JPS56166215A - Heat-resistant resin composition - Google Patents
Heat-resistant resin compositionInfo
- Publication number
- JPS56166215A JPS56166215A JP6955480A JP6955480A JPS56166215A JP S56166215 A JPS56166215 A JP S56166215A JP 6955480 A JP6955480 A JP 6955480A JP 6955480 A JP6955480 A JP 6955480A JP S56166215 A JPS56166215 A JP S56166215A
- Authority
- JP
- Japan
- Prior art keywords
- bis
- ether
- resin composition
- methyl
- maleimide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Abstract
PURPOSE: A resin composition that comprises an ether-imide compound containing ethylenically unsaturated bonds and an N,N'-substituted bis-maleimide compound, thus giving crosslinked products with high heat resistance and flexibility.
CONSTITUTION: (A) 100pts.wt. of Ether-imide compound of formula II (R1WR4 are H, lower alkyl; R5, R6 are H, methyl), which is obtained by reaction of a diamine with an ether linkage, such as 2,2-bis[4-(4-aminophenoxy)phenyl]propane with a dicarboxylic anhydride such as maleic anhydride, are combined with (B) preferably 10W1,000pts. of a bis-maleimide of formula III (Y is H, methyl; Z is divalent organic group) to produce the objective composition. The curing is conducted, e.g., by adding a polymerization initiator and heating to 100W200°C.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6955480A JPS56166215A (en) | 1980-05-27 | 1980-05-27 | Heat-resistant resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6955480A JPS56166215A (en) | 1980-05-27 | 1980-05-27 | Heat-resistant resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS56166215A true JPS56166215A (en) | 1981-12-21 |
| JPS6317081B2 JPS6317081B2 (en) | 1988-04-12 |
Family
ID=13406065
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6955480A Granted JPS56166215A (en) | 1980-05-27 | 1980-05-27 | Heat-resistant resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS56166215A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58127735A (en) * | 1982-01-26 | 1983-07-29 | Mitsui Toatsu Chem Inc | Curable resin composition |
| JPS61271326A (en) * | 1985-05-25 | 1986-12-01 | Matsushita Electric Works Ltd | Production of addition-type imide resin prepolymer |
| JPH04202323A (en) * | 1990-11-29 | 1992-07-23 | Nitto Denko Corp | Powder composition for electrical insulation |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5021517A (en) * | 1973-06-29 | 1975-03-07 |
-
1980
- 1980-05-27 JP JP6955480A patent/JPS56166215A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5021517A (en) * | 1973-06-29 | 1975-03-07 |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58127735A (en) * | 1982-01-26 | 1983-07-29 | Mitsui Toatsu Chem Inc | Curable resin composition |
| JPH0372655B2 (en) * | 1982-01-26 | 1991-11-19 | Mitsui Toatsu Chemicals | |
| JPS61271326A (en) * | 1985-05-25 | 1986-12-01 | Matsushita Electric Works Ltd | Production of addition-type imide resin prepolymer |
| JPH04202323A (en) * | 1990-11-29 | 1992-07-23 | Nitto Denko Corp | Powder composition for electrical insulation |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6317081B2 (en) | 1988-04-12 |
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