JP2010278435A - 傾斜三元または四元マルチゲートトランジスタ - Google Patents
傾斜三元または四元マルチゲートトランジスタ Download PDFInfo
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- 239000004065 semiconductor Substances 0.000 claims abstract description 85
- 239000000463 material Substances 0.000 claims abstract description 52
- 239000000758 substrate Substances 0.000 claims abstract description 34
- 238000000407 epitaxy Methods 0.000 claims abstract description 21
- 150000001875 compounds Chemical class 0.000 claims abstract description 18
- 229910052732 germanium Inorganic materials 0.000 claims description 14
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims description 14
- 229910000530 Gallium indium arsenide Inorganic materials 0.000 claims description 10
- 229910052710 silicon Inorganic materials 0.000 claims description 9
- 239000010703 silicon Substances 0.000 claims description 9
- 229910001218 Gallium arsenide Inorganic materials 0.000 claims description 8
- 229910052738 indium Inorganic materials 0.000 claims description 5
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 3
- 238000002955 isolation Methods 0.000 claims description 2
- 230000005669 field effect Effects 0.000 abstract description 8
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- 238000009413 insulation Methods 0.000 abstract description 4
- 238000000034 method Methods 0.000 description 25
- 239000000203 mixture Substances 0.000 description 18
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 8
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000003989 dielectric material Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910017115 AlSb Inorganic materials 0.000 description 2
- 229910005542 GaSb Inorganic materials 0.000 description 2
- 229910003855 HfAlO Inorganic materials 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910000577 Silicon-germanium Inorganic materials 0.000 description 2
- 229910052785 arsenic Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910021478 group 5 element Inorganic materials 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- XCZXGTMEAKBVPV-UHFFFAOYSA-N trimethylgallium Chemical compound C[Ga](C)C XCZXGTMEAKBVPV-UHFFFAOYSA-N 0.000 description 2
- IBEFSUTVZWZJEL-UHFFFAOYSA-N trimethylindium Chemical compound C[In](C)C IBEFSUTVZWZJEL-UHFFFAOYSA-N 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- 229910004129 HfSiO Inorganic materials 0.000 description 1
- -1 InAlAs Inorganic materials 0.000 description 1
- GPXJNWSHGFTCBW-UHFFFAOYSA-N Indium phosphide Chemical compound [In]#P GPXJNWSHGFTCBW-UHFFFAOYSA-N 0.000 description 1
- LEVVHYCKPQWKOP-UHFFFAOYSA-N [Si].[Ge] Chemical compound [Si].[Ge] LEVVHYCKPQWKOP-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 229910052735 hafnium Inorganic materials 0.000 description 1
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 229910021332 silicide Inorganic materials 0.000 description 1
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/785—Field effect transistors with field effect produced by an insulated gate having a channel with a horizontal current flow in a vertical sidewall of a semiconductor body, e.g. FinFET, MuGFET
- H01L29/7851—Field effect transistors with field effect produced by an insulated gate having a channel with a horizontal current flow in a vertical sidewall of a semiconductor body, e.g. FinFET, MuGFET with the body tied to the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66787—Unipolar field-effect transistors with an insulated gate, i.e. MISFET with a gate at the side of the channel
- H01L29/66795—Unipolar field-effect transistors with an insulated gate, i.e. MISFET with a gate at the side of the channel with a horizontal current flow in a vertical sidewall of a semiconductor body, e.g. FinFET, MuGFET
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
Abstract
【解決手段】 半導体基板、前記半導体基板上の絶縁領域、及び前記半導体基板上に位置し、前記絶縁領域間の間隙に少なくとも一部を有し、第1III-V族化合物半導体材料を含むエピタキシー領域を含み、前記エピタキシー領域は、そこと前記半導体基板が第1格子不整合を有する下部分、及び前記下部分上に位置し、そこと前記半導体基板が前記第1格子不整合と異なる第2格子不整合を有する上部分を更に含む集積回路構造。
【選択図】 図6
Description
D2 絶縁領域の厚さ
S 隣接の絶縁領域間の間隔
T フィンの厚さ
10 基板
14 絶縁領域
18 開口
22 半導体材料
221 半導体材料の底部
222 半導体材料の中間部
223 半導体材料の上部
24 フィン
26 高エネルギーギャップの半導体層
30 ゲート誘電体
34 ゲート
44 ソース領域
46 ドレイン領域
50 マスク層
100 FinFET
Claims (15)
- 半導体基板、
前記半導体基板上の絶縁領域、及び
前記半導体基板上に位置し、前記絶縁領域間の間隙に少なくとも一部を有し、第1のIII-V族化合物半導体材料を含むエピタキシー領域を含み、前記エピタキシー領域は、
前記半導体基板に対して第1格子不整合を有する下部分、及び
前記下部分の上部に位置し、前記半導体基板に対して、前記第1格子不整合と異なる第2格子不整合を有する上部分を更に含む集積回路構造。 - 前記エピタキシー領域は、連続的に変化した格子定数を有する部分を更に含む請求項1に記載の集積回路構造。
- 前記エピタキシー領域は、少なくとも3つの層を更に含み、前記少なくとも3つの層と前記半導体基板間の格子不整合は、前記少なくとも3つの層のより下層から前記少なくとも3つの層のより上層に増加する請求項1に記載の集積回路構造。
- 前記エピタキシー領域の上部分は、前記絶縁領域の上表面より高いフィンを形成し、前記フィンの側壁は、前記絶縁領域の上表面より低い前記エピタキシー領域の部分の側壁に垂直に位置合わせされる請求項1に記載の集積回路構造。
- 前記フィンの側壁上に設けられた高バンドギャップエピタキシャル層を更に含み、前記高バンドギャップエピタキシャル層は、前記フィンの第1バンドギャップより大きい第2バンドギャップを有する請求項4に記載の集積回路構造。
- 前記フィンは、InGaAsを含み、前記高バンドギャップエピタキシャル層は、GaAsを含む請求項5に記載の集積回路構造。
- 前記第2バンドギャップは、前記第1バンドギャップより約0.1eVだけ大きい請求項5に記載の集積回路構造。
- 前記半導体基板は、シリコンを含み、前記エピタキシー領域は、InGaAs層を含み、インジウムの比率はInGaAs層の下部分からInGaAs層の上部分に増加する請求項1に記載の集積回路構造。
- InGaAs層の下部分の下方に位置し、前記半導体基板に接触したGaAs層またはゲルマニウム層を更に含む請求項8に記載の集積回路構造。
- 前記絶縁領域は、シャロートレンチアイソレーション(STI)領域である請求項1に記載の集積回路構造。
- 第1格子定数を有する半導体基板、
前記半導体基板上に位置し、互いに対向した側壁を有する絶縁領域、
前記半導体基板上に設けられたIII-V族化合物半導体材料を含むと共に、前記絶縁領域の側壁に隣接した側壁を有するエピタキシー領域を含み、前記エピタキシー領域は、
前記絶縁領域の上表面の上部に位置し、前記第1格子定数と異なる第2格子定数を有するフィン、及び
前記フィンと前記半導体基板の間に位置し、且つそれらに接触する傾斜エピタキシー領域を備え、
前記傾斜エピタキシー領域は、前記第1格子定数と前記第2格子定数の間の第3格子定数を備え、前記フィンの側壁が前記傾斜エピタキシー側壁にほぼ垂直に位置合わせされており、且つ、前記フィンの上表面と側壁に位置し、前記フィンのバンドギャップより大きいバンドギャップを有する高バンドギャップ半導体層が設けられている集積回路構造。 - 高バンドギャップ半導体層上に設けられたゲート誘電体層、
前記ゲート誘電体層上に形成されたゲート電極、及び
前記フィンの互いに反対側の端部上に位置したソース領域とドレイン領域を更に含み、前記フィンと前記高バンドギャップ半導体層のそれぞれは、前記ソース領域から前記ドレイン領域に延伸する請求項11に記載の集積回路構造。 - 前記高バンドギャップ半導体層の底部端は、前記絶縁領域の上表面に接触する請求項11に記載の集積回路構造。
- 前記フィンは、三元III-V族化合物半導体材料または四元III-V族化合物半導体材料で形成される請求項11に記載の集積回路構造。
- 前記傾斜エピタキシー領域は、傾斜の格子定数を有し、前記傾斜エピタキシー領域の下部分は、前記傾斜エピタキシー領域の上部分の格子定数より小さい格子定数を有する請求項11に記載の集積回路構造。
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US18255009P | 2009-05-29 | 2009-05-29 | |
US61/182,550 | 2009-05-29 | ||
US12/616,068 | 2009-11-10 | ||
US12/616,068 US9768305B2 (en) | 2009-05-29 | 2009-11-10 | Gradient ternary or quaternary multiple-gate transistor |
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JP2010278435A true JP2010278435A (ja) | 2010-12-09 |
JP5341020B2 JP5341020B2 (ja) | 2013-11-13 |
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JP2010116844A Active JP5341020B2 (ja) | 2009-05-29 | 2010-05-21 | 傾斜三元または四元マルチゲートトランジスタ |
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US (2) | US9768305B2 (ja) |
JP (1) | JP5341020B2 (ja) |
KR (1) | KR101226827B1 (ja) |
CN (1) | CN101924105B (ja) |
TW (1) | TWI440182B (ja) |
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TW201104866A (en) | 2011-02-01 |
US9768305B2 (en) | 2017-09-19 |
CN101924105B (zh) | 2012-12-19 |
US20100301390A1 (en) | 2010-12-02 |
CN101924105A (zh) | 2010-12-22 |
TWI440182B (zh) | 2014-06-01 |
US10269970B2 (en) | 2019-04-23 |
JP5341020B2 (ja) | 2013-11-13 |
KR101226827B1 (ko) | 2013-01-25 |
US20180006156A1 (en) | 2018-01-04 |
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