JP2010500750A5 - - Google Patents

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Publication number
JP2010500750A5
JP2010500750A5 JP2009523772A JP2009523772A JP2010500750A5 JP 2010500750 A5 JP2010500750 A5 JP 2010500750A5 JP 2009523772 A JP2009523772 A JP 2009523772A JP 2009523772 A JP2009523772 A JP 2009523772A JP 2010500750 A5 JP2010500750 A5 JP 2010500750A5
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JP
Japan
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circuit
polybutadiene
layer
circuit material
poly
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JP2009523772A
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English (en)
Japanese (ja)
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JP5433416B2 (ja
JP2010500750A (ja
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Priority claimed from PCT/US2007/016987 external-priority patent/WO2008020984A2/en
Publication of JP2010500750A publication Critical patent/JP2010500750A/ja
Publication of JP2010500750A5 publication Critical patent/JP2010500750A5/ja
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JP2009523772A 2006-08-08 2007-07-27 回路材料、回路および多層回路積層板 Active JP5433416B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US82171006P 2006-08-08 2006-08-08
US60/821,710 2006-08-08
PCT/US2007/016987 WO2008020984A2 (en) 2006-08-08 2007-07-27 Circuit materials with improved bond, method of manufacture thereof, and articles formed therefrom

Publications (3)

Publication Number Publication Date
JP2010500750A JP2010500750A (ja) 2010-01-07
JP2010500750A5 true JP2010500750A5 (cg-RX-API-DMAC7.html) 2010-09-16
JP5433416B2 JP5433416B2 (ja) 2014-03-05

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JP2009523772A Active JP5433416B2 (ja) 2006-08-08 2007-07-27 回路材料、回路および多層回路積層板

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US (2) US8431222B2 (cg-RX-API-DMAC7.html)
JP (1) JP5433416B2 (cg-RX-API-DMAC7.html)
CN (1) CN101522318B (cg-RX-API-DMAC7.html)
DE (1) DE112007001861B4 (cg-RX-API-DMAC7.html)
GB (1) GB2455917B (cg-RX-API-DMAC7.html)
WO (1) WO2008020984A2 (cg-RX-API-DMAC7.html)

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