KR101210090B1 - 금속 코어 인쇄회로기판 및 이를 이용한 발광 다이오드패키징 방법 - Google Patents

금속 코어 인쇄회로기판 및 이를 이용한 발광 다이오드패키징 방법 Download PDF

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Publication number
KR101210090B1
KR101210090B1 KR1020060020305A KR20060020305A KR101210090B1 KR 101210090 B1 KR101210090 B1 KR 101210090B1 KR 1020060020305 A KR1020060020305 A KR 1020060020305A KR 20060020305 A KR20060020305 A KR 20060020305A KR 101210090 B1 KR101210090 B1 KR 101210090B1
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KR
South Korea
Prior art keywords
printed circuit
circuit board
metal core
emitting diode
core printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020060020305A
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English (en)
Korean (ko)
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KR20070090509A (ko
Inventor
신경호
Original Assignee
엘지이노텍 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to KR1020060020305A priority Critical patent/KR101210090B1/ko
Application filed by 엘지이노텍 주식회사 filed Critical 엘지이노텍 주식회사
Priority to US11/910,174 priority patent/US7745844B2/en
Priority to JP2008557208A priority patent/JP5323501B2/ja
Priority to CN2007800000705A priority patent/CN101213892B/zh
Priority to PCT/KR2007/001020 priority patent/WO2007100209A1/en
Priority to TW096107087A priority patent/TWI429100B/zh
Publication of KR20070090509A publication Critical patent/KR20070090509A/ko
Priority to US12/788,090 priority patent/US8212274B2/en
Priority to JP2012095306A priority patent/JP5759413B2/ja
Priority to US13/495,664 priority patent/US8796717B2/en
Application granted granted Critical
Publication of KR101210090B1 publication Critical patent/KR101210090B1/ko
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8582—Means for heat extraction or cooling characterised by their shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24C—DOMESTIC STOVES OR RANGES ; DETAILS OF DOMESTIC STOVES OR RANGES, OF GENERAL APPLICATION
    • F24C7/00—Stoves or ranges heated by electric energy
    • F24C7/06—Arrangement or mounting of electric heating elements
    • F24C7/062—Arrangement or mounting of electric heating elements on stoves
    • F24C7/065—Arrangement or mounting of electric heating elements on stoves with reflectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24C—DOMESTIC STOVES OR RANGES ; DETAILS OF DOMESTIC STOVES OR RANGES, OF GENERAL APPLICATION
    • F24C7/00—Stoves or ranges heated by electric energy
    • F24C7/08—Arrangement or mounting of control or safety devices
    • F24C7/081—Arrangement or mounting of control or safety devices on stoves
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8583—Means for heat extraction or cooling not being in contact with the bodies

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
KR1020060020305A 2006-03-03 2006-03-03 금속 코어 인쇄회로기판 및 이를 이용한 발광 다이오드패키징 방법 Expired - Fee Related KR101210090B1 (ko)

Priority Applications (9)

Application Number Priority Date Filing Date Title
KR1020060020305A KR101210090B1 (ko) 2006-03-03 2006-03-03 금속 코어 인쇄회로기판 및 이를 이용한 발광 다이오드패키징 방법
JP2008557208A JP5323501B2 (ja) 2006-03-03 2007-02-28 発光ダイオードパッケージ及びその製造方法
CN2007800000705A CN101213892B (zh) 2006-03-03 2007-02-28 发光二极管封装件及其制造方法
PCT/KR2007/001020 WO2007100209A1 (en) 2006-03-03 2007-02-28 Light-emitting diode package and manufacturing method thereof
US11/910,174 US7745844B2 (en) 2006-03-03 2007-02-28 Light-emitting diode package and manufacturing method thereof
TW096107087A TWI429100B (zh) 2006-03-03 2007-03-02 發光二極體封裝與其製造方法
US12/788,090 US8212274B2 (en) 2006-03-03 2010-05-26 Light-emitting diode package and manufacturing method thereof
JP2012095306A JP5759413B2 (ja) 2006-03-03 2012-04-19 発光ダイオードパッケージ
US13/495,664 US8796717B2 (en) 2006-03-03 2012-06-13 Light-emitting diode package and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020060020305A KR101210090B1 (ko) 2006-03-03 2006-03-03 금속 코어 인쇄회로기판 및 이를 이용한 발광 다이오드패키징 방법

Publications (2)

Publication Number Publication Date
KR20070090509A KR20070090509A (ko) 2007-09-06
KR101210090B1 true KR101210090B1 (ko) 2012-12-07

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020060020305A Expired - Fee Related KR101210090B1 (ko) 2006-03-03 2006-03-03 금속 코어 인쇄회로기판 및 이를 이용한 발광 다이오드패키징 방법

Country Status (6)

Country Link
US (3) US7745844B2 (enExample)
JP (2) JP5323501B2 (enExample)
KR (1) KR101210090B1 (enExample)
CN (1) CN101213892B (enExample)
TW (1) TWI429100B (enExample)
WO (1) WO2007100209A1 (enExample)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101210090B1 (ko) * 2006-03-03 2012-12-07 엘지이노텍 주식회사 금속 코어 인쇄회로기판 및 이를 이용한 발광 다이오드패키징 방법
KR20110046440A (ko) * 2008-08-21 2011-05-04 파나소닉 주식회사 조명용 광원
KR101134555B1 (ko) * 2009-03-23 2012-04-16 금호전기주식회사 발광소자 장착용 인쇄회로기판
KR101124102B1 (ko) * 2009-08-24 2012-03-21 삼성전기주식회사 발광 소자 패키지용 기판 및 이를 포함하는 발광 소자 패키지
KR20110068689A (ko) * 2009-12-16 2011-06-22 삼성전기주식회사 광학소자용 패키지 기판 및 그 제조방법
US8616732B2 (en) 2010-02-12 2013-12-31 Toshiba Lighting & Technology Corporation Light-emitting device and illumination device
KR101121151B1 (ko) * 2010-03-19 2012-03-20 주식회사 대원이노스트 Ｌｅｄ 모듈 및 그 제조 방법
KR101037168B1 (ko) * 2010-06-04 2011-05-26 지성수 절연 및 방열성능이 향상된 방열피씨비 및 이의 제조방법
KR101101709B1 (ko) * 2010-12-16 2012-01-05 한국세라믹기술원 Ｌｅｄ 어레이 방열모듈 및 이의 제조방법
KR101166066B1 (ko) 2010-12-21 2012-07-19 주식회사 루셈 발광다이오드 패키지
KR101775428B1 (ko) 2010-12-28 2017-09-06 삼성전자 주식회사 발광 소자 패키지 및 그 제조 방법
CN102104092A (zh) * 2011-01-13 2011-06-22 北京易光天元半导体照明科技有限公司 一种利于散热的新型led封装方法和装置
US9103532B2 (en) * 2011-01-25 2015-08-11 Koninklijke Philips N.V. LED-based modular assembly
TWI419270B (zh) * 2011-03-24 2013-12-11 南茂科技股份有限公司 封裝堆疊結構
TW201347244A (zh) * 2012-05-10 2013-11-16 盈勝科技股份有限公司 一體化高效率多層式照明裝置
KR101236715B1 (ko) * 2012-08-28 2013-02-25 주식회사 썬엘이디 실리콘 성형 방식을 이용한 칩온보드댐을 포함한 ｌｅｄ 모듈의 제조방법 및 상기 제조방법에 의해 제조된 ｌｅｄ 모듈
JP5784658B2 (ja) * 2013-02-28 2015-09-24 株式会社東芝 半導体装置の製造方法及び製造装置
EP2806211A1 (en) * 2013-05-21 2014-11-26 OSRAM GmbH Solid-state lighting device and related process
KR101592649B1 (ko) * 2013-12-24 2016-02-12 현대자동차주식회사 헤드램프용 레이저 광학계
CN104613379B (zh) * 2015-02-06 2017-12-26 东莞佰鸿电子有限公司 一种蓝宝石印刷电路板led灯具及其制作方法
CN105655472A (zh) * 2016-02-02 2016-06-08 上海鼎晖科技股份有限公司 一种金属导热柱cob led光源
CN106449563B (zh) * 2016-11-29 2018-11-13 卡姆丹克太阳能（江苏）有限公司 一种具有鳍形结构的晶圆封装
CN106449443B (zh) * 2016-11-29 2019-01-01 海安浩驰科技有限公司 一种具有鳍形结构的晶圆封装方法
DE102019126021A1 (de) * 2019-09-26 2021-04-01 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches halbleiterbauelement und verfahren zur herstellung eines optoelektronischen halbleiterbauelements
CN111048651B (zh) * 2019-12-27 2021-12-17 广州市鸿利秉一光电科技有限公司 一种高反射率uvled基板及生产方法
US11894357B2 (en) * 2020-09-10 2024-02-06 Sj Semiconductor (Jiangyin) Corporation System-level packaging structure and method for LED chip
WO2023133720A1 (zh) * 2022-01-12 2023-07-20 谢华棣 立体散热电路板组的制造方法
US20240074031A1 (en) * 2022-08-29 2024-02-29 Creeled, Inc. Textured metal core printed circuit boards for improved thermal dissipation
WO2024260748A1 (en) 2023-06-20 2024-12-26 Signify Holding B.V. A lighting device

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003304000A (ja) 2002-04-08 2003-10-24 Citizen Electronics Co Ltd 発光ダイオード用パッケージの製造方法
KR100455089B1 (ko) 2003-05-28 2004-11-06 서울반도체 주식회사 고출력 반도체 발광 소자용 패키지 구조 및 이를 사용하는 반도체 발광 소자
US20050199899A1 (en) 2004-03-11 2005-09-15 Ming-Der Lin Package array and package unit of flip chip LED

Family Cites Families (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6028366U (ja) * 1983-08-03 1985-02-26 昭和アルミニウム株式会社 凝縮器
JPH0416468Y2 (enExample) * 1986-07-31 1992-04-13
JPH0677540A (ja) * 1992-08-24 1994-03-18 Sanyo Electric Co Ltd 光半導体装置
JPH08204294A (ja) * 1995-01-27 1996-08-09 Fuji Electric Co Ltd 放熱フィン一体形プリント配線板
US5739554A (en) * 1995-05-08 1998-04-14 Cree Research, Inc. Double heterojunction light emitting diode with gallium nitride active layer
JPH10144963A (ja) * 1996-11-05 1998-05-29 Sanyo Electric Co Ltd Ｌｅｄ光源及びその製造方法
JPH11284110A (ja) * 1998-03-30 1999-10-15 Onkyo Corp ヒートシンクにおけるパワートランジスタの取付構造
JP3605547B2 (ja) * 1999-06-11 2004-12-22 松下電器産業株式会社 放熱基板及びその製造方法
JP3640153B2 (ja) * 1999-11-18 2005-04-20 松下電工株式会社 照明光源
TW507482B (en) * 2000-06-09 2002-10-21 Sanyo Electric Co Light emitting device, its manufacturing process, and lighting device using such a light-emitting device
JP3602453B2 (ja) * 2000-08-31 2004-12-15 Ｎｅｃエレクトロニクス株式会社 半導体装置
JP3472252B2 (ja) * 2000-09-07 2003-12-02 日本リークレス工業株式会社 膨張黒鉛製ヒートシンクの製造方法
US6906455B2 (en) * 2001-02-26 2005-06-14 Sony Corporation Transfer foil, transfer method, transfer apparatus, flat cathode-ray tube, and its manufacturing method
JP2003249675A (ja) * 2002-02-26 2003-09-05 Sumitomo Electric Ind Ltd 受光素子アレイ
JP3838164B2 (ja) * 2002-06-18 2006-10-25 住友電気工業株式会社 光通信用素子と光通信用素子の製造方法
JP3655267B2 (ja) * 2002-07-17 2005-06-02 株式会社東芝 半導体発光装置
TW578280B (en) * 2002-11-21 2004-03-01 United Epitaxy Co Ltd Light emitting diode and package scheme and method thereof
US7420271B2 (en) * 2003-02-20 2008-09-02 Tsung Hsin Chen Heat conductivity and brightness enhancing structure for light-emitting diode
JP2004319530A (ja) * 2003-02-28 2004-11-11 Sanyo Electric Co Ltd 光半導体装置およびその製造方法
TW560813U (en) * 2003-03-06 2003-11-01 Shang-Hua You Improved LED seat
TW594950B (en) * 2003-03-18 2004-06-21 United Epitaxy Co Ltd Light emitting diode and package scheme and method thereof
US6864513B2 (en) * 2003-05-07 2005-03-08 Kaylu Industrial Corporation Light emitting diode bulb having high heat dissipating efficiency
WO2004105142A1 (en) * 2003-05-26 2004-12-02 Matsushita Electric Works, Ltd. Light-emitting device
KR100524656B1 (ko) 2003-09-30 2005-10-31 서울반도체 주식회사 다색 발광다이오드 패키지 및 다색 발광다이오드 시스템
WO2004107461A1 (en) * 2003-05-28 2004-12-09 Seoul Semiconductor Co., Ltd. Light emitting diode package and light emitting diode system having at least two heat sinks
US6983086B2 (en) * 2003-06-19 2006-01-03 Intel Corporation Thermally isolating optical devices
JP4254470B2 (ja) * 2003-10-10 2009-04-15 豊田合成株式会社 発光装置
JP2005056653A (ja) * 2003-08-01 2005-03-03 Fuji Photo Film Co Ltd 光源装置
JP4400327B2 (ja) * 2003-09-11 2010-01-20 セイコーエプソン株式会社 タイル状素子用配線形成方法
US20050077616A1 (en) * 2003-10-09 2005-04-14 Ng Kee Yean High power light emitting diode device
JP2005217147A (ja) * 2004-01-29 2005-08-11 Seiko Epson Corp 受発光素子アレイ、光モジュール、および光伝達装置
CN1708212A (zh) * 2004-06-11 2005-12-14 周明庆 导热基板装置
US7745832B2 (en) * 2004-09-24 2010-06-29 Epistar Corporation Semiconductor light-emitting element assembly with a composite substrate
US20060097385A1 (en) * 2004-10-25 2006-05-11 Negley Gerald H Solid metal block semiconductor light emitting device mounting substrates and packages including cavities and heat sinks, and methods of packaging same
US20060124953A1 (en) * 2004-12-14 2006-06-15 Negley Gerald H Semiconductor light emitting device mounting substrates and packages including cavities and cover plates, and methods of packaging same
JP4618682B2 (ja) 2005-01-28 2011-01-26 株式会社神戸製鋼所 耐水素脆化特性に優れた高強度ばね用鋼
US7411225B2 (en) * 2005-03-21 2008-08-12 Lg Electronics Inc. Light source apparatus
KR100592508B1 (ko) * 2005-07-15 2006-06-26 한국광기술원 비콘 모양의 기판을 구비한 고출력 발광 다이오드 패키지
TWI280332B (en) * 2005-10-31 2007-05-01 Guei-Fang Chen LED lighting device
KR101210090B1 (ko) * 2006-03-03 2012-12-07 엘지이노텍 주식회사 금속 코어 인쇄회로기판 및 이를 이용한 발광 다이오드패키징 방법
US20080175003A1 (en) * 2007-01-22 2008-07-24 Cheng Home Electronics Co., Ltd. Led sunken lamp

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003304000A (ja) 2002-04-08 2003-10-24 Citizen Electronics Co Ltd 発光ダイオード用パッケージの製造方法
KR100455089B1 (ko) 2003-05-28 2004-11-06 서울반도체 주식회사 고출력 반도체 발광 소자용 패키지 구조 및 이를 사용하는 반도체 발광 소자
US20050199899A1 (en) 2004-03-11 2005-09-15 Ming-Der Lin Package array and package unit of flip chip LED

Also Published As

Publication number Publication date
CN101213892A (zh) 2008-07-02
US20120248488A1 (en) 2012-10-04
US20080179612A1 (en) 2008-07-31
US20100230707A1 (en) 2010-09-16
JP5759413B2 (ja) 2015-08-05
JP5323501B2 (ja) 2013-10-23
TW200735425A (en) 2007-09-16
TWI429100B (zh) 2014-03-01
US7745844B2 (en) 2010-06-29
KR20070090509A (ko) 2007-09-06
CN101213892B (zh) 2012-09-05
US8212274B2 (en) 2012-07-03
JP2009528695A (ja) 2009-08-06
US8796717B2 (en) 2014-08-05
WO2007100209A1 (en) 2007-09-07
JP2012178581A (ja) 2012-09-13

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