CN101213892B - 发光二极管封装件及其制造方法 - Google Patents

发光二极管封装件及其制造方法 Download PDF

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Publication number
CN101213892B
CN101213892B CN2007800000705A CN200780000070A CN101213892B CN 101213892 B CN101213892 B CN 101213892B CN 2007800000705 A CN2007800000705 A CN 2007800000705A CN 200780000070 A CN200780000070 A CN 200780000070A CN 101213892 B CN101213892 B CN 101213892B
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China
Prior art keywords
light emitting
emitting diode
insulating layer
metal plate
circuit pattern
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Chinese (zh)
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CN101213892A (zh
Inventor
申经浩
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Suzhou Liyu Semiconductor Co ltd
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LG Innotek Co Ltd
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8582—Means for heat extraction or cooling characterised by their shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24C—DOMESTIC STOVES OR RANGES ; DETAILS OF DOMESTIC STOVES OR RANGES, OF GENERAL APPLICATION
    • F24C7/00—Stoves or ranges heated by electric energy
    • F24C7/06—Arrangement or mounting of electric heating elements
    • F24C7/062—Arrangement or mounting of electric heating elements on stoves
    • F24C7/065—Arrangement or mounting of electric heating elements on stoves with reflectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24C—DOMESTIC STOVES OR RANGES ; DETAILS OF DOMESTIC STOVES OR RANGES, OF GENERAL APPLICATION
    • F24C7/00—Stoves or ranges heated by electric energy
    • F24C7/08—Arrangement or mounting of control or safety devices
    • F24C7/081—Arrangement or mounting of control or safety devices on stoves
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8583—Means for heat extraction or cooling not being in contact with the bodies

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
CN2007800000705A 2006-03-03 2007-02-28 发光二极管封装件及其制造方法 Active CN101213892B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR10-2006-0020305 2006-03-03
KR1020060020305A KR101210090B1 (ko) 2006-03-03 2006-03-03 금속 코어 인쇄회로기판 및 이를 이용한 발광 다이오드패키징 방법
KR1020060020305 2006-03-03
PCT/KR2007/001020 WO2007100209A1 (en) 2006-03-03 2007-02-28 Light-emitting diode package and manufacturing method thereof

Publications (2)

Publication Number Publication Date
CN101213892A CN101213892A (zh) 2008-07-02
CN101213892B true CN101213892B (zh) 2012-09-05

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CN2007800000705A Active CN101213892B (zh) 2006-03-03 2007-02-28 发光二极管封装件及其制造方法

Country Status (6)

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US (3) US7745844B2 (enExample)
JP (2) JP5323501B2 (enExample)
KR (1) KR101210090B1 (enExample)
CN (1) CN101213892B (enExample)
TW (1) TWI429100B (enExample)
WO (1) WO2007100209A1 (enExample)

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KR20110046440A (ko) * 2008-08-21 2011-05-04 파나소닉 주식회사 조명용 광원
KR101134555B1 (ko) * 2009-03-23 2012-04-16 금호전기주식회사 발광소자 장착용 인쇄회로기판
KR101124102B1 (ko) * 2009-08-24 2012-03-21 삼성전기주식회사 발광 소자 패키지용 기판 및 이를 포함하는 발광 소자 패키지
KR20110068689A (ko) * 2009-12-16 2011-06-22 삼성전기주식회사 광학소자용 패키지 기판 및 그 제조방법
US8616732B2 (en) 2010-02-12 2013-12-31 Toshiba Lighting & Technology Corporation Light-emitting device and illumination device
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KR101037168B1 (ko) * 2010-06-04 2011-05-26 지성수 절연 및 방열성능이 향상된 방열피씨비 및 이의 제조방법
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KR101166066B1 (ko) 2010-12-21 2012-07-19 주식회사 루셈 발광다이오드 패키지
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TWI419270B (zh) * 2011-03-24 2013-12-11 南茂科技股份有限公司 封裝堆疊結構
TW201347244A (zh) * 2012-05-10 2013-11-16 盈勝科技股份有限公司 一體化高效率多層式照明裝置
KR101236715B1 (ko) * 2012-08-28 2013-02-25 주식회사 썬엘이디 실리콘 성형 방식을 이용한 칩온보드댐을 포함한 ｌｅｄ 모듈의 제조방법 및 상기 제조방법에 의해 제조된 ｌｅｄ 모듈
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EP2806211A1 (en) * 2013-05-21 2014-11-26 OSRAM GmbH Solid-state lighting device and related process
KR101592649B1 (ko) * 2013-12-24 2016-02-12 현대자동차주식회사 헤드램프용 레이저 광학계
CN104613379B (zh) * 2015-02-06 2017-12-26 东莞佰鸿电子有限公司 一种蓝宝石印刷电路板led灯具及其制作方法
CN105655472A (zh) * 2016-02-02 2016-06-08 上海鼎晖科技股份有限公司 一种金属导热柱cob led光源
CN106449563B (zh) * 2016-11-29 2018-11-13 卡姆丹克太阳能（江苏）有限公司 一种具有鳍形结构的晶圆封装
CN106449443B (zh) * 2016-11-29 2019-01-01 海安浩驰科技有限公司 一种具有鳍形结构的晶圆封装方法
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CN111048651B (zh) * 2019-12-27 2021-12-17 广州市鸿利秉一光电科技有限公司 一种高反射率uvled基板及生产方法
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WO2023133720A1 (zh) * 2022-01-12 2023-07-20 谢华棣 立体散热电路板组的制造方法
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Also Published As

Publication number Publication date
CN101213892A (zh) 2008-07-02
US20120248488A1 (en) 2012-10-04
US20080179612A1 (en) 2008-07-31
US20100230707A1 (en) 2010-09-16
KR101210090B1 (ko) 2012-12-07
JP5759413B2 (ja) 2015-08-05
JP5323501B2 (ja) 2013-10-23
TW200735425A (en) 2007-09-16
TWI429100B (zh) 2014-03-01
US7745844B2 (en) 2010-06-29
KR20070090509A (ko) 2007-09-06
US8212274B2 (en) 2012-07-03
JP2009528695A (ja) 2009-08-06
US8796717B2 (en) 2014-08-05
WO2007100209A1 (en) 2007-09-07
JP2012178581A (ja) 2012-09-13

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