JP2009511717A - ポリイミドおよび疎水性エポキシを含む組成物、ならびにそれに関する方法 - Google Patents

ポリイミドおよび疎水性エポキシを含む組成物、ならびにそれに関する方法 Download PDF

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Publication number
JP2009511717A
JP2009511717A JP2008535675A JP2008535675A JP2009511717A JP 2009511717 A JP2009511717 A JP 2009511717A JP 2008535675 A JP2008535675 A JP 2008535675A JP 2008535675 A JP2008535675 A JP 2008535675A JP 2009511717 A JP2009511717 A JP 2009511717A
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Japan
Prior art keywords
composition
polyimide
bis
composition according
ptf
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English (en)
Japanese (ja)
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JP2009511717A5 (https=
Inventor
イー．デューバー トーマス
ディー．サマーズ ジョン
シー．アウマン ブライアン
エー．サブラマニアン ムニールパッラム
エス．ロガド ニリッサ
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EIDP Inc
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EI Du Pont de Nemours and Co
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Publication of JP2009511717A publication Critical patent/JP2009511717A/ja
Publication of JP2009511717A5 publication Critical patent/JP2009511717A5/ja
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/68—Organic materials, e.g. photoresists
    • H10P14/683—Organic materials, e.g. photoresists carbon-based polymeric organic materials, e.g. polyimides, poly cyclobutene or PVC
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0387—Polyamides or polyimides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/63—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
    • H10P14/6326—Deposition processes
    • H10P14/6342—Liquid deposition, e.g. spin-coating, sol-gel techniques or spray coating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y10T428/31522—Next to metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
JP2008535675A 2005-10-12 2006-10-12 ポリイミドおよび疎水性エポキシを含む組成物、ならびにそれに関する方法 Withdrawn JP2009511717A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/248,803 US7745516B2 (en) 2005-10-12 2005-10-12 Composition of polyimide and sterically-hindered hydrophobic epoxy
PCT/US2006/039912 WO2007047384A1 (en) 2005-10-12 2006-10-12 Compositions comprising polyimide and hydrophobic epoxy, and methods relating thereto

Publications (2)

Publication Number Publication Date
JP2009511717A true JP2009511717A (ja) 2009-03-19
JP2009511717A5 JP2009511717A5 (https=) 2009-09-24

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008535675A Withdrawn JP2009511717A (ja) 2005-10-12 2006-10-12 ポリイミドおよび疎水性エポキシを含む組成物、ならびにそれに関する方法

Country Status (6)

Country Link
US (2) US7745516B2 (https=)
EP (1) EP1943311A1 (https=)
JP (1) JP2009511717A (https=)
KR (1) KR20080066033A (https=)
CN (1) CN101283048A (https=)
WO (1) WO2007047384A1 (https=)

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JP2010053223A (ja) * 2008-08-27 2010-03-11 Shin-Etsu Chemical Co Ltd 無溶剤型ポリイミドシリコーン系樹脂組成物及びその硬化物
WO2013122062A1 (ja) * 2012-02-13 2013-08-22 日産化学工業株式会社 液晶配向剤、液晶配向膜および液晶表示素子
WO2014157625A1 (ja) * 2013-03-29 2014-10-02 日産化学工業株式会社 ブロック化されたイソシアネート基を有する重合体を含有する液晶配向剤、液晶配向膜、及び液晶表示素子
JP2017510978A (ja) * 2014-02-07 2017-04-13 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニーＥ．Ｉ．Ｄｕ Ｐｏｎｔ Ｄｅ Ｎｅｍｏｕｒｓ Ａｎｄ Ｃｏｍｐａｎｙ 熱伝導性電子基板およびそれに関連する方法
JP2018182199A (ja) * 2017-04-19 2018-11-15 三井化学株式会社 半導体用膜形成用組成物、半導体用膜形成用組成物の製造方法、半導体用部材の製造方法、及び半導体用工程材の製造方法
WO2019150994A1 (ja) * 2018-02-01 2019-08-08 三井金属鉱業株式会社 樹脂組成物、樹脂付銅箔、誘電体層、銅張積層板、キャパシタ素子及びキャパシタ内蔵プリント配線板
JPWO2021171939A1 (https=) * 2020-02-26 2021-09-02
JP2021527743A (ja) * 2018-06-18 2021-10-14 デュポン エレクトロニクス インコーポレイテッド 可撓性電気導電性ペースト及びそれを使用して製造されるデバイス

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US20080185361A1 (en) * 2006-11-17 2008-08-07 Summers John D Compositions for electronic circuitry applications and methods relating thereto
JP2010512449A (ja) * 2006-12-12 2010-04-22 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー 結晶性封入剤
US20090111948A1 (en) * 2007-10-25 2009-04-30 Thomas Eugene Dueber Compositions comprising polyimide and hydrophobic epoxy and phenolic resins, and methods relating thereto
KR100932765B1 (ko) * 2008-02-28 2009-12-21 한양대학교 산학협력단 폴리이미드-폴리벤조옥사졸 공중합체, 이의 제조방법, 및이를 포함하는 기체 분리막
JP5077583B2 (ja) * 2008-03-26 2012-11-21 Ｊｓｒ株式会社 液晶配向剤および液晶表示素子
JP5019064B2 (ja) * 2008-03-26 2012-09-05 Ｊｓｒ株式会社 液晶配向剤および液晶表示素子
TWI518458B (zh) * 2008-03-28 2016-01-21 富士軟片股份有限公司 正型感光性樹脂組成物及使用它的硬化膜形成方法
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KR20120101660A (ko) * 2009-10-27 2012-09-14 이 아이 듀폰 디 네모아 앤드 캄파니 고온 마모 용도를 위한 폴리이미드 수지
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CN105273614B (zh) * 2015-10-12 2017-08-22 广东省宜华木业股份有限公司 室温反应制备用于木质材料表面uv超疏水聚酰亚胺涂料
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CN109880111B (zh) * 2017-12-06 2021-08-06 中国石油化工股份有限公司 一种用于合成聚醚胺的催化剂及其制备方法
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KR102222571B1 (ko) 2019-10-28 2021-03-05 피아이첨단소재 주식회사 그라파이트 시트용 폴리이미드 필름 및 이로부터 제조된 그라파이트 시트
CN111925539B (zh) * 2020-07-10 2022-07-12 中国航空工业集团公司北京长城航空测控技术研究所 一种抗油液腐蚀动态吸-脱水高分子材料的制备方法
JP7745399B2 (ja) * 2020-09-30 2025-09-29 日鉄ケミカル＆マテリアル株式会社 樹脂組成物、樹脂フィルム、積層体、カバーレイフィルム、樹脂付き銅箔、金属張積層板及び回路基板
US11854927B2 (en) 2021-03-24 2023-12-26 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor package and method of forming same
WO2023021688A1 (ja) 2021-08-20 2023-02-23 住友ベークライト株式会社 感光性樹脂組成物、電子デバイスの製造方法および電子デバイス
US12009226B2 (en) * 2021-08-27 2024-06-11 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor device and method of forming same
CN114213790A (zh) * 2021-12-31 2022-03-22 南京清研新材料研究院有限公司 一种光配向聚酰亚胺组合物及其制备工艺
WO2024141855A1 (en) * 2022-12-27 2024-07-04 3M Innovative Properties Company Dielectric curable composition and dielectric curable composition component
CN116333587B (zh) * 2023-05-31 2023-09-01 北京爱思达航天科技有限公司 一种用于透波材料的低介电常数的疏水防潮涂料及应用
TW202540280A (zh) * 2023-12-11 2025-10-16 美商富士軟片電子材料美國股份有限公司 包括新穎的茚烷雙－鄰－胺基酚之聚醯亞胺、光敏性組成物、介電膜及包含其之緩衝塗層
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US20070083016A1 (en) 2007-04-12
KR20080066033A (ko) 2008-07-15

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