JPS6426555A - Addition reaction type ether imide compound, production and composition thereof - Google Patents
Addition reaction type ether imide compound, production and composition thereofInfo
- Publication number
- JPS6426555A JPS6426555A JP18106187A JP18106187A JPS6426555A JP S6426555 A JPS6426555 A JP S6426555A JP 18106187 A JP18106187 A JP 18106187A JP 18106187 A JP18106187 A JP 18106187A JP S6426555 A JPS6426555 A JP S6426555A
- Authority
- JP
- Japan
- Prior art keywords
- formula
- compound shown
- addition reaction
- composition
- production
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
NEW MATERIAL:A compound shown by formula I (D1 and D2 are bifunctional organic group containing ethylenic unsaturated double bond). USE:A polymer raw material readily providing a cured polymer having excellent heat flexibility resistance. PREPARATION:An ether diamine compound shown by formula II and a dicarboxylic acid anhydride (e.g. maleic anhydride) shown by formula III or formula IV containing ethylenic unsaturated double bond are subjected to addition reaction and condensed through dehydration to give a compound shown by formula I. The reaction is carried out by contact in a solvent such as DMF, DMA or DMSO. The compound shown by formula I is polymerized in the presence of an amine compound to give a heat-resistant resinous material.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18106187A JPS6426555A (en) | 1987-07-22 | 1987-07-22 | Addition reaction type ether imide compound, production and composition thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18106187A JPS6426555A (en) | 1987-07-22 | 1987-07-22 | Addition reaction type ether imide compound, production and composition thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6426555A true JPS6426555A (en) | 1989-01-27 |
Family
ID=16094101
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP18106187A Pending JPS6426555A (en) | 1987-07-22 | 1987-07-22 | Addition reaction type ether imide compound, production and composition thereof |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6426555A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010100609A (en) * | 2008-09-25 | 2010-05-06 | Chisso Corp | Polymerizable liquid crystal compound, liquid crystal composition and polymer |
US8431222B2 (en) | 2006-08-08 | 2013-04-30 | World Properties, Inc. | Circuit materials with improved bond, method of manufacture thereof, and articles formed therefrom |
US8519273B2 (en) | 2008-04-10 | 2013-08-27 | Sankar Paul | Circuit materials with improved bond, method of manufacture thereof, and articles formed therefrom |
US8632874B2 (en) | 2006-08-08 | 2014-01-21 | Rogers Corporation | Dielectric materials, methods of forming subassemblies therefrom, and the subassemblies formed therewith |
WO2020217678A1 (en) * | 2019-04-26 | 2020-10-29 | Dic株式会社 | Curable resin composition |
JP2021102714A (en) * | 2019-12-25 | 2021-07-15 | Dic株式会社 | (meth)acrylate resin composition, curable resin composition, cured product and article |
-
1987
- 1987-07-22 JP JP18106187A patent/JPS6426555A/en active Pending
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8431222B2 (en) | 2006-08-08 | 2013-04-30 | World Properties, Inc. | Circuit materials with improved bond, method of manufacture thereof, and articles formed therefrom |
US8632874B2 (en) | 2006-08-08 | 2014-01-21 | Rogers Corporation | Dielectric materials, methods of forming subassemblies therefrom, and the subassemblies formed therewith |
US8722192B2 (en) | 2006-08-08 | 2014-05-13 | World Properties, Inc. | Circuit materials with improved bond, method of manufacture thereof, and articles formed therefrom |
US8519273B2 (en) | 2008-04-10 | 2013-08-27 | Sankar Paul | Circuit materials with improved bond, method of manufacture thereof, and articles formed therefrom |
JP2010100609A (en) * | 2008-09-25 | 2010-05-06 | Chisso Corp | Polymerizable liquid crystal compound, liquid crystal composition and polymer |
WO2020217678A1 (en) * | 2019-04-26 | 2020-10-29 | Dic株式会社 | Curable resin composition |
JPWO2020217678A1 (en) * | 2019-04-26 | 2021-11-25 | Dic株式会社 | Curable resin composition |
CN113767130A (en) * | 2019-04-26 | 2021-12-07 | Dic株式会社 | Curable resin composition |
JP2021102714A (en) * | 2019-12-25 | 2021-07-15 | Dic株式会社 | (meth)acrylate resin composition, curable resin composition, cured product and article |
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