CN113767130A - Curable resin composition - Google Patents

Curable resin composition Download PDF

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CN113767130A
CN113767130A CN202080030892.3A CN202080030892A CN113767130A CN 113767130 A CN113767130 A CN 113767130A CN 202080030892 A CN202080030892 A CN 202080030892A CN 113767130 A CN113767130 A CN 113767130A
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resin composition
maleimide
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curable resin
carbon atoms
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CN113767130B (en
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下野智弘
冈本竜也
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DIC Corp
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
    • C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F279/00—Macromolecular compounds obtained by polymerising monomers on to polymers of monomers having two or more carbon-to-carbon double bonds as defined in group C08F36/00
    • C08F279/02—Macromolecular compounds obtained by polymerising monomers on to polymers of monomers having two or more carbon-to-carbon double bonds as defined in group C08F36/00 on to polymers of conjugated dienes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/088—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyamides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F22/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides or nitriles thereof
    • C08F22/36—Amides or imides
    • C08F22/40—Imides, e.g. cyclic imides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
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    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B32B2311/12—Copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
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  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Reinforced Plastic Materials (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laminated Bodies (AREA)
  • Graft Or Block Polymers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Pyrrole Compounds (AREA)

Abstract

Providing: a curable resin composition having a cured product thereof which has both excellent heat resistance and excellent dielectric properties, a cured product thereof, a prepreg, a circuit board, a build-up film, a semiconductor sealing material, and a semiconductor device having the above properties. The curable resin composition of the present invention is characterized by containing: a maleimide having an indane skeleton (A), and a diene polymer (B).

Description

Curable resin composition
Technical Field
The present invention relates to a curable resin composition, a cured product obtained from the curable resin composition, a prepreg, a circuit board, a build-up film, a semiconductor sealing material, and a semiconductor device.
Background
As materials for circuit boards for electronic devices, there are widely used: a prepreg obtained by impregnating a glass cloth with a thermosetting resin such as an epoxy resin-based or BT (bismaleimide triazine) resin-based resin and drying the resin by heating, a laminate obtained by heating and curing the prepreg, and a multilayer board obtained by combining the laminate and the prepreg and heating and curing the combination. Among them, thinning of the semiconductor package substrate has progressed, and warpage of the package substrate at the time of mounting has become a problem, and therefore, in order to suppress this, a material exhibiting high heat resistance is required.
In recent years, signals have been increased in speed and frequency, and it is desired to provide: a thermosetting resin composition which can provide a cured product that exhibits a sufficiently low dielectric loss tangent while maintaining a sufficiently low dielectric constant under these circumstances.
In particular, recently, further improvement in performance represented by heat resistance and dielectric characteristics, and materials and compositions having the performance are required for various electric material applications, particularly advanced material applications.
In response to such a demand, maleimide resins are attracting attention as materials having both heat resistance and low dielectric constant/low dielectric loss tangent. However, although the conventional maleimide resins exhibit high heat resistance, their dielectric constant/dielectric loss tangent values do not reach the level required for advanced material applications, and their handling properties are poor due to the solubility of the poorly soluble agent, and therefore, there is a strong demand for the development of resins that exhibit further low dielectric constant/low dielectric loss tangent and also have excellent solvent solubility while maintaining heat resistance.
In such a case, as a cyanate ester material having both high dielectric characteristics and high heat resistance, a resin composition in which a phenol novolac type cyanate ester resin, a bisphenol a cyanate ester resin, and a non-halogen epoxy resin are blended is known (see patent document 1).
However, although the resin composition described in patent document 1 has improved heat resistance and dielectric properties of a cured product to some extent, the heat resistance has not yet reached the level required in recent years.
Documents of the prior art
Patent document
Patent document 1: japanese patent laid-open publication No. 2004-182850
Disclosure of Invention
Problems to be solved by the invention
Accordingly, an object of the present invention is to provide: a curable resin composition having a cured product thereof which has both excellent heat resistance and excellent dielectric properties, a cured product thereof, and a prepreg, a circuit board, a build-up film, a semiconductor sealing material, and a semiconductor device having the above properties.
Means for solving the problems
The present inventors have therefore made intensive studies to solve the above-mentioned problems, and as a result, have found that a curable resin composition containing a maleimide having an indane skeleton (a) and a diene polymer (B) can provide a cured product having a low dielectric constant and a low dielectric loss tangent and having excellent heat resistance at the same time, and have completed the present invention.
That is, the present invention relates to a curable resin composition comprising: a maleimide having an indane skeleton (A), and a diene polymer (B).
In the curable resin composition of the present invention, the maleimide (a) is preferably represented by the following general formula (1).
Figure BDA0003317362130000031
(in the formula (1), Ra independently represents alkyl, alkoxy or alkylthio with 1-10 carbon atoms, aryl, aryloxy or arylthio with 6-10 carbon atoms, cycloalkyl with 3-10 carbon atoms, halogen atom, nitro, hydroxyl or sulfydryl, q represents an integer value of 0-4, when q is 2-4, Ra is optionally the same or different in the same ring, Rb independently represents alkyl, alkoxy or alkylthio with 1-10 carbon atoms, aryl, aryloxy or arylthio with 6-10 carbon atoms, cycloalkyl with 3-10 carbon atoms, halogen atom, hydroxyl or sulfydryl, r represents an integer value of 0-3, when r is 2-3, Rb is optionally the same or different in the same ring, n is an average repeating unit number and represents a number of 0.5-20.)
The cured product of the present invention is preferably obtained by curing the curable resin composition.
The prepreg of the present invention preferably has a reinforcing base material and a semi-cured product of the curable resin composition impregnated in the reinforcing base material.
The circuit board of the present invention is preferably obtained by laminating the prepreg and the copper foil and then heating, pressure-bonding, and molding the laminate.
The laminate film of the present invention preferably contains the curable resin composition.
The semiconductor sealing material of the present invention preferably contains the curable resin composition.
The semiconductor device of the present invention preferably includes a cured product obtained by heat-curing the semiconductor sealing material.
ADVANTAGEOUS EFFECTS OF INVENTION
According to the curable resin composition of the present invention, a cured product obtained from the curable resin composition can be provided which has both excellent heat resistance and dielectric properties and also the above properties, and a cured product obtained from the curable resin composition, a prepreg, a circuit board, a build-up film, a semiconductor sealing material, and a semiconductor device can be provided, and the curable resin composition is useful.
Detailed Description
The present invention will be described in detail below.
The present invention relates to a curable resin composition, characterized by containing: a maleimide having an indane skeleton (A), and a diene polymer (B). Among them, the maleimide (a) is preferably represented by the following general formula (1). The maleimide (a) has an indane skeleton, and is preferable because the proportion of polar functional groups in the structure of the maleimide (a) is smaller than that of conventional maleimides, and thus the dielectric properties are excellent. In addition, a cured product using a conventional maleimide resin tends to be brittle, and there is a fear that the brittleness resistance is poor, but the maleimide (a) has an indane skeleton and is excellent in flexibility, and improvement of the brittleness resistance can be expected, and is preferable.
Figure BDA0003317362130000041
In the general formula (1), Ra independently represents an alkyl group, an alkoxy group or an alkylthio group having 1 to 10 carbon atoms, an aryl group, an aryloxy group or an arylthio group having 6 to 10 carbon atoms, a cycloalkyl group having 3 to 10 carbon atoms (preferably 5 to 10 carbon atoms), a halogen atom, a nitro group, a hydroxyl group or a mercapto group, and q represents an integer of 0 to 4. When q is 2 to 4, Ra is optionally the same or different in the same ring. Rb each independently represents an alkyl group, an alkoxy group or an alkylthio group having 1 to 10 carbon atoms, an aryl group, an aryloxy group or an arylthio group having 6 to 10 carbon atoms, a cycloalkyl group having 3 to 10 carbon atoms, a halogen atom, a hydroxyl group or a mercapto group, and r represents an integer of 0 to 3. When r is 2-3, Rb is optionally the same or different in the same ring. n is the average number of repeating units and represents a number of 0.5 to 20. When r and q are 0, Ra and Rb each represent a hydrogen atom.
Ra in the general formula (1) is preferably any of an alkyl group having 1 to 4 carbon atoms, a cycloalkyl group having 3 to 6 carbon atoms, and an aryl group having 6 to 10 carbon atoms, and the alkyl group having 1 to 4 carbon atoms is used, whereby the solvent solubility is improved by lowering of planarity and lowering of crystallinity in the vicinity of the maleimide group, and a preferable mode is one in which a cured product can be obtained without impairing the reactivity of the maleimide group.
Q in the general formula (1) is preferably 2 to 3, and more preferably 2. When q is 2, the influence of steric hindrance is small, and the electron density on the aromatic ring is increased, which is a preferable mode in the production (synthesis) of maleimide.
In the general formula (1), r is 0, Rb is preferably a hydrogen atom, r is 1 to 3, Rb is preferably at least 1 selected from the group consisting of an alkyl group having 1 to 4 carbon atoms, a cycloalkyl group having 3 to 6 carbon atoms, and an aryl group having 6 to 10 carbon atoms, and particularly, when r is 0 and Rb is a hydrogen atom, steric hindrance is reduced when an indane skeleton is formed in maleimide, which is advantageous for the production (synthesis) of maleimide.
< method for producing maleimide (A) having indane skeleton >
The following describes a method for producing the maleimide (A).
The following general formula (2) is a compound: rc each independently represents a monovalent functional group selected from the group consisting of the following general formulae (3) and (4), at least one of 2 Rc has a hydrogen atom in the ortho-position, and Rb and r represent the same as above.
Figure BDA0003317362130000051
Figure BDA0003317362130000061
The following general formula (5) is: at least 1 of the ortho-position and para-position of the amino group is a hydrogen atom, and Ra and q each represent aniline or a derivative thereof as described above, and an intermediate amine compound represented by the following general formula (6) can be obtained by reacting a compound of the above general formula (2) with a compound of the following general formula (5) in the presence of an acid catalyst. In the following general formula (6), Ra, Rb, q, and r are the same as described above.
Figure BDA0003317362130000062
The intermediate amine compound represented by the above general formula (6) has a structure represented by the following general formula (7) having an indane skeleton, but when q is 3 or less and at least 2 of ortho-position and para-position of the amino group are hydrogen atoms in the aniline or derivative thereof represented by the above general formula (5), it has a structure represented by the following general formula (8). Wherein Ra, Rb, q and r in the following general formula (8) are the same as above, and m is the number of repeating units and represents an integer of 1 to 20. Further, the structure represented by the following general formula (8) may be included in the structure of the above general formula (6).
Figure BDA0003317362130000071
In the indane skeleton (see the general formula (7)) which is a characteristic of the maleimide (a) used in the present invention, the average number of repeating units n is 0.5 to 20, preferably 0.7 to 10.0, more preferably 0.95 to 10.0, further preferably 0.98 to 9.0, further preferably 0.99 to 8.0, further preferably 1.0 to 7.0, and further preferably 1.0 to 6.0 in terms of the average number of repeating units n (average value) in order to have a low melting point (low softening point), a low melt viscosity, and excellent handling properties. The maleimide (a) having an indane skeleton is preferable because it has excellent solvent solubility compared with conventionally used maleimides. When n is less than 0.5, the proportion of the high-melting-point substance in the structure of the maleimide (a) increases, the solubility in a solvent is poor, and the proportion of the high-molecular-weight component contributing to flexibility decreases, so that the brittleness resistance of the resulting cured product decreases, and the flexibility and flexibility decrease, which is not preferable. When n exceeds 20, the heat resistance may be poor, and the high molecular weight component may be excessive, which may result in poor flowability and poor handling properties when a cured product is formed. The value of n is preferably 0.5 to 10.0, more preferably 0.95 to 10.0, from the viewpoints of high heat distortion temperature, high glass transition temperature, and the like.
The compound represented by the above general formula (2) (hereinafter, "compound (a)") used in the present invention is not particularly limited, and typically, o-diisopropenylbenzene and m-diisopropenylbenzene, o-bis (α -hydroxyisopropyl) benzene and m-bis (α -hydroxyisopropyl) benzene, 1- (α -hydroxyisopropyl) -3-isopropenylbenzene, 1- (α -hydroxyisopropyl) -4-isopropenylbenzene, or a mixture thereof is used. In addition, nuclear alkyl substituted compounds of these compounds, such as diisopropenyltoluene and bis (. alpha. -hydroxyisopropyl) toluene, and further nuclear halogen substituted compounds, such as chlorodiisopropenylbenzene and chlorobis (. alpha. -hydroxyisopropyl) benzene, may be used.
Further, as the aforementioned compound (a), for example, 2-chloro-1, 4-diisopropenylbenzene, 2-chloro-1, 4-bis (. alpha. -hydroxyisopropyl) benzene, 2-bromo-1, 4-diisopropenylbenzene, 2-bromo-1, 4-bis (. alpha. -hydroxyisopropyl) benzene, 2-bromo-1, 3-diisopropenylbenzene, 2-bromo-1, 3-bis (. alpha. -hydroxyisopropyl) benzene, 4-bromo-1, 3-diisopropylbenzene, 4-bromo-1, 3-bis (. alpha. -hydroxyisopropyl) benzene, 5-bromo-1, 3-diisopropenylbenzene, 5-bromo-1, 3-bis (. alpha. -hydroxyisopropyl) benzene, 2-bromo-1, 4-diisopropenylbenzene, 2-bromo-bis (alpha. -hydroxyisopropyl) benzene, 2-bromo-1, 3-bis (alpha. -hydroxyisopropyl) benzene, 2-bromo-1, 4-diisopropenylbenzene, 2-hydroxy-1, 3-bis (alpha. -hydroxyisopropyl) benzene, 4-diisopropenylbenzene, 2-methoxy-1, 4-diisopropenylbenzene, 2-methoxy-1, 4-bis (. alpha. -hydroxyisopropyl) benzene, 5-ethoxy-1, 3-diisopropenylbenzene, 5-ethoxy-1, 3-bis (. alpha. -hydroxyisopropyl) benzene, 2-phenoxy-1, 4-diisopropenylbenzene, 2-phenoxy-1, 4-bis (. alpha. -hydroxyisopropyl) benzene, 2, 4-diisopropenylthiol, 2, 4-bis (. alpha. -hydroxyisopropyl) benzenethiol, 2, 5-diisopropenylthiol, 2, 5-bis (. alpha. -hydroxyisopropyl) benzenethiol, 2-methylthio-1, 4-diisopropenylbenzene, 2-methylthio-1, 4-bis (. alpha. -hydroxyisopropyl) benzene, 2-phenylthio-1, 3-diisopropenylbenzene, 2-phenylthio-1, 3-bis (. alpha. -hydroxyisopropyl) benzene, 2-phenyl-1, 4-diisopropenylbenzene, 2-phenyl-1, 4-bis (. alpha. -hydroxyisopropyl) benzene, 2-cyclopentyl-1, 4-diisopropenylbenzene, 2-cyclopentyl-1, 4-bis (. alpha. -hydroxyisopropyl) benzene, 5-naphthyl-1, 3-diisopropenylbenzene, 5-naphthyl-1, 3-bis (. alpha. -hydroxyisopropyl) benzene, 2-methyl-1, 4-diisopropenylbenzene, 2-methyl-1, 4-bis (. alpha. -hydroxyisopropyl) benzene, 5-butyl-1, 3-diisopropenylbenzene, 5-butyl-1, 3-bis (. alpha. -hydroxyisopropyl) benzene, 5-cyclohexyl-1, 3-diisopropenylbenzene, 5-cyclohexyl-1, 3-bis (. alpha. -hydroxyisopropyl) benzene, etc.
The substituent contained in the compound (a) is not particularly limited, and the compounds exemplified above can be used, and when the substituent has a large steric hindrance, the obtained maleimides are less likely to be stacked and less likely to be crystallized than the substituent having a small steric hindrance, that is, the solvent solubility of the maleimides is improved, which is a preferable embodiment.
As the compound represented by the above general formula (5) (hereinafter, "compound (b)"), typically, in addition to aniline, there can be used dimethylaniline, diethylaniline, diisopropylaniline, ethylmethylaniline, chloroaniline, dichloroaniline, toluidine, dimethylaniline, phenylaniline, nitroaniline, aminophenol, cyclohexylaniline, and the like. Furthermore, methoxyaniline, ethoxyaniline, phenoxyaniline, naphthyloxyaniline, aminothiol, methylthioaniline, ethylthioaniline and phenylthioaniline may also be exemplified.
In the case where a maleimide group is directly bonded to a benzene ring as in the case of a conventional maleimide (e.g., N-phenylmaleimide), the benzene ring and the 5-membered ring of the maleimide are stably aligned on the same plane, and therefore, they are easily stacked, and high crystallinity is exhibited. Therefore, the solvent solubility is poor. In contrast, in the case of the present invention, the compound (b) is not particularly limited, and the above exemplified compounds can be used, and for example, in the case of 2, 6-dimethylaniline having a methyl group as a substituent, the benzene ring is distorted with the 5-membered ring of the maleimide due to steric hindrance of the methyl group, and the compound is not easily accumulated, so that the crystallinity is reduced and the solvent solubility is improved, which is a preferable embodiment. Among them, if the steric hindrance is too large, reactivity may be inhibited at the time of synthesizing maleimide, and therefore, for example, the compound (b) having an alkyl group having 2 to 4 carbon atoms is preferably used.
In the method for producing an intermediate amine compound represented by the general formula (6) used in the present invention, the compound (a) and the compound (b) are fed and reacted at a molar ratio of the compound (b) to the compound (a) (compound (b)/compound (a)) of preferably 0.1 to 2.0, more preferably 0.2 to 1.0 (stage 1), and then the compound (b) is further fed and reacted at a molar ratio of preferably 0.5 to 20.0, more preferably 0.7 to 5.0 to the previously fed compound (a) (stage 2), whereby a maleimide (a) having an indane skeleton can be obtained. In addition, the 2-stage reaction also brings preferable results in view of the completion of the reaction or the handling property. In the reaction of the 1 st stage, it is preferable that the molar ratio of the compound (b) to the previously added compound (a) (compound (b)/compound (a)) is preferably 0.10 to 0.49, more preferably 0.15 to 0.40, and still more preferably 0.20 to 0.39, so that the molecular weight distribution is broad, the content ratio of the low-molecular-weight high-melting-point substance is low, and the ratio of the high-molecular-weight component is high, whereby an intermediate amine compound and maleimide which are excellent in solvent solubility and can contribute to flexibility and brittleness resistance can be obtained.
The acid catalyst used in the reaction may be, for example, an inorganic acid such as phosphoric acid, hydrochloric acid or sulfuric acid, an organic acid such as oxalic acid, benzenesulfonic acid, toluenesulfonic acid, methanesulfonic acid or fluoromethanesulfonic acid, a solid acid such as activated clay, acid clay, silica-alumina, zeolite or strongly acidic ion exchange resin, a heteropolyacid salt or the like, and the solid acid which can be removed easily by filtration after the reaction is preferable from the viewpoint of handling properties.
The amount of the acid catalyst to be mixed is preferably 5 to 40 parts by mass based on 100 parts by mass of the total amount of the compound (a) and the compound (b) of the raw materials to be initially charged, and 5 to 30 parts by mass in view of handling efficiency and economy. The reaction temperature is usually in the range of 100 to 300 ℃ and is preferably 150 to 230 ℃ in order to suppress the formation of an isomer structure and avoid side reactions such as thermal decomposition.
The reaction time is usually in the range of 2 to 48 hours, preferably 2 to 24 hours, more preferably 4 to 24 hours, and further preferably 4 to 12 hours in total, and more preferably 8 to 12 hours in total for reducing low molecular weight components and increasing high molecular weight components, because the reaction does not proceed completely in a short time and causes side reactions such as thermal decomposition of the product in a long time.
In the method for producing the intermediate amine compound, aniline or a derivative thereof also serves as a solvent, and therefore, it is not necessary to use another solvent, but a solvent may be used. For example, in the case of a reaction system having a dehydration reaction, specifically, in the case of reacting a compound having an α -hydroxypropyl group as a raw material, the following method can be employed: after completion of the dehydration reaction using a solvent capable of azeotropic dehydration such as toluene, xylene or chlorobenzene, the solvent is distilled off, and then the reaction is carried out at the above-mentioned reaction temperature range.
The maleimide (a) used in the present invention can be obtained as follows: the intermediate amine compound represented by the above general formula (6) obtained by the above method is charged into a reactor, dissolved in an appropriate solvent, reacted in the presence of maleic anhydride and a catalyst, unreacted maleic anhydride and other impurities are removed by washing with water or the like after the reaction, and the solvent is removed by reducing the pressure. In addition, a dehydrating agent may be used in the reaction.
The maleimide (a) used in the present invention includes a structure represented by the above general formula (7) having a skeleton of the above general formula (1) and an indane skeleton, and when q is 3 or less and at least 2 of ortho-positions and para-positions of amino groups are hydrogen atoms, a structure corresponding to the above general formula (8), that is, a structure represented by the below general formula (9) may be included as the structure represented by the above general formula (1).
Figure BDA0003317362130000111
Ra, Rb, q, r and m in the above general formula (9) are the same as described above.
Examples of the organic solvent used in the maleimidoylation reaction for synthesizing the maleimide (a) include ketones such as acetone, Methyl Ethyl Ketone (MEK), methyl isobutyl ketone, cyclohexanone, and acetophenone, aprotic solvents such as N, N-dimethylformamide, N-dimethylacetamide, dimethyl sulfoxide, N-methyl-2-pyrrolidone, acetonitrile, and sulfolane, cyclic ethers such as dioxane and tetrahydrofuran, esters such as ethyl acetate and butyl acetate, and aromatic solvents such as benzene, toluene, and xylene, and these solvents may be used alone or in combination.
In the maleimide-based reaction, it is preferable that the intermediate amine compound and maleic anhydride are mixed in such a manner that the equivalent ratio of maleic anhydride to the amino equivalent of the intermediate amine compound is 1 to 1.5, more preferably 1.1 to 1.2, and the reaction is carried out in an organic solvent in a mass ratio of 0.5 to 50, preferably 1 to 5, relative to the total amount of the intermediate amine compound and maleic anhydride.
Examples of the catalyst used in the maleimide reaction include inorganic salts such as acetates, chlorides, bromides, sulfates and nitrates of nickel, cobalt, sodium, calcium, iron, lithium and manganese, inorganic acids such as phosphoric acid, hydrochloric acid and sulfuric acid, organic acids such as oxalic acid, benzenesulfonic acid, toluenesulfonic acid, methanesulfonic acid and fluoromethanesulfonic acid, solid acids such as activated clay, acid clay, silica-alumina, zeolite and strongly acidic ion exchange resins, and heteropolyacid salts, and toluenesulfonic acid is particularly preferably used.
Examples of the dehydrating agent used in the maleimide reaction include lower aliphatic carboxylic acid anhydrides such as acetic anhydride, propionic anhydride and butyric anhydride, oxides such as phosphorus pentoxide, calcium oxide and barium oxide, inorganic acids such as sulfuric acid, porous ceramics such as a molecular sieve, and the like, and acetic anhydride is preferably used.
The amount of the catalyst and the dehydrating agent used in the maleimide reaction is not limited, and usually, the catalyst is used in an amount of 0.0001 to 1.0 mol, preferably 0.001 to 0.5 mol, more preferably 0.01 to 0.3 mol, and the dehydrating agent is used in an amount of 1 to 3 mol, preferably 1 to 1.5 mol, based on 1 equivalent of the amino group of the intermediate amine compound.
The maleimide reaction is carried out by charging the intermediate amine compound and maleic anhydride, reacting at 10 to 100 ℃, preferably 30 to 50 ℃ for 0.5 to 12 hours, preferably 1 to 8 hours, adding the catalyst, reacting at 90 to 130 ℃, preferably 105 to 120 ℃ for 2 to 24 hours, preferably 4 to 10 hours, and reducing the low molecular weight component and increasing the high molecular weight component, more preferably 6 to 10 hours. After the reaction, unreacted maleic anhydride and other impurities are removed by washing with water or the like, and the reaction product is aged by heating, so that the low molecular weight component is reduced and the high molecular weight component is increased.
The maleimide (A) has a molecular weight distribution (weight average molecular weight (Mw)/number average molecular weight (Mn)) calculated by Gel Permeation Chromatography (GPC) measurement in the range of preferably 1.0 to 10.0, more preferably 1.1 to 9.0, still more preferably 1.1 to 8.0, still more preferably 1.2 to 5.0, still more preferably 1.2 to 4.0, still more preferably 1.3 to 3.8, particularly preferably 1.3 to 3.6, and most preferably 1.3 to 3.4, from the viewpoint of excellent low dielectric constant and low dielectric loss tangent. In addition, according to the GPC diagram obtained by the GPC measurement, when the molecular weight distribution is wide and the high molecular weight component is large, the ratio of the high molecular weight component contributing to flexibility is large, and therefore, compared with a cured product using a conventional maleimide, brittleness can be suppressed, and a cured product excellent in flexibility and flexibility can be obtained, which is a preferable embodiment.
< measurement of GPC >
The molecular weight distribution (Mw/Mn) of the maleimide (A) was measured based on Gel Permeation Chromatography (GPC) using the following conditions.
A measuring device: HLC-8320GPC, manufactured by Tosoh corporation,
column: "HXL-L" manufactured by Tosoh corporation, "TSK-GELG 2000 HXL" manufactured by Tosoh corporation, "TSK-GELG 3000 HXL" manufactured by Tosoh corporation and "TSK-GELG 4000 HXL" manufactured by Tosoh corporation "
A detector: RI (differential refractometer)
Data processing: "EcoSEC-WorkStation" of Tosoh corporation "
The measurement conditions were as follows: column temperature 40 deg.C
Tetrahydrofuran as developing solvent
Flow rate 1.0 ml/min
The standard is as follows: the following monodisperse polystyrenes having known molecular weights were used according to the manual of the aforementioned "EcoSeC-WorkStation by GPC WorkStation".
(use of polystyrene)
"A-500" made by Tosoh corporation "
"A-1000" made by Tosoh corporation "
"A-2500" made by Tosoh corporation "
"A-5000" manufactured by Tosoh corporation "
"F-1" made by Tosoh corporation "
"F-2" made by Tosoh corporation "
"F-4" made by Tosoh corporation "
"F-10" made by Tosoh corporation "
"F-20" made by Tosoh corporation "
"F-40" made by Tosoh corporation "
"F-80" made by Tosoh corporation "
"F-128" made by Tosoh corporation "
Sample preparation: a tetrahydrofuran solution of 1.0 mass% of the maleimide obtained in the synthesis example, in terms of resin solid content, was filtered through a microfilter (50. mu.l).
< diene Polymer (B) >
The curable resin composition of the present invention is characterized in that: the composition contains a diene polymer (B) in addition to the maleimide having an indane skeleton (A). The diene polymer (B) has a low polarity and is excellent in dielectric properties such as dielectric constant and dielectric loss tangent, and therefore can be used as a molding material for high frequency signals, and is useful for producing a curable resin composition that can provide a cured product that can maintain a sufficiently low dielectric constant and exhibit a sufficiently low dielectric loss tangent even in a high frequency band (high frequency region) from MHz to GHz. In addition, the reaction with the maleimide having an indane skeleton (a) can function as a curing agent, and three-dimensionally crosslink the maleimide, whereby a cured product having excellent heat resistance can be obtained, which is a preferred embodiment.
The diene polymer (B) is not particularly limited, and examples thereof include non-modified diene polymers which are not modified with a polar group. The polar group is a functional group that affects dielectric characteristics, and examples thereof include a phenol group, an amino group, and an epoxy group. The diene polymer (B) is not particularly limited, and for example, 1, 2-polybutadiene, 1, 4-polybutadiene and the like can be used.
As the diene polymer (B), a homopolymer of butadiene in which 50% or more of the butadiene units in the polymer chain are 1, 2-bonded, and a derivative thereof may be used.
In the present invention, from the viewpoint of exhibiting more excellent dielectric characteristics, it is preferable that the diene polymer (B) is a diene polymer obtained by polymerizing a 1, 2-adduct (branched) and a 1, 4-adduct (linear) in a mass ratio of 1: 3-3: 1 in the ratio of 1. In addition, from the viewpoint of maintaining good dielectric characteristics in particular, the mass ratio is more preferably 1: 1-3: 1. more preferably 1: 1-2: 1.
the curable resin composition of the present invention may contain a curing agent other than the diene polymer (B) within a range not impairing the curing of the present invention. The diene polymer (B) is preferably 50% by mass or more, more preferably 60% by mass or more, further preferably 70% by mass or more, particularly preferably 80% by mass or more, and most preferably 90% by mass or more, based on 100% by mass of the total amount of the curing agent.
Examples of the curing agent other than the diene polymer (B) include amine compounds, amide compounds, acid anhydride compounds, phenol compounds, polyphenylene ether compounds, cyanate ester compounds, and compounds having a substituent having an unsaturated double bond. These curing agents may be used alone or in combination of two or more.
Examples of the amine compound include diaminodiphenylmethane, diethylenetriamine, triethylenetetramine, diaminodiphenylsulfone, isophoronediamine, imidazole, BF 3-amine complex, guanidine derivative, and the like.
Examples of the amide compound include dicyandiamide and polyamide resins synthesized from a dimer of linolenic acid and ethylenediamine.
Examples of the acid anhydride compound include phthalic anhydride, trimellitic anhydride, pyromellitic anhydride, maleic anhydride, tetrahydrophthalic anhydride, methyltetrahydrophthalic anhydride, methylnadic anhydride, hexahydrophthalic anhydride, and methylhexahydrophthalic anhydride.
Examples of the phenol compound include phenol novolac resins, cresol novolac resins, aromatic hydrocarbon formaldehyde resin-modified phenol resins, dicyclopentadiene phenol addition-type resins, phenol aralkyl resins (Xylock resins), polyhydric phenol novolac resins synthesized from a polyhydric hydroxyl compound and formaldehyde, such as resorcinol novolac resins, naphthol aralkyl resins, trimethylolmethane resins, tetraphenylethane resins, naphthol novolac resins, naphthol-phenol co-condensed novolac resins, naphthol-cresol co-condensed novolac resins, biphenyl-modified phenol resins (polyhydric phenol compounds obtained by connecting phenol cores with dimethylene), biphenyl-modified naphthol resins (polyhydric naphthol compounds obtained by connecting phenol cores with dimethylene), aminotriazine-modified phenol resins (polyhydric naphthol compounds obtained by connecting phenol cores with dimethylene), and the like, Polyphenol compounds formed by linking phenol nuclei such as benzoguanamine), and alkoxy group-containing aromatic ring-modified novolak resins (polyphenol compounds formed by linking phenol nuclei and alkoxy group-containing aromatic rings with formaldehyde).
The polyphenylene ether compound has, for example, a structure represented by the following general formula (10) or (11).
Figure BDA0003317362130000161
Rd in the general formulae (10) and (11) is independently hydrogen, alkyl group having 1 to 5 carbon atoms, alkenyl group having 1 to 5 carbon atoms, cycloalkyl group having 3 to 5 carbon atoms, alkoxy group having 1 to 5 carbon atoms, thioether group having 1 to 5 carbon atoms, alkylcarbonyl group having 2 to 5 carbon atoms, alkoxycarbonyl group having 2 to 5 carbon atoms, alkylcarbonyloxy group having 2 to 5 carbon atoms, alkylsulfonyl group having 1 to 5 carbon atoms, or the like. Examples of the terminal structure of the structures of the general formulae (10) and (11) include a group having a hydroxyl group or a reactive double bond. S is an integer of 1 to 30, and t and u are also integer values of 1 to 30.
The alkyl group having 1 to 5 carbon atoms is not particularly limited, and examples thereof include a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, an isobutyl group, a sec-butyl group, a tert-butyl group, and a propyl group.
The alkenyl group having 1 to 5 carbon atoms is not particularly limited, and examples thereof include a vinyl group, a 1-propenyl group, a 1-butenyl group, a 1-pentenyl group, and an isopropenyl group.
The cycloalkyl group having 3 to 5 carbon atoms is not particularly limited, and examples thereof include cyclopropyl, cyclobutyl, cyclopentyl, methylcyclobutyl and the like.
The alkoxy group having 1 to 5 carbon atoms is not particularly limited, and examples thereof include a methoxy group, an ethoxy group, a propoxy group, an isopropoxy group, a butoxy group, and a pentoxy group.
The thioether group having 1 to 5 carbon atoms is not particularly limited, and examples thereof include a methylthio group, an ethylthio group, a propylthio group, an isopropylthio group, a butylthio group, and a pentylthio group.
The alkylcarbonyl group having 2 to 5 carbon atoms is not particularly limited, and examples thereof include a methylcarbonyl group, an ethylcarbonyl group, a propylcarbonyl group, an isopropylcarbonyl group, and a butylcarbonyl group.
The alkoxycarbonyl group having 2 to 5 carbon atoms is not particularly limited, and includes methoxycarbonyl, ethoxycarbonyl, propoxycarbonyl, isopropoxycarbonyl, butoxycarbonyl and the like.
The alkylcarbonyloxy group having 2 to 5 carbon atoms is not particularly limited, and examples thereof include a methylcarbonyloxy group, an ethylcarbonyloxy group, a propylcarbonyloxy group, an isopropylcarbonyloxy group, and a butylcarbonyloxy group.
The alkylsulfonyl group having 1 to 5 carbon atoms is not particularly limited, and examples thereof include methylsulfonyl group, ethylsulfonyl group, propylsulfonyl group, isopropylsulfonyl group, butylsulfonyl group, and pentylsulfonyl group.
Among these, Rd is preferably a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, or a cycloalkyl group having 3 to 5 carbon atoms, more preferably a hydrogen atom or an alkyl group having 1 to 5 carbon atoms, further preferably a hydrogen atom, a methyl group, or an ethyl group, and particularly preferably a hydrogen atom or a methyl group.
Examples of Y in the above-mentioned (11) include 2-valent aromatic groups derived from an aromatic compound having 2 phenolic hydroxyl groups.
The aromatic compound having 2 phenolic hydroxyl groups is not particularly limited, and examples thereof include catechol, resorcinol, hydroquinone, 1, 4-dihydroxynaphthalene, 1, 5-dihydroxynaphthalene, 2, 6-dihydroxynaphthalene, 2, 7-dihydroxynaphthalene, 4' -biphenol, bisphenol a, bisphenol B, bisphenol BP, bisphenol C, bisphenol F, tetramethylbisphenol a, and the like. Among these, hydroquinone, 2, 6-dihydroxynaphthalene, 2, 7-dihydroxynaphthalene, 4 '-biphenol, bisphenol a, bisphenol E, and bisphenol F are preferable, and 4, 4' -biphenol, bisphenol a, and tetramethylbisphenol a are more preferable.
Since 2 phenolic hydroxyl groups of the aforementioned aromatic compound having 2 phenolic hydroxyl groups form a phenylene ether bond (2 oxygen atoms bonded to Y), Y becomes an aromatic group having a valence of 2 derived from the aromatic compound having 2 phenolic hydroxyl groups.
Examples of the cyanate ester compound include bisphenol A type cyanate ester resin, bisphenol F type cyanate ester resin, bisphenol E type cyanate ester resin, bisphenol S type cyanate ester resin, bisphenol thioether type cyanate ester resin, phenylene ether type cyanate ester resin, naphthylene ether type cyanate ester resin, biphenyl type cyanate ester resin, tetramethylbiphenyl type cyanate ester resin, polyhydroxynaphthalene type cyanate ester resin, phenol novolak type cyanate ester resin, cresol novolak type cyanate ester resin, triphenylmethane type cyanate ester resin, tetraphenylethane type cyanate ester resin, dicyclopentadiene-phenol addition reaction type cyanate ester resin, phenol aralkyl type cyanate ester resin, naphthol novolak type cyanate ester resin, naphthol aralkyl type cyanate ester resin, naphthol-phenol copolycondensation type cyanate ester resin, naphthol-cresol copolycondensation type cyanate ester resin, naphthol-phenol copolycondensation type cyanate ester resin, bisphenol F type cyanate ester resin, bisphenol E type cyanate ester resin, bisphenol S type cyanate ester resin, bisphenol thioether sulfide type cyanate ester resin, phenylene ether type cyanate ester resin, biphenyl type cyanate ester resin, tetramethylbiphenyl type cyanate ester resin, polyhydroxynaphthalene type cyanate ester resin, phenol type cyanate ester resin, and the like, Aromatic hydrocarbon formaldehyde resin-modified phenolic resin type cyanate ester resin, biphenyl-modified novolak type cyanate ester resin, anthracene type cyanate ester resin, and the like.
The compound having a substituent having an unsaturated double bond is not particularly limited as long as it has 2 or more substituents having an unsaturated bond in the molecule, and examples of the substituent having an unsaturated bond include compounds having an allyl group, an isopropenyl group, a 1-propenyl group, an acryloyl group, a methacryloyl group, a styryl group, a styrylmethyl group, and the like.
< preparation of curable resin composition >
The curable resin composition of the present invention is characterized by containing maleimide (a) having an indane skeleton (hereinafter sometimes referred to as "component (a)") and a diene polymer (B) (hereinafter sometimes referred to as "component (B)"). The component (B) is preferably a component capable of three-dimensionally crosslinking by reaction with the component (a) and capable of obtaining a cured product excellent in dielectric properties and heat resistance.
The blending ratio (parts by mass) of the component (a) and the component (B), the component (a): (B) the component is preferably 90: 10-10: 90, more preferably 80: 20-20: 80, more preferably 65: 35-35: 65, particularly preferably 55: 45-45: 55. by adjusting the compounding ratio within the above range, the heat resistance, the low dielectric constant and the low dielectric loss tangent are excellent, and flexibility can be expressed, which is preferable.
The curable resin composition of the present invention may contain an alkenyl group-containing compound, for example, bismaleimides other than the maleimide (a), allyl ether compounds, allylamine compounds, triallyl cyanurate, alkenyl phenol compounds, vinyl group-containing polyolefin compounds, and the like, in such an amount that does not impair the object. Other thermosetting resins, for example, thermosetting polyimide resins, epoxy resins, phenol resins, active ester resins, cyanate resins, and the like can be appropriately blended depending on the purpose.
In order to exhibit flame retardancy, the curable resin composition of the present invention may contain a non-halogen flame retardant that does not substantially contain a halogen atom within a range that does not impair the object. Examples of the non-halogen flame retardant include phosphorus flame retardants, nitrogen flame retardants, silicone flame retardants, inorganic flame retardants, and organic metal salt flame retardants, which may be used alone or in combination.
The curable resin composition of the present invention may contain an inorganic filler, if necessary. Examples of the inorganic filler include fused silica, crystalline silica, alumina, silicon nitride, and aluminum hydroxide. In particular, when the amount of the inorganic filler is increased, fused silica is preferably used. The fused silica may be in any of a crushed form and a spherical form, and the spherical form is preferably mainly used in order to increase the amount of the fused silica to be blended and to suppress an increase in melt viscosity of the molding material. Further, in order to increase the amount of the spherical silica to be blended, it is preferable to appropriately adjust the particle size distribution of the spherical silica. The filling ratio is preferably higher in view of flame retardancy, and is particularly preferably 20% by mass or more based on the total amount of the curable resin composition. When the curable resin composition is used for the purpose of conductive paste or the like described in detail below, a conductive filler such as silver powder or copper powder can be used.
The curable resin composition of the present invention may contain, as necessary, various blending agents such as a curing accelerator, a silane coupling agent, a release agent, a pigment, and an emulsifier.
< cured product >
The cured product of the present invention is preferably obtained by curing the curable resin composition. The curable resin composition can be obtained by uniformly mixing the above-mentioned components, and a cured product can be easily produced by the same method as a conventionally known method. Examples of the cured product include molded cured products such as laminates, cast molded products, adhesive layers, coating films, and films.
The curing (thermosetting) reaction can be easily carried out without a catalyst, and when a rapid reaction is desired, the addition of a polymerization initiator such as an organic peroxide or an azo compound, and a basic catalyst such as a phosphine compound or a tertiary amine is effective. Examples of the amount of the organic solvent include benzoyl peroxide, dicumyl peroxide, azobisisobutyronitrile, triphenylphosphine, triethylamine, and imidazoles, and the amount of the organic solvent is preferably 0.05 to 5% by mass based on the entire curable resin composition.
< prepreg >
The prepreg of the present invention preferably has a reinforcing base material and a semi-cured product of the curable resin composition impregnated in the reinforcing base material. As a method for producing the prepreg, a known method can be used, and a prepreg can be produced by impregnating a reinforcing base material with a resin varnish in which the curable resin composition is dissolved (diluted) in an organic solvent, and subjecting the reinforcing base material impregnated with the resin varnish to a heat treatment to semi-cure (or uncured) the curable resin composition.
The organic solvent may be used alone or as a mixed solvent of 2 or more kinds, for example, from toluene, xylene, N-dimethylformamide, N-dimethylacetamide, N-methyl-2-pyrrolidone, Methyl Ethyl Ketone (MEK), methyl isobutyl ketone, dioxane, tetrahydrofuran, or the like.
Examples of the reinforcing base material impregnated with the resin varnish include inorganic fibers such as glass fibers, polyester fibers and polyamide fibers, woven fabrics and nonwoven fabrics made of organic fibers, mats and papers, and these may be used alone or in combination.
The mass ratio of the curable resin composition to the reinforcing base material in the prepreg is not particularly limited, and it is generally preferable to prepare the prepreg so that the curable resin composition (resin in the prepreg) is 20 to 60 mass%.
The conditions for the heat treatment of the prepreg may be suitably selected depending on the kind and amount of the organic solvent, catalyst, and various additives to be used, and are usually carried out at a temperature of 80 to 220 ℃ for 3 to 30 minutes.
< Heat-resistant Material and electronic Material >
The cured product obtained from the curable resin composition of the present invention is excellent in heat resistance and dielectric properties, and therefore can be suitably used for heat-resistant members and electronic members. In particular, the resin composition can be suitably used for circuit boards, semiconductor sealing materials, semiconductor devices, laminated films, laminated boards, adhesives, resist materials, and the like. In addition, the resin composition can be used as a matrix resin for a fiber-reinforced resin, and is particularly suitable as a prepreg having high heat resistance. In addition, the maleimide (a) having an indane skeleton contained in the curable resin composition exhibits excellent solubility in various solvents, and thus can be made into a coating material. The heat-resistant member and the electronic member obtained in this way can be suitably used for various applications, and examples thereof include industrial machine parts, general machine parts, parts of automobiles, railways, vehicles and the like, space and aviation-related parts, electronic and electric parts, building materials, container and packaging members, living goods, sports and leisure goods, and housing members for wind power generation.
Hereinafter, a typical product produced by using the curable resin composition of the present invention will be described by way of example.
< Circuit Board >
In the present invention, the circuit board is preferably obtained by laminating the prepreg and the copper foil and then performing thermocompression bonding molding. Specifically, examples of the method for obtaining a circuit board from the curable resin composition of the present invention include the following methods: the prepreg is laminated by a conventional method, and is suitably laminated with a copper foil, and is subjected to thermocompression bonding molding at 170 to 300 ℃ for 10 minutes to 3 hours under a pressure of 1 to 10 MPa.
< semiconductor sealing Material >
In the present invention, the curable resin composition is preferably contained as a semiconductor sealing material. Specifically, examples of the method for obtaining a semiconductor sealing material from the curable resin composition of the present invention include the following methods: in the curable resin composition, a curing accelerator, which is an optional component, and a compounding agent such as an inorganic filler are sufficiently melt-mixed until uniform by using an extruder, a kneader, a roll, or the like as necessary. In this case, fused silica is generally used as the inorganic filler, and when used as a high thermal conductive semiconductor sealing material for power transistors and power ICs, highly filled crystals such as crystalline silica, alumina, and silicon nitride having higher thermal conductivity than fused silica, crystalline silica, alumina, and silicon nitride, and the like are preferably used. The filling rate is preferably 30 to 95 parts by mass of an inorganic filler per 100 parts by mass of the curable resin composition, and more preferably 70 parts by mass or more, and even more preferably 80 parts by mass or more, in order to improve flame retardancy, moisture resistance and solder crack resistance and reduce a linear expansion coefficient.
< semiconductor device >
In the present invention, the semiconductor device preferably includes a cured product obtained by heat-curing the semiconductor sealing material. Specifically, as a semiconductor package molding method for obtaining a semiconductor device from the curable resin composition of the present invention, the following methods can be mentioned: the semiconductor sealing material is cast or molded by a transfer molding machine or an injection molding machine, and further heated and cured at 50 to 250 ℃ for 2 to 10 hours.
< laminated substrate >
The method for obtaining a laminated substrate from the curable resin composition of the present invention includes the method including steps 1 to 3. In step 1, the curable resin composition containing a rubber, a filler, and the like as appropriate is applied to a circuit board on which a circuit is formed by a spray coating method, a curtain coating method, or the like, and then cured. In step 2, the circuit board coated with the curable resin composition is subjected to drilling of a predetermined through hole or the like, treated with a roughening agent, and the surface thereof is cleaned with hot water to form irregularities on the board and plated with a metal such as copper, if necessary. In step 3, the operations of steps 1 to 2 are sequentially repeated as desired, and the resin insulation layers and the conductor layers of the predetermined circuit pattern are alternately laminated to form a laminated substrate. In the above step, it is preferable that the through hole is drilled after the outermost resin insulation layer is formed. In the laminate substrate of the present invention, a resin-coated copper foil obtained by semi-curing the resin composition on a copper foil may be heat-pressed at 170 to 300 ℃ onto a wiring substrate having a circuit formed thereon to form a roughened surface, and the step of plating treatment may be omitted to produce a laminate substrate.
< laminated film >
The laminate film of the present invention preferably contains the curable resin composition. Examples of the method for obtaining a laminated film from the curable resin composition of the present invention include the following methods: after the curable resin composition is applied to the support film, it is dried, thereby forming a resin composition layer on the support film. When the curable resin composition of the present invention is used for a multilayer film, it is important that the film exhibits the following flowability (resin flow): the resin composition is softened under the temperature condition for lamination in the vacuum lamination method (usually 70 to 140 ℃), and the circuit board is laminated and the via hole or the through hole of the circuit board can be filled with the resin. In order to prevent the occurrence of a phenomenon that the obtained multilayer film or circuit board (such as a copper-clad laminate) locally exhibits different characteristic values due to phase separation or the like, the obtained multilayer film or circuit board is required to exhibit a constant performance at any position and to have uniform appearance.
Here, the diameter of the through hole of the circuit board is usually 0.1 to 0.5mm, and the depth is usually 0.1 to 1.2mm, and the resin filling can be usually performed within this range. When both surfaces of the circuit board are laminated, it is desirable that about 1/2 of the through hole is filled.
Specific examples of the method for producing the laminated film include the following methods: the organic solvent is blended to prepare a varnished resin composition, and the varnished resin composition is applied to the surface of the support film (Y), and the organic solvent is dried by heating, hot air blowing, or the like to form the resin composition layer (X).
As the organic solvent used here, for example, ketones such as acetone, methyl ethyl ketone and cyclohexanone, acetates such as ethyl acetate, butyl acetate, cellosolve acetate, propylene glycol monomethyl ether acetate and carbitol acetate, carbitols such as cellosolve and butyl carbitol, aromatic hydrocarbons such as toluene and xylene, dimethylformamide, dimethylacetamide and N-methylpyrrolidone are preferably used in a proportion of 30 to 60 mass% of nonvolatile components.
The thickness of the resin composition layer (X) to be formed is generally required to be equal to or greater than the thickness of the conductor layer. The thickness of the conductor layer of the circuit board is usually in the range of 5 to 70 μm, and therefore, the thickness of the resin composition layer (X) is preferably 10 to 100 μm. The resin composition layer (X) in the present invention may be protected by a protective film described later. The protective film protects the surface of the resin composition layer from dust and the like and prevents damage.
Examples of the support film and the protective film include polyolefins such as polyethylene, polypropylene, and polyvinyl chloride, polyesters such as polyethylene terephthalate (PET) and polyethylene naphthalate, polycarbonates, polyimides, and further metal foils such as release paper, copper foil, and aluminum foil. The support film and the protective film may be subjected to a matting treatment, a corona treatment, and a mold release treatment. The thickness of the support film is not particularly limited, and is usually 10 to 150 μm, preferably 25 to 50 μm. The thickness of the protective film is preferably 1 to 40 μm.
The support film (Y) is laminated on a circuit board or is thermally cured to form an insulating layer and then peeled off. When the support film (Y) is peeled off after the resin composition layer constituting the laminated film is cured by heating, adhesion of dust and the like in the curing step can be prevented. When the support film is peeled after curing, the support film is usually subjected to a mold release treatment in advance.
The product obtained as described aboveThe film is laminated to produce a multilayer printed circuit board. For example, when the resin composition layer (X) is protected by a protective film, the resin composition layer (X) is peeled off and then laminated on one surface or both surfaces of a circuit board by, for example, a vacuum lamination method so as to be in direct contact with the circuit board. The lamination method may be a batch method or a continuous method using a roll. Further, the laminate film and the circuit board may be heated (preheated) as necessary before lamination, if necessary. The lamination conditions are preferably such that the pressure bonding temperature (lamination temperature) is 70 to 140 ℃ and the pressure bonding pressure is 1 to 11kgf/cm 2(9.8×104～107.9×104N/m2) Preferably, the reaction is carried out under reduced pressure of 20mmHg (26.7hPa) or less.
< conductive paste >
As a method for obtaining a conductive paste from the curable resin composition of the present invention, for example, a method of dispersing conductive particles in the composition can be cited. The conductive paste may be a paste resin composition for circuit connection or an anisotropic conductive adhesive, depending on the type of conductive particles used.
Examples
The present invention is described specifically by examples and comparative examples, and the following "parts" and "%" are based on mass unless otherwise specified. The softening point, amine equivalent, GPC, and FD-MS spectra were measured and evaluated under the following conditions.
1) Softening point
The determination method comprises the following steps: the softening point (. degree. C.) of the intermediate amine compound obtained in the synthesis examples shown below was measured in accordance with JIS K7234 (Ring and ball method).
2) Amine equivalent
The amine equivalent of the intermediate amine compound was measured by the following measurement method.
About 2.5g of an intermediate amine compound, 7.5g of pyridine, 2.5g of acetic anhydride, and 7.5g of triphenylphosphine were precisely weighed in a 500mL Erlenmeyer flask with a stopper, and then a condenser tube was attached to the weighed intermediate amine compound, and the weighed intermediate amine compound was heated and refluxed for 150 minutes in an oil bath set to 120 ℃.
After cooling, 5.0mL of distilled water, 100mL of propylene glycol monomethyl ether, and 75mL of tetrahydrofuran were added, and titration was carried out by potentiometric titration using a 0.5mol/L potassium hydroxide-ethanol solution. Blank tests were carried out and corrected in the same manner.
Amine equivalent (g/eq.) - (S × 2000)/(Blank-a)
S: amount of sample (g)
A: consumption of 0.5mol/L Potassium hydroxide-ethanol solution (mL)
Blank: consumption of 0.5mol/L Potassium hydroxide-ethanol solution in blank test (mL)
3) GPC measurement
The following measurement apparatus and measurement conditions were used to perform measurement, and GPC diagrams (fig. 1 to 9) of the maleimide obtained in the following synthesis examples were obtained. From the results of the GPC chart, the molecular weight distribution (weight average molecular weight (Mw)/number average molecular weight (Mn)) was measured/calculated, and the average number of repeating units "n" contributing to the indane skeleton in the maleimide was measured/calculated based on the number average molecular weight (Mn). Specifically, for compounds in which n is 0 to 4, the theoretical molecular weight and the molecular weight of each measured value in GPC are plotted on a scatter diagram, an approximate straight line is drawn, the number average molecular weight (Mn) is obtained from the point indicated by the measured value Mn (1) on the straight line, and n is calculated.
A measuring device: HLC-8320GPC, manufactured by Tosoh corporation "
Column: "HXL-L" manufactured by Tosoh corporation, "TSK-GELG 2000 HXL" manufactured by Tosoh corporation, "TSK-GELG 3000 HXL" manufactured by Tosoh corporation and "TSK-GELG 4000 HXL" manufactured by Tosoh corporation "
A detector: RI (differential refractometer)
Data processing: "EcoSEC-WorkStation" of Tosoh corporation "
The measurement conditions were as follows: column temperature 40 deg.C
Tetrahydrofuran as developing solvent
Flow rate 1.0 ml/min
The standard is as follows: the following monodisperse polystyrenes having known molecular weights were used according to the manual of the aforementioned "EcoSeC-WorkStation at GPC WorkStation".
(use of polystyrene)
"A-500" made by Tosoh corporation "
"A-1000" made by Tosoh corporation "
"A-2500" made by Tosoh corporation "
"A-5000" manufactured by Tosoh corporation "
"F-1" made by Tosoh corporation "
"F-2" made by Tosoh corporation "
"F-4" made by Tosoh corporation "
"F-10" made by Tosoh corporation "
"F-20" made by Tosoh corporation "
"F-40" made by Tosoh corporation "
"F-80" made by Tosoh corporation "
"F-128" made by Tosoh corporation "
Sample preparation: a tetrahydrofuran solution of 1.0 mass% of the maleimide obtained in the synthesis example, in terms of resin solid content, was filtered through a microfilter (50. mu.l).
4) FD-MS spectra
The FD-MS spectrum was measured using the following measurement apparatus and measurement conditions.
A measuring device: JMS-T100GCAccuTOF
Measurement conditions
Measurement range: m/z is 4.00-2000.00
Rate of change: 51.2 mA/min
Final current value: 45mA
Cathode voltage: -10kV
Recording interval: 0.07 second
Synthesis example 1 Synthesis of Maleimide Compound A-1
(1) Synthesis of intermediate amine compounds
In a 1L flask equipped with a thermometer, a condenser, a dean-Stark trap and a stirrer, 48.5g (0.4mol) of 2, 6-dimethylaniline, 272.0g (1.4mol) of α, α' -dihydroxy-1, 3-diisopropylbenzene, 280g of xylene and 70g of activated clay were charged, and the mixture was heated to 120 ℃ with stirring. Further, the distilled wastewater was removed with a dean-Stark tube and heated to 210 ℃ to perform a reaction for 3 hours. Thereafter, the reaction mixture was cooled to 140 ℃ and 145.4g (1.2mol) of 2, 6-dimethylaniline was added, and then the temperature was raised to 220 ℃ to carry out the reaction for 3 hours. After the reaction, the reaction mixture was cooled to 100 ℃ with air, diluted with 300g of toluene, and filtered to remove the activated clay, and low molecular weight substances such as the solvent and unreacted substances were distilled off under reduced pressure, whereby 364.1g of an intermediate amine compound represented by the following general formula (A-1) was obtained. The amine equivalent weight is 298 and the softening point is 70 ℃.
Figure BDA0003317362130000271
(2) Maleinization of
131.8g (1.3mol) of maleic anhydride and 700g of toluene were put into a 2L flask equipped with a thermometer, a condenser, a dean-Stark trap and a stirrer, and stirred at room temperature. Then, a mixed solution of 364.1g of the reactant (A-1) and 175g of DMF was added dropwise over 1 hour.
After completion of the dropwise addition, the reaction was further carried out at room temperature for 2 hours. 37.1g of p-toluenesulfonic acid monohydrate was added, the reaction solution was heated, water azeotropic under reflux and toluene were cooled/separated, and then only toluene was returned to the system to conduct dehydration reaction for 8 hours. After air-cooling to room temperature, concentration under reduced pressure was carried out, and the brown solution was dissolved in 600g of ethyl acetate, washed 3 times with 150g of ion-exchanged water and 3 times with 150g of a 2% aqueous solution of sodium hydrogencarbonate, dried by adding sodium sulfate, and then concentrated under reduced pressure, and the resulting reaction product was dried under vacuum at 80 ℃ for 4 hours to obtain 413.0g of a maleimide compound A-1-containing product. In the FD-MS spectrum of the maleimide compound a-1, peaks of M + ═ 560, 718, and 876 were observed, and each peak corresponds to a case where n is 0, 1, or 2. The number n of repeating units in the indane skeleton portion of the maleimide a-1 (based on the number average molecular weight) was determined by GPC, and the GPC chart thereof was shown in fig. 1, where n was 1.47 and the molecular weight distribution (Mw/Mn) was 1.81.
Figure BDA0003317362130000281
Synthesis example 2 Synthesis of Maleimide Compound A-2
(1) Synthesis of intermediate amine compounds
In a 1L flask equipped with a thermometer, a condenser, a dean-Stark trap and a stirrer, 48.5g (0.4mol) of 2, 6-dimethylaniline, 233.2g (1.2mol) of α, α' -dihydroxy-1, 3-diisopropylbenzene, 230g of xylene and 66g of activated clay were charged, and the mixture was heated to 120 ℃ with stirring. Further, the distilled wastewater was removed with a dean-Stark tube and heated to 210 ℃ to perform a reaction for 3 hours. Thereafter, the reaction mixture was cooled to 140 ℃ and 145.4g (1.2mol) of 2, 6-dimethylaniline was added, and then the temperature was raised to 220 ℃ to carry out the reaction for 3 hours. After the reaction, the reaction mixture was cooled to 100 ℃ with air, diluted with 300g of toluene, and the activated clay was removed by filtration, and low molecular weight substances such as the solvent and unreacted substances were distilled off under reduced pressure, whereby 278.4g of an intermediate amine compound represented by the following general formula (a-2) was obtained. The amine equivalent weight is 294 and the softening point is 65 ℃.
Figure BDA0003317362130000291
(2) Maleinization of
107.9g (1.1mol) of maleic anhydride and 600g of toluene were put into a 2L flask equipped with a thermometer, a condenser, a dean-Stark trap and a stirrer, and stirred at room temperature. A mixed solution of 278.4g of the reactant (A-2) and 150g of DMF was then added dropwise over 1 hour.
After completion of the dropwise addition, the reaction was further carried out at room temperature for 2 hours. 27.0g of p-toluenesulfonic acid monohydrate was added, the reaction solution was heated, water azeotropic under reflux and toluene were cooled/separated, and then only toluene was returned to the system to conduct dehydration reaction for 8 hours. After air-cooling to room temperature, concentration was carried out under reduced pressure, the brown solution was dissolved in 500g of ethyl acetate, washed 3 times with 120g of ion-exchanged water and 3 times with 120g of a 2% aqueous solution of sodium hydrogencarbonate, dried by adding sodium sulfate, and then concentrated under reduced pressure, and the resulting reaction product was vacuum-dried at 80 ℃ for 4 hours to obtain 336.8g of a maleimide compound A-2-containing product. In the FD-MS spectrum of the maleimide compound a-2, peaks at M + ═ 560, 718, and 876 were observed, corresponding to the cases where n was 0, 1, and 2, respectively. The number n of repeating units in the indane skeleton portion of the maleimide a-2 (based on the number average molecular weight) was determined by GPC, and the GPC chart thereof was shown in fig. 2, where n was 1.25 and the molecular weight distribution (Mw/Mn) was 3.29.
Figure BDA0003317362130000301
Synthesis example 3 Synthesis of Maleimide Compound A-3
(1) Synthesis of intermediate amine compounds
In a 2L flask equipped with a thermometer, a condenser, a dean-Stark trap and a stirrer, 48.5g (0.4mol) of 2, 6-dimethylaniline, 388.6g (2.0mol) of. alpha.,. alpha.' -dihydroxy-1, 3-diisopropylbenzene, 350g of xylene and 123g of activated clay were charged and heated to 120 ℃ with stirring. Further, the distilled wastewater was removed with a dean-Stark tube and heated to 210 ℃ to perform a reaction for 3 hours. Thereafter, the reaction mixture was cooled to 140 ℃ and 145.4g (1.2mol) of 2, 6-dimethylaniline was added, and then the temperature was raised to 220 ℃ to carry out the reaction for 3 hours. After the reaction, the reaction mixture was cooled to 100 ℃ with air, diluted with 500g of toluene, and filtered to remove the activated clay, and low molecular weight substances such as the solvent and unreacted substances were distilled off under reduced pressure, whereby 402.1g of an intermediate amine compound represented by the following general formula (A-3) was obtained. The amine equivalent weight is 306 and the softening point is 65 ℃.
Figure BDA0003317362130000302
(2) Maleinization of
A2L flask equipped with a thermometer, a condenser, a dean-Stark trap and a stirrer was charged with 152.1g (1.5mol) of maleic anhydride and 700g of toluene and stirred at room temperature. Subsequently, a mixed solution of 402.1g of the reactant (A-3) and 200g of DMF was added dropwise over 1 hour.
After completion of the dropwise addition, the reaction was further carried out at room temperature for 2 hours. 37.5g of p-toluenesulfonic acid monohydrate was added, the reaction solution was heated, water azeotropic under reflux and toluene were cooled/separated, and then only toluene was returned to the system to conduct dehydration reaction for 8 hours. After air-cooling to room temperature, concentration was carried out under reduced pressure, the brown solution was dissolved in 800g of ethyl acetate, washed 3 times with 200g of ion-exchanged water and 3 times with 200g of 2% aqueous sodium bicarbonate solution, dried by adding sodium sulfate, and then concentrated under reduced pressure, and the resulting reaction product was dried under vacuum at 80 ℃ for 4 hours to obtain 486.9g of a maleimide compound a-3-containing product. In the FD-MS spectrum of the maleimide compound a-3, peaks at M + ═ 560, 718, and 876 were observed, corresponding to the cases where n was 0, 1, and 2, respectively. The value of the number n of repeating units in the indane skeleton portion of the maleimide a-3 (based on the number average molecular weight) was determined by GPC, and the GPC chart thereof was as shown in fig. 3, where n was 1.96 and the molecular weight distribution (Mw/Mn) was 1.52.
Figure BDA0003317362130000311
Synthesis example 4 Synthesis of Maleimide Compound A-4
(1) Synthesis of intermediate amine compounds
59.7g (0.4mol) of 2, 6-diethylaniline, 272.0g (1.4mol) of α, α' -dihydroxy-1, 3-diisopropylbenzene, 350g of xylene and 94g of activated clay were put into a 2L flask equipped with a thermometer, a condenser, a dean-Stark trap and a stirrer, and heated to 120 ℃ with stirring. Further, the distilled wastewater was removed with a dean-Stark tube and heated to 210 ℃ to perform a reaction for 3 hours. Thereafter, the reaction mixture was cooled to 140 ℃ and 179.1g (1.2mol) of 2, 6-diethylaniline was added, followed by heating to 220 ℃ to carry out the reaction for 3 hours. After the reaction, the reaction mixture was cooled to 100 ℃ with air, diluted with 500g of toluene, and filtered to remove the activated clay, and low molecular weight substances such as the solvent and unreacted substances were distilled off under reduced pressure, whereby 342.1g of an intermediate amine compound represented by the following general formula (A-4) was obtained. The amine equivalent weight is 364 and the softening point is 47 ℃.
Figure BDA0003317362130000321
(2) Maleinization of
107.9g (1.1mol) of maleic anhydride and 600g of toluene were put into a 2L flask equipped with a thermometer, a condenser, a dean-Stark trap and a stirrer, and stirred at room temperature. Then, a mixed solution of 342.1g of the reactant (A-4) and 180g of DMF was added dropwise over 1 hour.
After completion of the dropwise addition, the reaction was further carried out at room temperature for 2 hours. 26.8g of p-toluenesulfonic acid monohydrate was added, the reaction solution was heated, water azeotropic under reflux and toluene were cooled/separated, and then only toluene was returned to the system to conduct dehydration reaction for 8 hours. After air-cooling to room temperature, concentration was carried out under reduced pressure, the brown solution was dissolved in 500g of ethyl acetate, washed 3 times with 200g of ion-exchanged water and 3 times with 200g of 2% aqueous sodium bicarbonate solution, dried by adding sodium sulfate, and then concentrated under reduced pressure, and the resulting reaction product was dried under vacuum at 80 ℃ for 4 hours to obtain 388.1g of a maleimide compound a-4-containing product. In the FD-MS spectrum of the maleimide compound a-4, peaks at M + ═ 616, 774, and 932 were observed, corresponding to the cases where n was 0, 1, and 2, respectively. The number n of repeating units in the indane skeleton portion of the maleimide a-4 (based on the number average molecular weight) was determined by GPC, and the GPC chart thereof was shown in fig. 4, where n was 1.64 and the molecular weight distribution (Mw/Mn) was 1.40.
Figure BDA0003317362130000322
Synthesis example 5 Synthesis of Maleimide Compound A-5
(1) Synthesis of intermediate amine compounds
In a 1L flask equipped with a thermometer, a condenser, a dean-Stark trap and a stirrer, 70.9g (0.4mol) of 2, 6-diisopropylaniline, 272.0g (1.4mol) of α, α' -dihydroxy-1, 3-diisopropylbenzene, 350g of xylene and 97g of activated clay were charged, and the mixture was heated to 120 ℃ with stirring. Further, the distilled wastewater was removed with a dean-Stark tube and heated to 210 ℃ to perform a reaction for 3 hours. Thereafter, the reaction mixture was cooled to 140 ℃ and 212.7g (1.2mol) of 2, 6-diisopropylaniline was added thereto, followed by heating to 220 ℃ for 3 hours. After the reaction, the reaction mixture was cooled to 100 ℃ with air, diluted with 500g of toluene, and the active clay was removed by filtration, and low molecular weight substances such as the solvent and unreacted substances were distilled off under reduced pressure, whereby 317.5g of an intermediate amine compound represented by the following general formula (A-5) was obtained. The amine equivalent weight is 366 and the softening point is 55 ℃.
Figure BDA0003317362130000331
(2) Maleinization of
107.9g (1.1mol) of maleic anhydride and 600g of toluene were put into a 2L flask equipped with a thermometer, a condenser, a dean-Stark trap and a stirrer, and stirred at room temperature. Then, a mixed solution of 317.5g of the reactant (A-5) and DMF175g was added dropwise over 1 hour.
After completion of the dropwise addition, the reaction was further carried out at room temperature for 2 hours. 24.8g of p-toluenesulfonic acid monohydrate was added, the reaction solution was heated, water azeotropic under reflux and toluene were cooled/separated, and then only toluene was returned to the system to conduct dehydration reaction for 8 hours. After air-cooling to room temperature, concentration was carried out under reduced pressure, the brown solution was dissolved in 600g of ethyl acetate, washed 3 times with 200g of ion-exchanged water and 3 times with 200g of 2% aqueous sodium bicarbonate solution, dried by adding sodium sulfate, and then concentrated under reduced pressure, and the resulting reaction product was dried under vacuum at 80 ℃ for 4 hours to obtain 355.9g of a maleimide compound a-5-containing product. In the FD-MS spectrum of the maleimide compound a-5, peaks at M + ═ 672, 830, and 988 were observed, which corresponds to the cases where n was 0, 1, and 2, respectively. The number n of repeating units in the indane skeleton portion of the maleimide a-5 (based on the number average molecular weight) was determined by GPC, and the GPC chart thereof was shown in fig. 5, where n was 1.56 and the molecular weight distribution (Mw/Mn) was 1.24.
Figure BDA0003317362130000341
Synthesis example 6 Synthesis of Maleimide Compound A-9
(1) Synthesis of intermediate amine compounds
In the synthesis method of the intermediate amine compound A-1, 345.2g of an intermediate amine compound represented by the following general formula (A-9) was obtained by carrying out the same operation with the reaction time at 210 ℃ being changed to 6 hours and the reaction time at 220 ℃ being changed to 3 hours. The amine equivalent weight is 348 and the softening point is 71 ℃.
Figure BDA0003317362130000342
(2) Maleinization of
The same operation was carried out in the same manner as the above-described synthesis method for the maleimide compound A-1 except that the intermediate was replaced with A-9, whereby 407.6g of a maleimide compound A-9-containing product was obtained. In the FD-MS spectrum of the maleimide compound a-9, peaks of M + ═ 560, 718, and 876 were observed, and each peak corresponds to a case where n is 0, 1, or 2. The GPC chart of fig. 6 shows that the value of the number n of repeating units in the indane skeleton portion of the maleimide a-9 (based on the number average molecular weight) was obtained by GPC, where n is 2.59 and the molecular weight distribution (Mw/Mn) is 1.49.
Figure BDA0003317362130000351
Synthesis example 7 Synthesis of Maleimide Compound A-10
415.6g of a maleimide compound A-10-containing product was obtained under the same conditions as in the above-mentioned synthesis method for a maleimide compound A-1, except that the same operation was carried out except that the reaction time at 210 ℃ was changed to 6 hours and the reaction time at 220 ℃ was changed to 3 hours, and the dehydration reaction under reflux in the maleimide-based reaction was carried out for 10 hours with respect to the synthesized intermediate amine compound (amine equivalent: 347, softening point: 71 ℃). In the FD-MS spectrum of this maleimide compound a-10, peaks of M + ═ 560, 718, and 876 were observed, and each peak corresponds to the case where n is 0, 1, or 2. The GPC chart of fig. 7 shows that the value of the number n of repeating units in the indane skeleton portion of the maleimide a-10 (based on the number average molecular weight) was determined by GPC, and that n is 2.91 and the molecular weight distribution (Mw/Mn) is 1.64.
Figure BDA0003317362130000352
Synthesis example 8 Synthesis of Maleimide Compound A-11
398.7g of a maleimide compound A-11-containing product was obtained under the same conditions as in the above-mentioned synthesis method for a maleimide compound A-1, except that the same operation was carried out except that the reaction time at 210 ℃ was changed to 9 hours and the reaction time at 220 ℃ was changed to 3 hours, and the dehydration reaction under reflux in the maleimide reaction was carried out for the synthesized intermediate amine compound (having an amine equivalent of 342 and a softening point of 69 ℃) to 10 hours. In the FD-MS spectrum of the maleimide compound a-11, peaks of M + ═ 560, 718, and 876 were observed, and each peak corresponds to a case where n is 0, 1, or 2. The GPC chart of fig. 8 shows that the value of the number n of repeating units in the indane skeleton portion of the maleimide a-11 (based on the number average molecular weight) was obtained by GPC, where n is 3.68 and the molecular weight distribution (Mw/Mn) is 2.09.
Figure BDA0003317362130000361
Synthesis example 9 Synthesis of Maleimide Compound A-12
422.7g of a maleimide compound A-12-containing product was obtained under the same conditions as in the above-mentioned synthesis method for a maleimide compound A-1, except that the reaction time at 210 ℃ was changed to 9 hours and the reaction time at 220 ℃ was changed to 3 hours, and the same operation was carried out, except that the dehydration reaction under reflux in the maleimide reaction was carried out for 12 hours with respect to the synthesized intermediate amine compound (amine equivalent: 347, softening point: 70 ℃ C.). In the FD-MS spectrum of the maleimide compound a-12, peaks of M + ═ 560, 718, and 876 were observed, and each peak corresponds to a case where n is 0, 1, or 2. The number n of repeating units in the indane skeleton portion of the maleimide a-12 (based on the number average molecular weight) was determined by GPC, and the GPC chart thereof was shown in fig. 9, where n was 4.29 and the molecular weight distribution (Mw/Mn) was 3.02.
Figure BDA0003317362130000362
[ examples 1 to 9 and comparative example 1 ]
< solvent solubility of maleimide >
The solubilities of the maleimides (A-1) to (A-5) and (A-9) to (A-12) obtained in Synthesis examples 1 to 9 and a comparative commercially available maleimide (A-6) (4, 4' -diphenylmethane bismaleimide, manufactured by Kokusho chemical Co., Ltd., BMI-1000) were evaluated with respect to toluene and Methyl Ethyl Ketone (MEK), and the evaluation results are shown in Table 1.
As a method for evaluating the solubility in a solvent, a toluene solution and a Methyl Ethyl Ketone (MEK) solution were prepared so that nonvolatile components became 10, 20, 30, 40, 50, 60, and 70 mass%, using each of the maleimides obtained in the above synthesis examples and comparative examples.
Specifically, the vials containing each of the maleimides obtained in the synthesis examples and comparative examples were left at room temperature (25 ℃) for 60 days, and the nonvolatile components were uniformly dissolved in each solution (without insoluble matter) and evaluated as good, and the insoluble (with insoluble matter) was evaluated as x (visual). When the nonvolatile content is 20 mass% or more, it is practically preferable if the nonvolatile content can be dissolved in a solvent.
[ examples 10 to 14 and comparative example 2 ]
< preparation of curable resin composition >
The maleimides (A-1), (A-9) and (A-12) obtained in Synthesis examples 1 and 6 to 9, comparative maleimide (A-6) (4,4' -diphenylmethane bismaleimide, "BMI-1000", manufactured by Kagaku Kogyo Co., Ltd.), diene polymer (B-1) ("B-3000", manufactured by Nippon Kogyo Co., Ltd., Mw: 3200), and curing accelerator (C-1) (dicumyl peroxide, manufactured by Tokyo Kagaku Kogyo Co., Ltd.) were compounded at the ratios shown in Table 2 to prepare curable resin compositions.
[ examples 15 to 20 and comparative examples 3 to 8 ]
< preparation of curable resin composition >
The maleimides (A-1), (A-9) and (A-12) obtained in Synthesis examples 1, 6 to 9, comparative maleimide (A-6) (4,4 '-diphenylmethane bismaleimide, "BMI-1000", Daghuazai Kaisha Co., Ltd.), comparative maleimide (A-7) (bisphenol A diphenyletherbismaleimide, "BMI-4000", Dazaisha Kaisha Co., Ltd.), comparative maleimide (A-8) (3,3' -dimethyl-5, 5 '-diethyl-4, 4' -diphenylmethane bismaleimide, "BMI-5100", Dazaisha Kaisha Kogya Co., Ltd.), diene polymer (B-1) ("B-3000", manufactured by Nippon Kagaku K K.K.), Mw: 3200) the diene polymer (B-2) ("B-2000", manufactured by Nippon soda, Mw: 2100) a curable resin composition was prepared by mixing a curing accelerator (C-1) (dicumyl peroxide, manufactured by Tokyo chemical industries, Ltd.) and Methyl Ethyl Ketone (MEK) at the ratios shown in Table 3.
< solubility of varnish >
Whether or not the curable resin compositions of examples 15 to 20 and comparative examples 3 to 8 were uniformly dissolved (confirmation of solubility of varnish) was visually confirmed. The case of uniform dissolution was evaluated as good, and the case of non-uniform dissolution or incomplete dissolution was evaluated as x (e.g., the case of insoluble matter, etc.).
< preparation of cured product (molded article) >
The curable resin composition was subjected to the following conditions to prepare a cured product (molded product).
Curing conditions are as follows: after heating at 200 ℃ for 2 hours, further heating at 250 ℃ for 2 hours was carried out to cure.
Thickness of cured product (molded product) after molding: 2.4mm
The obtained cured product was evaluated for various physical properties and characteristics by the following methods. The evaluation results are shown in table 4.
< glass transition temperature (Tg) >
A cured product having a thickness of 2.4mm was cut into a size of 5mm in width and 54mm in length to prepare a test piece. The test piece was evaluated by using a viscoelasticity measuring apparatus (DMA: solid viscoelasticity measuring apparatus "DMS 6100" manufactured by Hitachi High-Tech Science Corporation, deformation mode: double-sided bending, measurement mode: sine wave oscillation, frequency 1Hz, temperature rise rate 3 ℃/min) and setting the temperature at which the change in elastic modulus becomes maximum (tan. delta. change rate becomes maximum) as the glass transition temperature Tg (. degree. C.). From the viewpoint of heat resistance, the glass transition temperature Tg is preferably 250 ℃ or higher (higher Tg), and more preferably 260 ℃ or higher.
< dielectric characteristics >
The dielectric constant and dielectric loss tangent at 1GHz of the test piece after being stored in a room at 23 ℃ and a humidity of 50% for 24 hours after the test piece was completely dried were measured by the cavity resonator method using a network analyzer "E8362C" manufactured by Agilent Technologies, Ltd., according to JIS-C-6481. The dielectric constant and the dielectric loss tangent are preferably 2.60 or less, more preferably 2.55 or less, and the dielectric loss tangent is preferably 0.0030 or less, more preferably 0.0025 or less, from the viewpoint of reducing the transmission loss as an electronic material.
[ Table 1]
Figure BDA0003317362130000391
[ Table 2]
Figure BDA0003317362130000401
[ Table 3]
Figure BDA0003317362130000402
[ Table 4]
Figure BDA0003317362130000411
From the evaluation results of table 1 above, it was confirmed that: in examples 1 to 9, since maleimide having an indane skeleton was used, the nonvolatile content was soluble even at 20 mass% in the preparation of the toluene solution, and the nonvolatile content was soluble even at 50 mass% in the preparation of the MEK solution, and the solvent solubility was excellent. On the other hand, it was confirmed that the commercially available maleimide used in comparative example 1 had no indane skeleton in the structure and was poor in solvent solubility.
From the evaluation results of table 3 above, it was confirmed that: in examples 15 to 20, the curable resin composition solution (varnish) containing maleimide having an indane skeleton was uniformly dissolved. On the other hand, it was confirmed that: in comparative examples 3 to 8, since a commercially available maleimide having no indane skeleton was used, the maleimide was not uniformly dissolved, and it was difficult to use the maleimide for applications such as a circuit board (e.g., a copper-clad laminate) and a build-up film.
From the evaluation results of table 4 above, it was also confirmed that: in examples 10 to 14, the use of the diene polymer (B) having dielectric properties in addition to the maleimide having an indane skeleton increased the glass transition temperature, and was excellent in heat resistance, and also suppressed the dielectric constant and dielectric loss tangent to be low, and was excellent in dielectric properties. On the other hand, it can be confirmed that: in comparative example 2, a sample for measuring the glass transition temperature could not be prepared, and the reason therefor was that the influence of brittleness of the cured product was considered, and it was confirmed that: the dielectric constant and the dielectric loss tangent were not suppressed to be lower than those of examples, and the dielectric characteristics were also poor.
Industrial applicability
The curable resin composition of the present invention has a cured product excellent in heat resistance and dielectric properties, and therefore can be suitably used for heat-resistant members and electronic members, particularly for semiconductor sealing materials, circuit boards, build-up films, build-up boards, etc., adhesives, and resist materials. Further, the resin composition can be suitably used as a matrix resin for a fiber-reinforced resin, and is suitably used as a prepreg having high heat resistance.
Drawings
FIG. 1 is a GPC chart of the maleimide compound (A-1) obtained in Synthesis example 1.
FIG. 2 is a GPC chart of the maleimide compound (A-2) obtained in Synthesis example 2.
FIG. 3 is a GPC chart of the maleimide compound (A-3) obtained in Synthesis example 3.
FIG. 4 is a GPC chart of the maleimide compound (A-4) obtained in Synthesis example 4.
FIG. 5 is a GPC chart of the maleimide compound (A-5) obtained in Synthesis example 5.
FIG. 6 is a GPC chart of the maleimide compound (A-9) obtained in Synthesis example 6.
FIG. 7 is a GPC chart of the maleimide compound (A-10) obtained in Synthesis example 7.
FIG. 8 is a GPC chart of the maleimide compound (A-11) obtained in Synthesis example 8.
FIG. 9 is a GPC chart of the maleimide compound (A-12) obtained in Synthesis example 9.

Claims (8)

1. A curable resin composition characterized by containing: a maleimide having an indane skeleton (A), and a diene polymer (B).
2. The curable resin composition according to claim 1, wherein the maleimide (A) is represented by the following general formula (1),
Figure FDA0003317362120000011
in the formula (1), Ra independently represents alkyl, alkoxy or alkylthio with 1-10 carbon atoms, aryl, aryloxy or arylthio with 6-10 carbon atoms, cycloalkyl with 3-10 carbon atoms, halogen atoms, nitro, hydroxyl or sulfydryl, q represents an integer value of 0-4, when q is 2-4, Ra is optionally the same or different in the same ring, Rb independently represents alkyl, alkoxy or alkylthio with 1-10 carbon atoms, aryl, aryloxy or arylthio with 6-10 carbon atoms, cycloalkyl with 3-10 carbon atoms, halogen atoms, hydroxyl or sulfydryl, r represents an integer value of 0-3, when r is 2-3, Rb is optionally the same or different in the same ring, and n is an average repeating unit number and represents a numerical value of 0.5-20.
3. A cured product obtained by curing the curable resin composition according to claim 1 or 2.
4. A prepreg comprising a reinforcing base material and a prepreg of the curable resin composition according to claim 1 or 2 impregnated in the reinforcing base material.
5. A circuit board obtained by laminating the prepreg according to claim 4 and a copper foil and performing thermocompression bonding molding.
6. A multilayer film comprising the curable resin composition according to any one of claims 1 to 3.
7. A semiconductor sealing material comprising the curable resin composition according to any one of claims 1 to 3.
8. A semiconductor device comprising a cured product obtained by heat-curing the semiconductor sealing material according to claim 7.
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WO2020262537A1 (en) * 2019-06-25 2020-12-30 昭和電工マテリアルズ株式会社 Maleimide resin composition, prepreg, laminated board, resin film, multilayer printed wiring board, and semiconductor package
US20230323000A1 (en) * 2020-09-11 2023-10-12 Panasonic Intellectual Property Management Co., Ltd. Resin composition, prepreg, film provided with resin, metal foil provided with resin, metal-clad laminate, and wiring board
US20230331957A1 (en) * 2020-09-11 2023-10-19 Panasonic Intellectual Property Management Co., Ltd. Resin composition, prepreg, film provided with resin, metal foil provided with resin, metal-clad laminate, and wiring board
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US12024624B2 (en) 2020-11-16 2024-07-02 Resonac Corporation Maleimide resin composition, prepreg, laminated board, resin film, printed wiring board, and semiconductor package
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WO2022244723A1 (en) * 2021-05-17 2022-11-24 パナソニックＩｐマネジメント株式会社 Resin composition, prepreg using same, film provided with resin, metal foil provided with resin, metal-clad laminate, and wiring board
KR20240008879A (en) 2021-05-17 2024-01-19 파나소닉 아이피 매니지먼트 가부시키가이샤 Resin composition, prepreg using the same, resin-added film, resin-added metal foil, metal-clad laminate, and wiring board
TW202342631A (en) * 2022-03-14 2023-11-01 日商三菱瓦斯化學股份有限公司 Resin composition, cured product, prepreg, metal-foil-clad laminate, resin composite sheet, printed circuit board, and semiconductor device

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63275562A (en) * 1987-05-06 1988-11-14 Hitachi Ltd Addition reaction-type ether imide compound, its production and composition containing same
JPS6426555A (en) * 1987-07-22 1989-01-27 Hitachi Ltd Addition reaction type ether imide compound, production and composition thereof
JPH06192478A (en) * 1992-10-28 1994-07-12 Nippon Soda Co Ltd Curable resin composition, and prepreg, laminate and molding material each prepared by using same
US5399715A (en) * 1991-12-27 1995-03-21 Sumitomo Chemical Company, Limited Polyamino oligomers and polymaleimide compounds
JP2008133454A (en) * 2006-10-26 2008-06-12 Hitachi Chem Co Ltd Resin composition for printed circuit board and resin varnish using the same, prepreg and metal-clad laminate
JP2009035710A (en) * 2007-07-11 2009-02-19 Hitachi Chem Co Ltd Thermosetting resin composition, and resin varnish for printed circuit board, prepreg and metal-clad laminate using the same
CN103347596A (en) * 2011-03-07 2013-10-09 佐治亚科技研究公司 Polyimide-based carbon molecular sieve membrane for ethylene/ethane separations
JP2018012671A (en) * 2016-07-22 2018-01-25 Ｊｆｅケミカル株式会社 Bismaleimide compound and method for producing the same

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004182850A (en) 2002-12-03 2004-07-02 Mitsubishi Gas Chem Co Inc Prepreg having excellent balance of characteristics and laminated sheet

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63275562A (en) * 1987-05-06 1988-11-14 Hitachi Ltd Addition reaction-type ether imide compound, its production and composition containing same
JPS6426555A (en) * 1987-07-22 1989-01-27 Hitachi Ltd Addition reaction type ether imide compound, production and composition thereof
US5399715A (en) * 1991-12-27 1995-03-21 Sumitomo Chemical Company, Limited Polyamino oligomers and polymaleimide compounds
JPH06192478A (en) * 1992-10-28 1994-07-12 Nippon Soda Co Ltd Curable resin composition, and prepreg, laminate and molding material each prepared by using same
JP2008133454A (en) * 2006-10-26 2008-06-12 Hitachi Chem Co Ltd Resin composition for printed circuit board and resin varnish using the same, prepreg and metal-clad laminate
JP2009035710A (en) * 2007-07-11 2009-02-19 Hitachi Chem Co Ltd Thermosetting resin composition, and resin varnish for printed circuit board, prepreg and metal-clad laminate using the same
CN103347596A (en) * 2011-03-07 2013-10-09 佐治亚科技研究公司 Polyimide-based carbon molecular sieve membrane for ethylene/ethane separations
JP2018012671A (en) * 2016-07-22 2018-01-25 Ｊｆｅケミカル株式会社 Bismaleimide compound and method for producing the same

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
RAJENDRAN SURENDER: "Indane-based bismaleimide and cloisite 15a nanoclay blends: Kinetics of thermal curing and degradation of particulate nanocomposites", POLYMER COMPOSITES, vol. 34, no. 8, pages 1279 - 1297 *

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