CN1121447C - 疏水性环氧树脂组合物,其交联产物及其用途 - Google Patents
疏水性环氧树脂组合物,其交联产物及其用途 Download PDFInfo
- Publication number
- CN1121447C CN1121447C CN99814092A CN99814092A CN1121447C CN 1121447 C CN1121447 C CN 1121447C CN 99814092 A CN99814092 A CN 99814092A CN 99814092 A CN99814092 A CN 99814092A CN 1121447 C CN1121447 C CN 1121447C
- Authority
- CN
- China
- Prior art keywords
- component
- composition
- acid
- general formula
- polysiloxane
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/06—Ethers; Acetals; Ketals; Ortho-esters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/549—Silicon-containing compounds containing silicon in a ring
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
- C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/46—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes silicones
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Organic Insulating Materials (AREA)
- Processes Of Treating Macromolecular Substances (AREA)
Abstract
Description
TS | 性能 | 平面样品 | 样品45°倾斜 | 样品先平的,然后45°倾斜 |
1 | 无疏水转移效应(HTE) | 水滴被很快吸收 | ||
1.5 | 水滴2分钟内被吸收 | |||
2 | 弱的HTE | 水滴稳定保留2分钟 | ||
2.5 | 水滴形成“鼻子状” | |||
3 | 中等的HTE | 带着很多FRS材料滚落 | 水滴在倾斜时保持稳定 | |
3.5 | 带着很多FRS材料滚落 | 水滴在倾斜时形成“鼻子状” | ||
4 | 好的HTE | 水滴在倾斜时滚落留有清晰可见的痕迹 | ||
4.5 | 水滴滚落时留下模糊的痕迹 | |||
5 | 很好的HTE | 水滴滚落不带异物层材料并在样品轻微倾斜时“蹦蹦跳跳” |
HK类型 | 性能 | 效应描述 |
1 | 极好的表面疏水性 | 仅为不连续的水滴,大多水滴的接触角>80° |
2 | 很好的表面疏水性 | 仅为不连续的水滴,大多水滴的接触角>50°但<80° |
3 | 好的表面疏水性 | 仅为不连续的水滴,大多水滴的接触角>20°但<50° |
4 | 中等的表面疏水性 | 不连续的水滴和不连续的润湿表面,单个润湿表面大小<2cm2并且总润湿面<90% |
5 | 弱的表面疏水性 | 几个不连续的润湿表面>2cm2,总润湿面<90% |
6 | 弱的亲水性 | 总润湿面>90%,但仍能辨认出几个不润湿点 |
7 | 强亲水性表面 | 在整个试验表面上形成连续的水膜 |
比较和发明实施例 | VB1 | EB1 | EB2 | EB3 | VB2 | VB3 | VB4 |
组合物[重量份数]环氧树脂1ESOELO聚硅氧烷1聚硅氧烷2FluordBDMA1-MIAerosil二亚苄基山梨醇固化剂1W12 EST | 1000.590270 | 90.52510.451.581.45257.8 | 68.5511.4311.43250.10.230.451.580.66254.6 | 912510.450.50.582354.2 | 9720.49187.3266.1 | 9450.47184.6262.3 | 9910.589.1268.7 |
乳液稳定性(树脂组份+Aerosil) | 单相 | 好 | 好 | 好 | 差 | 差 | 单相 |
Tg(DSC)[℃] | 110 | 110 | 109 | 110 | |||
正切δ(50Hz)[%]24℃100℃时丧失8%时的温度[℃] | 12125 | 0.51.6127 | 0.21.7123 | ||||
抗张强度[MPa]断裂伸长[%]弯曲强度[MPa]边缘纤维(Randfaser)伸长[%]弹性弯曲模数[MPa]临界的张力强度系数K1C[MPa·(m)1/2]断裂能量G1C[J/m2] | 901.41251.3105002.25485 | 861.41371.697852.24465 | 751.31271.788132.12465 | ||||
应用实施例(AB) | AB2 | AB2 | AB2 | AB2 | AB2 | AB2 | AB2 |
转移等级[TS] 50h | 1 | 3.5 | 3.5 | 4.5 | 2.5 | 1 |
500h后在第二次涂层500h后 | 11 | 44 | 44 | 4.54.5 | 3.5 | 1 | |
疏水类别[HK]等离子化前等离子化后直接测等离子化后1h等离子化后1d | 3776 | 2721 | 3763 | 3655 | 2655 | 2675 | |
应用实施例(AB) | AB1 | AB1 | AB1 | AB3 | |||
填料含量[%]折断强试(弯曲负荷)[N]撕裂强度[N] | 66612571.6 | 66597264.8 | 66550962 | 66撕裂试验 |
温度[℃]/时间[小时] | EB(20个样品)撕裂样品数 | VB(20个样品)撕裂样品数 |
25/8 | 0 | 0 |
-10/8+25/8 | 0 | 17 |
-20/16+25/8 | 1 | 2 |
-40/16+25/8 | 4 | 1(20) |
-60/16+25/8 | 7 | - |
-80/16+25/8 | 5 | - |
-100/16+25/8 | 3(20) | - |
Claims (17)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH2441/1998 | 1998-12-09 | ||
CH244198 | 1998-12-09 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1329642A CN1329642A (zh) | 2002-01-02 |
CN1121447C true CN1121447C (zh) | 2003-09-17 |
Family
ID=4233896
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN99814092A Expired - Lifetime CN1121447C (zh) | 1998-12-09 | 1999-11-29 | 疏水性环氧树脂组合物,其交联产物及其用途 |
Country Status (15)
Country | Link |
---|---|
EP (1) | EP1141127B1 (zh) |
JP (1) | JP4823419B2 (zh) |
KR (1) | KR100659220B1 (zh) |
CN (1) | CN1121447C (zh) |
AT (1) | ATE232224T1 (zh) |
AU (1) | AU767776B2 (zh) |
BR (1) | BR9916010A (zh) |
CA (1) | CA2351333A1 (zh) |
CZ (1) | CZ20012031A3 (zh) |
DE (1) | DE59904252D1 (zh) |
ES (1) | ES2190277T3 (zh) |
HK (1) | HK1039627B (zh) |
HU (1) | HUP0200220A2 (zh) |
WO (1) | WO2000034388A1 (zh) |
ZA (1) | ZA200104729B (zh) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10051051A1 (de) * | 2000-10-14 | 2002-04-18 | Bosch Gmbh Robert | Silikonmodifizierte Einkomponentenvergußmasse |
US6653378B2 (en) * | 2000-12-18 | 2003-11-25 | Dow Corning Corporation | Silicone elastomer compositions |
EP1354916A1 (de) * | 2002-04-17 | 2003-10-22 | Abb Research Ltd. | Selbstheilende Epoxidharze für die Herstellung von elektrischen Isolierungen |
EP1568733A1 (de) * | 2004-02-20 | 2005-08-31 | Abb Research Ltd. | Füllstoff bestehend aus mit Organopolysiloxan beschichteten porösen anorganischen Füllstoffteilchen zur Verwendung in härtbaren Vergussmassen |
DE102004008772A1 (de) | 2004-02-23 | 2005-09-08 | Institut für Neue Materialien Gemeinnützige GmbH | Abriebbeständige und alkalibeständige Beschichtungen oder Formkörper mit Niedrigenergieoberfläche |
JP4572661B2 (ja) * | 2004-11-05 | 2010-11-04 | 日立化成工業株式会社 | 樹脂組成物、それを用いたプリプレグ、積層板および印刷配線板 |
WO2007010025A1 (fr) | 2005-07-20 | 2007-01-25 | Areva T & D Sa | Isolateur electrique et procede de fabrication. |
US7745516B2 (en) * | 2005-10-12 | 2010-06-29 | E. I. Du Pont De Nemours And Company | Composition of polyimide and sterically-hindered hydrophobic epoxy |
JP2008037921A (ja) * | 2006-08-02 | 2008-02-21 | Meidensha Corp | 絶縁性高分子材料組成物 |
KR100834351B1 (ko) * | 2006-11-24 | 2008-06-02 | 제일모직주식회사 | 멀티칩 패키지 밀봉용 에폭시 수지 조성물 및 이를이용한 멀티칩 패키지 |
RU2466471C2 (ru) * | 2008-02-12 | 2012-11-10 | Абб Рисерч Лтд | Поверхностно-модифицированная электроизоляционная система |
WO2009100757A1 (en) * | 2008-02-12 | 2009-08-20 | Abb Research Ltd | Surface modified electrical insulation system |
JP4893720B2 (ja) * | 2008-09-25 | 2012-03-07 | パナソニック電工株式会社 | 熱硬化性樹脂組成物及びその製造方法 |
CN101445396B (zh) * | 2008-12-09 | 2011-08-31 | 西安交通大学 | 一种瓷绝缘子表面超疏水性涂层的制备方法 |
EP2230267B1 (en) * | 2009-03-20 | 2014-08-13 | ABB Research Ltd. | Method of producing a curable epoxy resin composition |
JP5325742B2 (ja) * | 2009-10-29 | 2013-10-23 | 日本ペイント株式会社 | 天然油脂を原料とする有機無機複合コーティング組成物 |
CN102884131A (zh) * | 2010-05-07 | 2013-01-16 | 住友电木株式会社 | 电路基板用环氧树脂组合物、预成型料、层叠板、树脂片、印刷线路板用层叠基材、印刷线路板及半导体装置 |
SG187208A1 (en) * | 2010-08-31 | 2013-02-28 | Mitsubishi Gas Chemical Co | Resin composition, prepreg, and laminated sheet |
JP5965485B2 (ja) * | 2011-08-31 | 2016-08-03 | ハンツマン・アドヴァンスト・マテリアルズ・(スイッツランド)・ゲーエムベーハー | 計器用トランスフォーマーを封止するための疎水性エポキシ樹脂システムの使用 |
CN108350150B (zh) * | 2015-06-16 | 2021-09-10 | 亨斯迈先进材料许可(瑞士)有限公司 | 环氧树脂组合物 |
CN108752749A (zh) * | 2018-06-29 | 2018-11-06 | 合肥帧讯低温科技有限公司 | 一种拉伸强度疏水性相协调的薄膜及其制备方法 |
CN110722652B (zh) * | 2019-10-25 | 2021-05-28 | 福建省顺昌县升升木业有限公司 | 一种杉木疏水改性处理方法 |
CN112341756B (zh) * | 2020-10-12 | 2022-05-24 | 北京国电富通科技发展有限责任公司 | 用于机器人绝缘衣的有机硅改性环氧树脂及其制备方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4609692A (en) * | 1984-11-28 | 1986-09-02 | E. I. Du Pont De Nemours And Company | Low temperature curing maintenance coatings comprising (a) epoxy resin (b) polyamine curing agent (c) polymer containing pendant aminoester groups and (d) organic solvent |
JPS63309515A (ja) * | 1987-06-12 | 1988-12-16 | Toshiba Corp | エポキシ樹脂組成物及び樹脂封止型半導体装置 |
JP2927817B2 (ja) * | 1989-05-19 | 1999-07-28 | 日東電工株式会社 | 半導体装置 |
JP3321858B2 (ja) * | 1992-11-25 | 2002-09-09 | ジェイエスアール株式会社 | 熱硬化性樹脂組成物 |
DE19523897C2 (de) * | 1995-06-30 | 2002-10-24 | Bosch Gmbh Robert | Verwendung von Silicon-modifizierten Epoxidharzen als Vergußmassen für elektrotechnische oder elektronische Bauteile |
JP3592825B2 (ja) * | 1996-02-07 | 2004-11-24 | 東レ・ダウコーニング・シリコーン株式会社 | 硬化性エポキシ樹脂組成物および電子部品 |
US5757541A (en) * | 1997-01-15 | 1998-05-26 | Litton Systems, Inc. | Method and apparatus for an optical fiber amplifier |
ES2237832T3 (es) * | 1997-08-27 | 2005-08-01 | Huntsman Advanced Materials (Switzerland) Gmbh | Sistema de resina epoxi hidrofoba. |
-
1999
- 1999-11-29 EP EP99959356A patent/EP1141127B1/de not_active Expired - Lifetime
- 1999-11-29 CN CN99814092A patent/CN1121447C/zh not_active Expired - Lifetime
- 1999-11-29 AT AT99959356T patent/ATE232224T1/de not_active IP Right Cessation
- 1999-11-29 HU HU0200220A patent/HUP0200220A2/hu unknown
- 1999-11-29 KR KR1020017006558A patent/KR100659220B1/ko active IP Right Grant
- 1999-11-29 CA CA002351333A patent/CA2351333A1/en not_active Abandoned
- 1999-11-29 DE DE59904252T patent/DE59904252D1/de not_active Expired - Lifetime
- 1999-11-29 JP JP2000586829A patent/JP4823419B2/ja not_active Expired - Fee Related
- 1999-11-29 AU AU16560/00A patent/AU767776B2/en not_active Ceased
- 1999-11-29 WO PCT/EP1999/009240 patent/WO2000034388A1/de active IP Right Grant
- 1999-11-29 ES ES99959356T patent/ES2190277T3/es not_active Expired - Lifetime
- 1999-11-29 BR BR9916010-2A patent/BR9916010A/pt not_active IP Right Cessation
- 1999-11-29 CZ CZ20012031A patent/CZ20012031A3/cs unknown
-
2001
- 2001-06-11 ZA ZA200104729A patent/ZA200104729B/en unknown
-
2002
- 2002-02-07 HK HK02100960.4A patent/HK1039627B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP1141127A1 (de) | 2001-10-10 |
HK1039627B (zh) | 2003-07-04 |
WO2000034388A1 (de) | 2000-06-15 |
CZ20012031A3 (cs) | 2001-11-14 |
HUP0200220A2 (en) | 2002-05-29 |
CN1329642A (zh) | 2002-01-02 |
AU767776B2 (en) | 2003-11-27 |
ES2190277T3 (es) | 2003-07-16 |
BR9916010A (pt) | 2001-09-04 |
DE59904252D1 (de) | 2003-03-13 |
KR100659220B1 (ko) | 2006-12-20 |
AU1656000A (en) | 2000-06-26 |
ATE232224T1 (de) | 2003-02-15 |
JP4823419B2 (ja) | 2011-11-24 |
ZA200104729B (en) | 2002-05-03 |
KR20010101078A (ko) | 2001-11-14 |
EP1141127B1 (de) | 2003-02-05 |
HK1039627A1 (en) | 2002-05-03 |
CA2351333A1 (en) | 2000-06-15 |
JP2002531672A (ja) | 2002-09-24 |
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Address after: Basel, Switzerland Patentee after: HUNTSMAN ADVANCED MATERIALS (SWITZERLAND) GmbH Address before: Basel, Switzerland Patentee before: VANTICO GmbH |
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Effective date of registration: 20161213 Address after: Basel, Switzerland Patentee after: Huntsman Advanced Materials (Switzerland) Licensing Co.,Ltd. Address before: Basel, Switzerland Patentee before: Huntsman Advanced Materials (Switzerland) GmbH Effective date of registration: 20161213 Address after: Basel, Switzerland Patentee after: VANTICO GmbH Address before: Basel, Switzerland Patentee before: Vantico AG |
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