JP2017523589A - 同じダイ上にGe/SiGeチャネルおよびIII−V族チャネルのトランジスタを形成するための技術 - Google Patents
同じダイ上にGe/SiGeチャネルおよびIII−V族チャネルのトランジスタを形成するための技術 Download PDFInfo
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- JP2017523589A JP2017523589A JP2016566283A JP2016566283A JP2017523589A JP 2017523589 A JP2017523589 A JP 2017523589A JP 2016566283 A JP2016566283 A JP 2016566283A JP 2016566283 A JP2016566283 A JP 2016566283A JP 2017523589 A JP2017523589 A JP 2017523589A
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Abstract
Description
以下の複数の例は、さらなる複数の実施形態に関するものであり、そこから多数の変形および構成が明らかになるであろう。
様々な異なる工程が、1または複数のトランジスタの形成を完了116すべく実行され得、そのような工程は、一実施形態による、図2Hに見られるような複数のフィン212および222の上にゲートまたはゲートスタック252を形成する段階を含んでよい。ゲート252の形成は、ダミーゲート酸化物堆積、ダミーゲート電極(例えば、poly‐Si)堆積、およびハードマスク堆積のパターニングを含んでよい。
付加的な処理は、複数のダミーゲートのパターニングおよびスペーサ材料の堆積/エッチングを含んでよい。そのような工程に続いて、方法は、置き換え金属ゲート工程について行われるように、複数のトランジスタのチャネル領域を露出させるべく、絶縁体堆積、平坦化、および次にダミーゲート電極およびゲート酸化物の除去を継続してよい。
チャネル領域の開放に続いて、ダミーゲート酸化物および電極は、それぞれ、例えば高誘電率(high−k )誘電体および置き換え金属ゲートと置き換えられてよい。
ソース/コンタクトトレンチ処理ループが、次に実行されてよく、それは、例えば複数のソース/ドレイン金属接触部または接触層の堆積を含んでよい。
方法100は、本開示に照らし明らかであるように、様々な適切な付加的または代替の工程を含んでよい。
Claims (25)
- 集積回路であって、
シリコン(Si)または絶縁体の基板と、
前記基板の上に形成され、
ゲルマニウム(Ge)およびシリコンゲルマニウム(SiGe)のうち少なくとも1つ、または
少なくとも1つのIII−V族材料のうち一方を有する疑似基板と、
チャネル領域を含む第1のトランジスタであって、前記第1のトランジスタのチャネル領域は、前記疑似基板の一部から形成され、前記疑似基板の材料を有する、第1のトランジスタと、
チャネル領域を含む第2のトランジスタであって、前記第2のトランジスタのチャネル領域は、前記疑似基板の上に形成され、
GeおよびSiGeのうち少なくとも1つ、または
少なくとも1つのIII−V族材料のうち他方を有する、第2のトランジスタと、を備える、
集積回路。 - 前記疑似基板は、前記基板の上にブランケット堆積される、請求項1に記載の集積回路。
- 前記GeおよびSiGeのチャネル領域のうち少なくとも1つはp型にドープされて、前記III−V族のチャネル領域はn型にドープされる、請求項1または2に記載の集積回路。
- GeおよびSiGeのチャネル領域のうち少なくとも1つを有するトランジスタは、Si1‐xGexから成り、x>0.8または0.4>x>0.2である、請求項1から3のいずれか一項に記載の集積回路。
- 前記第2のトランジスタは、前記基板の上に形成され、前記第2のトランジスタのチャネル領域材料を有するソース/ドレイン領域を含む、請求項1から4のいずれか一項に記載の集積回路。
- 前記第2のトランジスタは、前記疑似基板の一部から形成されたソース/ドレイン領域を含み、前記疑似基板の材料を有する、請求項1から5のいずれか一項に記載の集積回路。
- 前記少なくとも1つのIII−V族材料は、少なくとも2つのIII−V族材料のスタックを有する、請求項1から6のいずれか一項に記載の集積回路。
- 前記スタックにおける底部の材料は、砒化ガリウム(GaAs)、リン化インジウム(InP)、砒化アルミニウム(AlAs)、およびインジウムアルミニウム砒素(InAlAs)のうち1つである、請求項7に記載の集積回路。
- 前記スタックにおける上部の材料は、インジウムガリウム砒素(InGaAs)および砒化インジウム(InAs)のうち一方である、請求項7に記載の集積回路。
- 前記少なくとも1つのIII−V族材料は、底部の付近でp型にドープされ、上部の付近でn型にドープされる、請求項1から9のいずれか一項に記載の集積回路。
- 前記第1のトランジスタおよび前記第2のトランジスタのうち少なくとも1つが、フィン型構成を有する、請求項1から10のいずれか一項に記載の集積回路。
- 前記第1のトランジスタおよび前記第2のトランジスタのうち少なくとも1つが、ナノワイヤまたはナノリボン構成を有する、請求項1から11のいずれか一項に記載の集積回路。
- 請求項1から12のいずれか一項に記載の集積回路を有する、相補型金属酸化膜半導体(CMOS)デバイス。
- 請求項1から12のいずれか一項に記載の集積回路を有する、コンピューティングシステム。
- 集積回路であって、
シリコン(Si)または絶縁体の基板と、
前記基板の上に形成され、
ゲルマニウム(Ge)およびシリコンゲルマニウム(SiGe)のうち少なくとも1つ、または
少なくとも1つのIII−V族材料のうち一方を有する、疑似基板と、
前記疑似基板から形成された第1のフィンと、
前記疑似基板の上に形成され、
GeおよびSiGeのうち少なくとも1つ、または
少なくとも1つのIII−V族材料のうち他方を有する、第2のフィンと、を備える、
集積回路。 - 前記第1のフィンの上に形成された第1のトランジスタと、
前記第2のフィンの上に形成された第2のトランジスタと、をさらに備える、
請求項15に記載の集積回路。 - 前記第1のフィンから形成されたチャネル領域を含む第1のトランジスタと、
前記第2のフィンから形成されたチャネル領域を含む第2のトランジスタと、をさらに備える、
請求項15に記載の集積回路。 - 前記第1のトランジスタは、p−MOSトランジスタであり、前記第2のトランジスタは、n−MOSトランジスタである、請求項16または17に記載の集積回路。
- 前記第1のフィンおよび前記第2のフィンのうち一方の少なくとも一部が、1または複数のナノワイヤまたはナノリボンへと形成される、請求項16または17に記載の集積回路。
- 集積回路を形成する方法であって、
シリコン(Si)または絶縁体の基板の上に疑似基板をブランケット堆積させる段階であって、前記疑似基板は、
ゲルマニウム(Ge)およびシリコンゲルマニウム(SiGe)のうち少なくとも1つ、または
少なくとも1つのIII−V族材料のうち一方を有する、段階と、
前記疑似基板を複数のフィンへとパターニングする段階と、
前記複数のフィンのサブセット内の各フィンの少なくとも一部を、
GeおよびSiGeのうち少なくとも1つ、または
少なくとも1つのIII−V族材料のうち他方を含む置き換え材料と置き換える段階と、を備える、
方法。 - 前記疑似基板の材料で形成された前記複数のフィンの上に1または複数のトランジスタの第1のセットを形成する段階と、
置き換えられた前記複数のフィンのサブセットの上に1または複数のトランジスタの第2のセットを形成する段階と、をさらに備える、
請求項20に記載の方法。 - 前記複数のフィンの前記サブセット内の各フィンの少なくとも一部だけが置き換えられ、複数の前記一部は、後に形成される複数のトランジスタのための複数のチャネル領域から成る、請求項20に記載の方法。
- 各フィンの少なくとも一部を1または複数のナノワイヤへと形成する段階をさらに備える、請求項20から22のいずれか一項に記載の方法。
- 各フィンの少なくとも一部を1または複数のナノワイヤと置き換える段階をさらに備える、請求項20から22のいずれか一項に記載の方法。
- 前記複数のフィンの前記サブセットまたは前記サブセット以外の複数のフィンのうち一方の上に1または複数のフィン型トランジスタを形成する段階と、
前記複数のフィンの前記サブセットまたは前記サブセット以外の前記複数のフィンのうち他方の上に1または複数のナノワイヤトランジスタを形成する段階と、をさらに備える、
請求項20から22のいずれか一項に記載の方法。
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JP6428789B2 (ja) | 2018-11-28 |
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TWI565000B (zh) | 2017-01-01 |
EP3161870B1 (en) | 2022-05-25 |
EP3161870A1 (en) | 2017-05-03 |
KR20170017886A (ko) | 2017-02-15 |
WO2015199655A1 (en) | 2015-12-30 |
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