JP2009511717A5 - - Google Patents

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Publication number
JP2009511717A5
JP2009511717A5 JP2008535675A JP2008535675A JP2009511717A5 JP 2009511717 A5 JP2009511717 A5 JP 2009511717A5 JP 2008535675 A JP2008535675 A JP 2008535675A JP 2008535675 A JP2008535675 A JP 2008535675A JP 2009511717 A5 JP2009511717 A5 JP 2009511717A5
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JP
Japan
Prior art keywords
composition according
bis
epoxy
dianhydride
group
Prior art date
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Withdrawn
Application number
JP2008535675A
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English (en)
Japanese (ja)
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JP2009511717A (ja
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Priority claimed from US11/248,803 external-priority patent/US7745516B2/en
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Publication of JP2009511717A publication Critical patent/JP2009511717A/ja
Publication of JP2009511717A5 publication Critical patent/JP2009511717A5/ja
Withdrawn legal-status Critical Current

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JP2008535675A 2005-10-12 2006-10-12 ポリイミドおよび疎水性エポキシを含む組成物、ならびにそれに関する方法 Withdrawn JP2009511717A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/248,803 US7745516B2 (en) 2005-10-12 2005-10-12 Composition of polyimide and sterically-hindered hydrophobic epoxy
PCT/US2006/039912 WO2007047384A1 (en) 2005-10-12 2006-10-12 Compositions comprising polyimide and hydrophobic epoxy, and methods relating thereto

Publications (2)

Publication Number Publication Date
JP2009511717A JP2009511717A (ja) 2009-03-19
JP2009511717A5 true JP2009511717A5 (https=) 2009-09-24

Family

ID=37672407

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008535675A Withdrawn JP2009511717A (ja) 2005-10-12 2006-10-12 ポリイミドおよび疎水性エポキシを含む組成物、ならびにそれに関する方法

Country Status (6)

Country Link
US (2) US7745516B2 (https=)
EP (1) EP1943311A1 (https=)
JP (1) JP2009511717A (https=)
KR (1) KR20080066033A (https=)
CN (1) CN101283048A (https=)
WO (1) WO2007047384A1 (https=)

Families Citing this family (60)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8361811B2 (en) 2006-06-28 2013-01-29 Research In Motion Rf, Inc. Electronic component with reactive barrier and hermetic passivation layer
CN101125207B (zh) * 2006-11-14 2012-09-05 上海华谊生物技术有限公司 带有聚乙二醇基团的艾塞丁或其类似物及其制剂和用途
US20080185361A1 (en) * 2006-11-17 2008-08-07 Summers John D Compositions for electronic circuitry applications and methods relating thereto
JP2010512449A (ja) * 2006-12-12 2010-04-22 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー 結晶性封入剤
US20090111948A1 (en) * 2007-10-25 2009-04-30 Thomas Eugene Dueber Compositions comprising polyimide and hydrophobic epoxy and phenolic resins, and methods relating thereto
KR100932765B1 (ko) * 2008-02-28 2009-12-21 한양대학교 산학협력단 폴리이미드-폴리벤조옥사졸 공중합체, 이의 제조방법, 및이를 포함하는 기체 분리막
JP5077583B2 (ja) * 2008-03-26 2012-11-21 Jsr株式会社 液晶配向剤および液晶表示素子
JP5019064B2 (ja) * 2008-03-26 2012-09-05 Jsr株式会社 液晶配向剤および液晶表示素子
TWI518458B (zh) * 2008-03-28 2016-01-21 富士軟片股份有限公司 正型感光性樹脂組成物及使用它的硬化膜形成方法
CA2640517A1 (en) * 2008-05-19 2009-11-19 Industry-University Cooperation Foundation, Hanyang University Polyamic acids dope composition, preparation method of hollow fiber using the same and hollow fiber prepared therefrom
US8784555B2 (en) * 2008-07-29 2014-07-22 Axalta Coating Systems Ip Co., Llc Surface active blocked isocyanates and coating compositions thereof
JP4771100B2 (ja) * 2008-08-27 2011-09-14 信越化学工業株式会社 無溶剤型ポリイミドシリコーン系樹脂組成物及びその硬化物
US8013103B2 (en) * 2008-10-10 2011-09-06 Industry-University Cooperation Foundation, Hanyang University Polymer compounds and a preparation method thereof
US8487064B2 (en) 2008-10-10 2013-07-16 Industry-University Cooperation Foundation, Hanyang University Polymer compounds and a preparation method thereof
EP2192598A1 (en) * 2008-12-01 2010-06-02 Exax Inc. Paste composition for forming heat-resistant conductive patterns on substrate
KR100983219B1 (ko) * 2008-12-05 2010-09-20 조근호 직접인쇄방식에 의한 인쇄회로기판의 제조방법 및 이에 의하여 제조된 인쇄회로기판
WO2010080384A2 (en) * 2008-12-18 2010-07-15 Novartis Ag Reusable lens molds and methods of use thereof
WO2010095738A1 (ja) * 2009-02-21 2010-08-26 ソニーケミカル&インフォメーションデバイス株式会社 保護膜形成用原料液、保護膜、保護膜付き配線基板
US8194387B2 (en) 2009-03-20 2012-06-05 Paratek Microwave, Inc. Electrostrictive resonance suppression for tunable capacitors
CN102365327A (zh) * 2009-04-03 2012-02-29 株式会社村田制作所 薄膜电容器用电介质树脂组合物和薄膜电容器
KR101050370B1 (ko) * 2009-08-18 2011-07-20 한국화학연구원 폴리이미드를 포함하는 유기절연체 형성용 조성물, 및 이를 이용한 유기절연체 및 유기박막트랜지스터
KR20120101660A (ko) * 2009-10-27 2012-09-14 이 아이 듀폰 디 네모아 앤드 캄파니 고온 마모 용도를 위한 폴리이미드 수지
CN102161826B (zh) * 2010-02-24 2013-12-11 东丽纤维研究所(中国)有限公司 聚酰亚胺树脂基三元杂化材料及其制备方法
US8475925B2 (en) * 2010-06-22 2013-07-02 Pbi Performance Products, Inc. PBI/epoxy coatings
KR101350490B1 (ko) * 2010-07-05 2014-01-15 조근호 직접인쇄방법에 의하여 회로가 형성되는 인쇄회로기판
CN102351539B (zh) * 2011-07-05 2013-03-06 东华大学 一种硼化锆纳米陶瓷纤维静电纺丝液的制备方法
KR20130035779A (ko) * 2011-09-30 2013-04-09 코오롱인더스트리 주식회사 포지티브형 감광성 수지 조성물,이로부터 형성된 절연막 및 유기발광소자
TWI628214B (zh) * 2012-02-13 2018-07-01 日產化學工業股份有限公司 液晶配向劑、液晶配向膜及液晶顯示元件
TWI471360B (zh) * 2012-12-26 2015-02-01 Ind Tech Res Inst 感光型聚亞醯胺及負型光阻組成物
WO2014157625A1 (ja) * 2013-03-29 2014-10-02 日産化学工業株式会社 ブロック化されたイソシアネート基を有する重合体を含有する液晶配向剤、液晶配向膜、及び液晶表示素子
JP6269098B2 (ja) * 2013-04-26 2018-01-31 Jsr株式会社 液晶配向剤、液晶配向膜及び液晶表示素子
SG10201709161SA (en) 2013-05-17 2017-12-28 Fujifilm Electronic Mat Usa Inc Novel polymer and thermosetting composition containing same
US10077345B2 (en) 2013-05-31 2018-09-18 Sabic Global Technologies B.V. Capacitor films, methods of manufacture, and articles manufactured therefrom
US9659711B2 (en) 2013-05-31 2017-05-23 Sabic Global Technologies B.V. Capacitor films, methods of manufacture, and articles manufactured therefrom
JP2015135869A (ja) * 2014-01-16 2015-07-27 株式会社テラプローブ 半導体装置、及び半導体装置の製造方法
US20150228374A1 (en) * 2014-02-07 2015-08-13 E I Du Pont De Nemours And Company Thermally conductive electronic substrates and methods relating thereto
WO2016172089A1 (en) 2015-04-21 2016-10-27 Fujifilm Electronic Materials U.S.A., Inc. Photosensitive polyimide compositions
US9649730B2 (en) 2015-08-12 2017-05-16 E I Du Pont De Nemours And Company Paste and process for forming a solderable polyimide-based polymer thick film conductor
CN105273614B (zh) * 2015-10-12 2017-08-22 广东省宜华木业股份有限公司 室温反应制备用于木质材料表面uv超疏水聚酰亚胺涂料
US10153075B2 (en) * 2016-01-07 2018-12-11 E I Du Pont De Nemours And Company Polyimide-based polymer thick film resistor composition
JP6884026B2 (ja) * 2017-04-19 2021-06-09 三井化学株式会社 半導体用膜形成用組成物、半導体用膜形成用組成物の製造方法、半導体用部材の製造方法、及び半導体用工程材の製造方法
KR102456361B1 (ko) 2017-09-11 2022-10-19 후지필름 일렉트로닉 머티리얼스 유.에스.에이., 아이엔씨. 유전체 필름 형성 조성물
CN109880111B (zh) * 2017-12-06 2021-08-06 中国石油化工股份有限公司 一种用于合成聚醚胺的催化剂及其制备方法
CN107897181A (zh) * 2017-12-08 2018-04-13 江汉大学 一种四甲基双酚a的应用及抗菌材料
CN111344351B (zh) * 2018-02-01 2024-02-09 三井金属矿业株式会社 树脂组合物、带树脂铜箔、介电层、覆铜层叠板、电容器元件以及内置电容器的印刷电路板
US11611157B2 (en) 2018-06-18 2023-03-21 Du Pont China Limited Flexible electrically conductive pastes and devices made therewith
DE112019003063B4 (de) 2018-06-18 2024-11-07 Du Pont China Ltd. Dielektrische Polymerdickschichtpastenzusammensetzung
KR20220079595A (ko) 2019-10-04 2022-06-13 후지필름 일렉트로닉 머티리얼스 유.에스.에이., 아이엔씨. 평탄화 방법 및 조성물
KR102222571B1 (ko) 2019-10-28 2021-03-05 피아이첨단소재 주식회사 그라파이트 시트용 폴리이미드 필름 및 이로부터 제조된 그라파이트 시트
WO2021171939A1 (ja) * 2020-02-26 2021-09-02 日産化学株式会社 ポリイミドワニス
CN111925539B (zh) * 2020-07-10 2022-07-12 中国航空工业集团公司北京长城航空测控技术研究所 一种抗油液腐蚀动态吸-脱水高分子材料的制备方法
JP7745399B2 (ja) * 2020-09-30 2025-09-29 日鉄ケミカル&マテリアル株式会社 樹脂組成物、樹脂フィルム、積層体、カバーレイフィルム、樹脂付き銅箔、金属張積層板及び回路基板
US11854927B2 (en) 2021-03-24 2023-12-26 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor package and method of forming same
WO2023021688A1 (ja) 2021-08-20 2023-02-23 住友ベークライト株式会社 感光性樹脂組成物、電子デバイスの製造方法および電子デバイス
US12009226B2 (en) * 2021-08-27 2024-06-11 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor device and method of forming same
CN114213790A (zh) * 2021-12-31 2022-03-22 南京清研新材料研究院有限公司 一种光配向聚酰亚胺组合物及其制备工艺
WO2024141855A1 (en) * 2022-12-27 2024-07-04 3M Innovative Properties Company Dielectric curable composition and dielectric curable composition component
CN116333587B (zh) * 2023-05-31 2023-09-01 北京爱思达航天科技有限公司 一种用于透波材料的低介电常数的疏水防潮涂料及应用
TW202540280A (zh) * 2023-12-11 2025-10-16 美商富士軟片電子材料美國股份有限公司 包括新穎的茚烷雙-鄰-胺基酚之聚醯亞胺、光敏性組成物、介電膜及包含其之緩衝塗層
CN120399495A (zh) * 2025-04-28 2025-08-01 四川嘉越智能科技有限公司 聚酰亚胺-碳化硅高附着力耐湿热油墨及其制备工艺

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4557860A (en) 1984-07-06 1985-12-10 Stauffer Chemical Company Solventless, polyimide-modified epoxy composition
JPH0684473B2 (ja) * 1985-12-26 1994-10-26 ニッポン高度紙工業 株式会社 耐湿耐熱性樹脂組成物
US4985377A (en) 1987-12-14 1991-01-15 Matsushita Electric Industrial Co., Ltd. Glaze resistor
FR2645539B1 (fr) 1989-04-10 1991-06-14 Rhone Poulenc Chimie Polymeres a groupements imides faits a partir de diamines encombrees
JPH0461703A (ja) * 1990-06-27 1992-02-27 Haisoole Kk 印刷用導電性ペースト
US5750958A (en) 1993-09-20 1998-05-12 Kyocera Corporation Ceramic glow plug
JP3137309B2 (ja) * 1994-02-08 2001-02-19 住友ベークライト株式会社 耐熱性樹脂組成物
JPH07247339A (ja) * 1994-03-10 1995-09-26 Hitachi Chem Co Ltd 光半導体素子封止用エポキシ樹脂組成物、及び該エポキシ樹脂組成物を用いた光半導体装置
US6143423A (en) * 1997-04-07 2000-11-07 Shin-Etsu Chemical Co., Ltd. Flame retardant epoxy resin compositions
JP3635883B2 (ja) 1997-08-08 2005-04-06 Jsr株式会社 水性分散体およびその製造方法
US5980785A (en) 1997-10-02 1999-11-09 Ormet Corporation Metal-containing compositions and uses thereof, including preparation of resistor and thermistor elements
JP3426531B2 (ja) * 1998-10-30 2003-07-14 日立化成デュポンマイクロシステムズ株式会社 感光性重合体組成物、レリーフパターンの製造法及び電子部品
TW498091B (en) * 1998-11-09 2002-08-11 Kanegafuchi Chemical Ind Polyimide composition and its manufacture process
CN1121447C (zh) 1998-12-09 2003-09-17 范蒂科股份公司 疏水性环氧树脂组合物,其交联产物及其用途
US6342333B1 (en) * 1999-09-23 2002-01-29 Hitachi Chemical Dupont Microsystems, L.L.C. Photosensitive resin composition, patterning method, and electronic components
KR100780505B1 (ko) * 1999-12-28 2007-11-29 가부시키가이샤 가네카 에폭시변성폴리이미드 및, 이것을 사용한 감광성조성물,커버레이필름, 솔더레지스트, 프린트배선판
DE10126363B4 (de) 2000-06-02 2011-08-11 Basf Se, 67063 Verfahren und Vorrichtung zur Herstellung von Aldehyden und/oder Alkoholen mit 6 bis 30 C-Atomen
KR100377861B1 (ko) * 2000-07-07 2003-03-29 한학수 전자소자 또는 칩용 절연성 박막 또는 박막형 패키지를 위한 조성물
WO2002082473A2 (en) 2001-04-09 2002-10-17 Morgan Chemical Products, Inc. Thick film paste systems for circuits on diamonds substrates
JP2003155325A (ja) * 2001-11-21 2003-05-27 Toto Kagaku Kogyo Kk 耐熱性樹脂組成物
US20060199920A1 (en) * 2003-04-15 2006-09-07 Koji Okada Photosensitive resin composition capable of being developed with aqueous developer and photosensitive dry film resist, and use thereof
JP4395350B2 (ja) * 2003-10-09 2010-01-06 信越化学工業株式会社 硬化性樹脂組成物および導電性接着剤
US7348373B2 (en) 2004-01-09 2008-03-25 E.I. Du Pont De Nemours And Company Polyimide compositions having resistance to water sorption, and methods relating thereto

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