MXPA01005404A - Hydrophobic epoxide resin system - Google Patents
Hydrophobic epoxide resin systemInfo
- Publication number
- MXPA01005404A MXPA01005404A MXPA/A/2001/005404A MXPA01005404A MXPA01005404A MX PA01005404 A MXPA01005404 A MX PA01005404A MX PA01005404 A MXPA01005404 A MX PA01005404A MX PA01005404 A MXPA01005404 A MX PA01005404A
- Authority
- MX
- Mexico
- Prior art keywords
- composition according
- component
- carbon atoms
- acid
- formula
- Prior art date
Links
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 35
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 31
- KRZGZGXXONWBRA-UHFFFAOYSA-N 1,4-bis(ethenyl)benzene;2-(phenylmethoxymethyl)oxirane;styrene Chemical compound C=CC1=CC=CC=C1.C=CC1=CC=C(C=C)C=C1.C1OC1COCC1=CC=CC=C1 KRZGZGXXONWBRA-UHFFFAOYSA-N 0.000 title abstract 2
- 230000002209 hydrophobic Effects 0.000 title description 23
- 239000000203 mixture Substances 0.000 claims abstract description 90
- -1 polysiloxane Polymers 0.000 claims abstract description 79
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 45
- 239000000463 material Substances 0.000 claims abstract description 16
- 125000004122 cyclic group Chemical group 0.000 claims abstract description 10
- 238000010292 electrical insulation Methods 0.000 claims abstract description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 28
- 230000000694 effects Effects 0.000 claims description 25
- 150000001875 compounds Chemical class 0.000 claims description 23
- 235000012239 silicon dioxide Nutrition 0.000 claims description 23
- 125000004432 carbon atoms Chemical group C* 0.000 claims description 22
- 239000000843 powder Substances 0.000 claims description 19
- 229910052904 quartz Inorganic materials 0.000 claims description 18
- 239000010453 quartz Substances 0.000 claims description 17
- 239000004848 polyfunctional curative Substances 0.000 claims description 15
- 239000003921 oil Substances 0.000 claims description 14
- 235000019198 oils Nutrition 0.000 claims description 14
- 125000000217 alkyl group Chemical group 0.000 claims description 12
- 239000003999 initiator Substances 0.000 claims description 10
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 8
- 239000000654 additive Substances 0.000 claims description 7
- 125000003710 aryl alkyl group Chemical group 0.000 claims description 7
- 125000003118 aryl group Chemical group 0.000 claims description 7
- 150000008065 acid anhydrides Chemical class 0.000 claims description 6
- 239000011353 cycloaliphatic epoxy resin Substances 0.000 claims description 5
- 239000000945 filler Substances 0.000 claims description 5
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 5
- RMAQACBXLXPBSY-UHFFFAOYSA-N Silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 claims description 4
- 238000010538 cationic polymerization reaction Methods 0.000 claims description 4
- 239000003153 chemical reaction reagent Substances 0.000 claims description 4
- 238000006735 epoxidation reaction Methods 0.000 claims description 4
- 125000005469 ethylenyl group Chemical group 0.000 claims description 4
- 229910052740 iodine Inorganic materials 0.000 claims description 4
- 239000000944 linseed oil Substances 0.000 claims description 4
- 235000021388 linseed oil Nutrition 0.000 claims description 4
- 239000003549 soybean oil Substances 0.000 claims description 4
- 235000012424 soybean oil Nutrition 0.000 claims description 4
- IUMSDRXLFWAGNT-UHFFFAOYSA-N 2,2,4,4,6,6,8,8,10,10,12,12-dodecamethyl-1,3,5,7,9,11-hexaoxa-2,4,6,8,10,12-hexasilacyclododecane Chemical compound C[Si]1(C)O[Si](C)(C)O[Si](C)(C)O[Si](C)(C)O[Si](C)(C)O[Si](C)(C)O1 IUMSDRXLFWAGNT-UHFFFAOYSA-N 0.000 claims description 3
- 230000000996 additive Effects 0.000 claims description 3
- XFUOBHWPTSIEOV-UHFFFAOYSA-N bis(oxiran-2-ylmethyl) cyclohexane-1,2-dicarboxylate Chemical compound C1CCCC(C(=O)OCC2OC2)C1C(=O)OCC1CO1 XFUOBHWPTSIEOV-UHFFFAOYSA-N 0.000 claims description 3
- 239000003995 emulsifying agent Substances 0.000 claims description 3
- 239000000376 reactant Substances 0.000 claims description 3
- 239000002562 thickening agent Substances 0.000 claims description 3
- XMSXQFUHVRWGNA-UHFFFAOYSA-N Decamethylcyclopentasiloxane Chemical compound C[Si]1(C)O[Si](C)(C)O[Si](C)(C)O[Si](C)(C)O[Si](C)(C)O1 XMSXQFUHVRWGNA-UHFFFAOYSA-N 0.000 claims description 2
- HMMGMWAXVFQUOA-UHFFFAOYSA-N octamethylcyclotetrasiloxane Chemical compound C[Si]1(C)O[Si](C)(C)O[Si](C)(C)O[Si](C)(C)O1 HMMGMWAXVFQUOA-UHFFFAOYSA-N 0.000 claims description 2
- WNROFYMDJYEPJX-UHFFFAOYSA-K Aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims 1
- YENWHDHPCQNHJJ-UHFFFAOYSA-N aluminum;oxygen(2-) Chemical compound [O-2].[O-2].[Al+3] YENWHDHPCQNHJJ-UHFFFAOYSA-N 0.000 claims 1
- 239000012042 active reagent Substances 0.000 abstract 1
- 239000002253 acid Substances 0.000 description 18
- 229920005989 resin Polymers 0.000 description 18
- 239000011347 resin Substances 0.000 description 18
- 230000000052 comparative effect Effects 0.000 description 15
- 239000000047 product Substances 0.000 description 13
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 11
- XXBDWLFCJWSEKW-UHFFFAOYSA-N Dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 10
- 239000004593 Epoxy Substances 0.000 description 10
- 125000003700 epoxy group Chemical group 0.000 description 10
- 238000011084 recovery Methods 0.000 description 9
- 210000002381 Plasma Anatomy 0.000 description 8
- 150000008064 anhydrides Chemical class 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 229910002012 Aerosil® Inorganic materials 0.000 description 7
- 150000002148 esters Chemical class 0.000 description 7
- 239000012212 insulator Substances 0.000 description 7
- 239000003795 chemical substances by application Substances 0.000 description 6
- 230000000875 corresponding Effects 0.000 description 6
- 238000000465 moulding Methods 0.000 description 6
- 150000007513 acids Chemical class 0.000 description 5
- 229910052799 carbon Inorganic materials 0.000 description 5
- 239000000839 emulsion Substances 0.000 description 5
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 5
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 5
- 238000003860 storage Methods 0.000 description 5
- 206010053317 Hydrophobia Diseases 0.000 description 4
- 206010037742 Rabies Diseases 0.000 description 4
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 4
- 238000007792 addition Methods 0.000 description 4
- 238000005452 bending Methods 0.000 description 4
- 231100001004 fissure Toxicity 0.000 description 4
- 238000001879 gelation Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 238000006011 modification reaction Methods 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 4
- SVLTVRFYVWMEQN-UHFFFAOYSA-N 5-methylcyclohex-3-ene-1,2-dicarboxylic acid Chemical compound CC1CC(C(O)=O)C(C(O)=O)C=C1 SVLTVRFYVWMEQN-UHFFFAOYSA-N 0.000 description 3
- 125000003580 L-valyl group Chemical group [H]N([H])[C@]([H])(C(=O)[*])C(C([H])([H])[H])(C([H])([H])[H])[H] 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 3
- 150000001298 alcohols Chemical class 0.000 description 3
- 125000001931 aliphatic group Chemical group 0.000 description 3
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 125000002993 cycloalkylene group Chemical group 0.000 description 3
- IFDVQVHZEKPUSC-UHFFFAOYSA-N cyclohex-3-ene-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCC=CC1C(O)=O IFDVQVHZEKPUSC-UHFFFAOYSA-N 0.000 description 3
- 235000014113 dietary fatty acids Nutrition 0.000 description 3
- 238000000113 differential scanning calorimetry Methods 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 3
- BRLQWZUYTZBJKN-UHFFFAOYSA-N epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 3
- 150000002170 ethers Chemical class 0.000 description 3
- 239000000194 fatty acid Substances 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- RWSOTUBLDIXVET-UHFFFAOYSA-O sulfonium Chemical class [SH3+] RWSOTUBLDIXVET-UHFFFAOYSA-O 0.000 description 3
- 150000003512 tertiary amines Chemical class 0.000 description 3
- NWXADGGHXYSLSP-IYWMVGAKSA-N (3S,4S,5S,6R)-1,8-diphenylocta-1,7-diene-2,3,4,5,6,7-hexol Chemical compound OC([C@H](O)[C@@H](O)[C@H](O)[C@H](O)C(O)=CC=1C=CC=CC=1)=CC1=CC=CC=C1 NWXADGGHXYSLSP-IYWMVGAKSA-N 0.000 description 2
- MFEWNFVBWPABCX-UHFFFAOYSA-N 1,1,2,2-tetraphenylethane-1,2-diol Chemical compound C=1C=CC=CC=1C(C(O)(C=1C=CC=CC=1)C=1C=CC=CC=1)(O)C1=CC=CC=C1 MFEWNFVBWPABCX-UHFFFAOYSA-N 0.000 description 2
- MCTWTZJPVLRJOU-UHFFFAOYSA-N 1-Methylimidazole Chemical compound CN1C=CN=C1 MCTWTZJPVLRJOU-UHFFFAOYSA-N 0.000 description 2
- WXQZLPFNTPKVJM-UHFFFAOYSA-N 4-[(4-hydroxycyclohexyl)methyl]cyclohexan-1-ol Chemical compound C1CC(O)CCC1CC1CCC(O)CC1 WXQZLPFNTPKVJM-UHFFFAOYSA-N 0.000 description 2
- OYHQOLUKZRVURQ-HZJYTTRNSA-N 60-33-3 Chemical compound CCCCC\C=C/C\C=C/CCCCCCCC(O)=O OYHQOLUKZRVURQ-HZJYTTRNSA-N 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N Adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N Bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- WTEOIRVLGSZEPR-UHFFFAOYSA-N Boron trifluoride Chemical compound FB(F)F WTEOIRVLGSZEPR-UHFFFAOYSA-N 0.000 description 2
- MTHSVFCYNBDYFN-UHFFFAOYSA-N Diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 2
- DPUOLQHDNGRHBS-KTKRTIGZSA-N Erucic acid Chemical compound CCCCCCCC\C=C/CCCCCCCCCCCC(O)=O DPUOLQHDNGRHBS-KTKRTIGZSA-N 0.000 description 2
- JFCQEDHGNNZCLN-UHFFFAOYSA-N Glutaric acid Chemical compound OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 description 2
- RAXXELZNTBOGNW-UHFFFAOYSA-N Imidazole Chemical compound C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 2
- FPYJFEHAWHCUMM-UHFFFAOYSA-N Maleic anhydride Chemical group O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 2
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N Oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 2
- WLJVNTCWHIRURA-UHFFFAOYSA-N Pimelic acid Chemical compound OC(=O)CCCCCC(O)=O WLJVNTCWHIRURA-UHFFFAOYSA-N 0.000 description 2
- 229920002732 Polyanhydride Polymers 0.000 description 2
- 108010009736 Protein Hydrolysates Proteins 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N Sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- TYFQFVWCELRYAO-UHFFFAOYSA-N Suberic acid Chemical compound OC(=O)CCCCCCC(O)=O TYFQFVWCELRYAO-UHFFFAOYSA-N 0.000 description 2
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Chemical compound OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 2
- RINCXYDBBGOEEQ-UHFFFAOYSA-N Succinic anhydride Chemical group O=C1CCC(=O)O1 RINCXYDBBGOEEQ-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 238000003915 air pollution Methods 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N al2o3 Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 125000002947 alkylene group Chemical group 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N benzohydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 235000013877 carbamide Nutrition 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 125000002091 cationic group Chemical group 0.000 description 2
- QSAWQNUELGIYBC-UHFFFAOYSA-N cyclohexane-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCCCC1C(O)=O QSAWQNUELGIYBC-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 2
- 239000000806 elastomer Substances 0.000 description 2
- 150000004665 fatty acids Chemical class 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- LYCAIKOWRPUZTN-UHFFFAOYSA-N glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 2
- 150000002334 glycols Chemical class 0.000 description 2
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- 238000006460 hydrolysis reaction Methods 0.000 description 2
- 150000002460 imidazoles Chemical class 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000000543 intermediate Substances 0.000 description 2
- 229960004232 linoleic acid Drugs 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- VYKXQOYUCMREIS-UHFFFAOYSA-N methylhexahydrophthalic anhydride Chemical compound C1CCCC2C(=O)OC(=O)C21C VYKXQOYUCMREIS-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N nitrogen Chemical class N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- 230000000269 nucleophilic Effects 0.000 description 2
- 239000004006 olive oil Substances 0.000 description 2
- 235000008390 olive oil Nutrition 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- MYMOFIZGZYHOMD-UHFFFAOYSA-N oxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 2
- KFSLWBXXFJQRDL-UHFFFAOYSA-N peracetic acid Chemical compound CC(=O)OO KFSLWBXXFJQRDL-UHFFFAOYSA-N 0.000 description 2
- 238000009832 plasma treatment Methods 0.000 description 2
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 125000005624 silicic acid group Chemical class 0.000 description 2
- 239000011863 silicon-based powder Substances 0.000 description 2
- 125000005373 siloxane group Chemical group [SiH2](O*)* 0.000 description 2
- 239000011780 sodium chloride Substances 0.000 description 2
- 230000000087 stabilizing Effects 0.000 description 2
- 150000003626 triacylglycerols Chemical class 0.000 description 2
- DTOSIQBPPRVQHS-PDBXOOCHSA-N α-linolenic acid Chemical compound CC\C=C/C\C=C/C\C=C/CCCCCCCC(O)=O DTOSIQBPPRVQHS-PDBXOOCHSA-N 0.000 description 2
- LMZLWUYNLQAQHZ-YRPNKDGESA-N (2S,3S,4S,5R)-1,6-bis(phenylmethoxy)hexane-2,3,4,5-tetrol Chemical compound C([C@H](O)[C@H](O)[C@@H](O)[C@H](O)COCC=1C=CC=CC=1)OCC1=CC=CC=C1 LMZLWUYNLQAQHZ-YRPNKDGESA-N 0.000 description 1
- YUFFSWGQGVEMMI-JLNKQSITSA-N (7Z,10Z,13Z,16Z,19Z)-docosapentaenoic acid Chemical compound CC\C=C/C\C=C/C\C=C/C\C=C/C\C=C/CCCCCC(O)=O YUFFSWGQGVEMMI-JLNKQSITSA-N 0.000 description 1
- VYMPLPIFKRHAAC-UHFFFAOYSA-N 1,2-Ethanedithiol Chemical compound SCCS VYMPLPIFKRHAAC-UHFFFAOYSA-N 0.000 description 1
- OUPZKGBUJRBPGC-UHFFFAOYSA-N 1,3,5-tris(oxiran-2-ylmethyl)-1,3,5-triazinane-2,4,6-trione Chemical compound O=C1N(CC2OC2)C(=O)N(CC2OC2)C(=O)N1CC1CO1 OUPZKGBUJRBPGC-UHFFFAOYSA-N 0.000 description 1
- WERYXYBDKMZEQL-UHFFFAOYSA-N 1,4-Butanediol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 1
- ALQSHHUCVQOPAS-UHFFFAOYSA-N 1,5-Pentanediol Chemical compound OCCCCCO ALQSHHUCVQOPAS-UHFFFAOYSA-N 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N 1,6-Hexanediol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- XZTUYISAOWDOSC-UHFFFAOYSA-N 1-(4-chlorophenyl)-1,3-dimethylurea Chemical class CNC(=O)N(C)C1=CC=C(Cl)C=C1 XZTUYISAOWDOSC-UHFFFAOYSA-N 0.000 description 1
- VQGBPCIONNQYIL-UHFFFAOYSA-N 1-benzylquinolin-1-ium Chemical compound C=1C=CC2=CC=CC=C2[N+]=1CC1=CC=CC=C1 VQGBPCIONNQYIL-UHFFFAOYSA-N 0.000 description 1
- MQCPOLNSJCWPGT-UHFFFAOYSA-N 2,2'-Bisphenol F Chemical compound OC1=CC=CC=C1CC1=CC=CC=C1O MQCPOLNSJCWPGT-UHFFFAOYSA-N 0.000 description 1
- XKJMJYZFAWYREL-UHFFFAOYSA-N 2,2,4,4,6,6,8,8,10,10,12,12,14,14,16,16-hexadecamethyl-1,3,5,7,9,11,13,15-octaoxa-2,4,6,8,10,12,14,16-octasilacyclohexadecane Chemical compound C[Si]1(C)O[Si](C)(C)O[Si](C)(C)O[Si](C)(C)O[Si](C)(C)O[Si](C)(C)O[Si](C)(C)O[Si](C)(C)O1 XKJMJYZFAWYREL-UHFFFAOYSA-N 0.000 description 1
- GSANOGQCVHBHIF-UHFFFAOYSA-N 2,2,4,4,6,6,8,8,10,10,12,12,14,14-tetradecamethyl-1,3,5,7,9,11,13-heptaoxa-2,4,6,8,10,12,14-heptasilacyclotetradecane Chemical compound C[Si]1(C)O[Si](C)(C)O[Si](C)(C)O[Si](C)(C)O[Si](C)(C)O[Si](C)(C)O[Si](C)(C)O1 GSANOGQCVHBHIF-UHFFFAOYSA-N 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N 2,2-bis(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- SZCFDTYKNQJQKT-UHFFFAOYSA-N 2-(oxiran-2-ylmethoxy)-6-oxabicyclo[3.1.0]hexane Chemical compound C1CC2OC2C1OCC1CO1 SZCFDTYKNQJQKT-UHFFFAOYSA-N 0.000 description 1
- XPUOOBYARDRAQJ-UHFFFAOYSA-N 2-[(2-amino-4-methylphenyl)methyl]-5-methylaniline Chemical compound NC1=CC(C)=CC=C1CC1=CC=C(C)C=C1N XPUOOBYARDRAQJ-UHFFFAOYSA-N 0.000 description 1
- VKADIMFVVBZHTF-UHFFFAOYSA-N 2-[2-(6-oxabicyclo[3.1.0]hexan-2-yl)ethyl]-6-oxabicyclo[3.1.0]hexane Chemical compound C1CC2OC2C1CCC1C2OC2CC1 VKADIMFVVBZHTF-UHFFFAOYSA-N 0.000 description 1
- OJPDDQSCZGTACX-UHFFFAOYSA-N 2-[N-(2-hydroxyethyl)anilino]ethanol Chemical compound OCCN(CCO)C1=CC=CC=C1 OJPDDQSCZGTACX-UHFFFAOYSA-N 0.000 description 1
- ODGCZQFTJDEYNI-UHFFFAOYSA-N 2-methylcyclohex-3-ene-1,2-dicarboxylic acid Chemical compound OC(=O)C1(C)C=CCCC1C(O)=O ODGCZQFTJDEYNI-UHFFFAOYSA-N 0.000 description 1
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1H-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 1
- GRWFFFOEIHGUBG-UHFFFAOYSA-N 3,4-Epoxy-6-methylcyclohexylmethyl-3,4-epoxy-6-methylcyclo-hexanecarboxylate Chemical compound C1C2OC2CC(C)C1C(=O)OCC1CC2OC2CC1C GRWFFFOEIHGUBG-UHFFFAOYSA-N 0.000 description 1
- AGULWIQIYWWFBJ-UHFFFAOYSA-N 3,4-dichlorofuran-2,5-dione Chemical compound ClC1=C(Cl)C(=O)OC1=O AGULWIQIYWWFBJ-UHFFFAOYSA-N 0.000 description 1
- WXYTXCXWNITTLN-UHFFFAOYSA-N 3-methylcyclohexane-1,2-dicarboxylic acid Chemical compound CC1CCCC(C(O)=O)C1C(O)=O WXYTXCXWNITTLN-UHFFFAOYSA-N 0.000 description 1
- AYKYXWQEBUNJCN-UHFFFAOYSA-N 3-methylfuran-2,5-dione Chemical group CC1=CC(=O)OC1=O AYKYXWQEBUNJCN-UHFFFAOYSA-N 0.000 description 1
- OFNISBHGPNMTMS-UHFFFAOYSA-N 3-methylideneoxolane-2,5-dione Chemical group C=C1CC(=O)OC1=O OFNISBHGPNMTMS-UHFFFAOYSA-N 0.000 description 1
- 125000006201 3-phenylpropyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- YBRVSVVVWCFQMG-UHFFFAOYSA-N 4,4'-Methylenedianiline Chemical compound C1=CC(N)=CC=C1CC1=CC=C(N)C=C1 YBRVSVVVWCFQMG-UHFFFAOYSA-N 0.000 description 1
- KJYXWNPAZCIVSW-UHFFFAOYSA-N 4-(4-hydroxycyclohexyl)sulfonylcyclohexan-1-ol Chemical compound C1CC(O)CCC1S(=O)(=O)C1CCC(O)CC1 KJYXWNPAZCIVSW-UHFFFAOYSA-N 0.000 description 1
- HDPBBNNDDQOWPJ-UHFFFAOYSA-N 4-[1,2,2-tris(4-hydroxyphenyl)ethyl]phenol Chemical compound C1=CC(O)=CC=C1C(C=1C=CC(O)=CC=1)C(C=1C=CC(O)=CC=1)C1=CC=C(O)C=C1 HDPBBNNDDQOWPJ-UHFFFAOYSA-N 0.000 description 1
- CDBAMNGURPMUTG-UHFFFAOYSA-N 4-[2-(4-hydroxycyclohexyl)propan-2-yl]cyclohexan-1-ol Chemical compound C1CC(O)CCC1C(C)(C)C1CCC(O)CC1 CDBAMNGURPMUTG-UHFFFAOYSA-N 0.000 description 1
- YWVFNWVZBAWOOY-UHFFFAOYSA-N 4-methylcyclohexane-1,2-dicarboxylic acid Chemical compound CC1CCC(C(O)=O)C(C(O)=O)C1 YWVFNWVZBAWOOY-UHFFFAOYSA-N 0.000 description 1
- OECTYKWYRCHAKR-UHFFFAOYSA-N 4-vinylcyclohexene dioxide Chemical compound C1OC1C1CC2OC2CC1 OECTYKWYRCHAKR-UHFFFAOYSA-N 0.000 description 1
- YIROYDNZEPTFOL-UHFFFAOYSA-N 5,5-dimethylimidazolidine-2,4-dione Chemical compound CC1(C)NC(=O)NC1=O YIROYDNZEPTFOL-UHFFFAOYSA-N 0.000 description 1
- CSHJJWDAZSZQBT-UHFFFAOYSA-N 7a-methyl-4,5-dihydro-3aH-2-benzofuran-1,3-dione Chemical compound C1=CCCC2C(=O)OC(=O)C21C CSHJJWDAZSZQBT-UHFFFAOYSA-N 0.000 description 1
- 229910002016 Aerosil® 200 Inorganic materials 0.000 description 1
- 235000019489 Almond oil Nutrition 0.000 description 1
- 229940091292 Alo Drugs 0.000 description 1
- FAHBNUUHRFUEAI-UHFFFAOYSA-M Aluminium hydroxide oxide Chemical compound O[Al]=O FAHBNUUHRFUEAI-UHFFFAOYSA-M 0.000 description 1
- 239000005995 Aluminium silicate Substances 0.000 description 1
- PZZYQPZGQPZBDN-UHFFFAOYSA-N Aluminium silicate Chemical compound O=[Al]O[Si](=O)O[Al]=O PZZYQPZGQPZBDN-UHFFFAOYSA-N 0.000 description 1
- 229940114079 Arachidonic Acid Drugs 0.000 description 1
- YZXBAPSDXZZRGB-DOFZRALJSA-N Arachidonic acid Chemical compound CCCCC\C=C/C\C=C/C\C=C/C\C=C/CCCC(O)=O YZXBAPSDXZZRGB-DOFZRALJSA-N 0.000 description 1
- 229910017048 AsF6 Inorganic materials 0.000 description 1
- BDJRBEYXGGNYIS-UHFFFAOYSA-N Azelaic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- TZCXTZWJZNENPQ-UHFFFAOYSA-L Barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 1
- ADAHGVUHKDNLEB-UHFFFAOYSA-N Bis(2,3-epoxycyclopentyl)ether Chemical compound C1CC2OC2C1OC1CCC2OC21 ADAHGVUHKDNLEB-UHFFFAOYSA-N 0.000 description 1
- 210000000988 Bone and Bones Anatomy 0.000 description 1
- 241000273930 Brevoortia tyrannus Species 0.000 description 1
- 241000332382 Ceiba Species 0.000 description 1
- 241000252203 Clupea harengus Species 0.000 description 1
- ZSWFCLXCOIISFI-UHFFFAOYSA-N Cyclopentadiene Chemical compound C1C=CC=C1 ZSWFCLXCOIISFI-UHFFFAOYSA-N 0.000 description 1
- FBPFZTCFMRRESA-FSIIMWSLSA-N D-Glucitol Natural products OC[C@H](O)[C@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-FSIIMWSLSA-N 0.000 description 1
- FBPFZTCFMRRESA-JGWLITMVSA-N D-glucitol Chemical compound OC[C@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-JGWLITMVSA-N 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N Diglycidyl ether Chemical class C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- NDDPPRMOYLBFCF-UHFFFAOYSA-N Dodecenyl succinic anhydride Chemical group CCCCCC=CCCCCCC1CC(=O)OC1=O NDDPPRMOYLBFCF-UHFFFAOYSA-N 0.000 description 1
- 241000221079 Euphorbia <genus> Species 0.000 description 1
- 235000010099 Fagus sylvatica Nutrition 0.000 description 1
- 240000000731 Fagus sylvatica Species 0.000 description 1
- 235000019487 Hazelnut oil Nutrition 0.000 description 1
- 240000006669 Helianthus annuus Species 0.000 description 1
- 235000003222 Helianthus annuus Nutrition 0.000 description 1
- WJRBRSLFGCUECM-UHFFFAOYSA-N Hydantoin Chemical compound O=C1CNC(=O)N1 WJRBRSLFGCUECM-UHFFFAOYSA-N 0.000 description 1
- AQYSYJUIMQTRMV-UHFFFAOYSA-N Hypofluorous acid Chemical compound FO AQYSYJUIMQTRMV-UHFFFAOYSA-N 0.000 description 1
- QQVIHTHCMHWDBS-UHFFFAOYSA-N Isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 1
- 229960004488 Linolenic Acid Drugs 0.000 description 1
- 241000219745 Lupinus Species 0.000 description 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L Magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- NFWSQSCIDYBUOU-UHFFFAOYSA-N Methylcyclopentadiene Chemical compound CC1=CC=CC1 NFWSQSCIDYBUOU-UHFFFAOYSA-N 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N N#B Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- HQABUPZFAYXKJW-UHFFFAOYSA-N N-Butylamine Chemical compound CCCCN HQABUPZFAYXKJW-UHFFFAOYSA-N 0.000 description 1
- 210000004940 Nucleus Anatomy 0.000 description 1
- 239000005642 Oleic acid Substances 0.000 description 1
- 235000008753 Papaver somniferum Nutrition 0.000 description 1
- 240000001090 Papaver somniferum Species 0.000 description 1
- 235000019483 Peanut oil Nutrition 0.000 description 1
- XNGIFLGASWRNHJ-UHFFFAOYSA-N Phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 1
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Chemical compound C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- KQTIIICEAUMSDG-UHFFFAOYSA-N Propane-1,2,3-tricarboxylic acid Chemical group OC(=O)CC(C(O)=O)CC(O)=O KQTIIICEAUMSDG-UHFFFAOYSA-N 0.000 description 1
- 239000006004 Quartz sand Substances 0.000 description 1
- 235000019484 Rapeseed oil Nutrition 0.000 description 1
- GHMLBKRAJCXXBS-UHFFFAOYSA-N Resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 1
- WBHHMMIMDMUBKC-QJWNTBNXSA-N Ricinoleic acid Chemical compound CCCCCC[C@@H](O)C\C=C/CCCCCCCC(O)=O WBHHMMIMDMUBKC-QJWNTBNXSA-N 0.000 description 1
- WBHHMMIMDMUBKC-GKUQOKNUSA-N Ricinoleic acid Natural products CCCCCC[C@H](O)C\C=C/CCCCCCCC(O)=O WBHHMMIMDMUBKC-GKUQOKNUSA-N 0.000 description 1
- 241001125046 Sardina pilchardus Species 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N Silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 210000001138 Tears Anatomy 0.000 description 1
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 1
- VEORPZCZECFIRK-UHFFFAOYSA-N Tetrabromobisphenol A Chemical compound C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- HWKQNAWCHQMZHK-UHFFFAOYSA-N Trolnitrate Chemical compound [O-][N+](=O)OCCN(CCO[N+]([O-])=O)CCO[N+]([O-])=O HWKQNAWCHQMZHK-UHFFFAOYSA-N 0.000 description 1
- 240000006365 Vitis vinifera Species 0.000 description 1
- 235000014787 Vitis vinifera Nutrition 0.000 description 1
- 229920004482 WACKER® Polymers 0.000 description 1
- MCMNRKCIXSYSNV-UHFFFAOYSA-N ZrO2 Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 1
- YXEBFFWTZWGHEY-UHFFFAOYSA-N [1-(hydroxymethyl)cyclohex-3-en-1-yl]methanol Chemical compound OCC1(CO)CCC=CC1 YXEBFFWTZWGHEY-UHFFFAOYSA-N 0.000 description 1
- YIMQCDZDWXUDCA-UHFFFAOYSA-N [4-(hydroxymethyl)cyclohexyl]methanol Chemical compound OCC1CCC(CO)CC1 YIMQCDZDWXUDCA-UHFFFAOYSA-N 0.000 description 1
- MSILJOYZYPRFDK-UHFFFAOYSA-N [4-[4-(sulfanylmethyl)phenoxy]phenyl]methanethiol Chemical compound C1=CC(CS)=CC=C1OC1=CC=C(CS)C=C1 MSILJOYZYPRFDK-UHFFFAOYSA-N 0.000 description 1
- 239000003377 acid catalyst Substances 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 230000001070 adhesive Effects 0.000 description 1
- WNLRTRBMVRJNCN-UHFFFAOYSA-L adipate(2-) Chemical compound [O-]C(=O)CCCCC([O-])=O WNLRTRBMVRJNCN-UHFFFAOYSA-L 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 230000001476 alcoholic Effects 0.000 description 1
- 125000003342 alkenyl group Chemical group 0.000 description 1
- 239000008168 almond oil Substances 0.000 description 1
- 235000020661 alpha-linolenic acid Nutrition 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminum Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PIGFYZPCRLYGLF-UHFFFAOYSA-N aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 1
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 1
- 150000001450 anions Chemical class 0.000 description 1
- 125000005428 anthryl group Chemical group [H]C1=C([H])C([H])=C2C([H])=C3C(*)=C([H])C([H])=C([H])C3=C([H])C2=C1[H] 0.000 description 1
- 230000000111 anti-oxidant Effects 0.000 description 1
- 229940053200 antiepileptics Fatty acid derivatives Drugs 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 235000021342 arachidonic acid Nutrition 0.000 description 1
- 125000001204 arachidyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000006615 aromatic heterocyclic group Chemical group 0.000 description 1
- 239000010428 baryte Substances 0.000 description 1
- 229910052601 baryte Inorganic materials 0.000 description 1
- 239000000440 bentonite Substances 0.000 description 1
- 229910000278 bentonite Inorganic materials 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- DJUWPHRCMMMSCV-UHFFFAOYSA-N bis(7-oxabicyclo[4.1.0]heptan-4-ylmethyl) hexanedioate Chemical compound C1CC2OC2CC1COC(=O)CCCCC(=O)OCC1CC2OC2CC1 DJUWPHRCMMMSCV-UHFFFAOYSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 235000010216 calcium carbonate Nutrition 0.000 description 1
- 239000004202 carbamide Substances 0.000 description 1
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 125000002843 carboxylic acid group Chemical group 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000004359 castor oil Substances 0.000 description 1
- 235000019438 castor oil Nutrition 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 239000008199 coating composition Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 235000005687 corn oil Nutrition 0.000 description 1
- 239000002285 corn oil Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 235000012343 cottonseed oil Nutrition 0.000 description 1
- 239000002385 cottonseed oil Substances 0.000 description 1
- 125000000853 cresyl group Chemical class C1(=CC=C(C=C1)C)* 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000005712 crystallization Effects 0.000 description 1
- PFURGBBHAOXLIO-UHFFFAOYSA-N cyclohexane-1,2-diol Chemical compound OC1CCCCC1O PFURGBBHAOXLIO-UHFFFAOYSA-N 0.000 description 1
- RLMGYIOTPQVQJR-UHFFFAOYSA-N cyclohexane-1,3-diol Chemical compound OC1CCCC(O)C1 RLMGYIOTPQVQJR-UHFFFAOYSA-N 0.000 description 1
- VKONPUDBRVKQLM-UHFFFAOYSA-N cyclohexane-1,4-diol Chemical compound OC1CCC(O)CC1 VKONPUDBRVKQLM-UHFFFAOYSA-N 0.000 description 1
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 238000007033 dehydrochlorination reaction Methods 0.000 description 1
- 238000006356 dehydrogenation reaction Methods 0.000 description 1
- 229940087101 dibenzylidene sorbitol Drugs 0.000 description 1
- 239000004205 dimethyl polysiloxane Substances 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 150000004662 dithiols Chemical class 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 239000010459 dolomite Substances 0.000 description 1
- 229910000514 dolomite Inorganic materials 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 238000005755 formation reaction Methods 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N fumaric acid Chemical compound OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 230000000855 fungicidal Effects 0.000 description 1
- 239000000417 fungicide Substances 0.000 description 1
- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PEDCQBHIVMGVHV-UHFFFAOYSA-N glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 229920000578 graft polymer Polymers 0.000 description 1
- 235000009754 grape Nutrition 0.000 description 1
- 235000012333 grape Nutrition 0.000 description 1
- 239000010440 gypsum Substances 0.000 description 1
- 229910052602 gypsum Inorganic materials 0.000 description 1
- 239000010468 hazelnut oil Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000010460 hemp oil Substances 0.000 description 1
- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 235000019514 herring Nutrition 0.000 description 1
- MBAKFIZHTUAVJN-UHFFFAOYSA-H hexafluoroantimony(1-) Chemical compound F[Sb-](F)(F)(F)(F)F MBAKFIZHTUAVJN-UHFFFAOYSA-H 0.000 description 1
- MUTGBJKUEZFXGO-UHFFFAOYSA-N hexahydrophthalic anhydride Chemical compound C1CCCC2C(=O)OC(=O)C21 MUTGBJKUEZFXGO-UHFFFAOYSA-N 0.000 description 1
- WJSATVJYSKVUGV-UHFFFAOYSA-N hexane-1,3,5-triol Chemical compound CC(O)CC(O)CCO WJSATVJYSKVUGV-UHFFFAOYSA-N 0.000 description 1
- 239000003906 humectant Substances 0.000 description 1
- 229910000515 huntite Inorganic materials 0.000 description 1
- 150000002430 hydrocarbons Chemical group 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 125000004029 hydroxymethyl group Chemical group [H]OC([H])([H])* 0.000 description 1
- YAMHXTCMCPHKLN-UHFFFAOYSA-N imidazolidin-2-one Chemical compound O=C1NCCN1 YAMHXTCMCPHKLN-UHFFFAOYSA-N 0.000 description 1
- 125000003454 indenyl group Chemical group C1(C=CC2=CC=CC=C12)* 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- PNDPGZBMCMUPRI-UHFFFAOYSA-N iodine Chemical compound II PNDPGZBMCMUPRI-UHFFFAOYSA-N 0.000 description 1
- 239000011630 iodine Substances 0.000 description 1
- MGFYSGNNHQQTJW-UHFFFAOYSA-N iodonium Chemical class [IH2+] MGFYSGNNHQQTJW-UHFFFAOYSA-N 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 230000002101 lytic Effects 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 125000002960 margaryl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 150000001247 metal acetylides Chemical class 0.000 description 1
- 229910000000 metal hydroxide Inorganic materials 0.000 description 1
- 150000004692 metal hydroxides Chemical class 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 235000010755 mineral Nutrition 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910003465 moissanite Inorganic materials 0.000 description 1
- 239000002808 molecular sieve Substances 0.000 description 1
- BMLIZLVNXIYGCK-UHFFFAOYSA-N monuron Chemical compound CN(C)C(=O)NC1=CC=C(Cl)C=C1 BMLIZLVNXIYGCK-UHFFFAOYSA-N 0.000 description 1
- 125000001421 myristyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 235000021290 n-3 DPA Nutrition 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 125000001196 nonadecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000001181 organosilyl group Chemical group [SiH3]* 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- CNRZQDQNVUKEJG-UHFFFAOYSA-N oxo-bis(oxoalumanyloxy)titanium Chemical compound O=[Al]O[Ti](=O)O[Al]=O CNRZQDQNVUKEJG-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-O oxonium Chemical class [OH3+] XLYOFNOQVPJJNP-UHFFFAOYSA-O 0.000 description 1
- RZVAJINKPMORJF-UHFFFAOYSA-N p-acetaminophenol Chemical compound CC(=O)NC1=CC=C(O)C=C1 RZVAJINKPMORJF-UHFFFAOYSA-N 0.000 description 1
- 125000000913 palmityl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000000312 peanut oil Substances 0.000 description 1
- 125000002958 pentadecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- SCKXCAADGDQQCS-UHFFFAOYSA-N performic acid Chemical compound OOC=O SCKXCAADGDQQCS-UHFFFAOYSA-N 0.000 description 1
- 150000004965 peroxy acids Chemical class 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 125000000286 phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])* 0.000 description 1
- 150000004714 phosphonium salts Chemical class 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920001281 polyalkylene Polymers 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 239000011164 primary particle Substances 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- DNIAPMSPPWPWGF-UHFFFAOYSA-N propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 1
- 239000001944 prunus armeniaca kernel oil Substances 0.000 description 1
- 229960001755 resorcinol Drugs 0.000 description 1
- 229960003656 ricinoleic acid Drugs 0.000 description 1
- 239000011435 rock Substances 0.000 description 1
- 235000005713 safflower oil Nutrition 0.000 description 1
- 239000003813 safflower oil Substances 0.000 description 1
- 235000019512 sardine Nutrition 0.000 description 1
- 125000003748 selenium group Chemical class *[Se]* 0.000 description 1
- 239000008159 sesame oil Substances 0.000 description 1
- 235000011803 sesame oil Nutrition 0.000 description 1
- 150000004819 silanols Chemical class 0.000 description 1
- 150000004760 silicates Chemical class 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000600 sorbitol Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000001384 succinic acid Substances 0.000 description 1
- 150000003467 sulfuric acid derivatives Chemical class 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 239000003760 tallow Substances 0.000 description 1
- 229910052714 tellurium Inorganic materials 0.000 description 1
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 description 1
- AUHHYELHRWCWEZ-UHFFFAOYSA-N tetrachlorophthalic anhydride Chemical compound ClC1=C(Cl)C(Cl)=C2C(=O)OC(=O)C2=C1Cl AUHHYELHRWCWEZ-UHFFFAOYSA-N 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- FAQYAMRNWDIXMY-UHFFFAOYSA-N trichloroborane Chemical compound ClB(Cl)Cl FAQYAMRNWDIXMY-UHFFFAOYSA-N 0.000 description 1
- 125000002889 tridecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 1
- 239000002383 tung oil Substances 0.000 description 1
- 125000002948 undecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 150000003672 ureas Chemical class 0.000 description 1
- 239000010698 whale oil Substances 0.000 description 1
- 239000010456 wollastonite Substances 0.000 description 1
- 229910052882 wollastonite Inorganic materials 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- 239000010457 zeolite Chemical class 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Abstract
The invention relates to a composition containing (a) an epoxide resin, (b) an OH-terminated polysiloxane, (c) a cyclic polysiloxane and (d) a non-ionic, fluoroaliphatic surface-active reagent. The composition has excellent hydrophobicity properties and can be used as an electrical insulation material.
Description
HYDROPHOBIC SYSTEM OF EPOXY RESIN
The present invention relates to a composition comprising an epoxy resin, various polysiloxanes and fluorinated compounds, to crosslinked products obtainable by hardening a composition such as this as well as to the use of this composition as electrical insulation material. Due to their good mechanical properties and their high specific resistance, epoxy resins are often used as electrical insulation material. Due to its high resistance to inclement weather, cycloaliphatic epoxy resins are especially suitable for outdoor use. However, especially in regions with high levels of precipitation with severe air pollution, the problem arises that a dirt / water conductive layer can be formed on the surface of the insulation, which produces leakage currents and arcs voltaicos and can have as a consequence a damage to the insulator until its total destruction. Also in the case of insulations based on epoxies with little dirt, an increase in surface conductivity can occur, when the surface erodes in the course of time due to inclement weather and water can better moisturize a rough layer as the that is formed. As disclosed in U.S. Patent 3,926,885, the hydrophobic characteristics can be provided to the epoxy resins by the addition of polysiloxane / polyether copolymers and OH-terminated polysiloxanes. However, the adhesion of this material to the metal is not sufficient for all applications. Japanese Patent JP-A 2-305454 discloses mixtures of epoxy resins with high moisture stability, which, in addition to an epoxinovolak and a phenolic resin, also contain small amounts of a cyclic dimethylsiloxane. Although in these compositions the corrosion produced by the bonding of water on the surface is largely avoided, this system does not achieve a sufficient hydrophobic effect for use as an insulator. In International Publication 098/32138 a resins system suitable as electrical insulation material is described, based on hardenable mixtures of epoxy resins and special silicone oligomers, which present final glycidyl groups. By hardening, the silicone oligomers become part of the cross-linked structure that is formed, the hardened material being able to provide the known properties of the silicones, such as hydrophobicity and good resistance to weathering. The disadvantage is the use of expensive silicone oligomers which can be obtained commercially and a poor hydrophobic transfer effect. It has now been found that compositions containing an epoxy resin, at least two specific polysiloxanes and a nonionic, fluoroaliphatic active surface reactant, can result in storage stable emulsions, which in the hardened state exhibit a marked hydrophobic transfer effect and recovery effects. The object of the present invention is a composition containing: (a) an epoxy resin, (b) an OH-terminated polysiloxane, (c) a cyclic polysiloxane, and (d) a non-ionic, fluoroaliphatic active surface reactant. In the compositions according to the invention, the amounts of the components (a) to (c) can vary within wide ranges. The compositions are preferred which, based on the total composition of (a), (b), (c) and (d), contain 77.0 to 97.99% by weight, in particular 86.0 to 96.95% by weight, of component (a) , 1.0 to 10.0% by weight, in particular 2.0 to 6.0% by weight, of component (b), 1.0 to 10.0% by weight, in particular 1.0 to 5.0% by weight, of component (c) and 0.01 to 3.0% by weight weight, in particular 0.05 to 3.0% by weight, of the subject (d), where the sum of the components (a), (b), (c) and (d) is 100% by weight. As component (a) of the compositions according to the invention, all types of epoxies containing at least one glycidyl or β-methylglycidyl group, a linear alkylene oxide group or a cycloalkylene oxide group are suitable. Examples of suitable epoxy resins are polyglycidyl and poly (β-methylglycidyl) ether, which can be obtained by the reaction of a compound containing at least two free alcoholic and / or phenolic hydroxyl groups per molecule, with epichlorohydrin or β -methylepicloridrine, under alkaline conditions or, also, in the presence of an acid catalyst with the subsequent alkaline treatment. Suitable starting compounds for the preparation of these glycidyl- or β-methyl glycidyl ethers are, for example, acyclic alcohols such as ethylene glycol, diethylene glycol and high molecular weight poly (oxyethylene) glycols, propan-1,2-diol and poly (oxypropylene) glycols, propan-l, 3-diol, butan-1,4-diol, poly (oxytetramethylene) -glycols, pentan-1,5-diol, hexane-1,6-diol, hexan-2, 4 , 6-triol, glycerin, 1,1-trimethylolpropane, pentaerythritol or sorbitol, cycloaliphatic alcohols such as resorcite, quinite, bis- (4-hydroxycyclohexyl) -methane, 2,2-bis- (4-hydroxycyclohexyl) -pyrropane and 1, 1-bis- (hydroxymethyl) -cyclohexen-3 and alcohols with aromatic nuclei, such as N, N-bis- (2-hydroxyethyl) -aniline and p, p '-bis- (2-n-hydroxyethylamino) -diphenylmethane. Other dihydroxyl compounds suitable for the preparation of glycidyl- or β-methylglycidyl ethers are monocyclic phenols such as resorcin and hydroquinone, polycyclic phenols, such as bis- (-hydroxyphenyl) -methane, 4,4-dihydroxydiphenyl, bis- (4) -hydroxyphenyl) -sulfone, 1,1,2,2-tetrakis- (4-hydroxyphenyl) -ethane, 2,2-bis- (4-hydroxy-phenyl) -propane (Bisphenol A) and 2, 2-bis- (3, 5-dibrom-4-hydroxyphenyl) -propane, as well as Novolak, for example, novolak of phenol and cresol. The polyglycidyl- and poly (β-methylglycidyl) -esters can be obtained by the reaction of a compound containing two or more carboxylic acid groups per molecule with epichlorohydrin, glycerindichlorohydrin or β-methylepicloridrine in the presence of alkalis. These polyglycidyl esters can be derived from aliphatic polycarboxylic acids, for example, oxalic acid, succinic acid, glutaric acid, adipic acid, pimelic acid, suberic acid, azelaic acid; sebacic acid or dimerized or trimerized linolic acid, of cycloaliphatic polycarboxylic acids, such as tetrahydrophthalic acid, 4-methyltetrahydrophthalic acid, hexahydrophthalic acid and methylmethylhydrophthalic acid, and of aromatic plicarboxylic acids, such as phthalic acid, isophthalic acid and terephthalic acid. Other epoxies suitable as component (a) are poly (N-glycidyl) compounds, such as products obtainable by dehydrochlorination of the reaction products of epichlorohydrin with amines containing at least two amine hydrogen atoms, such as aniline, n-butylamine, bis- (4-aminophenyl) -methane and bis- (4-methyl-aminophenyl) -methane. Among the above are also triglycidyl isocyanurate as well as N, N'-diglycidyl derivatives of cyclic alkylene ureas, such as ethylene urea and 1,3-propylenic urea and hydantoins, such as 5,5-dimethylhydantoin. Also suitable are poly (S-glycidyl) compounds, such as for example the di-S-glycidyl derivatives of dithiols, such as ethane-1,2-dithiol and bis- (4-mercaptomethylphenyl) -ether. Preferably, the compositions contain as component (a) a cycloaliphatic epoxy resin or an epoxidation product of an unsaturated natural oil and a derivative thereof.
Within the framework of the present invention, the term "cycloaliphatic epoxy resin" encompasses all epoxy resins with cycloaliphatic structural units, that is, it includes both glycidyl cycloaliphatic compounds, ß-methylglycidyl compounds, and also epoxy resins based on oxides of cycloalkylene. Suitable glycidyl cycloaliphatic compounds and suitable β-methylglycidyl compounds are the glycidyl esters and β-methylglycidyl esters of cycloaliphatic polycarboxylic acids, such as tetrahydrophthalic acid, 4-methyltetrahydrophthalic acid, hexahydrophthalic acid, 3-methylhexahydrophthalic acid and 4-methylglycidic acid. methylhexahydrophthalic. Other suitable epoxy resins are the diglycidyl ethers and β-methylglycidyl ethers of cycloaliphatic alcohols, such as 1,2-dihydroxycyclohexane, 1,3-dihydroxycyclohexane and 1,4-dihydroxycyclohexane, 1,4-cyclohexanedimethanol, 1,1-bis (hydroxymethyl) cyclohex-3-ene, bis (4-hydroxycyclohexyl) methane, 2,2-bis (4-hydroxycyclohexyl) -propane and bis (4-hydroxycyclohexyl) sulfone. Examples of epoxy resins with cycloalkylene oxide structures are bis (2,3-epoxycyclopentyl) ether, 2,3-epoxycyclopentylglycidylether, 1,2-bis (2,3-epoxycyclopentyl) ethane, vinylcyclohexene dioxide, 3, 4-epoxycyclohexylmethyl-3 ', 4'-epoxycyclohexanecarboxylate, 3,4-epoxy-6-methylcyclohexylmethyl-3', 4'-epoxy-6'-methylcyclohexanecarboxylate, bis (3,4-epoxycyclohexylmethyl) adipate and bis (3) 4-epoxy-6-methylcyclohexylmethyl) adipate. Preferred cycloaliphatic epoxy resins are bLs (4-hydroxycyclohexyl) methan-diglycidyl ether, 2,2-bis (4-hydroxycyclohexyl) propandiglycidyl ether, diglycidyl ester of tetrahydrophthalic acid, diglycidyl ester of 4-methyltetrahydrophthalic acid, diglycidyl ester of 4-methylhexahydrophthalic acid, and, in particular, diglycidyl ester of hexahydrophthalic acid and 3,4-epoxycyclohexylmethyl-3 '4'-epoxycyclohexanecarboxylate. As component (a), epoxidation products of unsaturated esters of fatty acids can also be used in the compositions according to the invention. Preference is given to using epoxy-containing compounds, which are derived from mono- and polyhydric acids having 12 to 22 carbon atoms and an iodine number between 30 and 400, such as, for example, lauroleinic acid, myristoleinic acid, palmitoleinic acid, oleic acid, gadoleinic acid, erucic acid, ricinoleic acid, linolic acid, linolenic acid, elaidinic acid, licánic acid, arachidonic acid and clupanodonic acid. Suitable are, for example, the epoxidation products of soybean oil, linseed oil, knob oil, tung oil, ocydic oil, safflower oil, poppy oil, hemp oil, cottonseed oil, oil. of sunflower, rapeseed oil, poly-unsaturated triglycerides, triglycerides of euphorbia plants, peanut oil, olive oil, olive oil, almond oil, ceiba oil, hazelnut oil, apricot kernel oil, beech oil, lupine oil, corn oil, sesame oil, grape bone oil, lalemancy oil, castor oil, herring oil, sardine oil, menhaden oil, whale oil, tallow and derivatives of the same. Also suitable are the high unsaturated derivatives, which can be obtained by further dehydrogenation reactions of these oils. The olefinic double bonds of the fatty acid radicals or the aforementioned compounds can be epoxidized according to known methods, for example by reaction with hydrogen peroxide, optionally in the presence of a catalyst, an alkyl hydroperoxide or a peracid, as for example, performic acid or peracetic acid. Within the framework of the invention, both the fully epoxidized and the partially epoxidized derivatives still containing free double bonds can be used as component (a). As the component (a), epoxidized soybean oil and linseed oil are especially preferred. The polysiloxanes terminated in OH according to component (b) can be obtained by known methods, for example, with the hydrolysis of the corresponding organophosilanes and the subsequent polycondensation of the silanols. In the foregoing, polysiloxane mixtures with molecular masses of 1'000-150'000 g / mol are usually obtained. A series of these OH-terminated polysiloxanes can be obtained in commerce. Liquid polysiloxanes are preferably used in the compositions according to the invention. Preferably, a polysiloxane of the formula I is used:
wherein Ri and R, independently of one another, mean alkyl of 1 to 18 carbon atoms, aryl of 5 to 14 carbon atoms or aralkyl of 6 to 24 carbon atoms, and n means an average value of 3 to 60, in particular from 4 to 20. Alkyl may be, for example, methyl, ethyl, isopropyl, normal propyl, normal butyl, isobutyl, secondary butyl, tertiary butyl as well as various isomeric pentyl, hexyl, heptyl, octyl, nonyl, decyl groups , undecyl, dodecyl, tridecyl, tetradecyl, pentadecyl, hexadecyl, heptadecyl, octadecyl, nonadecyl and eicosyl. Aryl as Ri or R2 preferably contains 6 to 14 carbon atoms. It can be, for example, phenyl, tolyl, pentalinyl, indenyl, naphthyl, blueinyl and anthryl. Aralkyl as R? or R2 preferably contains 7 a
12 carbon atoms and in particular 7 to 10 carbon atoms. It may be, for example, benzyl, phenylethyl, 3-phenylpropyl, α-methylbenzyl, 4-phenylbutyl or α, α-dimethylbenzyl. Especially preferred are the polysiloxanes of the formula I, in which Ri and R2, independently of one another, mean methyl, ethyl or phenyl. As component (b), polysiloxanes of the formula I are particularly preferred, in which Ri and R 2 represent methyl and n means 4 to 20. The polysiloxanes according to component (c) are also known to those skilled in the art and can be obtained in accordance with to known methods. Preferably, a cyclic polysiloxane of the formula II is used as component (c):
wherein Ri and R, independently of one another, mean alkyl of 1 to 18 carbon atoms, aryl of 5 to 14 carbon atoms or aralkyl of 6 to 24 carbon atoms, and m means an integer of 3 to 12. Alkyl, aryl and aralkyl in the formula (II) have the same meaning as the corresponding groups of the formula (I). As component (c), cyclic polysiloxanes of the formula II are preferred, in which R x and R 2, independently of one another, mean methyl, ethyl or phenyl, and m means an integer from 3 to 8. In particular, R and R 2 represent methyl and m means an integer from 6 to 8. As described in J. Am. Chem. Soc. 6_8, 358
(1946), these cyclic polysiloxanes can be isolated from the product mixture that is generated in the hydrolysis of the corresponding dialkyl-, diaryl- or diaralkyldiclorsilanes. As component (c), the commercially available compounds octamethylcyclotetrasiloxane (m = 4), decamethylcyclopenta siloxane (m = 5) and, in particular, dodecamethylcyclohexasiloxane (m = 6), as well as the hydrolysates of dimethyldiclorsilane, in particular undistilled hydrolysates, since they have high portions of cyclic polysiloxanes with the preferred ring size m = 6 to 8, that is, in addition to dodecamethylcyclohexasiloxane also tetradecamethylcycloheptasiloxane (m = 7) and hexadecamethylcyclooctasiloxane (m = 8). As reagent of surface activity in the form of component (c) of the compositions according to the invention, perfluorinated nonionic polyalkylene derivatives, such as perfluorinated polyoxyalkylene, are suitable. Preference is given to compounds of a combination of a perfluorinated aliphatic alkyl unit Rf with a hydrocarbon unit R, wherein the latter contains at least one mono- or divalent polar functional group, which preferably contains oxygen, such as, for example, -OH, -COOH, -COOR, -COO-, -CO-, -0-. Suitable compounds are alkoxylated, especially ethoxylated, perfluorinated fatty acid derivatives, for example: Rf-COO- (CH2-CH20) mR (III) OR Rf- (CH2CH20) mR (IV) wherein m means 1 to 200, Rf means a perfluorinated alkyl, linear or branched, of 2 to 22 carbon atoms, and R means H, alkyl of 1 to 6 carbon atoms or
Rf. Preferably, compounds of the formulas (III) or (IV) are used, in which the molar mass according to the theoretical additive formulait is only from 200 to 10'000, in particular from 300 to 8000. Preferred compounds are, for example, F3C- (CF2) 5- (CH2CH20) -H = 1, 2, 2-tetrahydroperfluoroctanol (according to formula (IV), wherein Rf = perfluorinated normal hexyl, m = 1 and R = H) or Rf-COO- (CH2CH20) mR, wherein Rf means linear alkyl perfluorinated with 16 to 18 carbon atoms, m = 110- 130 and R = H. These compounds can be obtained in part from several suppliers in commerce, for example, as ZONYL® Fluorochemical Intermediates (DuPont), for example, ZONYL® BA-L and BA fluoroalcohol, or FLUORAD® Fluorosurfactants (3M ), for example, FLUORAD® FC-431. Other surface-active compounds which can be used according to the invention can be found in the technical bulletins of the aforementioned manufacturers, for example, "Technical Information" 233592B (1/94) on ZONYL® Fluorochemical Intermediates (DuPont). In the compositions according to the invention, one or more compounds of the components (a) to (d) can be used respectively. In principle, the compositions according to the invention can be hardened by cationic polymerization of the epoxy resin system with an initiator system or with any usual epoxy hardener. However, anhydride hardeners are preferably used. Therefore, another object of the invention is constituted by a composition containing the above-mentioned components (a) to (d) and, additionally, as component (e), a polycarboxylic acid anhydride. They can be linear, aliphatic, polymeric anhydrides, such as, for example, polyanebic acid polyanhydride or polyazelaminic acid polyanhydride, or cyclic carboxylic acid anhydrides. Cyclic carboxylic acid anhydrides are preferred. Examples of cyclic carboxylic acid anhydrides are: succinic acid anhydride, citraconic anhydride, itaconic anhydride, succinic anhydrides substituted with alkenyl, dodecenylsuccinic anhydride, maleic acid anhydride and tricarballylic acid anhydride, adduct anhydride of maleic acid with cyclopentadiene or methylcyclopentadiene, adduct of lytic acid with maleic anhydride, alkylated anhydrides of endoalkylenetetrahydrophthalic acid, anhydride of methyltetrahydrophthalic acid and anhydride of trahydrofic acid, where mixtures of isomers of the latter two are especially suitable. . Hexahydrophthalic anhydride and methylhexahydrophthalic acid anhydride are particularly preferred. Other examples of cyclic carboxylic acid anhydrides are aromatic anhydrides, such as pyromellitic acid dianhydride, trimellitic acid anhydride and phthalic anhydride. Chlorinated or brominated anhydrides can also be used, such as, for example, tetrachlorophthalic acid anhydride, tetrabromphthalic acid anhydride, dichlormaleic acid anhydride and clorendic anhydride. Optionally, the compositions according to the invention may additionally contain a hardening accelerator (f). Suitable accelerators are known to the person skilled in the art. Examples which may be mentioned are: complexes of amines, especially tertiary amines, with boron trichloride or boron trifluoride; tertiary amines, such as benzyldimethylamine; urea derivatives, such as optionally substituted N-4-chlorophenyl-N ', N 1 -dimethylurea (monuron), imidazoles, such as imidazole or 2-phenylimidazole. For the aforementioned compositions containing epoxidized oils, the preferred accelerators are the tertiary amines, in particular benzyldimethylamine, and the imidazoles (for example, 1-methylimidazole). The components (e) and (f) are used in the amounts which are normally effective, ie sufficient for the hardening of the compositions according to the invention. The proportion of the components (a) and (e) and, optionally, (f), depends on the type of compound used, the required curing speed and the properties desired in the final product, and the person skilled in the art can determine it easily. In general, 0.4 to 1.6, preferably 0.8 to 1.2, equivalents of anhydride groups per equivalent of epoxy are employed. In general, the mixture of resins (a) to (d) and the hardener component (e), possibly together with the accelerator (f), are stored separately and mixed just before application. If the mixture of resins (a) to (d) must be stored before curing, it requires additional auxiliaries as an optional component (g), in order to keep the emulsion-forming mixture storable. As stabilizing aids of this type, both emulsifiers (surface activity and surface area compounds) and also thickeners (for example, silicic acids, bentonite, dibenzylidensorbitol, etc.) can be used. The above and their use are known to the person skilled in the art. Of the aforementioned auxiliaries, highly dispersed silicic acid is preferably used. Highly dispersed, hydrophilic, untreated silicic acids are especially suitable. You can get them in trade, for example, like Aerosil. The effective amounts of silicic acid are in the range of 0.01 to 3.5, preferably 0.05 to 3.0% by weight, based on the sum of the components (a) to (d), and the average size of the primary particles is conveniently around 12 nm. Therefore, the compositions stable to storage, which can be obtained by the addition of stabilizing aids, such as emulsifiers or thickeners, are also subject of the invention. Instead of the hardening component (e), optionally together with an accelerator (f), the mixture of resins (a) to (d) may contain as component (e) an initiator system for the cationic polymerization of the epoxy resin. As the initiator system for the cationic polymerization of the epoxy resins, for example, thermally activatable initiators are used, such as onium salts, oxonium salts, iodonium salts, sulfonium salts, phosphonium salts or quaternary ammonium salts, which do not They contain nucleophilic anions. These initiators and their application are known. For example, in U.S. Patent 4,336,363, in European Patent EP-A-0 379 464 or in European Patent EP-A-0580 552, specific sulfonium salts are disclosed as a hardener for epoxy resins. In U.S. Patent 4,058,401, in addition to the determined sulfonium salts, the corresponding tellurium and selenium salts are also described. The quaternary ammonium salts as thermally activatable initiators are disclosed, for example, in European Patent EP-A 0 066 543 and in European Patent EP-A-0 673 104. In this case, these are salts of nitrogen bases aromatic - heterocyclic, with non-nucleophilic halide anions, for example, complexes, such as BF4", PF6", SbFs (OH) "and AsF6". Preferably, N-benzylquinolium hexafluoroantimonate is used as the quaternary ammonium salt. In the use of the quaternary ammonium salts, it is also convenient to use a thermal radical former, such as, for example, pinacols and their ethers, esters or silyl derivatives. These compounds are known and can be obtained according to known procedures. As the thermal radical former, pinacols, such as acetophenonepinacols or, in particular, 1, 1, 2, 2-tetraphenyl-1,2-ethanediol (benzpinacol), are preferably used. In particular, N-benzylquinolium-hexafluoroantimonate is used as a thermally activatable initiator with 1,2,1-tetraphenyl-1,2-ethanediol, preferably in a molar ratio of 1: 1. In general, the activation temperature of the cationic initiators is located above room temperature, preferably in the range between 60 and 180 ° C, especially between 90 and 150 ° C. In general, the amount of the cationic initiator contained in the cationically hardenable epoxy resin is 0.05 to 30% by weight, preferably 0.5 to 15% by weight, based on the amount of the cationically polymerizable epoxy resin. Also, the hardenable mixtures may contain agents for toughness ("Toughener"), such as Core / Shell polymers or elastomers known to the person skilled in the art as "Rubber Toughener" or graft polymers containing elastomers. Suitable tenacity agents are described, for example, in European Patent EP-A-0 449 776.
They are preferably used in an amount of 1 to 20% by weight, based on the total amount of epoxy resin in the composition.
Likewise, hardenable mixtures, in addition to the aforementioned, may contain other fillers such as metal powder, wood dust, glass powder, glass spheres, semimetal and metal oxides, such as, for example, Si02 (quartz sand, quartz powder, silanized quartz powder, molten silicon powder, silanized molten silicon powder), aluminum oxide, titanium oxide and zirconium oxide, metal hydroxides, such as Mg (OH) 2, Al (OH) 3, Al (OH) 3 silanized and ALO (OH), nitrides of semimetals and metals, such as, for example, silicon nitride, boron nitride and aluminum nitride, semimetal and metal carbides
(SiC and boron carbides), metal carbonates (dolomite, gis,
CaCO3), metal sulphates (barite, gypsum), rock powders, such as hydromagnesite and huntite, and natural and synthetic minerals, mainly from the series of silicates, such as, for example, zeolites (especially molecular sieves), talc, mica, kaolin, wollastonite and others. Preferred fillers are quartz powder, silanized quartz powder, aluminum hydroxide or aluminum oxide. In addition to the aforementioned additives, the hardenable mixtures may contain other customary additives, such as, for example, antioxidants, photoresists, flame retardants, fillers containing water of crystallization, plasticizers, dyes, pigments, fungicides, thioxotropic agents, tenacity improvers, defoamers, antistatic agents, lubricants, antisease agents, humectants and mold release aids. The compositions according to the invention can be obtained according to known methods, with the aid of known mixing aggregates, such as, for example, stirrers
(especially dispersers and Supraton® with high shear gradient), mixers, rollers or dry mixers.
In the case of solid epoxy resins, the dispersion can also be carried out in the melt. The curing of the mixtures according to the invention can be carried out, as is known, in one or more steps. In general, it is carried out by heating the mixtures at temperatures between 60 ° C and 200 ° C, in particular between 80 ° C and 180 ° C. The invention also relates to crosslinked products that can be obtained by hardening a composition according to the invention. Surprisingly, the addition of the two chemically different siloxane components and the surface activity reagent to the compositions according to the invention, in comparison with the corresponding unmodified systems (Comparative Example 1), produces practically no worsening, or only slight, of the mechanical and electrical properties of the products obtained from them. In general, the addition of silicones causes a worsening of the adhesive properties. Even so, the compositions according to the invention unexpectedly show a good adhesion to the metal, which is reflected in excellent values of bending break and tear force without modifications. In the same way, a behavior at comparatively very good temperature change of the encapsulated molding bodies with a system according to the invention is surprisingly observed. With respect to unmodified systems, the invention offers the advantage that traces of the siloxanes used according to the invention can migrate to the soils present in the hardened material. In this way, even an initially hydrophilic dirt layer becomes hydrophobic (hydrophobic transfer). This results in the water sliding more easily from the dirt and does not form, as in the case of the unmodified system, a continuous and conductive dirt / water layer, and thereby, harmful. Even, this effect is surprisingly marked. Water slides essentially better and faster. Surprisingly, also the durability of this effect is very good. That is to say, even in case of detachment several times and the dirt layer is deposited again, the marked hydrophobic transfer effect is maintained. Also in the case of lightly soiled insulators based on epoxy resin, a loss of the original hydrophobicity and, with it, an increase in surface conductivity can occur. The reason are micro-discharges that can be caused, for example, by certain drops of rain on the insulating surface. With respect to unmodified systems (Comparative Example 1), another advantage of the present invention is that with the present systems, surprisingly, after a forced loss like this, the recovery of the original hydrophobicity can take place. This implies that the original hydrophobia is restored within a period of hours to a few days (recovery effect). In this way, the systems according to the invention, with their excellent hydrophobic properties in the form of a very good and also permanent hydrophobic transfer effect in combination with a very good recovery effect and good properties at temperature changes , are predestined to be used as insulation material in outdoor applications in difficult climatic zones. The compositions according to the invention are especially suitable as molding resins, molding compounds ("structural casting"), rolling resins, compression molding materials ("epoxy molding compounds"), coating compositions, and special, as electrical insulation masses. The use of the compositions according to the invention as electrical insulation material is another object of the invention. The following commercial substances are used in the following examples: Epoxy resin 1: hexahydrophthalic acid diglycidyl ester; epoxy content: 5.6 to 6.2 val / kg ("CY 184", Ciba Spezialitáten Chemie). ESO: epoxidized soybean oil; Epoxy content: 4.10 to 4.20 val / kg; ("Reoplast", Witco). ELO: epoxidized linseed oil; Epoxy content: 5.50 to 5.65 val / kg; ("Merginat", Harburger Chemie). Hardener 1: hardener mixture of 70 parts by weight of hexahydrofonic acid anhydride and 30 parts by weight of methylhexahydrophthalic acid anhydride. W 12: untreated quartz powder (Quarzwerke
Frechen). W 12 EST: quartz powder pretreated with epoxysilane (Quarzwerke Frechen). Polysiloxane 1: OH-terminated polydimethylsiloxane with a viscosity of 5 Pa. * S ("NG200-5000", Wacker).
Polysiloxane 2: mixture of linear polydimethylsiloxanes terminated in OH (< 40%) and cyclic dimethylsiloxanes (> 60%), with a viscosity of 5 to 20 Pa * s ("Dimethylmethanolysat", GE-Bayer AG). Fluorad: untreated perfluorinated aliphatic polymeric ester (perfluorinated ethoxylated fatty acid) ("Fluorad FC 431", 3M). BDMA: benzyldimethylamine. 1-M1: 1-methylimidazole. Aerosil: highly dispersed hydrophilic silicic acid ("Aerosil 200", Degussa).
Preparation examples Comparative Example 1: In a paddle mixer, 1000 g of epoxy resin 1, 900 g of hardener 1, 5.0 g of BDMA and 2700 g of quartz powder W are mixed at 60 ° C in a lapse of 30 minutes. 12 EST, and then, at approximately 10 mbar, it is degassed briefly. Subsequently, the composition hardens 6 hours at 80 ° C and 10 hours at 140 ° C. The properties of the hardened product are summarized in Table 1.
Example of conformity with the invention 1: In a mixer with dispersing discs they are mixed in 10 minutes at 3750 r.p.m. and at room temperature 9050 g of epoxy resin 1, 200 g of polysiloxane 1, 500 g of polysiloxane 2 and 100 g of Fluorad. Then add 150 g of Aerosil to the mixture and mix for one hour at 3750 r.p.m. and room temperature. In this way a white emulsion is obtained, stable to storage. 1000 g of the resin premix obtained in this way are mixed with a paddle mixer, at 60 ° C, in a lapse of 30 minutes, with 814.5 g of hardener 1, 4.5 g of BDMA and 2578.1 g of quartz powder W 12 EST, and then degas briefly to about 10 mbar. Subsequently, the composition hardens 6 hours at 80 ° C and 10 hours at 140 ° C. The properties of the hardened product are summarized in Table 1.
Example of conformity with the invention 2: In a mixer with dispersing discs they are mixed in 10 minutes at 3750 r.p.m. and at room temperature 6855 g of epoxy 1, 200 g of polysiloxane 1, 500 g of polysiloxane 2, 10 g of Fluorad, 1143 g of ESO and 1143 g of ELO. Then add 150 g of Aerosil to the mixture and mix for one hour at 3750 r.p.m. and room temperature. In this way a white emulsion is obtained, stable to storage. 1000 g of the resin premix obtained in this way are mixed with a paddle mixer, at 60 ° C, in a lapse of 30 minutes, with 806.6 g of hardener 1, 2.3 g of BDMA, 4.5 g of 1-MI and 2567.1 g of quartz powder W 12 EST, and then degas briefly to about 10 mbar. Subsequently, the composition hardens 6 hours at 80 ° C and 10 hours at 140 ° C. The properties of the hardened product are summarized in Table 1.
EXAMPLE OF COMPLIANCE WITH THE INVENTION 3: In a mixer with dispersing discs, at first 110 ° 50 g of dibenzylidene sorbitol are dissolved in 9100 g of epoxy resin 1, and then the mixture is cooled to room temperature. Then 200 g of polysiloxane 1, 500 g of polysiloxane 2 and 100 g of Fluorad are added, and the mixture is stirred for 15 minutes at 1500 r.p.m. and room temperature. Then, 50 g of Aerosil are added to the mixture and the whole mixture is stirred again for one hour at 1500 r.p.m. and room temperature. A white emulsion is obtained, stable to storage. 1000 g of the resin premix obtained in this way is mixed with a paddle mixer, at 60 ° C, in a lapse of 30 minutes, with 820 g of hardener 1, 4.5 g of BDMA and 3542 g of quartz powder W 12 EST, and then degas briefly to about 10 mbar.
Application Example 1: By means of the pressure gelation process, rigid insulators are manufactured. For this, the non-hardening mixtures obtained according to Example 1 and Comparative Example 1 analogously, but with a filling degree of 66% by weight, they are injected into a metal mold heated to 140 ° C, treated with release agents. After gelation (after approximately 20 minutes), the molded part is removed from the mold and further hardens 10 hours at 140 ° C. The insulator made with the composition according to the invention surprisingly has an equally high breaking strength by bending as that of the insulator made from the analogous composition without silicone additives, while a comparison of the tearing forces demonstrates that the material of conformity with the invention it remains very well adhered to the insertion (see Table 1).
Application Example 2: The following tests show the best performance of the insulators made with the modified system according to the invention, in atmospheres with a high air pollution, especially the best hydrophobic properties: 2A: Hydrophobic transfer effect examine samples of the examples according to the invention 1 to 3 to check the so-called "hydrophobic transfer effect". For this purpose, on four plates of the material obtained respectively with the product according to the examples according to the invention 1 to 3 and to Comparative Example 1 (obtained without using release agents containing silicone and cleaned with acetone after demolding), applies artificial dirt. For this purpose, quartz powder W 12 is applied to the plates by means of a vibrating device, in such quantities per surface, that subsequently, when flattening with a ruler or the like, a layer thickness of 0.5 mm can be achieved. In order to check whether the material transfers the hydrophobicity to the hydrophilic quartz layer itself, a drop of water of 30 μl is applied to the outer layer at regular intervals with a pipette, whose behavior is observed and classified according to the following scheme:
Transfer level system (NT)
Transfer level system: 500 μm quartz powder coating (W 12 quartz powder, Quarzwerke Frechen), 30 μl water drop application
2B: Checking the recovery effect by the plasma test To check the recovery effect, the state of the hydrophobicity is determined (see point 2B1). Subsequently, the hydrophilic state is forced by applying a plasma (see point 2B2). After the plasma treatment, which is intended to cause the loss of hydrophobicity, the state of the surface is again examined at various times (immediately, after one hour (h) and one day (d)). A recovery effect is observed when a sample passes from the hydrophilic state (approximately in class 5 to 7) to the hydrophobic state (approximately to class 1 to 4), that is, when it was restored to something before the plasma state. The results are shown in Table 1. 2B1: The state of momentary hydrophobicity of the samples is determined as follows: a sample surface of approximately 100 cm2, in vertical position, is sprayed with water 20 times (once per second) ) with a rolling bottle at a distance of about 25 ± 10 cm. After another 10 seconds, the sample is checked and the surface condition is classified according to the following scheme:
Classification of the hydrophobic state in the spray test
Class Properties Description of the effects CH 1 Excellent surface hydrophobia Only discrete drops, the wet angle of most drops is > 80 ° Very good surface hydrophobicity Only discrete drops, the wet angle of most drops is > 50 ° but < 80 ° Good surface hydrophobia Only discrete drops, the wet angle of the
2B2: A loss of hydrophobicity or hydrophilicity is forced by a plasma treatment. To do this, the 10 x 10 x 0.4 cm3 test plates are placed in a plasma chamber of type 440 (Technics Plasma GmbH) and are subjected to the following conditions: plasma application time: 2 minutes, pressure: 2 at 3 mbar, gas: oxygen, power: 200 Watts. This treatment produces the loss of hydrophobicity (see Table 1).
Comparative Application Examples: In principle analogously to the example according to the invention 1, three comparative examples are produced. Unlike Comparative Example 1, where the polysiloxanes 1 and 2 and a reagent of surface activity are simultaneously used, only one additive is used respectively. The compositions and the properties of the hardened products are summarized in Table 1. Table 1
Comparative examples and according to the invention EC 1 The 1 The 2 The 3 EC 2 EC 3 EC 4
Composition [parts by weight] Epoxy resin 1 100 90.5 68.55 91 97 94 99 ESO 11.43 ELO 11.43 Polysiloxane 1 2 2 2 Polysiloxane 2 5 5 5 Fluorad 1 0.1 1 1 BDMA 0.5 0.45 0.23 0.45 0.49 0.47 0.5 1-MI 0.45 Aerosil 1.5 1.5 0.5 Dibenzylidensorbitol 0.5 Hardener 1 90 81.45 80.66 82 87.3 84.6 89.1 W 12 EST 270 257.8 254.6 354.2 266.1 262.3 268.7
Stability of the emulsion A good phase good good bad bad One phase (resin + Aerosil components) TG (DSC) [° C1 110 110 109 110 tangent d (50 Hz) [% at 24 ° C 1 0.5 0.2 at 100 ° C 2 1.6 1.7 Temperature with a loss of 8% [° C] 125 127 123 Tensile strength [MPa] 90 86 75 Elongation at break [%] 1.4 1.4 1.3 Resistance to bending [MPa] 125 137 127 Elongation of fiber edge [%] 1.3 1.6 1.7 Elastic bending module [MPa] 10500 9785 8813 Critical voltage factor K1C [MPa * (m) 1/2] 2.25 2.24 2.12 DSC (Differential Scanning Calorimetry) made with the TA 4000 device Mettier) Electrical values (tangent d) in accordance with DIN
53483, measuring frequency 50 Hz Tensile strength and breaking strength conforming to ISO R527 Flexural strength, edge fiber elongation and elastic flexural modulus conforming to ISO 178
K1C and G1C: Double torsion test
Table 1 shows: 1) The properties of a reference material without modification: no hydrophobic transfer is observed, but a good surface hydrophobicity is observed. However, after its loss (by plasma), surface hydrophobia is not restored.
2) The properties of the compositions according to the invention: Example 1 very quickly shows a good hydrophobic transfer effect, also in the second application of the outer layer. In the initial state, the material is quite hydrophobic and returns to recover very quickly the hydrophobicity after the forced loss by plasma, and with it, has an excellent recovery effect. The second example shows practically the same hydrophobic transfer effect as Example 1, but a less good surface hydrophobicity. After its loss
(by plasma), it is restored, although less quickly than in Example 1. The third example has a very good and rapid action of hydrophobic transfer effect. 3) The other Comparative Examples show that the effect of recovery can not be influenced simply by the various additives. In none of the cases is hydrophobic reestablishment after forced loss.
Application Example 3 (comparative fissure test): Molded steel bodies are respectively encapsulated with the molding resin system 3, according to the invention (see example according to the invention 3) and a molding resin system without modifications and the resin hardens. The molded bodies are then subjected to a cycle with defined time units, at certain intervals of constant lack of temperature, and after each interval they are examined as to the eventual occurrence of fissures. Preparation of the comparative mixture without modifications (analogously to Comparative Example 1): in a mixer with paddles, 1000 g of epoxy resin 1, 900 g of hardener 1, 5.0 g of water are mixed in a lapse of 30 minutes at 60 ° C. BDMA and 3780 g of W 12 EST quartz powder, and then degas briefly to about 10 mbar. The molded bodies are subjected to the following crack test:
Crack test In an aluminum mold with depressions, 20 sample bodies of steel are produced respectively from the molding resin systems to be compared, by applying the APG (Automatic Pressure Gelation) process. In this process, the liquid resin mixture is heated to 40-60 ° C and stirred under vacuum. The resin mixture is then injected under light pressure of 2-5 bar into the mold heated to 140 -150 ° C. Maintaining the pressure, the resin system is allowed to gel in the mold for a few minutes. In the foregoing, each sample body is manufactured with an internal steel body. After gelation, the sample bodies are removed from the mold and further hardened for 10 hours at 140 ° C. Then, the sample bodies are subjected to a certain temperature profile. The temperature profile consists of a series of cycles that have an upper temperature limit of 25 ° C, in which the inspection is also carried out as regards the appearance of cracks. In contrast, the lower limit of the temperature becomes lower with each cycle. In each of them, the samples are quickly taken to the lower temperature limit, respectively, higher and are maintained each time a few hours at the corresponding limit temperature. The cycle in which the sample shows the first fissures is noted. The average crack temperature of a resin system is determined from the frequency distribution of crack formation per cycle. The results of the comparative fissure test of Application Example 3 are presented in the following table:
For the comparative system, an average crack temperature of -12 ° C results, however, for the system according to the invention, of -66 ° C. Thus, the systems according to the invention, in comparison with an unmodified system, in addition to their hydrophobic behavior, surprisingly show an obviously better behavior at temperature changes.
Claims (22)
1. A composition characterized in that it contains: (a) an epoxy resin,? (b) an OH-terminated polysiloxane, (c) a cyclic polysiloxane, and (d) a non-ionic, fluoroaliphatic active surface reactant.
2. A composition according to claim 1, characterized in that, based on the total composition of (a), (b), (c) and (d), it contains 77.0 to 97.99% by weight of component (a), 1.0 to 10.0% by weight of component (b), 1.0 to 10.0% by weight of component (c) and 0.01 to 3.0% by weight of component (d), where the sum of components (a), (b), (c) and (d) is 100% by weight.
3. A composition according to claim 1, characterized in that it contains as component (a) a cycloaliphatic epoxy resin or an epoxidation product of an unsaturated natural oil or a derivative thereof.
4. A composition according to claim 1, characterized in that it contains as component (a) diglycidyl ester of hexahydrophthalic acid and 3,4-epoxycyclohexylmethyl-3 '4'-epoxycyclohexanecarboxylate, as well as epoxidized soybean oil or epoxidized linseed oil.
5. A composition according to claim 1, characterized in that it contains as component (b) a polysiloxane of the formula I: wherein Ri and 2, independently of one another, mean alkyl of 1 to 18 carbon atoms, aryl of 5 to 14 carbon atoms or aralkyl of 6 to 24 carbon atoms, and n means an average value of 3 to 60.
6. A composition according to claim 5, characterized in that it contains as component (b) a polysiloxane of the formula I, in which Ri and R, independently of one another, mean methyl, ethyl or phenyl.
7. A composition according to claim 5, characterized in that it contains as component (b) a polysiloxane of the formula I, in which Ri and R2 signify methyl.
8. A composition according to claim 1, characterized in that it contains as component (c) a cyclic polysiloxane of the formula II: wherein Ri and R2, independently of one another, mean alkyl of 1 to 18 carbon atoms, aryl of 5 to 14 carbon atoms or aralkyl of 6 to 24 carbon atoms, and m means an integer of 3 to 12.
9. A composition according to claim 8, characterized in that it contains as component (c) a cyclic polysiloxane of the formula II, in which Ri and R, independently of one another, mean methyl, ethyl or phenyl, and m means a number whole from 3 to 8.
A composition according to claim 8, characterized in that it contains as component (c) octamethylcyclotetrasiloxane, decamethylcyclo-pentasiloxane, dodecamethylcyclohexasiloxane or a dimethylclorsilane hydrolyzate.
11. A composition according to claim 11, characterized in that it contains as component (d) a non-ionic, fluoraliphatic reagent of surface activity of the formula: Rf-COO- (CH2-CH20) m -R (III) Rf- (CH2CH20) m -R (IV) wherein ra means 1 to 200, Rf means a perfluorinated alkyl, linear or branched, of 2 to 22 carbon atoms, and R means H, alkyl of 1 to 6 carbon atoms or Rf.
12. A composition according to claim 11, characterized in that it contains as component (d) compounds of the formula (III) or (IV), in which the molar mass conforms to the theoretical additive formula, is from 300 to 8000.
13. A composition according to claim 12, characterized in that it contains as component (d) 1, 1, 2, 2-tetrahydroperfluoroctanol or Rf-COO- (CH2CH20) mR, wherein Rf means a linear perfluorinated alkyl with 16-18 carbon atoms, m = 110-130 and R = H.
14. A composition according to claim 1, characterized in that it additionally contains as another component (g) emulsifiers or, also, thickeners.
15. A composition according to claim 14, characterized in that it contains as component (g) 0.01 to 3.5% by weight, referred to the sum of components (a) to (d), hydrophilic silicic acid, highly dispersed, untreated.
16. A composition according to claim 1 or 14 or 15, characterized in that it additionally contains a hardener.
17. A composition according to claim 16, characterized in that the hardener is selected from a polycarboxylic acid anhydride (e) or a polycarboxylic acid anhydride (e) together with an accelerator (f).
18. A composition according to claim 16, characterized in that the hardener is an initiator system for cationic polymerization.
19. A composition according to any of claims 1 or 14 to 18, characterized in that it contains fillers.
20. A composition according to claim 19, characterized in that quartz powder, silanized quartz powder, aluminum hydroxide or, alternatively, aluminum dioxide are contained as fillers.
21. Cross-linked products characterized in that they can be obtained by hardening a composition according to any of claims 1 to 20.
22. Electrical insulation material according to claim 21.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CH2441/98 | 1998-12-09 |
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Publication Number | Publication Date |
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MXPA01005404A true MXPA01005404A (en) | 2002-03-26 |
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