CN101213892B - 发光二极管封装件及其制造方法 - Google Patents
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Abstract
提供一种LED封装件。所述LED封装件包括金属板、电路图案和LED。所述金属板包含凹槽。所述绝缘层形成在所述金属板上。所述电路图案形成在所述绝缘层上。所述LED与所述绝缘层上的电路图案电连接。
Description
【技术领域】
本发明的实施方案涉及发光二极管(LED)封装件及其制造方法。
【背景技术】
LED封装件包括LED和印刷电路板(PCB),所述印刷电路板向LED提供驱动信号并支撑LED。
LED是一种将电能转换为光的器件。在电能转换为光时产生热。上述产生的热使LED的驱动特性下降。
因此,在LED中产生的热需要被有效吸除。同时,LED封装件可以将散热器构件附着在PCB上,以使在LED中产生的热可以迅速散失。
然而,在附着散热器构件的情况下,工艺变得复杂且成本增加。
并且,根据散热器构件附着的位置,从LED发出的光被阻挡,因此LED芯片的光发射效率下降。
【发明内容】
【技术问题】
本发明的实施方案提供一种LED封装件以及制造方法,其使得从LED芯片产生的热可以有效散失。
本发明的实施方案提供一种LED封装件以及制造方法,其能够防止光发射效率下降,同时使得从LED芯片产生的热可以有效散失。
【技术方案】
本发明的实施方案提供一种发光二极管封装件,所述封装件包括:具有凹槽的金属板;所述金属板上的绝缘层;所述绝缘层上的电路图案;和与所述绝缘层上的电路图案电连接的发光二极管。本发明的实施方案提供一种制造发光二极管封装件的方法,所述方法包括:制备金属芯印刷电路板;选择性移除包含在所述金属芯印刷电路板中的金属板,以形成凹槽;和在所述金属芯印刷电路板上安装发光二极管。
本发明的实施方案提供一种装置,所述装置包括:具有凹槽的金属板;金属板上的绝缘层;所述绝缘层上的电路图案;和与所述绝缘层上的电路图案电连接的电子器件。
【有益效果】
根据本发明的实施方案的LED封装件可以允许热被有效散失。
根据本发明的实施方案的LED封装件可以允许热被有效散失,而不降低LED芯片的光发射效率。
【附图说明】
图1到4是说明根据本发明第一实施方案的LED封装件的制造方法的视图;
图5是说明根据本发明第二实施方案的LED封装件的视图;和
图6是说明根据本发明第三实施方案的LED封装件的视图。
【具体实施方式】
以下将详细参考本发明的优选实施方案,其实施例在附图中说明。还应该理解的是,当一个元件被称为在另一个元件之上或之下时,它可以是直接在其它元件上,或者也可以存在中间插入的元件。
图1到4是说明根据本发明第一实施方案的LED封装件的制造方法的视图。图1和2是示例性说明形成金属芯印刷电路板(MCPCB)的方法的视图。
将根据本发明的实施方案描述用于使MCPCB的散热效应最大化的方法。
参照图1,绝缘层11形成在金属板10上。绝缘层11可以是树脂层。例如作为玻璃环氧基材料的FR4树脂层可以用作所述树脂层。金属板10使用具有极佳热导率的例如Al和Au的金属形成为几毫米到几十毫米的厚度,并且用作散热器。
使用具有高机械强度和极佳耐久性的FR4树脂层形成绝缘层11,因此即使当绝缘层11的厚度薄时,也极少受热变形,并且所述FR4树脂层具有粘附性,因此适合于形成层。
同时,可以使用压机或者热压夹具,在金属板10的上表面上形成绝缘层11。可以利用由压机或者热压夹具施加的热使绝缘层11粘附在金属板10上。
参照图2,在绝缘层11上形成电路图案12。
电路图案12由例如Cu的金属形成。电路图案12可以利用形成半导体电路的工艺技术形成,例如光刻法、金属化、刻蚀等。
通过上述工艺,制备已经形成有电路图案12的MCPCB,如图1和2所示。
参照图3,在绝缘层11上选择性形成反射层13。
反射层13可以使用涂覆方法形成在还没有形成电路图案12的部分绝缘层11上。反射层13设计为增加从LED芯片发出的光的亮度,并且考虑LED芯片的安装区域和电路图案12形成区域,在绝缘层11的一部分上适当地形成反射层13。
反射层13可以使用白色树脂形成,所述白色树脂通过将作为主要成分的TiO2和树脂与CaCO3、BaSO4、ZnO中的至少其一混合而形成。当然,反射层13可以使用除白色树脂之外的白色颜料形成。
虽然在图3中,反射层13没有形成在电路图案12之间,但反射层13可以根据选择形成在电路图案12之间。
采用丝网印刷而非使用气压的滴涂(dispensing)来形成反射层13形式的白色树脂。
对比使用气压的滴涂,丝网印刷可以在相对短的时间内大面积涂覆白色树脂,并且只需低成本。
根据丝网印刷,在电路图案12上形成50μm厚的丝网掩模,并且使用刮刀在丝网掩模以外的部分填充白色树脂。
具体而言,刮刀在沿着丝网掩模上表面的预定方向上移动,同时擦涂液体白色树脂,因此除丝网掩模以外的部分填充有液体白色树脂。丝网掩模以外的部分填充有液体白色树脂,使得白色树脂的表面平坦化,与与丝网掩模的上表面齐平。并且,移除丝网掩模,在预定温度下实施退火以固化白色树脂。
参照图4,在形成由白色树脂形成的反射层13之后,在MCPCB上安装LED芯片14。
具体而言,LED芯片14安装在电路图案12上,并且LED芯片14使用引线15与电路图案12电连接。并且,形成成型部分16以覆盖LED芯片14以及引线15。
LED芯片14可以形成在绝缘层11或者反射层13上。
同时,通过倒装接合,LED芯片14可以安装在硅光学基板(SiOB)上。使用具有导热性的胶,将已在其上通过倒装接合安装LED芯片14的SiOB安装到绝缘层11上,从而可以使用引线框将LED芯片14电连接到电路图案12。
在LED芯片14安装到MCPCB上以后,选择性移除金属板10、绝缘层11、和反射层13,以在金属板10的上表面中形成多个凹槽17。由于从凹槽17的上表面中移除绝缘层11和反射层13的一部分,因此凹槽17的底表面和侧面暴露在空气中。因此,可以使金属板10的散热器效应最大化。
同时,LED芯片14可以在形成凹槽17之后安装在MCPCB上。
这里,可以通过使用钻孔机或者铣床的机械方法或者使用刻蚀的化学方法来形成多个凹槽17。
因此,根据上述实施方案的LED封装件,通过多个凹槽17而加宽散热器所需的金属板10的表面积,因此可以使从LED芯片14产生的热被有效散失。因此,可以改善LED芯片14的热可靠性,并由此可以改善LED芯片14的性能。
图5是说明根据本发明第二实施方案的LED封装件的视图。
与图4的LED封装件不同,图5所示的LED封装件提供形成在金属板下表面中的多个凹槽17。
因此,已在其上形成有反射层13的区域增大,因而可以甚至更大地改善光效率并且增加凹槽17的数量以最大化散热器效应。
图6是说明根据本发明第三实施方案的LED封装件的视图。
与图4和5的LED封装件不同,图6所示的LED封装件提供形成在金属板10的上表面和下表面中的多个凹槽17。
因此,通过多个凹槽17可以使散热器效应最大化。同时,形成金属板10的上表面中的凹槽17和金属板10的下表面中的凹槽17,使得它们的位置互不相同。也就是,凹槽17不形成在金属板的上表面中形成的凹槽17的下部,并且凹槽17形成在还没有形成凹槽17的金属板的上表面的下部。
换言之,形成在金属板的上表面中的凹槽17和形成在金属板的下表面中的凹槽17不处于同一直线上。
因此,可以保持金属板10的机械强度。虽然已经对其上已安装LED芯片的LED封装件的实施方案进行了描述,但本发明还可以应用到其上安装有各种电子器件例如集成电路(IC)和电阻器的MCPCB上。
【工业适用性】
本发明的实施方案可以应用于其上已安装有电子器件的电路板上。很显然对本领域技术人员而言,在本发明中可以做出多种修改和变化。因此,只要本发明的修改与变化落入所附权利要求及其等同物的范围内,则预期本发明涵盖所述修改与变化。
Claims (13)
1.一种发光二极管封装件,包括:
具有凹槽的金属板,其中所述凹槽形成在所述金属板的上表面中;
形成在所述金属板的所述上表面上的绝缘层;
所述绝缘层上的电路图案;和
与所述绝缘层上的电路图案电连接的发光二极管。
2.根据权利要求1所述的发光二极管封装件,其中在所述绝缘层上形成有反射层。
3.根据权利要求1所述的发光二极管封装件,其中所述凹槽还形成在所述金属板的下表面中。
4.根据权利要求2所述的发光二极管封装件,其中所述发光二极管形成在所述电路图案和所述反射层的其中之一上,
其中所述电路图案和所述反射层均形成在所述绝缘层上,
其中所述电路图案形成在所述绝缘层的第一部分上,所述反射层形成在所述绝缘层的其中不形成所述电路图案的第二部分上。
5.根据权利要求3所述的发光二极管封装件,其中所述上表面中的凹槽和所述下表面中的凹槽不处于同一直线上。
6.根据权利要求1所述的发光二极管封装件,其中所述凹槽的底表面和侧面在向上的方向上暴露,沿着所述向上的方向已形成有所述发光二极管。
7.根据权利要求1所述的发光二极管封装件,其中所述反射层通过将作为主要成分的TiO2和树脂二者与CaCO3、BaSO4、ZnO中的至少其一混合而形成。
8.根据权利要求1所述的发光二极管封装件,其包括用于保护电路图案的至少一部分和发光二极管的成型部分。
9.一种制造发光二极管封装件的方法,所述方法包括:
制备金属芯印刷电路板,所述金属芯印刷电路板包括金属板和在所述金属板的上表面上的绝缘层;
在所述绝缘层上形成电路图案;
选择性移除包含在所述金属芯印刷电路板中的所述金属板的所述上表面和所述绝缘层,以形成凹槽;和
在所述金属芯印刷电路板上安装发光二极管;
其中所述电路图案与所述发光二极管连接。
10.根据权利要求9所述的方法,其还包括在形成所述电路图案之后,在所述金属芯印刷电路板上形成反射层。
11.根据权利要求9所述的方法,其中在移除所述金属板的所述上表面和所述绝缘层之后,通过选择性移除所述金属板的下表面,而在所述金属板的下表面中还形成所述凹槽。
12.根据权利要求9所述的方法,其中使用机械方法和化学方法的其中之一形成所述凹槽。
13.根据权利要求10所述的方法,其中所述反射层包含白色树脂,所述白色树脂使用丝网印刷、通过将作为主要成分的TiO2和树脂二者与CaCO3、BaSO4、ZnO中的至少其一混合而形成。
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KR1020060020305 | 2006-03-03 | ||
KR10-2006-0020305 | 2006-03-03 | ||
PCT/KR2007/001020 WO2007100209A1 (en) | 2006-03-03 | 2007-02-28 | Light-emitting diode package and manufacturing method thereof |
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JP (2) | JP5323501B2 (zh) |
KR (1) | KR101210090B1 (zh) |
CN (1) | CN101213892B (zh) |
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- 2007-02-28 CN CN2007800000705A patent/CN101213892B/zh active Active
- 2007-02-28 JP JP2008557208A patent/JP5323501B2/ja active Active
- 2007-02-28 US US11/910,174 patent/US7745844B2/en active Active
- 2007-03-02 TW TW096107087A patent/TWI429100B/zh active
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Also Published As
Publication number | Publication date |
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JP2009528695A (ja) | 2009-08-06 |
US20080179612A1 (en) | 2008-07-31 |
CN101213892A (zh) | 2008-07-02 |
US8212274B2 (en) | 2012-07-03 |
US8796717B2 (en) | 2014-08-05 |
US20100230707A1 (en) | 2010-09-16 |
WO2007100209A1 (en) | 2007-09-07 |
TW200735425A (en) | 2007-09-16 |
JP5759413B2 (ja) | 2015-08-05 |
US20120248488A1 (en) | 2012-10-04 |
TWI429100B (zh) | 2014-03-01 |
KR101210090B1 (ko) | 2012-12-07 |
KR20070090509A (ko) | 2007-09-06 |
JP5323501B2 (ja) | 2013-10-23 |
US7745844B2 (en) | 2010-06-29 |
JP2012178581A (ja) | 2012-09-13 |
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