06-12 | 2013-12-12 | International Business Machines Corporation | Preventing fully silicided formation in high-k metal gate processing |
| KR101909204B1 (ko) * | 2012-06-25 | 2018-10-17 | 삼성전자 주식회사 | 내장된 스트레인-유도 패턴을 갖는 반도체 소자 및 그 형성 방법 |
| US9029208B2 (en) | 2012-11-30 | 2015-05-12 | International Business Machines Corporation | Semiconductor device with replacement metal gate and method for selective deposition of material for replacement metal gate |
| US9356136B2 (en) * | 2013-03-07 | 2016-05-31 | Taiwan Semiconductor Manufacturing Co., Ltd. | Engineered source/drain region for n-Type MOSFET |
| DE102013105705B4 (de) * | 2013-03-13 | 2020-03-12 | Taiwan Semiconductor Manufacturing Company, Ltd. | Halbleitervorrichtung und dessen Herstellung |
| US9691882B2 (en) * | 2013-03-14 | 2017-06-27 | International Business Machines Corporation | Carbon-doped cap for a raised active semiconductor region |
| JP2014187238A (ja) * | 2013-03-25 | 2014-10-02 | Toyoda Gosei Co Ltd | Mis型半導体装置の製造方法 |
| US9059217B2 (en) | 2013-03-28 | 2015-06-16 | International Business Machines Corporation | FET semiconductor device with low resistance and enhanced metal fill |
| US9252014B2 (en) | 2013-09-04 | 2016-02-02 | Globalfoundries Inc. | Trench sidewall protection for selective epitaxial semiconductor material formation |
| CN104465383B (zh) * | 2013-09-23 | 2018-03-06 | 中芯国际集成电路制造(上海)有限公司 | 降低mos晶体管短沟道效应的方法 |
| US10090392B2 (en) * | 2014-01-17 | 2018-10-02 | Taiwan Semiconductor Manufacturing Company Ltd. | Semiconductor device and manufacturing method thereof |
| US9324830B2 (en) | 2014-03-27 | 2016-04-26 | International Business Machines Corporation | Self-aligned contact process enabled by low temperature |
| JP6194516B2 (ja) | 2014-08-29 | 2017-09-13 | 豊田合成株式会社 | Mis型半導体装置 |
| US9543438B2 (en) * | 2014-10-15 | 2017-01-10 | Taiwan Semiconductor Manufacturing Company, Ltd. | Contact resistance reduction technique |
| KR102152285B1 (ko) * | 2014-12-08 | 2020-09-04 | 삼성전자주식회사 | 스트레서를 갖는 반도체 소자 및 그 형성 방법 |
| US9991343B2 (en) * | 2015-02-26 | 2018-06-05 | Taiwan Semiconductor Manufacturing Company Ltd. | LDD-free semiconductor structure and manufacturing method of the same |
| KR102326112B1 (ko) | 2015-03-30 | 2021-11-15 | 삼성전자주식회사 | 반도체 소자 |
| US9947755B2 (en) * | 2015-09-30 | 2018-04-17 | International Business Machines Corporation | III-V MOSFET with self-aligned diffusion barrier |
| CN106960838B (zh) * | 2016-01-11 | 2019-07-02 | 中芯国际集成电路制造(上海)有限公司 | 静电保护器件及其形成方法 |
| US9997631B2 (en) * | 2016-06-03 | 2018-06-12 | Taiwan Semiconductor Manufacturing Company | Methods for reducing contact resistance in semiconductors manufacturing process |
| JP6685870B2 (ja) | 2016-09-15 | 2020-04-22 | 株式会社東芝 | 半導体装置 |
| CN107958935B (zh) * | 2016-10-18 | 2020-11-27 | 中芯国际集成电路制造(上海)有限公司 | 鳍式场效应管及其形成方法 |
| US10879354B2 (en) * | 2016-11-28 | 2020-12-29 | Taiwan Semiconductor Manufacturing Co., Ltd. | Semiconductor device and forming method thereof |
| CN109300788A (zh) * | 2017-07-25 | 2019-02-01 | 中芯国际集成电路制造(北京)有限公司 | 半导体结构及其形成方法 |
| US10468530B2 (en) | 2017-11-15 | 2019-11-05 | Taiwan Semiconductor Manufacturing Co., Ltd. | Semiconductor structure with source/drain multi-layer structure and method for forming the same |
| US10510889B2 (en) | 2017-11-29 | 2019-12-17 | Taiwan Semiconductor Manufacturing Co., Ltd. | P-type strained channel in a fin field effect transistor (FinFET) device |
| CN110838521B (zh) * | 2019-11-19 | 2023-04-07 | 上海华力集成电路制造有限公司 | P型半导体器件及其制造方法 |
Family Cites Families (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2839018B2 (ja) * | 1996-07-31 | 1998-12-16 | 日本電気株式会社 | 半導体装置の製造方法 |
| JP2001127291A (ja) * | 1999-11-01 | 2001-05-11 | Mitsubishi Electric Corp | 半導体装置及びその製造方法 |
| US6621131B2 (en) | 2001-11-01 | 2003-09-16 | Intel Corporation | Semiconductor transistor having a stressed channel |
| KR100406537B1 (ko) | 2001-12-03 | 2003-11-20 | 주식회사 하이닉스반도체 | 반도체장치의 제조 방법 |
| US7335545B2 (en) | 2002-06-07 | 2008-02-26 | Amberwave Systems Corporation | Control of strain in device layers by prevention of relaxation |
| US6995430B2 (en) * | 2002-06-07 | 2006-02-07 | Amberwave Systems Corporation | Strained-semiconductor-on-insulator device structures |
| US7329923B2 (en) | 2003-06-17 | 2008-02-12 | International Business Machines Corporation | High-performance CMOS devices on hybrid crystal oriented substrates |
| US6891192B2 (en) | 2003-08-04 | 2005-05-10 | International Business Machines Corporation | Structure and method of making strained semiconductor CMOS transistors having lattice-mismatched semiconductor regions underlying source and drain regions |
| US7166528B2 (en) * | 2003-10-10 | 2007-01-23 | Applied Materials, Inc. | Methods of selective deposition of heavily doped epitaxial SiGe |
| US7303949B2 (en) * | 2003-10-20 | 2007-12-04 | International Business Machines Corporation | High performance stress-enhanced MOSFETs using Si:C and SiGe epitaxial source/drain and method of manufacture |
| US7023055B2 (en) | 2003-10-29 | 2006-04-04 | International Business Machines Corporation | CMOS on hybrid substrate with different crystal orientations using silicon-to-silicon direct wafer bonding |
| US20050116290A1 (en) | 2003-12-02 | 2005-06-02 | De Souza Joel P. | Planar substrate with selected semiconductor crystal orientations formed by localized amorphization and recrystallization of stacked template layers |
| US6946350B2 (en) | 2003-12-31 | 2005-09-20 | Intel Corporation | Controlled faceting of source/drain regions |
| US7226842B2 (en) | 2004-02-17 | 2007-06-05 | Intel Corporation | Fabricating strained channel epitaxial source/drain transistors |
| KR100642747B1 (ko) | 2004-06-22 | 2006-11-10 | 삼성전자주식회사 | Cmos 트랜지스터의 제조방법 및 그에 의해 제조된cmos 트랜지스터 |
| JP4369359B2 (ja) * | 2004-12-28 | 2009-11-18 | 富士通マイクロエレクトロニクス株式会社 | 半導体装置 |
| US7816236B2 (en) * | 2005-02-04 | 2010-10-19 | Asm America Inc. | Selective deposition of silicon-containing films |
| US7202513B1 (en) * | 2005-09-29 | 2007-04-10 | International Business Machines Corporation | Stress engineering using dual pad nitride with selective SOI device architecture |
| DE102006009226B9 (de) * | 2006-02-28 | 2011-03-10 | Advanced Micro Devices, Inc., Sunnyvale | Verfahren zum Herstellen eines Transistors mit einer erhöhten Schwellwertstabilität ohne Durchlass-Strombeeinträchtigung und Transistor |
| US7618866B2 (en) * | 2006-06-09 | 2009-11-17 | International Business Machines Corporation | Structure and method to form multilayer embedded stressors |
| JP2008235568A (ja) * | 2007-03-20 | 2008-10-02 | Toshiba Corp | 半導体装置およびその製造方法 |
| US7745847B2 (en) * | 2007-08-09 | 2010-06-29 | United Microelectronics Corp. | Metal oxide semiconductor transistor |
| US7759199B2 (en) * | 2007-09-19 | 2010-07-20 | Asm America, Inc. | Stressor for engineered strain on channel |
| US20090140351A1 (en) * | 2007-11-30 | 2009-06-04 | Hong-Nien Lin | MOS Devices Having Elevated Source/Drain Regions |
-
2009
- 2009-09-24 US US12/566,004 patent/US8022488B2/en active Active
-
2010
- 2010-09-08 DE DE112010002895T patent/DE112010002895B4/de active Active
- 2010-09-08 WO PCT/US2010/048039 patent/WO2011037743A2/en not_active Ceased
- 2010-09-08 GB GB1204634.8A patent/GB2486839B/en not_active Expired - Fee Related
- 2010-09-08 CN CN201080041761.1A patent/CN102511081B/zh not_active Expired - Fee Related
- 2010-09-08 JP JP2012530914A patent/JP5689470B2/ja not_active Expired - Fee Related
- 2010-09-17 TW TW099131667A patent/TW201125124A/zh unknown
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