TWI703185B - 樹脂組合物、可剝離膠層、ic載板及ic封裝製程 - Google Patents
樹脂組合物、可剝離膠層、ic載板及ic封裝製程 Download PDFInfo
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Abstract
一種樹脂組合物,包括苯乙烯-丁二烯-苯乙烯嵌段共聚物,所述樹脂組合物還包括複數分散在所述苯乙烯-丁二烯-苯乙烯嵌段共聚物中的微膠囊顆粒,或包括複數分散在所述苯乙烯-丁二烯-苯乙烯嵌段共聚物中的無機水合物及微膠囊顆粒,所述無機水合物發生失水現象變成無機物時的失水溫度大於250攝氏度,每一微膠囊顆粒包括殼體及被所述殼體完全包覆的內埋物,所述微膠囊顆粒中的內埋物突破所述殼體大量揮發時的脫離溫度大於250攝氏度。另,本發明還提供一種應用所述樹脂組合物的可剝離膠層、IC載板及IC封裝製程。
Description
本發明涉及一種樹脂組合物、應用所述樹脂組合物的可剝離膠層、IC載板及IC封裝製程。
在通過表面安裝技術將積體電路(IC)安裝於軟性電路載板上時,由於軟性電路載板較為柔軟的機械性能,為了在安裝時提高所述軟性電路載板的機械性能,通常會將所述軟性電路載板藉由一可剝膠層結合於一硬性的載體上。藉由表面安裝技術將IC安裝於軟性電路載板上時的溫度約為250攝氏度,然,習知的可剝膠層在200攝氏度左右時就會出現剝落甚至脆化的現象,無法良好的適用於上述安裝製程中。
有鑑於此,有必要提供一種提升可剝離溫度的樹脂組合物。
另,還有必要提供一種應用所述樹脂組合物的可剝離膠層。
另,還有必要提供一種應用所述樹脂組合物的IC載板。
另,還有必要提供一種應用所述樹脂組合物的IC封裝製程。
一種樹脂組合物,包括苯乙烯-丁二烯-苯乙烯嵌段共聚物,所述樹脂組合物還包括複數分散在所述苯乙烯-丁二烯-苯乙烯嵌段共聚物中的微膠囊顆粒,或包括複數分散在所述苯乙烯-丁二烯-苯乙烯嵌段共聚物中的無機水合物及微膠囊顆粒,所述無機水合物發生失水現象變成無機物時的失水溫度大於250攝氏度,每一微膠囊顆粒包括殼體及被所述殼體完全包覆的內埋物,所述微膠囊顆粒中的內埋物突破所述殼體大量揮發時的脫離溫度大於250攝氏度。
一種可剝離膠層,所述可剝離膠層由如上所述的樹脂組合物經烘烤後製得。
一種IC載板,包括一載體及一形成於所述載體一表面的線路結構,所述IC載板還包括一由如上所述的樹脂組合物經烘烤後製得可剝離膠層,所述可剝離膠層結合於所述載體與所述線路結構之間。
一種應用由如上所述的樹脂組合物經烘烤後製得可剝離膠層的IC封裝製程,其包括以下步驟:提供一IC載板,所述IC載板包括一載體、一線路結構及一結合於所述載體與所述線路結構之間的可剝離膠層;將一積體電路藉由表面組裝技術安裝於所述線路結構遠離所述載體的一側上,所述表面組裝技術具有一安裝溫度,所述脫離溫度高於所述安裝溫度,或者所述失水溫度及所述脫離溫度高於所述安裝溫度;將上述積體電路藉由一封裝結構封裝於所述IC載板上;對上述IC載板進行高溫烘烤,當所述可剝離膠層包含微膠囊顆粒時,所述高溫烘烤的溫度大於或等於所述脫離溫度,當所述可剝離膠層包含無機水合物及微膠囊顆粒時,所述高溫烘烤的溫度大於或等於所述失水溫度及所述脫離溫度,使得所述可剝離膠層中的無機水合物及微膠囊顆粒產生大量氣體並向外溢出,從而使得所述可剝離膠層從所述線路結構上剝離,且所述線路結構上不存在殘膠,進而製得一IC封裝電路板。
本發明的樹脂組合物中的無機水合物及/或微膠囊顆粒,使得所述樹脂組合物形成的可剝離膠層的可剝離溫度提升,使得所述可剝離膠層在經歷表面組裝技術時不發生剝落現象,且所述可剝離膠層在剝離後不存在殘膠現象。
1:IC載板
10:載體
13:線路結構
15:可剝離膠層
2:積體電路
3:封裝結構
5:IC封裝電路板
圖1為本發明實施方式的IC載板的截面示意圖。
圖2為在圖1所示的IC載板上安裝積體電路的截面示意圖。
圖3為將圖2所示的積體電路藉由封裝結構封裝的截面示意圖。
圖4為將圖3中所示的可剝離膠層剝離後製得IC封裝電路板的截面示意圖。
圖5為本發明實施例的可剝離膠層的DSC圖。
圖6為本發明比較例的膠層的DSC圖。
圖7為氫氧化鋁無機水合物的DSC圖。
本發明較佳實施方式的樹脂組合物,其可作為可剝離膠層應用於電路板製程中,如IC封裝製程。所述樹脂組合物中含有苯乙烯-丁二烯-苯乙烯嵌段共聚物(SBS),且所述樹脂組合物還包含複數分散在所述苯乙烯-丁二烯-苯乙烯嵌段共聚物中的無機水合物及/或微膠囊顆粒。每一微膠囊顆粒包括殼體及被所述殼體完全包覆的內埋物。其中,所述無機水合物發生失水現象變成無機物時的失水溫度大於250攝氏度,所述微膠囊顆粒中的內埋物突破所述殼體大量揮發或汽化時的脫離溫度大於250攝氏度。
所述樹脂組合物中,所述苯乙烯-丁二烯-苯乙烯嵌段共聚物的含量為100重量份,當所述樹脂組合物包含所述無機水合物時,所述無機水合物的含量為1~50重量份,當所述樹脂組合物包含所述微膠囊顆粒時,所述微膠囊顆粒的含量為5~50重量份。
本實施方式中,所述無機水合物可選自但不僅限於氫氧化鋁及氫氧化鎂等中的至少一種。本實施方式中,所述微膠囊顆粒為感香粉,所述內埋物為香精及精油中的至少一種,例如,所述內埋物為順式茉莉酮的感香粉。在其他實施方式中,所述微膠囊顆粒可為其他材質。
本實施方式中,所述微膠囊顆粒的平均粒徑為3微米~12微米。
一種由上述樹脂組合物製得的可剝離膠層,所述可剝離膠層藉由烘烤所述樹脂組合物製得。本實施方式中,所述樹脂組合物在110攝氏度的溫度下烘烤15分鐘後製得所述可剝離膠層。所述可剝離膠層為半固化狀態。
當所述樹脂組合物只含無機水合物或微膠囊顆粒,所述可剝離膠層在溫度小於所述失水溫度或所述脫離溫度時,所述可剝離膠層中的苯乙烯-丁二烯-苯乙烯嵌段共聚物之間進一步發生交聯反應,使得所述可剝離膠層的黏性降低但不脆化。所述可剝離膠層在溫度大於或等於所述失水溫度或所述脫離溫度時,所述無機水合物或所述微膠囊顆粒產生大量氣體並向外溢出,從而使得所述可剝離膠層輕易地從與其結合的物體上剝離,且不存在殘膠現象。
當所述樹脂組合物一併包含無機水合物及微膠囊顆粒,所述可剝離膠層在溫度小於所述失水溫度或/及所述脫離溫度時,所述可剝離膠層中的苯乙烯-丁二烯-苯乙烯嵌段共聚物之間進一步發生交聯反應,使得所述可剝離膠層的黏性降低但不脆化。所述可剝離膠層在溫度大於或等於所述失水溫度及所述脫離溫度時,所述無機水合物脫水且水汽化,或所述微膠囊顆粒中的內埋物揮發或汽化,進而產生大量氣體並向外溢出,從而使得所述可剝離膠層輕易地從與其結合的物體上剝離,且不存在殘膠現象。
請參閱圖1,一種IC載板1,其包括一載體10、一線路結構13及一結合於所述載體10與所述線路結構13之間的可剝離膠層15。
本發明還提供一種IC封裝製程,其包括以下步驟:
步驟S1,請參閱圖1,提供一IC載板1,所述IC載板1包括一載體10、一線路結構13及一結合於所述載體10與所述線路結構13之間的上述可剝離膠層15。
步驟S2,請參閱圖2,將一積體電路2(即IC)藉由表面組裝技術(SMT)安裝於所述線路結構13遠離所述載體10的一側上。其中,所述表面組裝技術的安裝溫度約為250攝氏度,所述失水溫度或/及所述脫離溫度均高於所述安裝溫度。此時,所述可剝離膠層15中的苯乙烯-丁二烯-苯乙烯嵌段共聚物之間發生交聯反應,使得所述可剝離膠層的黏性降低但不脆化。
步驟S3,請參閱圖3,將上述積體電路2藉由封裝結構3封裝於所述IC載板1上。
具體的,藉由成型的方式直接在所述IC載板1安裝有所述積體電路2的一側形成封裝結構3,以封裝所述積體電路2。
步驟S4,請參閱圖4,將上述封裝有積體電路2的IC載板1進行高溫烘烤,當所述可剝離膠層15只含無機水合物或微膠囊顆粒時,所述高溫烘
烤的溫度大於或等於所述失水溫度或所述脫離溫度,使得可剝離膠層15中的無機水合物或微膠囊顆粒產生大量氣體並向外溢出,從而使得所述可剝離膠層15輕易地從所述線路結構13上剝離,且所述線路結構13不存在殘膠,進而製得一IC封裝電路板5。當所述可剝離膠層15一併包含無機水合物及微膠囊顆粒時,所述高溫烘烤的溫度大於或等於所述失水溫度及所述脫離溫度,使得可剝離膠層15中的無機水合物及微膠囊顆粒產生大量氣體並向外溢出,從而使得所述可剝離膠層15輕易地從所述線路結構13上剝離,且所述線路結構13不存在殘膠,進而製得一IC封裝電路板5。
可理解,在步驟S4後還可包括其他製程工藝。
下面藉由實施例及比較例來對本發明進行具體說明。
實施例
將100g科騰聚合物公司生產的型號為D1101的苯乙烯-丁二烯-苯乙烯嵌段共聚物及20g崇裕科技股份有限公司生產的型號為SS-PD 41104-1的茉莉香的感香粉置於甲苯中,攪拌混合均勻且使得所述苯乙烯-丁二烯-苯乙烯嵌段共聚物溶於所述甲苯即配置完成樹脂組合物。
將所述樹脂組合物塗佈於一銅箔一表面,並在110攝氏度下烘烤15分鐘,以使得所述樹脂組合物形成一黏結於所述銅箔表面的可剝離膠層。
比較例1
將100g科騰聚合物公司生產的型號為D1101的苯乙烯-丁二烯-苯乙烯嵌段共聚物置於甲苯中,攪拌混合均勻且使得所述苯乙烯-丁二烯-苯乙烯嵌段共聚物溶於所述甲苯即配置完成樹脂組合物。
將所述樹脂組合物塗佈於一銅箔一表面,並在110攝氏度下烘烤15分鐘,以使得所述樹脂組合物形成一黏結於所述銅箔表面的膠層。
比較例2
將長興化學工業股份有限公司生產的型號為ETERAC 7735P的樹脂材料塗佈於一銅箔一表面並形成一膠層。
在常溫下對上述實施例的可剝離膠層及比較例1-2的膠層分別進行銅剝離強度測試,而後在230攝氏度烘烤5分鐘上述實施例的可剝離膠層及比較例1-2的膠層後再對實施例的可剝離膠層及比較例1-2的膠層分別進行銅剝離強度測試,最後在270攝氏度烘烤30分鐘上述實施例的可剝離膠層及比較例1-2的膠層後再對實施例的可剝離膠層及比較例1-2的膠層分別進行銅剝離強度測試。檢測結果請參照表1的檢測資料、圖5、圖6及圖7。
圖5為實施例的可剝離膠層的DSC圖,其中,圖6為比較例1的膠層的DSC圖,其中,該膠層在310攝氏度方出現很強烈的吸收峰,可知該膠層黏性消失的溫度較高,即後續剝離時的溫度需較高。圖7為氫氧化鋁無機水合物的DSC圖,氫氧化鋁在266攝氏度方出現強烈的放熱反應。
由表1及圖5-7可看出,本發明實施例形成的可剝離膠層在230及270攝氏度烘烤後還具有一定的銅剝離強度,且銅剝離強度小於比較例1不含感香粉的樹脂組合物形成的膠層的銅剝離強度,使得在後續剝離處理時本發明實施例形成的可剝離膠層更易去除且不易留殘膠。相較於比較例2的膠層,本發明實施例形成的可剝離膠層在經歷表面組裝技術時不發生剝落現象。
本發明的樹脂組合物中的無機水合物及/或微膠囊顆粒,使得所述樹脂組合物形成的可剝離膠層的可剝離溫度提升,使得所述可剝離膠層在經歷表面組裝技術時不發生剝落現象,且所述可剝離膠層在剝離後不存在殘膠現象。
另,對於本領域的普通技術人員來說,可根據本發明的技術構思做出其它各種相應的改變與變形,而所有該等改變與變形均應屬於本發明申請專利範圍的保護範圍。
1:IC載板
10:載體
13:線路結構
15:可剝離膠層
2:積體電路
3:封裝結構
Claims (12)
- 一種樹脂組合物,包括苯乙烯-丁二烯-苯乙烯嵌段共聚物,其改良在於,所述樹脂組合物還包括複數分散在所述苯乙烯-丁二烯-苯乙烯嵌段共聚物中的微膠囊顆粒,或包括複數分散在所述苯乙烯-丁二烯-苯乙烯嵌段共聚物中的無機水合物及微膠囊顆粒,所述無機水合物發生失水現象變成無機物時的失水溫度大於250攝氏度,每一微膠囊顆粒包括殼體及被所述殼體完全包覆的內埋物,所述微膠囊顆粒中的內埋物突破所述殼體大量揮發時的脫離溫度大於250攝氏度。
- 如申請專利範圍第1項所述的樹脂組合物,其中,所述樹脂組合物中,所述苯乙烯-丁二烯-苯乙烯嵌段共聚物的含量為100重量份,當所述樹脂組合物包含所述無機水合物時,所述無機水合物的含量為1~50重量份,當所述樹脂組合物包含所述微膠囊顆粒時,所述微膠囊顆粒的含量為5~50重量份。
- 如申請專利範圍第1項所述的樹脂組合物,其中,所述無機水合物選自氫氧化鋁及氫氧化鎂中的至少一種。
- 如申請專利範圍第1項所述的樹脂組合物,其中,所述微膠囊顆粒為感香粉。
- 如申請專利範圍第1項所述的樹脂組合物,其中,所述微膠囊顆粒的平均粒徑為3微米~12微米。
- 一種可剝離膠層,其改良在於,所述可剝離膠層由如申請專利範圍第1~6項任一項所述的樹脂組合物經烘烤後製得。
- 如申請專利範圍第7項所述的可剝離膠層,其中,所述烘烤的溫度為110攝氏度,所述烘烤的時間為15分鐘。
- 一種IC載板,包括一載體及一形成於所述載體一表面的線路結構,其改良在於,所述IC載板還包括一由如申請專利範圍第1~6項任一項所述的樹脂組合物經烘烤後製得的可剝離膠層,所述可剝離膠層結合於所述載體與所述線路結構之間。
- 如申請專利範圍第9項所述的IC載板,其中,所述烘烤的溫度為110攝氏度,所述烘烤的時間為15分鐘。
- 一種應用由如申請專利範圍第1~6項任一項所述的樹脂組合物經烘烤後製得可剝離膠層的IC封裝製程,其包括以下步驟:提供一IC載板,所述IC載板包括一載體、一線路結構及一結合於所述載體與所述線路結構之間的可剝離膠層;將一積體電路藉由表面組裝技術安裝於所述線路結構遠離所述載體的一側上,所述表面組裝技術具有一安裝溫度,所述脫離溫度高於所述安裝溫度,或者所述失水溫度及所述脫離溫度高於所述安裝溫度;將上述積體電路藉由一封裝結構封裝於所述IC載板上;對上述IC載板進行高溫烘烤,當所述可剝離膠層包含微膠囊顆粒時,所述高溫烘烤的溫度大於或等於所述脫離溫度,當所述可剝離膠層包含無機水合物及微膠囊顆粒時,所述高溫烘烤的溫度大於或等於所述失水溫度及所述脫離溫度,使得所述可剝離膠層中的無機水合物及微膠囊顆粒產生大量氣體並向外溢 出,從而使得所述可剝離膠層從所述線路結構上剝離,且所述線路結構不存在殘膠,進而製得一IC封裝電路板。
- 如申請專利範圍第11項所述的IC封裝製程,其中,所述樹脂組合物經烘烤後製得可剝離膠層的烘烤溫度為110攝氏度,時間為15分鐘。
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