JPS6426555A - Addition reaction type ether imide compound, production and composition thereof - Google Patents

Addition reaction type ether imide compound, production and composition thereof

Info

Publication number
JPS6426555A
JPS6426555A JP18106187A JP18106187A JPS6426555A JP S6426555 A JPS6426555 A JP S6426555A JP 18106187 A JP18106187 A JP 18106187A JP 18106187 A JP18106187 A JP 18106187A JP S6426555 A JPS6426555 A JP S6426555A
Authority
JP
Japan
Prior art keywords
formula
compound shown
addition reaction
composition
production
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18106187A
Other languages
Japanese (ja)
Inventor
Akio Nishikawa
Toru Koyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP18106187A priority Critical patent/JPS6426555A/en
Publication of JPS6426555A publication Critical patent/JPS6426555A/en
Pending legal-status Critical Current

Links

Abstract

NEW MATERIAL:A compound shown by formula I (D1 and D2 are bifunctional organic group containing ethylenic unsaturated double bond). USE:A polymer raw material readily providing a cured polymer having excellent heat flexibility resistance. PREPARATION:An ether diamine compound shown by formula II and a dicarboxylic acid anhydride (e.g. maleic anhydride) shown by formula III or formula IV containing ethylenic unsaturated double bond are subjected to addition reaction and condensed through dehydration to give a compound shown by formula I. The reaction is carried out by contact in a solvent such as DMF, DMA or DMSO. The compound shown by formula I is polymerized in the presence of an amine compound to give a heat-resistant resinous material.
JP18106187A 1987-07-22 1987-07-22 Addition reaction type ether imide compound, production and composition thereof Pending JPS6426555A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18106187A JPS6426555A (en) 1987-07-22 1987-07-22 Addition reaction type ether imide compound, production and composition thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18106187A JPS6426555A (en) 1987-07-22 1987-07-22 Addition reaction type ether imide compound, production and composition thereof

Publications (1)

Publication Number Publication Date
JPS6426555A true JPS6426555A (en) 1989-01-27

Family

ID=16094101

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18106187A Pending JPS6426555A (en) 1987-07-22 1987-07-22 Addition reaction type ether imide compound, production and composition thereof

Country Status (1)

Country Link
JP (1) JPS6426555A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010100609A (en) * 2008-09-25 2010-05-06 Chisso Corp Polymerizable liquid crystal compound, liquid crystal composition and polymer
US8431222B2 (en) 2006-08-08 2013-04-30 World Properties, Inc. Circuit materials with improved bond, method of manufacture thereof, and articles formed therefrom
US8519273B2 (en) 2008-04-10 2013-08-27 Sankar Paul Circuit materials with improved bond, method of manufacture thereof, and articles formed therefrom
US8632874B2 (en) 2006-08-08 2014-01-21 Rogers Corporation Dielectric materials, methods of forming subassemblies therefrom, and the subassemblies formed therewith
WO2020217678A1 (en) * 2019-04-26 2020-10-29 Dic株式会社 Curable resin composition
JP2021102714A (en) * 2019-12-25 2021-07-15 Dic株式会社 (meth)acrylate resin composition, curable resin composition, cured product and article

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8431222B2 (en) 2006-08-08 2013-04-30 World Properties, Inc. Circuit materials with improved bond, method of manufacture thereof, and articles formed therefrom
US8632874B2 (en) 2006-08-08 2014-01-21 Rogers Corporation Dielectric materials, methods of forming subassemblies therefrom, and the subassemblies formed therewith
US8722192B2 (en) 2006-08-08 2014-05-13 World Properties, Inc. Circuit materials with improved bond, method of manufacture thereof, and articles formed therefrom
US8519273B2 (en) 2008-04-10 2013-08-27 Sankar Paul Circuit materials with improved bond, method of manufacture thereof, and articles formed therefrom
JP2010100609A (en) * 2008-09-25 2010-05-06 Chisso Corp Polymerizable liquid crystal compound, liquid crystal composition and polymer
WO2020217678A1 (en) * 2019-04-26 2020-10-29 Dic株式会社 Curable resin composition
JPWO2020217678A1 (en) * 2019-04-26 2021-11-25 Dic株式会社 Curable resin composition
CN113767130A (en) * 2019-04-26 2021-12-07 Dic株式会社 Curable resin composition
JP2021102714A (en) * 2019-12-25 2021-07-15 Dic株式会社 (meth)acrylate resin composition, curable resin composition, cured product and article

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