WO2023133720A1 - 立体散热电路板组的制造方法 - Google Patents

立体散热电路板组的制造方法 Download PDF

Info

Publication number
WO2023133720A1
WO2023133720A1 PCT/CN2022/071522 CN2022071522W WO2023133720A1 WO 2023133720 A1 WO2023133720 A1 WO 2023133720A1 CN 2022071522 W CN2022071522 W CN 2022071522W WO 2023133720 A1 WO2023133720 A1 WO 2023133720A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat dissipation
circuit board
board assembly
manufacturing
assembly according
Prior art date
Application number
PCT/CN2022/071522
Other languages
English (en)
French (fr)
Inventor
谢华棣
Original Assignee
谢华棣
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 谢华棣 filed Critical 谢华棣
Priority to PCT/CN2022/071522 priority Critical patent/WO2023133720A1/zh
Publication of WO2023133720A1 publication Critical patent/WO2023133720A1/zh

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • the invention relates to a method for manufacturing a heat dissipation circuit board group, in particular to a method for manufacturing a three-dimensional heat dissipation circuit board group.
  • the present invention provides a method for manufacturing a three-dimensional heat dissipation circuit board set, so that the three-dimensional heat dissipation circuit board set can carry large current, dissipate energy and be safe.
  • the manufacturing method of the three-dimensional cooling circuit board set disclosed by an embodiment of the present invention includes the following steps. Supplied with a stack of boards.
  • the laminated board includes a metal carrier board, an insulating heat conducting layer and a circuit conductor layer.
  • the metal carrier has a first surface and a second surface opposite to each other.
  • the insulation and heat conduction layer is stacked on the first surface of the metal carrier.
  • the circuit conductor layer is stacked on the insulation and heat conduction layer.
  • the circuit conductor layer is processed to form a circuit pattern on the circuit conductor layer. Cutting the second surface of the metal carrier to form a heat dissipation structure on the second surface of the metal carrier.
  • the three-dimensional heat dissipation circuit board set since the thickness of the metal carrier plate of the three-dimensional heat dissipation circuit board set is relatively thick, and the integrated heat dissipation structure and the carrier plate are directly processed and formed, the three-dimensional heat dissipation circuit board set only There are three layers of structure.
  • the weather resistance, ease of manufacturing and heat dissipation performance of the three-dimensional heat dissipation circuit board group in this embodiment are all better than The previous products can then take into account the high current carrying capacity, heat dissipation energy and safety.
  • the flatness and structural strength of the three-dimensional heat dissipation circuit board group can be improved because the metal carrier board, the insulating heat conduction layer and the circuit conductor layer are laminated first, and then the heat dissipation structure and circuit pattern are processed.
  • FIG. 1 is a schematic side view of a three-dimensional heat dissipation circuit board assembly according to a first embodiment of the present invention.
  • FIG. 2 to 8 are schematic diagrams of the manufacturing process of the three-dimensional heat dissipation circuit board assembly shown in FIG. 1 .
  • FIG. 9 is a schematic perspective view of a three-dimensional heat dissipation circuit board assembly according to a second embodiment of the present invention.
  • FIG. 10 is a schematic plan view of a three-dimensional heat dissipation circuit board assembly according to a third embodiment of the present invention.
  • FIG. 11 is a schematic plan view of a three-dimensional heat dissipation circuit board assembly according to a fourth embodiment of the present invention.
  • FIG. 12 is a schematic plan view of a three-dimensional heat dissipation circuit board assembly according to a fifth embodiment of the present invention.
  • FIG. 13 is an exploded schematic diagram of FIG. 12 .
  • FIG. 14 is a schematic plan view of a three-dimensional heat dissipation circuit board assembly according to a sixth embodiment of the present invention.
  • FIG. 15 is an exploded schematic view of FIG. 14 .
  • FIG. 1 is a schematic side view of a three-dimensional heat dissipation circuit board assembly 10 according to a first embodiment of the present invention.
  • the three-dimensional heat dissipation circuit board assembly 10 of this embodiment is, for example, applied to the power supply control of a vehicle, so the current carrying capacity, heat dissipation performance and safety of the three-dimensional heat dissipation circuit board need to be considered.
  • the three-dimensional heat dissipation circuit board set 10 includes a metal carrier 100 , an insulation and heat conduction layer 200 and a circuit conductor layer 300 .
  • the material of the metal carrier 100 is gold, silver, copper, aluminum, etc., for example.
  • the metal carrier 100 has an opposite first surface 101 and a second surface 102, and the second surface 102 of the metal carrier 100 is, for example, cut by machining, so that the metal carrier 100 includes an integrally formed carrier.
  • the plate portion 110 and a plurality of heat dissipation columns 120 constitute a heat dissipation structure. That is to say, the first surface 101 of the metal carrier 100 is located on the side of the carrier part 110 facing away from the heat dissipation column 120 , and the second surface 102 of the metal carrier 100 is located on the side of the heat dissipation column 120 facing away from the carrier part 110 .
  • a distance G is maintained between any two adjacent cooling columns 120 .
  • the distance G is greater than or equal to 0.5 mm and less than or equal to 15 mm, and the ratio of the height of the cooling column 120 to the distance G is greater than or equal to 1 and less than or equal to 40, for example.
  • the thickness of the carrier part 110 is, for example, greater than or equal to 0.5 mm, and is used to support the circuit conductor layer 300 , so as to take into account the overall structural strength of the three-dimensional heat dissipation circuit board assembly 10 .
  • the cooling columns 120 are arranged in an array, but not limited thereto. In other embodiments, the cooling columns may not be arranged in an array.
  • the metal carrier 100 is an example of a columnar heat dissipation structure, but it is not limited thereto. In other embodiments, it can also be changed to a sheet heat dissipation structure.
  • the insulating and heat-conducting layer 200 is stacked on the first surface 101 of the carrier portion 110 of the metal carrier 100 , and has characteristics of electrical insulation and heat conduction.
  • the circuit conductor layer 300 is stacked on the insulating and heat-conducting layer 200 and includes a plurality of separated conductive blocks 310 .
  • the material of the circuit conductor layer 300 is, for example, gold, silver, copper, aluminum or other conductive materials. That is to say, the conductive block 310 is, for example, a conductive structure such as a gold block, a silver block, a copper block, an aluminum block, or other conductive materials.
  • the conductive blocks 310 form a circuit pattern.
  • the thickness of the circuit conductor layer 300 is, for example, greater than or equal to 0.1 mm and less than or equal to 10 mm.
  • the ratio of the thickness T of the conductive block 310 to the distance P between any two adjacent conductive blocks 310 of the circuit conductor layer 300 is, for example, greater than or equal to 0.2 and less than or equal to 20.
  • the distance P between any two adjacent conductive blocks 310 of the circuit conductor layer 300 is, for example but not limited to, greater than 0.3 mm.
  • FIGS. 2 to 8 The following will introduce the manufacturing process of the three-dimensional cooling circuit board assembly 10 , please refer to FIGS. 2 to 8 .
  • FIGS. 2 to 8 The following will introduce the manufacturing process of the three-dimensional cooling circuit board assembly 10 , please refer to FIGS. 2 to 8 .
  • FIGS. 2 to 8 The following will introduce the manufacturing process of the three-dimensional cooling circuit board assembly 10 , please refer to FIGS. 2 to 8 .
  • a metal carrier 100 is provided.
  • the insulating and heat-conducting layer 200 is stacked on the first surface 101 of the metal carrier 100 .
  • the first surface 101 of the circuit conductor layer 300 is stacked on the insulation and heat conduction layer 200 , so that the metal carrier 100 , the insulation and heat conduction layer 200 and the circuit conductor layer 300 together form a laminated board.
  • the circuit conductor layer 300 is processed to form a circuit pattern with a plurality of conductive blocks 310 on the circuit conductor layer 300 .
  • the second surface 102 of the metal carrier 100 is cut to form a heat dissipation structure on the second surface 102 of the metal carrier 100 .
  • the method of processing the circuit conductor layer is to adopt a combined process, such as mechanical desmearing processing combined with chemical etching processing, but it is not limited thereto.
  • the method of processing the circuit conductor layer can also be changed to a single process, such as mechanical descaling processing or chemical etching processing.
  • the step of processing the circuit conductor layer 300 to form a circuit pattern with a plurality of conductive blocks 310 on the circuit conductor layer 300 it may further include performing a surface treatment procedure on the circuit conductor layer forming the circuit pattern.
  • the surface treatment procedure is, for example, removing residual material (such as residual copper) or burrs on the surface of the insulating and heat-conducting layer other than the circuit patterns by etching, laser or sandblasting.
  • the step of forming the laminate is to sequentially stack the insulating and heat-conducting layer 200 and the circuit conductor layer 300 from the metal carrier 100 , but the present invention is not limited thereto. In other embodiments, the step of forming the stacked board may also be sequentially stacked from the circuit conductor layer to the insulating and heat-conducting layer and the metal carrier. In addition, ready-made laminates can also be directly used for subsequent processing. In this way, the step of forming the laminate can be omitted.
  • the metal carrier 100 , the insulating and heat-conducting layer 200 and the circuit conductor layer 300 are combined by sintering.
  • the insulating and heat-conducting layer 200 is made of a polymer composite material, the metal carrier 100 , the insulating and heat-conducting layer 200 and the circuit conductor layer 300 are combined by thermocompression.
  • the circuit pattern is processed first and then the heat dissipation structure is cut, but it is not limited thereto. In other embodiments, the heat dissipation structure may also be cut before processing the circuit pattern.
  • the related products in the past have a circuit conductor layer 300, an insulating and heat-conducting layer 200, a carrier part 110, a thermally conductive adhesive, and a five-layer structure of the heat dissipation structure, and even more multi-layer structure.
  • the metal carrier plate 100 of the three-dimensional heat dissipation circuit board assembly 10 is thicker, and the heat dissipation structure and the carrier plate portion 110 are directly processed and formed into one, the three-dimensional heat dissipation circuit board assembly 10 has only a three-layer structure.
  • the three-dimensional heat dissipation circuit board set 10 Since the number of layers of the three-layer three-dimensional heat dissipation circuit board set 10 is smaller than that of the existing five-layer heat dissipation circuit board set, the three-dimensional heat dissipation circuit board set 10 of this embodiment has excellent weather resistance, process ease and heat dissipation performance. better than previous products.
  • the metal carrier 100, the insulating and heat-conducting layer 200, and the circuit conductor layer 300 are stacked first, and then the heat dissipation structure is cut and the circuit pattern is processed, which can improve the flatness and structural strength of the three-dimensional heat dissipation circuit board assembly 10 .
  • a circuit conductor layer 300 with a relatively thick thickness can be formed.
  • the thicker circuit conductor layer 300 can allow the three-dimensional heat dissipation circuit board assembly 10 to carry a large current of hundreds or even thousands of amperes. Machining can not only break through the limitation of the aspect ratio of etching technology or the limitation of copper thickness, but also make use of the integrated lead frame that is connected to the external circuit during processing, which not only simplifies the production process, but also greatly improves its reliability. Spend.
  • a numerically controlled processing machine is used to cooperate with appropriate tools such as milling cutters, drills or saw blades to form a heat dissipation structure in the form of metal removal.
  • appropriate tools such as milling cutters, drills or saw blades
  • it can also be achieved through Tool selection and processing parameter adjustment (this is another difference between this case and the previous case, it is recommended to add) to minimize the force in the process of processing, and then achieve the effect of protecting the three-dimensional circuit.
  • the insulating and heat-conducting layer whether it is ceramic or polymer material, is hard and brittle.
  • stamping or forging is used to form the heat-dissipating structure, in addition to causing deformation of the laminated structure, it will also cause cracks in the insulating and heat-conducting layer, and even causing the entire stack to break apart.
  • FIG. 9 is a schematic perspective view of a three-dimensional heat dissipation circuit board assembly 10 according to a second embodiment of the present invention.
  • the three-dimensional heat dissipation circuit board assembly 10B includes a metal carrier 100B, an insulation and heat conduction layer 200B, and a circuit conductor layer 300B.
  • the metal carrier 100B is similar to the metal carrier 100 of the previous embodiment, and also includes a connected carrier part 110B and a plurality of heat dissipation columns 120B, and the insulating and heat-conducting layer 200B is similar in structure to the insulating and heat-conducting layer 200 of the previous embodiment, so it does not Let me repeat.
  • the circuit pattern includes a plurality of conductive blocks 310B, two vertical lead frames 320B and a horizontal lead frame 330B. Parts of the conductive blocks 310B are respectively electrically connected to the two vertical lead frames 320B. The other ones of the conductive blocks 310B are electrically connected to the horizontal lead frame 330B, and the horizontal lead frame 330B and the vertical lead frame 320B respectively extend along directions E1 and E2 and are perpendicular to each other.
  • the vertical lead frame 320B is integrally formed with the conductive block 310B connected thereto
  • the horizontal lead frame 330B is integrally formed with the conductive block 310B connected thereto.
  • the conductive block 310B, the vertical lead frame 320B and the horizontal lead frame 330B are formed together in the process of forming the circuit pattern.
  • the integrally formed vertical lead frame 320B of this embodiment can not only carry a larger current, but also improve reliability.
  • a vertical lead frame 320B and a horizontal lead frame 330B are provided, but the present invention is not limited thereto. In other embodiments, only vertical lead frames or only horizontal lead frames may be provided. In addition, in this embodiment, the number of the vertical lead frame 320B is two, and its section is circular or square, but it is not limited thereto. In other embodiments, the number of vertical lead frames can also be changed to a single one or more than two.
  • FIG. 10 is a schematic plan view of a three-dimensional heat dissipation circuit board assembly according to a third embodiment of the present invention.
  • 11 is a schematic plan view of a three-dimensional heat dissipation circuit board assembly according to a fourth embodiment of the present invention.
  • the heat dissipation structure includes a carrier portion 110C and a plurality of heat dissipation columns 120C integrally formed, and the cross sections of these heat dissipation columns 120C are diamond-shaped.
  • FIG. 10 is a schematic plan view of a three-dimensional heat dissipation circuit board assembly according to a third embodiment of the present invention.
  • 11 is a schematic plan view of a three-dimensional heat dissipation circuit board assembly according to a fourth embodiment of the present invention.
  • the heat dissipation structure includes a carrier portion 110C and a plurality of heat dissipation columns 120C integrally formed, and the cross sections of these heat dissipation columns 120C are diamond-shaped.
  • the heat dissipation structure includes a carrier portion 110D and a plurality of heat dissipation columns 120D integrally formed, and the cross sections of the heat dissipation columns 120D are circular.
  • the cross-sectional shape of the cooling post is not intended to limit the present invention, and in other embodiments, the cross-sectional shape of the cooling post can also be a parallelogram.
  • a single manufacturing process of a single three-dimensional heat dissipation circuit board assembly 10 is taken as an example for illustration. But not limited to this.
  • multiple three-dimensional heat dissipation circuit board groups can also be produced in a single process, that is, the size of the laminated board is slightly larger than the overall size of the multiple three-dimensional heat dissipation circuit board groups. After the circuit patterning, the processed laminated boards are cut to divide multiple three-dimensional heat dissipation circuit board groups at one time.
  • FIG. 12 is a schematic plan view of a three-dimensional heat dissipation circuit board assembly according to a fifth embodiment of the present invention.
  • FIG. 13 is an exploded schematic diagram of FIG. 12 .
  • the three-dimensional heat dissipation circuit board assembly 10E includes a metal carrier 100E, an insulating and heat-conducting layer 200E, a circuit conductor layer 300E and a plurality of heat pipes 400E.
  • the insulating and heat-conducting layer 200E is similar in structure to the insulating heat-conducting layer 200 of the foregoing embodiment
  • the circuit conductor layer 300E is similar in structure to the circuit conductor layer 300 of the foregoing embodiment, and also includes a plurality of conductive blocks 310E, so details are not repeated here.
  • the metal carrier 100E has a first surface 101E and a second surface 102E opposite to each other, and the second surface 102E of the metal carrier 100E is cut, for example, by machining, so that the metal carrier 100E It includes a carrier part 110E and a plurality of cooling grooves 120E integrally formed. Central portions of the heat pipes 400E are disposed in the heat dissipation grooves 120E, and opposite two sections of the heat pipes 400E extend to opposite sides of the metal carrier 100E respectively.
  • the central part of the heat pipe 400E mainly absorbs the heat transferred from the metal carrier 100E, and transfers the absorbed heat to the two opposite sections of the heat pipe 400E to improve the heat dissipation performance of the three-dimensional heat dissipation circuit board assembly 10E. Furthermore, the heat pipe 400E has a sealed cavity inside, and the sealed cavity stores, for example, a two-phase cooling fluid. The cooling fluid in the central part of the heat pipe 400E absorbs the heat transferred from the metal carrier plate 100E, and undergoes a phase change to be vaporized into gas.
  • the gaseous cooling fluid flows to the two opposite sections of the heat pipe 400E, and condenses back to the liquid cooling fluid at the two opposite sections of the heat pipe 400E, and then flows back to the central portion of the heat pipe 400E. In this way, the cooling fluid will form a cooling cycle inside the heat pipe 400E.
  • a capillary structure may be provided in the heat pipe to assist the condensed cooling fluid to flow back, but the invention is not limited thereto. In other embodiments, there may be no capillary structure inside the heat pipe.
  • heat dissipation grooves 120E and heat pipes 400E there are multiple heat dissipation grooves 120E and heat pipes 400E, but it is not limited thereto. In other embodiments, the number of heat dissipation grooves and heat pipes can also be changed to one.
  • FIG. 14 is a schematic plan view of a three-dimensional heat dissipation circuit board assembly according to a sixth embodiment of the present invention.
  • FIG. 15 is an exploded schematic view of FIG. 14 .
  • the three-dimensional heat dissipation circuit board assembly 10F includes a metal carrier 100F, an insulating and heat-conducting layer 200F, a circuit conductor layer 300F and a flow tube 400F.
  • the insulating and heat-conducting layer 200F is similar in structure to the insulating and heat-conducting layer 200 of the foregoing embodiment
  • the circuit conductor layer 300F is similar in structure to the circuit conductor layer 300 of the foregoing embodiment, and also includes a plurality of conductive blocks 310F, so details are not repeated here.
  • the metal carrier 100F has a first surface 101F and a second surface 102F opposite to each other, and the second surface 102F of the metal carrier 100F is cut by machining, for example, so that the metal carrier 100F It includes a carrier part 110F and a plurality of cooling grooves 120F integrally formed.
  • the flow tubes 400F are installed in the cooling grooves 120F, and have a liquid inlet 410F and a liquid outlet 420F.
  • the liquid inlet 410F and the liquid outlet 420F are, for example, respectively used to communicate with the liquid outlet and the liquid inlet of a water-cooling row (not shown), so that the three-dimensional heat dissipation circuit board assembly 10F and the water-cooling row together form a circulation channel.
  • the cooling fluid in the flow tube 400F such as water or refrigerant, is used to absorb the heat transferred from the metal carrier 100F, and transfer the absorbed heat to the water cooling radiator to improve the heat dissipation performance of the three-dimensional heat dissipation circuit board assembly 10F.
  • the three-dimensional heat dissipation circuit board set since the thickness of the metal carrier plate of the three-dimensional heat dissipation circuit board set is relatively thick, and the integrated heat dissipation structure and the carrier plate are directly processed and formed, the three-dimensional heat dissipation circuit board set only There are three layers of structure.
  • the weather resistance, ease of manufacturing and heat dissipation performance of the three-dimensional heat dissipation circuit board group in this embodiment are all better than The previous products can then take into account the high current carrying capacity, heat dissipation energy and safety.
  • the flatness and structural strength of the three-dimensional heat dissipation circuit board group can be improved by laminating the metal carrier board, the insulating heat conduction layer and the circuit conductor layer first, and then cutting the heat dissipation structure and processing the circuit pattern.
  • a circuit conductor layer with a relatively thick thickness can be formed.
  • the thicker circuit conductor layer can allow the three-dimensional heat dissipation circuit board assembly to carry a large current of hundreds or even thousands of amperes. Machining can not only break through the aspect ratio limit of etching technology or the limit of copper thickness, but also improve the processing accuracy.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

一种立体散热电路板组的制造方法包含下列步骤：提供一叠板，叠板包含一金属载板、一绝缘导热层及一电路导体层，金属载板具有相对的一第一面及一第二面，绝缘导热层叠设于金属载板的第一面，电路导体层叠设于绝缘导热层；切割金属载板的第二面，以于金属载板的第二面形成一散热结构；加工电路导体层，以于电路导体层形成一电路图案。

Description

立体散热电路板组的制造方法 技术领域
本发明涉及一种散热电路板组的制造方法，特别是一种立体散热电路板组的制造方法。
背景技术
随着科技发展，于电路板上所设置的功率元件数量越来越多，又或者是例如逆变器用于电动车、充电桩、储能设备、高速运算等的大功率应用，DC-AC转换输出等大电流的应用需求，因为车载电控对于安全性和可靠度要求甚高，同时衍生出电路板需要极大的散热要求。因此，除了增加铜层厚度以承载数百甚至是上千安培的大电流，连带着对介面材料及组装的稳固性有着高标准的规范。
因此，如何在兼顾承载大电流、散热能量和安全性，且不需使用介面材料或螺丝固定件的情况下，提供有效解决方案实为亟需克服的问题。
发明内容
本发明在于提供一种立体散热电路板组的制造方法，藉以让立体散热电路板组兼顾承载大电流、散热能量和安全性。
本发明的一实施例所揭露的立体散热电路板组的制造方法包含下列步骤。提供一叠板。叠板包含一金属载板、一绝缘导热层及一电路导体层。金属载板具有相对的一第一面及一第二面。绝缘导热层叠设于金属载板的第一面。电路导体层叠设于绝缘导热层。加工电路导体层，以于电路导体层形成一电路图案。切割金属载板的第二面，以于金属载板的第二面形成一散热结构。
根据上述实施例的立体散热电路板组的制造方法，由于立体散热电路板组的金属载板的厚度较厚，并直接加工成型出一体成散热结构与载板部，使得立体散热电路板组仅有三层结构。由于三层式立体散热电路板组的层数小于现有的五层式散热电路板组的层数，故本实施例的立体散热电路板组的耐候性、制程容易度及散热效能皆优于以往的产品，进而能够兼顾承载大电流、散热能量和安全性。
此外，由于先叠合金属载板、绝缘导热层与电路导体层，再进行散热结构与电路图案的加工制作，故可提升立体散热电路板组的平整度与结构强度。
以上关于本发明内容的说明及以下实施方式的说明系用以示范与解释本发明的原 理，并且为本发明的保护范围提供更进一步的解释。
附图说明
图1为根据本发明第一实施例所述的立体散热电路板组的侧视示意图。
图2至图8为图1的立体散热电路板组的制造流程示意图。
图9为根据本发明第二实施例所述的立体散热电路板组的立体示意图。
图10为根据本发明第三实施例所述的立体散热电路板组的平面示意图。
图11为根据本发明第四实施例所述的立体散热电路板组的平面示意图。
图12为根据本发明第五实施例所述的立体散热电路板组的平面示意图。
图13为图12的分解示意图。
图14为根据本发明第六实施例所述的立体散热电路板组的平面示意图。
图15为图14的分解示意图。
【附图标记说明】
10、10B、10E、10F：立体散热电路板组
100、100A、100C、100E、100F：金属载板
101、101E、101F：第一面
102、102E、102F：第二面
110、110C、110D、110E、110F：载板部
120、120C、120D：散热柱
120E、120F：散热凹槽
200、200E、200F：绝缘导热层
300、300A、300B、200E、200F：电路导体层
310、310B、310E、310F：导电块
320B：垂直导线架
330B：水平导线架
400E：热管
400F：流管
410F：液体入口
420F：液体出口
H：高度
T：厚度
G、P：间距
E1、E2：方向
具体实施方式
请参阅图1。图1为根据本发明第一实施例所述的立体散热电路板组10的侧视示意图。
本实施例的立体散热电路板组10例如应用于车辆的动力电源控制，故需考虑立体散热电路板的承载电流能力、散热效能和安全性。立体散热电路板组10包含一金属载板100、一绝缘导热层200及一电路导体层300。金属载板100的材质例如金、银、铜、铝等。金属载板100具有相对的一第一面101及一第二面102，且金属载板100的第二面102例如通过机械加工的方式除料切割，使得金属载板100包含一体成型的一载板部110及多个散热柱120，且这些散热柱120构成一散热结构。也就是说，金属载板100的第一面101位于载板部110背向散热柱120的一侧，以及金属载板100的第二面102位于散热柱120背向载板部110的一侧。任二相邻的这些散热柱120保持一间距G。间距G大于等于0.5毫米，以及小于等于15毫米，且散热柱120的高度与间距G的比例例如大于等于1，以及小于等于40。此外，载板部110的厚度例如大于等于0.5毫米，并用以支撑电路导体层300，以兼顾立体散热电路板组10的整体结构强度。
在本实施例中，散热柱120呈阵列排列，但并不以此为限。在其他实施例中，散热柱也可以不呈阵列排列。
在本实施例中，金属载板100系以柱状散热结构为例，但并不以此为限。在其他实施例中，也可以改为片状散热结构。
绝缘导热层200叠设于金属载板100的载板部110的第一面101，并具有电绝缘与导热的特性。电路导体层300叠设于绝缘导热层200，并包含多个相分离的导电块310。电路导体层300的材质例如为金、银、铜、铝或其他具有导电性的材料。也就是说，导电块310例如为金块、银块、铜块或、铝块或其他具有导电性的材料等导电结构。这些导电块310形成一电路图案。
在本实施例中，电路导体层300的厚度例如大于等于0.1毫米，以及小于等于10毫米。导电块310的厚度T与电路导体层300的任二相邻导电块310的间距P的比例例如大于等于0.2，以及小于等于20。此外，在本实施例中，电路导体层300的任二相邻导电块310的间距P例如但不限于大于0.3毫米。
以下将介绍立体散热电路板组10的制造流程，请参阅图2至图8，图2至图8为图1的立体散热电路板组10的制造流程示意图。
首先，如图2所示，提供一金属载板100。接着，如图3所示，将绝缘导热层200叠设于金属载板100的第一面101。接着，如图4所示，将电路导体层300的第一面101叠设于绝缘导热层200，以令金属载板100、绝缘导热层200及电路导体层300共同构成一叠板。接着，如图5与图6所示，加工电路导体层300，以于电路导体层300形成具有多个导电块310的一电路图案。接着，如图7与图8所示，切割金属载板100的第二面102，以于金属载板100的第二面102形成一散热结构。
在本实施例中，加工电路导体层的方式为采用复合制程，如机械除料加工搭配化学蚀刻加工，但并不以此为限。在其他实施例中，加工电路导体层的方式亦可改为采单一制程，如机械除料加工或化学蚀刻加工。
此外，于加工电路导体层300，以于电路导体层300形成具有多个导电块310的一电路图案的步骤后，还可以包含对形成电路图案的电路导体层进行一表面处理程序。表面处理程序例如为通过蚀刻制程、激光制程或喷砂制程来去除绝缘导热层表面上电路图案以外的区域的残留材料(如残铜)或毛边。
在本实施例中，形成叠板的步骤系从金属载板100依序叠设绝缘导热层200与电路导体层300，但并不以此为限。在其他实施例中，形成叠板的步骤亦可从电路导体层依序叠设绝缘导热层与金属载板。此外，亦可直接拿现成的叠板来进行后续的加工。如此一来，即可省略形成叠板的步骤。
在本实施例中，若绝缘导热层200由陶瓷材料制成，则金属载板100、绝缘导热层200及电路导体层300通过烧结的方式相结合。此外，若绝缘导热层200由高分子混合材料制成，金属载板100、绝缘导热层200及电路导体层300通过热压合的方式相结合。
在本实施例中，系先加工电路图案再切割散热结构，但并不以此为限。在其他实施例中，也可以先切割散热结构再加工电路图案。
相较于以往载板部110与散热结构为组合式的作法来说，以往的相关产品有电路导体层300、绝缘导热层200、载板部110、导热胶、散热结构五层结构，甚至更多层结构。在本实施例中，由于立体散热电路板组10的金属载板100的厚度较厚，并直接加工成型出一体成散热结构与载板部110，使得立体散热电路板组10仅有三层结构。由于三层式立体散热电路板组10的层数小于现有的五层式散热电路板组的层数，故本实施例的立体散热电路板组10的耐候性、制程容易度及散热效能皆优于以往的产品。
在本实施例中，先叠合金属载板100、绝缘导热层200与电路导体层300，再进行散热结构的切割与电路图案的加工，可提升立体散热电路板组10的平整度与结构强度。
在本实施例中，由于散热结构与电路图案皆系通过机械加工的方式加工而成，故能够形成厚度较厚(如厚度大于1毫米)的电路导体层300。厚度较厚的电路导体层300能够让立体散热电路板组10承载数百甚至是上千安培的大电流。用机械加工不但可突破蚀刻技艺的纵横比限或铜厚的限制，更能利用加工过成中制成对外连接电路的一体成型的导线架，不但可简化制作流程，更可大幅提升可其可靠度。
在本实施例中，使用数值控制加工机，配合适当的刀具如铣刀、钻头或锯片等，以金属除料的方式来形成散热结构，除可提升产品尺寸的精准度外，更可通过刀具选择、加工参数的调整(此为本案与前案的另一差异特征，建议补充)，来使得加工过程作用力的最小化，进而达到保护立体电路的效果。毕竟绝缘导热层，无论是陶瓷或高分子材料，皆有硬且脆的特性，若使用冲压或锻造方式来形成散热结构，除造成叠构的变形外，更会使得绝缘导热层产生裂缝，甚至使得整个叠构破裂分离。
请参阅图9，图9为根据本发明第二实施例所述的立体散热电路板组10的立体示意图。
在本实施例中，立体散热电路板组10B包含一金属载板100B、一绝缘导热层200B及一电路导体层300B。金属载板100B与前述实施例的金属载板100相似，同样包含相连的一载板部110B及多个散热柱120B，且绝缘导热层200B与前述实施例的缘导热层200结构相似，故不再赘述。
在本实施例中，电路图案包含多个导电块310B、二垂直导线架320B及一水平导线架330B。这些导电块310B的部分分别电性连接于二垂直导线架320B。这些导电块310B的另一电性连接于水平导线架330B，且水平导线架330B与垂直导线架320B分别沿方向E1、E2延伸，而彼此相垂直。
在本实施例中，垂直导线架320B与其相连的导电块310B为一体成型的结构，以及水平导线架330B与其相连的导电块310B为一体成型的结构。举例来说，于加工形成电路图案的步骤中一并形成导电块310B、垂直导线架320B及水平导线架330B。
由于垂直导线架320B系通过机械加工的方式切割而成，故能够让垂直导线架320B的高度达到5毫米，甚至更高，以利导电块310B与外部电源连接，此为以往通过蚀刻制程所无法达成的成果。此外，相较于现有通过焊接的方式连接导线架的结构，本实施例的一体成型的垂直导线架320B，除了能承载较大电流外，亦能提升可靠度。
在本实施例中，除了导电块310B外更设有垂直导线架320B与水平导线架330B，但并不以此为限。在其他实施例中，也可以仅设有垂直导线架或仅设有水平导线架。此外，在本实施例中，垂直导线架320B的数量为两个，其断面为圆形或方形，但并不以此为限。在其他实施例中，垂直导线架的数量也可以改为单个或是多于2个。
在本实施例中，散热柱120的断面呈方形，但并不以此为限。请参阅图10与图11，图10为根据本发明第三实施例所述的立体散热电路板组的平面示意图。图11为根据本发明第四实施例所述的立体散热电路板组的平面示意图。如图10所示，散热结构包含一体成型的一载板部110C及多个散热柱120C，且这些散热柱120C的断面呈菱形。如图11所示，散热结构包含一体成型的一载板部110D及多个散热柱120D，且这些散热柱120D的断面呈圆形。不过，散热柱的断面形状并非用以限制本发明，在其他实施例中，散热柱的断面形状亦可呈平行四边形。
在上述实施例中，系以单次制程制作单个立体散热电路板组10为例进行说明。但并不以此为限。在其他实施例中，亦可在单次制程制作出多个立体散热电路板组，即叠板的尺寸略大于多个立体散热电路板组的整体尺寸，在叠板切割出散热结构与加工出电路图案后，再通过切割加工后的叠板，以一次性分割出多个立体散热电路板组。
请参阅图12与图13，图12为根据本发明第五实施例所述的立体散热电路板组的平面示意图。图13为图12的分解示意图。
在本实施例中，立体散热电路板组10E包含一金属载板100E、一绝缘导热层200E、一电路导体层300E及多个热管400E。绝缘导热层200E与前述实施例的缘导热层200结构相似，且电路导体层300E与前述实施例的电路导体层300结构相似，同样包含多个导电块310E，故不再赘述。
在本实施例中，金属载板100E具有相对的一第一面101E及一第二面102E，且金属载板100E的第二面102E例如通过机械加工的方式除料切割，使得金属载板100E包含一体成型的一载板部110E及多个散热凹槽120E。这些热管400E的中央部分装设于这些散热凹槽120E内，且这些热管400E的相对两段分别延伸至金属载板100E的相对两侧。热管400E的中央部分主要吸收金属载板100E传递来的热量，并将所吸收的热量传递至热管400E的相对两段而提升立体散热电路板组10E的散热效能。更进一步来说，热管400E内部具密封腔，且密封腔例如存放有两相变化的冷却流体。热管400E的中央部分的冷却流体吸收金属载板100E传递来的热量后会产生相变化而汽化成气体。气态的冷却流体流至热管400E的相对两段，并于热管400E的相对两段凝结回液态的冷却流体再回流至热管400E的中央部分。如此一来，冷却流体将在热管 400E内部形成冷却循环。此外，热管内可设有毛细结构来协助凝结的冷却流体回流，但并不以此为限。在其他实施例中，热管内也可无设有毛细结构。
在本实施例中，散热凹槽120E与热管400E的数量为多个，但并不以此为限。在其他实施例中，散热凹槽与热管的数量也可以改为单个。
请参阅图14与图15，图14根据本发明第六实施例所述的立体散热电路板组的平面示意图。图15为图14的分解示意图。
在本实施例中，立体散热电路板组10F包含一金属载板100F、一绝缘导热层200F、一电路导体层300F及一流管400F。绝缘导热层200F与前述实施例的缘导热层200结构相似，且电路导体层300F与前述实施例的电路导体层300结构相似，同样包含多个导电块310F，故不再赘述。
在本实施例中，金属载板100F具有相对的一第一面101F及一第二面102F，且金属载板100F的第二面102F例如通过机械加工的方式除料切割，使得金属载板100F包含一体成型的一载板部110F及多个散热凹槽120F。这些流管400F装设于这些散热凹槽120F内，并具有一液体入口410F及一液体出口420F。液体入口410F与液体出口420F例如分别用来连通水冷排(未示出)的液体出口及液体入口，以令立体散热电路板组10F与水冷排共同构成循环流道。流管400F内的冷却流体，如水或冷媒用来吸收金属载板100F传递来的热量，并将所吸收的热量传递至水冷排散热而提升立体散热电路板组10F的散热效能。
根据上述实施例的立体散热电路板组的制造方法，由于立体散热电路板组的金属载板的厚度较厚，并直接加工成型出一体成散热结构与载板部，使得立体散热电路板组仅有三层结构。由于三层式立体散热电路板组的层数小于现有的五层式散热电路板组的层数，故本实施例的立体散热电路板组的耐候性、制程容易度及散热效能皆优于以往的产品，进而能够兼顾承载大电流、散热能量和安全性。
此外，由于先叠合金属载板、绝缘导热层与电路导体层，再进行散热结构的切割与电路图案的加工，故可提升立体散热电路板组的平整度与结构强度。
此外，由于散热结构与电路图案皆系通过机械加工的方式加工而成，故能够形成厚度较厚(如厚度大于1毫米)的电路导体层。厚度较厚的电路导体层能够让立体散热电路板组承载数百甚至是上千安培的大电流。用机械加工不但可突破蚀刻技艺的纵横比限或铜厚的限制，更能够提升加工精准性。

Claims (20)

  1. 一种立体散热电路板组的制造方法，其特征在于，包含：
    提供一叠板，该叠板包含一金属载板、一绝缘导热层及一电路导体层，该金属载板具有相对的一第一面及一第二面，该绝缘导热层叠设于该金属载板的该第一面，该电路导体层叠设于该绝缘导热层；
    加工该电路导体层，以于该电路导体层形成一电路图案；以及
    切割该金属载板的该第二面，以于该金属载板的该第二面形成一散热结构。
  2. 如权利要求1所述的立体散热电路板组的制造方法，其特征在于，提供该叠板的步骤前，更包含：
    将该绝缘导热层叠设于该金属载板的该第一面；以及
    将该电路导体层叠设于该绝缘导热层。
  3. 如权利要求1所述的立体散热电路板组的制造方法，其特征在于，该绝缘导热层由陶瓷材料制成，该金属载板、该绝缘导热层及该电路导体层通过烧结的方式相结合。
  4. 如权利要求1所述的立体散热电路板组的制造方法，其特征在于，该绝缘导热层由高分子混合材料制成，该金属载板、该绝缘导热层及该电路导体层通过热压合的方式相结合。
  5. 如权利要求1所述的立体散热电路板组的制造方法，其特征在于，该散热结构包含多个散热柱。
  6. 如权利要求5所述的立体散热电路板组的制造方法，其特征在于，多个该散热柱呈阵列排列。
  7. 如权利要求6所述的立体散热电路板组的制造方法，其特征在于，多个该散热柱的截面为圆形、方形、菱形或平行四边形。
  8. 如权利要求1所述的立体散热电路板组的制造方法，其特征在于，该电路图案包含多个导电块及至少一垂直导线架，多个该导电块的部分电性连接于该至少一垂直导线架。
  9. 如权利要求8所述的立体散热电路板组的制造方法，其特征在于，该至少一垂直导线架与其相连的该导电块为一体成型的结构。
  10. 如权利要求8所述的立体散热电路板组的制造方法，其特征在于，该电路图案更包含至少一水平导线架，该至少一水平导线架与该至少一垂直导线架的延伸方向相垂直，多个该导电块的部分电性连接于该至少一水平导线架。
  11. 如权利要求10所述的立体散热电路板组的制造方法，其特征在于，该至少一水平导线架与其相连的该导电块为一体成型的结构。
  12. 如权利要求1所述的立体散热电路板组的制造方法，其特征在于，该金属载板包含一载板部及多个散热柱，任二相邻的多个该散热柱保持一间距，其中该间距大于等于0.5毫米，以及小于等于15毫米，该散热柱的高度与该间距的比例大于等于1，以及小于等于40。
  13. 如权利要求12所述的立体散热电路板组的制造方法，其特征在于，该载板部的厚度大于等于0.5毫米。
  14. 如权利要求1所述的立体散热电路板组的制造方法，其特征在于，该电路导体层的厚度大于等于0.1毫米，以及小于等于10毫米。
  15. 如权利要求1所述的立体散热电路板组的制造方法，其特征在于，加工该电路导体层的方式为机械除料加工、化学蚀刻加工或机械除料加工搭配化学蚀刻加工。
  16. 如权利要求1所述的立体散热电路板组的制造方法，其特征在于，于形成该电路图案的步骤中，于该电路导体层的该第二面形成多个导电块、至少一垂直导线架及至少一水平导线架，多个该导电块的部分电性连接于该至少一垂直导线架，多个该导电块的部分电性连接于该至少一水平导线架，该至少一水平导线架与该至少一垂直导线架的延伸方向相垂直。
  17. 如权利要求1所述的立体散热电路板组的制造方法，其特征在于，于加工该电路导体层的步骤后，更包含：
    对形成该电路图案的该电路导体层进行一表面处理程序。
  18. 如权利要求17所述的立体散热电路板组的制造方法，其特征在于，该表面处理程序为通过蚀刻制程、激光制程或喷砂制程来去除绝缘导热层表面上该电路图案以外的区域的残留材料。
  19. 如权利要求1所述的立体散热电路板组的制造方法，其特征在于，更包含至少一热管，该散热结构为凹槽，该至少一热管设置于该散热结构内。
  20. 如权利要求1所述的立体散热电路板组的制造方法，其特征在于，更包含至少一流管，该散热结构为凹槽，该至少一流管设置于该散热结构内，该至少一流管具有一液体入口及一液体出口。
PCT/CN2022/071522 2022-01-12 2022-01-12 立体散热电路板组的制造方法 WO2023133720A1 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/CN2022/071522 WO2023133720A1 (zh) 2022-01-12 2022-01-12 立体散热电路板组的制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2022/071522 WO2023133720A1 (zh) 2022-01-12 2022-01-12 立体散热电路板组的制造方法

Publications (1)

Publication Number Publication Date
WO2023133720A1 true WO2023133720A1 (zh) 2023-07-20

Family

ID=87279980

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2022/071522 WO2023133720A1 (zh) 2022-01-12 2022-01-12 立体散热电路板组的制造方法

Country Status (1)

Country Link
WO (1) WO2023133720A1 (zh)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08204294A (ja) * 1995-01-27 1996-08-09 Fuji Electric Co Ltd 放熱フィン一体形プリント配線板
JP2005011922A (ja) * 2003-06-18 2005-01-13 Mitsubishi Electric Corp ヒートシンクを備えた両面銅貼り基板、およびこれを用いた半導体装置
JP2009528695A (ja) * 2006-03-03 2009-08-06 エルジー イノテック カンパニー リミテッド 発光ダイオードパッケージ及びその製造方法
CN101925285A (zh) * 2009-06-17 2010-12-22 奇鋐科技股份有限公司 散热板结构及其制造方法
JP2011009475A (ja) * 2009-06-25 2011-01-13 Panasonic Electric Works Co Ltd 放熱部品一体型回路基板
JP2013211288A (ja) * 2012-03-30 2013-10-10 Mitsubishi Materials Corp ヒートシンク付パワーモジュール用基板の製造方法
CN106659055A (zh) * 2015-10-29 2017-05-10 奇鋐科技股份有限公司 散热单元及其制造方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08204294A (ja) * 1995-01-27 1996-08-09 Fuji Electric Co Ltd 放熱フィン一体形プリント配線板
JP2005011922A (ja) * 2003-06-18 2005-01-13 Mitsubishi Electric Corp ヒートシンクを備えた両面銅貼り基板、およびこれを用いた半導体装置
JP2009528695A (ja) * 2006-03-03 2009-08-06 エルジー イノテック カンパニー リミテッド 発光ダイオードパッケージ及びその製造方法
CN101925285A (zh) * 2009-06-17 2010-12-22 奇鋐科技股份有限公司 散热板结构及其制造方法
JP2011009475A (ja) * 2009-06-25 2011-01-13 Panasonic Electric Works Co Ltd 放熱部品一体型回路基板
JP2013211288A (ja) * 2012-03-30 2013-10-10 Mitsubishi Materials Corp ヒートシンク付パワーモジュール用基板の製造方法
CN106659055A (zh) * 2015-10-29 2017-05-10 奇鋐科技股份有限公司 散热单元及其制造方法

Similar Documents

Publication Publication Date Title
EP2131640B1 (en) Thermal management device and method for making the same
EP3254308B1 (en) Systems for combined thermal and electrical energy transfer
US20120026692A1 (en) Electronics substrate with enhanced direct bonded metal
WO2010059879A9 (en) Heat exchanger apparatus and methods of manufacturing cross reference
EP2654079A2 (en) Heat dissipation device and method for manufacturing the same
CN110268520B (zh) 用于集成功率芯片以及形成散热器的汇流条的方法
CN102354590B (zh) 一种精密电流感测元件及制造方法
CN115084058A (zh) 一种功率半导体器件封装结构
JPWO2017119248A1 (ja) 多層基板、電子機器及び多層基板の製造方法
WO2023133720A1 (zh) 立体散热电路板组的制造方法
TWI792852B (zh) 立體散熱電路板組及其製造方法
JP6537739B2 (ja) 液冷システムによって冷却される少なくとも１つのパワーダイを備える少なくとも１つのパワーモジュールを備えるシステム
CN106954343B (zh) 一种厚导体层的母排电路板的制作方法
JPS63253677A (ja) 多層熱電変換装置
US20240064943A1 (en) Cold plates incorporating reactive multilayer systems and s-cells
JP2020501381A (ja) 並行化が可能なパワーチップの集積方法、およびパワー電子モジュール
JP5817164B2 (ja) 接合方法、接合治具
US11812550B2 (en) Embedding method of a flat heat pipe into PCB for active device cooling
US20240292576A1 (en) Power electronics assemblies having power electronics devices embedded within a flip chip
JPH0556679B2 (zh)
JP2020502804A (ja) ヒートシンクを形成するバスバーを備える電子電力回路および集積方法
Zhou et al. Power Devices Embedded Printed Circuit Broads for Future Highly Integrated Power Electronics
CN215420931U (zh) 导热电路板
CN116193757A (zh) 一种高精密热电分离铜基线路板的制备工艺
JPH0361539B2 (zh)

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 22919386

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE