JP2009530821A - 軽減システムの改善された操作方法及び装置 - Google Patents
軽減システムの改善された操作方法及び装置 Download PDFInfo
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- JP2009530821A JP2009530821A JP2009500470A JP2009500470A JP2009530821A JP 2009530821 A JP2009530821 A JP 2009530821A JP 2009500470 A JP2009500470 A JP 2009500470A JP 2009500470 A JP2009500470 A JP 2009500470A JP 2009530821 A JP2009530821 A JP 2009530821A
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- information
- effluent
- mitigation system
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- electronic device
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- 230000000116 mitigating effect Effects 0.000 title claims abstract description 95
- 238000000034 method Methods 0.000 title claims description 57
- 238000004519 manufacturing process Methods 0.000 claims abstract description 38
- 239000000463 material Substances 0.000 claims abstract description 22
- 239000000126 substance Substances 0.000 claims description 15
- 239000000376 reactant Substances 0.000 claims description 10
- 239000003054 catalyst Substances 0.000 claims description 4
- 238000002485 combustion reaction Methods 0.000 claims description 3
- 238000007865 diluting Methods 0.000 claims 2
- TXEYQDLBPFQVAA-UHFFFAOYSA-N tetrafluoromethane Chemical compound FC(F)(F)F TXEYQDLBPFQVAA-UHFFFAOYSA-N 0.000 description 30
- 238000000354 decomposition reaction Methods 0.000 description 18
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 14
- 238000001595 flow curve Methods 0.000 description 9
- 238000009826 distribution Methods 0.000 description 6
- 239000000446 fuel Substances 0.000 description 5
- 239000007789 gas Substances 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 4
- 239000012530 fluid Substances 0.000 description 4
- 239000012707 chemical precursor Substances 0.000 description 3
- 239000002826 coolant Substances 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 238000011017 operating method Methods 0.000 description 3
- 238000010926 purge Methods 0.000 description 3
- 238000004458 analytical method Methods 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 238000006731 degradation reaction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000011065 in-situ storage Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- JEGUKCSWCFPDGT-UHFFFAOYSA-N h2o hydrate Chemical compound O.O JEGUKCSWCFPDGT-UHFFFAOYSA-N 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000003345 natural gas Substances 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
- F04B49/00—Control, e.g. of pump delivery, or pump pressure of, or safety measures for, machines, pumps, or pumping installations, not otherwise provided for, or of interest apart from, groups F04B1/00 - F04B47/00
- F04B49/06—Control using electricity
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
- F04B49/00—Control, e.g. of pump delivery, or pump pressure of, or safety measures for, machines, pumps, or pumping installations, not otherwise provided for, or of interest apart from, groups F04B1/00 - F04B47/00
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D16/00—Control of fluid pressure
- G05D16/20—Control of fluid pressure characterised by the use of electric means
Abstract
Description
Claims (15)
- 望ましくない物質を有する流出物を生成する電子デバイス製造システムについての情報を分析し、前記流出物についての情報を提供するように適合されたインタフェースと、
前記流出物についての情報を受信し、前記流出物を受け、前記望ましくない物質を希釈するように適合された軽減システムとを含む装置。 - 前記システム情報が、前記電子デバイス製造システムにより提供される情報を含む請求項1記載の装置。
- 前記システム情報が、予測解を含む請求項1記載の装置。
- 前記軽減システムが、前記流出物についての前記情報を利用して、前記望ましくない物質を希釈する請求項1記載の装置。
- 前記軽減システムが、プラズマ軽減システムである請求項1記載の装置。
- 前記軽減システムが、触媒軽減システムである請求項1記載の装置。
- 前記軽減システムが、燃焼軽減システムである請求項1記載の装置。
- 前記流出物が、プロセスチャンバにより生成される請求項1記載の装置。
- 前記流出物が、前記プロセスチャンバから、ポンプにより除去される請求項8記載の装置。
- 軽減システムにより情報を受信する工程であって、前記情報が、望ましくない物質を有する流出物についてのものである工程と、
前記流出物を受ける工程とを含む方法。 - 望ましくない物質に関する前記情報が、予測解を含む請求項10記載の方法。
- 前記情報が、インタフェースにより提供される請求項10記載の方法。
- 前記電子デバイス製造システムに関する操作情報を、前記インタフェースに提供する工程を含む請求項12記載の方法。
- 前記望ましくない物質を、前記軽減システムにより希釈する工程を含む請求項10記載の方法。
- 前記望ましくない物質を、前記軽減システムにより希釈する工程が、前記望ましくない物質を反応物質と反応させる工程を含む請求項14記載の方法。
Applications Claiming Priority (9)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US78337006P | 2006-03-16 | 2006-03-16 | |
US78333706P | 2006-03-16 | 2006-03-16 | |
US78337406P | 2006-03-16 | 2006-03-16 | |
US60/783,374 | 2006-03-16 | ||
US60/783,337 | 2006-03-16 | ||
US60/783,370 | 2006-03-16 | ||
US89060907P | 2007-02-19 | 2007-02-19 | |
US60/890,609 | 2007-02-19 | ||
PCT/US2007/006494 WO2007109081A2 (en) | 2006-03-16 | 2007-03-14 | Method and apparatus for improved operation of an abatement system |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2009530821A true JP2009530821A (ja) | 2009-08-27 |
JP2009530821A5 JP2009530821A5 (ja) | 2011-05-19 |
JP6034546B2 JP6034546B2 (ja) | 2016-11-30 |
Family
ID=38522928
Family Applications (4)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009500452A Pending JP2009530819A (ja) | 2006-03-16 | 2007-03-14 | 電子デバイス製造システムにおける圧力制御方法及び装置 |
JP2009500471A Active JP6030278B2 (ja) | 2006-03-16 | 2007-03-14 | 電子デバイス製造システムの操作を改善する方法及び装置 |
JP2009500470A Active JP6034546B2 (ja) | 2006-03-16 | 2007-03-14 | 軽減システムの改善された操作方法及び装置 |
JP2014165252A Active JP6182116B2 (ja) | 2006-03-16 | 2014-08-14 | 電子デバイス製造システムの操作を改善する方法及び装置 |
Family Applications Before (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009500452A Pending JP2009530819A (ja) | 2006-03-16 | 2007-03-14 | 電子デバイス製造システムにおける圧力制御方法及び装置 |
JP2009500471A Active JP6030278B2 (ja) | 2006-03-16 | 2007-03-14 | 電子デバイス製造システムの操作を改善する方法及び装置 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014165252A Active JP6182116B2 (ja) | 2006-03-16 | 2014-08-14 | 電子デバイス製造システムの操作を改善する方法及び装置 |
Country Status (7)
Country | Link |
---|---|
US (3) | US7532952B2 (ja) |
EP (3) | EP1994458A2 (ja) |
JP (4) | JP2009530819A (ja) |
KR (2) | KR101126413B1 (ja) |
CN (1) | CN101495925B (ja) |
TW (3) | TWI407997B (ja) |
WO (3) | WO2007109082A2 (ja) |
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