JP2009528695A5 - - Google Patents
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- Publication number
- JP2009528695A5 JP2009528695A5 JP2008557208A JP2008557208A JP2009528695A5 JP 2009528695 A5 JP2009528695 A5 JP 2009528695A5 JP 2008557208 A JP2008557208 A JP 2008557208A JP 2008557208 A JP2008557208 A JP 2008557208A JP 2009528695 A5 JP2009528695 A5 JP 2009528695A5
- Authority
- JP
- Japan
- Prior art keywords
- metal plate
- emitting diode
- light emitting
- groove
- insulating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910052751 metal Inorganic materials 0.000 claims 22
- 239000002184 metal Substances 0.000 claims 22
- 238000004519 manufacturing process Methods 0.000 claims 6
- 238000000034 method Methods 0.000 claims 5
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims 4
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims 4
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 claims 4
- 229910000019 calcium carbonate Inorganic materials 0.000 claims 2
- 239000011347 resin Substances 0.000 claims 2
- 229920005989 resin Polymers 0.000 claims 2
- 239000011787 zinc oxide Substances 0.000 claims 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims 1
- 238000000465 moulding Methods 0.000 claims 1
- 238000007650 screen-printing Methods 0.000 claims 1
- 239000000126 substance Substances 0.000 claims 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2006-0020305 | 2006-03-03 | ||
| KR1020060020305A KR101210090B1 (ko) | 2006-03-03 | 2006-03-03 | 금속 코어 인쇄회로기판 및 이를 이용한 발광 다이오드패키징 방법 |
| PCT/KR2007/001020 WO2007100209A1 (en) | 2006-03-03 | 2007-02-28 | Light-emitting diode package and manufacturing method thereof |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012095306A Division JP5759413B2 (ja) | 2006-03-03 | 2012-04-19 | 発光ダイオードパッケージ |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2009528695A JP2009528695A (ja) | 2009-08-06 |
| JP2009528695A5 true JP2009528695A5 (enExample) | 2010-01-14 |
| JP5323501B2 JP5323501B2 (ja) | 2013-10-23 |
Family
ID=38459278
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008557208A Active JP5323501B2 (ja) | 2006-03-03 | 2007-02-28 | 発光ダイオードパッケージ及びその製造方法 |
| JP2012095306A Expired - Fee Related JP5759413B2 (ja) | 2006-03-03 | 2012-04-19 | 発光ダイオードパッケージ |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012095306A Expired - Fee Related JP5759413B2 (ja) | 2006-03-03 | 2012-04-19 | 発光ダイオードパッケージ |
Country Status (6)
| Country | Link |
|---|---|
| US (3) | US7745844B2 (enExample) |
| JP (2) | JP5323501B2 (enExample) |
| KR (1) | KR101210090B1 (enExample) |
| CN (1) | CN101213892B (enExample) |
| TW (1) | TWI429100B (enExample) |
| WO (1) | WO2007100209A1 (enExample) |
Families Citing this family (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101210090B1 (ko) * | 2006-03-03 | 2012-12-07 | 엘지이노텍 주식회사 | 금속 코어 인쇄회로기판 및 이를 이용한 발광 다이오드패키징 방법 |
| KR20110046440A (ko) * | 2008-08-21 | 2011-05-04 | 파나소닉 주식회사 | 조명용 광원 |
| KR101134555B1 (ko) * | 2009-03-23 | 2012-04-16 | 금호전기주식회사 | 발광소자 장착용 인쇄회로기판 |
| KR101124102B1 (ko) * | 2009-08-24 | 2012-03-21 | 삼성전기주식회사 | 발광 소자 패키지용 기판 및 이를 포함하는 발광 소자 패키지 |
| KR20110068689A (ko) * | 2009-12-16 | 2011-06-22 | 삼성전기주식회사 | 광학소자용 패키지 기판 및 그 제조방법 |
| US8616732B2 (en) | 2010-02-12 | 2013-12-31 | Toshiba Lighting & Technology Corporation | Light-emitting device and illumination device |
| KR101121151B1 (ko) | 2010-03-19 | 2012-03-20 | 주식회사 대원이노스트 | Led 모듈 및 그 제조 방법 |
| KR101037168B1 (ko) * | 2010-06-04 | 2011-05-26 | 지성수 | 절연 및 방열성능이 향상된 방열피씨비 및 이의 제조방법 |
| KR101101709B1 (ko) * | 2010-12-16 | 2012-01-05 | 한국세라믹기술원 | Led 어레이 방열모듈 및 이의 제조방법 |
| KR101166066B1 (ko) | 2010-12-21 | 2012-07-19 | 주식회사 루셈 | 발광다이오드 패키지 |
| KR101775428B1 (ko) | 2010-12-28 | 2017-09-06 | 삼성전자 주식회사 | 발광 소자 패키지 및 그 제조 방법 |
| CN102104092A (zh) * | 2011-01-13 | 2011-06-22 | 北京易光天元半导体照明科技有限公司 | 一种利于散热的新型led封装方法和装置 |
| US9103532B2 (en) * | 2011-01-25 | 2015-08-11 | Koninklijke Philips N.V. | LED-based modular assembly |
| TWI419270B (zh) * | 2011-03-24 | 2013-12-11 | 南茂科技股份有限公司 | 封裝堆疊結構 |
| TW201347244A (zh) * | 2012-05-10 | 2013-11-16 | 盈勝科技股份有限公司 | 一體化高效率多層式照明裝置 |
| KR101236715B1 (ko) * | 2012-08-28 | 2013-02-25 | 주식회사 썬엘이디 | 실리콘 성형 방식을 이용한 칩온보드댐을 포함한 led 모듈의 제조방법 및 상기 제조방법에 의해 제조된 led 모듈 |
| JP5784658B2 (ja) * | 2013-02-28 | 2015-09-24 | 株式会社東芝 | 半導体装置の製造方法及び製造装置 |
| EP2806211A1 (en) * | 2013-05-21 | 2014-11-26 | OSRAM GmbH | Solid-state lighting device and related process |
| KR101592649B1 (ko) * | 2013-12-24 | 2016-02-12 | 현대자동차주식회사 | 헤드램프용 레이저 광학계 |
| CN104613379B (zh) * | 2015-02-06 | 2017-12-26 | 东莞佰鸿电子有限公司 | 一种蓝宝石印刷电路板led灯具及其制作方法 |
| CN105655472A (zh) * | 2016-02-02 | 2016-06-08 | 上海鼎晖科技股份有限公司 | 一种金属导热柱cob led光源 |
| CN106449443B (zh) * | 2016-11-29 | 2019-01-01 | 海安浩驰科技有限公司 | 一种具有鳍形结构的晶圆封装方法 |
| CN106449563B (zh) * | 2016-11-29 | 2018-11-13 | 卡姆丹克太阳能(江苏)有限公司 | 一种具有鳍形结构的晶圆封装 |
| DE102019126021A1 (de) * | 2019-09-26 | 2021-04-01 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronisches halbleiterbauelement und verfahren zur herstellung eines optoelektronischen halbleiterbauelements |
| CN111048651B (zh) * | 2019-12-27 | 2021-12-17 | 广州市鸿利秉一光电科技有限公司 | 一种高反射率uvled基板及生产方法 |
| US11894357B2 (en) * | 2020-09-10 | 2024-02-06 | Sj Semiconductor (Jiangyin) Corporation | System-level packaging structure and method for LED chip |
| WO2023133720A1 (zh) * | 2022-01-12 | 2023-07-20 | 谢华棣 | 立体散热电路板组的制造方法 |
| US20240074031A1 (en) * | 2022-08-29 | 2024-02-29 | Creeled, Inc. | Textured metal core printed circuit boards for improved thermal dissipation |
| WO2024260748A1 (en) | 2023-06-20 | 2024-12-26 | Signify Holding B.V. | A lighting device |
Family Cites Families (44)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JPS6028366U (ja) * | 1983-08-03 | 1985-02-26 | 昭和アルミニウム株式会社 | 凝縮器 |
| JPH0416468Y2 (enExample) * | 1986-07-31 | 1992-04-13 | ||
| JPH0677540A (ja) * | 1992-08-24 | 1994-03-18 | Sanyo Electric Co Ltd | 光半導体装置 |
| JPH08204294A (ja) * | 1995-01-27 | 1996-08-09 | Fuji Electric Co Ltd | 放熱フィン一体形プリント配線板 |
| US5739554A (en) * | 1995-05-08 | 1998-04-14 | Cree Research, Inc. | Double heterojunction light emitting diode with gallium nitride active layer |
| JPH10144963A (ja) * | 1996-11-05 | 1998-05-29 | Sanyo Electric Co Ltd | Led光源及びその製造方法 |
| JPH11284110A (ja) * | 1998-03-30 | 1999-10-15 | Onkyo Corp | ヒートシンクにおけるパワートランジスタの取付構造 |
| JP3605547B2 (ja) * | 1999-06-11 | 2004-12-22 | 松下電器産業株式会社 | 放熱基板及びその製造方法 |
| JP3640153B2 (ja) * | 1999-11-18 | 2005-04-20 | 松下電工株式会社 | 照明光源 |
| TW507482B (en) * | 2000-06-09 | 2002-10-21 | Sanyo Electric Co | Light emitting device, its manufacturing process, and lighting device using such a light-emitting device |
| JP3602453B2 (ja) * | 2000-08-31 | 2004-12-15 | Necエレクトロニクス株式会社 | 半導体装置 |
| JP3472252B2 (ja) * | 2000-09-07 | 2003-12-02 | 日本リークレス工業株式会社 | 膨張黒鉛製ヒートシンクの製造方法 |
| US6906455B2 (en) * | 2001-02-26 | 2005-06-14 | Sony Corporation | Transfer foil, transfer method, transfer apparatus, flat cathode-ray tube, and its manufacturing method |
| JP2003249675A (ja) * | 2002-02-26 | 2003-09-05 | Sumitomo Electric Ind Ltd | 受光素子アレイ |
| JP2003304000A (ja) | 2002-04-08 | 2003-10-24 | Citizen Electronics Co Ltd | 発光ダイオード用パッケージの製造方法 |
| JP3838164B2 (ja) * | 2002-06-18 | 2006-10-25 | 住友電気工業株式会社 | 光通信用素子と光通信用素子の製造方法 |
| JP3655267B2 (ja) * | 2002-07-17 | 2005-06-02 | 株式会社東芝 | 半導体発光装置 |
| TW578280B (en) * | 2002-11-21 | 2004-03-01 | United Epitaxy Co Ltd | Light emitting diode and package scheme and method thereof |
| US7420271B2 (en) * | 2003-02-20 | 2008-09-02 | Tsung Hsin Chen | Heat conductivity and brightness enhancing structure for light-emitting diode |
| JP2004319530A (ja) * | 2003-02-28 | 2004-11-11 | Sanyo Electric Co Ltd | 光半導体装置およびその製造方法 |
| TW560813U (en) * | 2003-03-06 | 2003-11-01 | Shang-Hua You | Improved LED seat |
| TW594950B (en) * | 2003-03-18 | 2004-06-21 | United Epitaxy Co Ltd | Light emitting diode and package scheme and method thereof |
| US6864513B2 (en) * | 2003-05-07 | 2005-03-08 | Kaylu Industrial Corporation | Light emitting diode bulb having high heat dissipating efficiency |
| TWI253765B (en) * | 2003-05-26 | 2006-04-21 | Matsushita Electric Works Ltd | Light-emitting device |
| WO2004107461A1 (en) | 2003-05-28 | 2004-12-09 | Seoul Semiconductor Co., Ltd. | Light emitting diode package and light emitting diode system having at least two heat sinks |
| KR100455089B1 (ko) | 2003-05-28 | 2004-11-06 | 서울반도체 주식회사 | 고출력 반도체 발광 소자용 패키지 구조 및 이를 사용하는 반도체 발광 소자 |
| KR100524656B1 (ko) | 2003-09-30 | 2005-10-31 | 서울반도체 주식회사 | 다색 발광다이오드 패키지 및 다색 발광다이오드 시스템 |
| US6983086B2 (en) * | 2003-06-19 | 2006-01-03 | Intel Corporation | Thermally isolating optical devices |
| JP4254470B2 (ja) * | 2003-10-10 | 2009-04-15 | 豊田合成株式会社 | 発光装置 |
| JP2005056653A (ja) * | 2003-08-01 | 2005-03-03 | Fuji Photo Film Co Ltd | 光源装置 |
| JP4400327B2 (ja) * | 2003-09-11 | 2010-01-20 | セイコーエプソン株式会社 | タイル状素子用配線形成方法 |
| US20050077616A1 (en) * | 2003-10-09 | 2005-04-14 | Ng Kee Yean | High power light emitting diode device |
| JP2005217147A (ja) * | 2004-01-29 | 2005-08-11 | Seiko Epson Corp | 受発光素子アレイ、光モジュール、および光伝達装置 |
| US20050199899A1 (en) | 2004-03-11 | 2005-09-15 | Ming-Der Lin | Package array and package unit of flip chip LED |
| CN1708212A (zh) * | 2004-06-11 | 2005-12-14 | 周明庆 | 导热基板装置 |
| US7745832B2 (en) * | 2004-09-24 | 2010-06-29 | Epistar Corporation | Semiconductor light-emitting element assembly with a composite substrate |
| US20060097385A1 (en) * | 2004-10-25 | 2006-05-11 | Negley Gerald H | Solid metal block semiconductor light emitting device mounting substrates and packages including cavities and heat sinks, and methods of packaging same |
| US20060124953A1 (en) * | 2004-12-14 | 2006-06-15 | Negley Gerald H | Semiconductor light emitting device mounting substrates and packages including cavities and cover plates, and methods of packaging same |
| JP4618682B2 (ja) | 2005-01-28 | 2011-01-26 | 株式会社神戸製鋼所 | 耐水素脆化特性に優れた高強度ばね用鋼 |
| US7411225B2 (en) * | 2005-03-21 | 2008-08-12 | Lg Electronics Inc. | Light source apparatus |
| KR100592508B1 (ko) * | 2005-07-15 | 2006-06-26 | 한국광기술원 | 비콘 모양의 기판을 구비한 고출력 발광 다이오드 패키지 |
| TWI280332B (en) * | 2005-10-31 | 2007-05-01 | Guei-Fang Chen | LED lighting device |
| KR101210090B1 (ko) * | 2006-03-03 | 2012-12-07 | 엘지이노텍 주식회사 | 금속 코어 인쇄회로기판 및 이를 이용한 발광 다이오드패키징 방법 |
| US20080175003A1 (en) * | 2007-01-22 | 2008-07-24 | Cheng Home Electronics Co., Ltd. | Led sunken lamp |
-
2006
- 2006-03-03 KR KR1020060020305A patent/KR101210090B1/ko not_active Expired - Fee Related
-
2007
- 2007-02-28 JP JP2008557208A patent/JP5323501B2/ja active Active
- 2007-02-28 WO PCT/KR2007/001020 patent/WO2007100209A1/en not_active Ceased
- 2007-02-28 CN CN2007800000705A patent/CN101213892B/zh active Active
- 2007-02-28 US US11/910,174 patent/US7745844B2/en active Active
- 2007-03-02 TW TW096107087A patent/TWI429100B/zh active
-
2010
- 2010-05-26 US US12/788,090 patent/US8212274B2/en not_active Expired - Fee Related
-
2012
- 2012-04-19 JP JP2012095306A patent/JP5759413B2/ja not_active Expired - Fee Related
- 2012-06-13 US US13/495,664 patent/US8796717B2/en active Active
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