JP2011009475A - 放熱部品一体型回路基板 - Google Patents
放熱部品一体型回路基板 Download PDFInfo
- Publication number
- JP2011009475A JP2011009475A JP2009151645A JP2009151645A JP2011009475A JP 2011009475 A JP2011009475 A JP 2011009475A JP 2009151645 A JP2009151645 A JP 2009151645A JP 2009151645 A JP2009151645 A JP 2009151645A JP 2011009475 A JP2011009475 A JP 2011009475A
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- JP
- Japan
- Prior art keywords
- insulating layer
- circuit board
- circuit
- component
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
- H01L2224/45124—Aluminium (Al) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structure Of Printed Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
【解決手段】放熱部品一体型回路基板に関する。放熱部品1に絶縁層2を設ける。前記絶縁層2に回路3を設けて形成されている。
【選択図】図1
Description
2 絶縁層
3 回路
4 転写材
5 転写用回路
6 ステンレス材
7 フィルム材
8 金属板
9 電子部品
Claims (10)
- 放熱部品に絶縁層を設け、前記絶縁層に回路を設けて形成されていることを特徴とする放熱部品一体型回路基板。
- 転写材に転写用回路を設け、前記転写用回路を絶縁層に転写することによって、前記絶縁層に回路が設けられていることを特徴とする請求項1に記載の放熱部品一体型回路基板。
- 転写材としてステンレス材が用いられていることを特徴とする請求項2に記載の放熱部品一体型回路基板。
- 転写材としてフィルム材が用いられていることを特徴とする請求項2に記載の放熱部品一体型回路基板。
- 回路が異種金属を積層して形成されていることを特徴とする請求項1乃至4のいずれか1項に記載の放熱部品一体型回路基板。
- 絶縁層がポリイミド樹脂で形成されていることを特徴とする請求項1乃至5のいずれか1項に記載の放熱部品一体型回路基板。
- 絶縁層に無機フィラーが含有され、前記絶縁層の熱伝導率が2W/mk以上であることを特徴とする請求項1乃至6のいずれか1項に記載の放熱部品一体型回路基板。
- 回路に金属板が固定されていることを特徴とする請求項1乃至7のいずれか1項に記載の放熱部品一体型回路基板。
- 回路に電子部品が実装されていることを特徴とする請求項1乃至8のいずれか1項に記載の放熱部品一体型回路基板。
- 回路と金属板の両方又は一方に電子部品が実装されていることを特徴とする請求項8に記載の放熱部品一体型回路基板。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009151645A JP5087048B2 (ja) | 2009-06-25 | 2009-06-25 | 放熱部品一体型回路基板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009151645A JP5087048B2 (ja) | 2009-06-25 | 2009-06-25 | 放熱部品一体型回路基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011009475A true JP2011009475A (ja) | 2011-01-13 |
JP5087048B2 JP5087048B2 (ja) | 2012-11-28 |
Family
ID=43565789
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009151645A Expired - Fee Related JP5087048B2 (ja) | 2009-06-25 | 2009-06-25 | 放熱部品一体型回路基板 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5087048B2 (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013084417A1 (ja) * | 2011-12-09 | 2013-06-13 | 富士電機株式会社 | 電力変換装置 |
JP2015508571A (ja) * | 2011-12-23 | 2015-03-19 | インクテック カンパニー リミテッド | 金属印刷回路基板の製造方法 |
CN107453016A (zh) * | 2017-07-10 | 2017-12-08 | 深圳市嘉姆特通信电子有限公司 | 具有散热功能的无线通信天线结构 |
WO2023133720A1 (zh) * | 2022-01-12 | 2023-07-20 | 谢华棣 | 立体散热电路板组的制造方法 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02148877A (ja) * | 1988-11-30 | 1990-06-07 | Furukawa Electric Co Ltd:The | 金属板ベースプリント配線板 |
JPH03204996A (ja) * | 1989-10-09 | 1991-09-06 | Furukawa Electric Co Ltd:The | 金属ベース多層回路基板 |
JPH04251965A (ja) * | 1990-12-28 | 1992-09-08 | Denki Kagaku Kogyo Kk | 回路用金属ベース基板 |
JPH05218606A (ja) * | 1992-09-25 | 1993-08-27 | Matsushita Electric Works Ltd | 回路装置 |
JP2002076577A (ja) * | 2000-08-23 | 2002-03-15 | Ibiden Co Ltd | プリント配線板及びその製造方法 |
JP2003133596A (ja) * | 2001-10-26 | 2003-05-09 | Matsushita Electric Works Ltd | 高熱伝導性立体基板及びその製造方法、led表示装置 |
JP2005311202A (ja) * | 2004-04-23 | 2005-11-04 | Matsushita Electric Works Ltd | 配線基板及びその製造方法 |
JP2006303082A (ja) * | 2005-04-19 | 2006-11-02 | Denki Kagaku Kogyo Kk | 金属ベース回路基板およびその製法ならびにそれを用いた混成集積回路 |
-
2009
- 2009-06-25 JP JP2009151645A patent/JP5087048B2/ja not_active Expired - Fee Related
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02148877A (ja) * | 1988-11-30 | 1990-06-07 | Furukawa Electric Co Ltd:The | 金属板ベースプリント配線板 |
JPH03204996A (ja) * | 1989-10-09 | 1991-09-06 | Furukawa Electric Co Ltd:The | 金属ベース多層回路基板 |
JPH04251965A (ja) * | 1990-12-28 | 1992-09-08 | Denki Kagaku Kogyo Kk | 回路用金属ベース基板 |
JPH05218606A (ja) * | 1992-09-25 | 1993-08-27 | Matsushita Electric Works Ltd | 回路装置 |
JP2002076577A (ja) * | 2000-08-23 | 2002-03-15 | Ibiden Co Ltd | プリント配線板及びその製造方法 |
JP2003133596A (ja) * | 2001-10-26 | 2003-05-09 | Matsushita Electric Works Ltd | 高熱伝導性立体基板及びその製造方法、led表示装置 |
JP2005311202A (ja) * | 2004-04-23 | 2005-11-04 | Matsushita Electric Works Ltd | 配線基板及びその製造方法 |
JP2006303082A (ja) * | 2005-04-19 | 2006-11-02 | Denki Kagaku Kogyo Kk | 金属ベース回路基板およびその製法ならびにそれを用いた混成集積回路 |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013084417A1 (ja) * | 2011-12-09 | 2013-06-13 | 富士電機株式会社 | 電力変換装置 |
JP2015508571A (ja) * | 2011-12-23 | 2015-03-19 | インクテック カンパニー リミテッド | 金属印刷回路基板の製造方法 |
US10178773B2 (en) | 2011-12-23 | 2019-01-08 | Inktec Co., Ltd. | Method for manufacturing a metal printed circuit board |
CN107453016A (zh) * | 2017-07-10 | 2017-12-08 | 深圳市嘉姆特通信电子有限公司 | 具有散热功能的无线通信天线结构 |
CN107453016B (zh) * | 2017-07-10 | 2023-10-03 | 深圳市嘉姆特通信电子有限公司 | 具有散热功能的无线通信天线结构 |
WO2023133720A1 (zh) * | 2022-01-12 | 2023-07-20 | 谢华棣 | 立体散热电路板组的制造方法 |
Also Published As
Publication number | Publication date |
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JP5087048B2 (ja) | 2012-11-28 |
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