HK1039627B - 疏水性還氧樹脂體系 - Google Patents

疏水性還氧樹脂體系

Info

Publication number
HK1039627B
HK1039627B HK02100960.4A HK02100960A HK1039627B HK 1039627 B HK1039627 B HK 1039627B HK 02100960 A HK02100960 A HK 02100960A HK 1039627 B HK1039627 B HK 1039627B
Authority
HK
Hong Kong
Prior art keywords
epoxide resin
resin system
hydrophobic epoxide
hydrophobic
composition
Prior art date
Application number
HK02100960.4A
Other languages
English (en)
Other versions
HK1039627A1 (en
Inventor
Beisele Christian
Kainmuller Thomas
Tang Qian
Original Assignee
Vantico Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vantico Ag filed Critical Vantico Ag
Publication of HK1039627A1 publication Critical patent/HK1039627A1/xx
Publication of HK1039627B publication Critical patent/HK1039627B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/06—Ethers; Acetals; Ketals; Ortho-esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/549—Silicon-containing compounds containing silicon in a ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/46—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes silicones
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Organic Insulating Materials (AREA)
  • Processes Of Treating Macromolecular Substances (AREA)
HK02100960.4A 1998-12-09 2002-02-07 疏水性還氧樹脂體系 HK1039627B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH244198 1998-12-09
PCT/EP1999/009240 WO2000034388A1 (de) 1998-12-09 1999-11-29 Hydrophobes epoxidharzsystem

Publications (2)

Publication Number Publication Date
HK1039627A1 HK1039627A1 (en) 2002-05-03
HK1039627B true HK1039627B (zh) 2003-07-04

Family

ID=4233896

Family Applications (1)

Application Number Title Priority Date Filing Date
HK02100960.4A HK1039627B (zh) 1998-12-09 2002-02-07 疏水性還氧樹脂體系

Country Status (15)

Country Link
EP (1) EP1141127B1 (zh)
JP (1) JP4823419B2 (zh)
KR (1) KR100659220B1 (zh)
CN (1) CN1121447C (zh)
AT (1) ATE232224T1 (zh)
AU (1) AU767776B2 (zh)
BR (1) BR9916010A (zh)
CA (1) CA2351333A1 (zh)
CZ (1) CZ20012031A3 (zh)
DE (1) DE59904252D1 (zh)
ES (1) ES2190277T3 (zh)
HK (1) HK1039627B (zh)
HU (1) HUP0200220A2 (zh)
WO (1) WO2000034388A1 (zh)
ZA (1) ZA200104729B (zh)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10051051A1 (de) * 2000-10-14 2002-04-18 Bosch Gmbh Robert Silikonmodifizierte Einkomponentenvergußmasse
US6653378B2 (en) * 2000-12-18 2003-11-25 Dow Corning Corporation Silicone elastomer compositions
EP1354916A1 (de) * 2002-04-17 2003-10-22 Abb Research Ltd. Selbstheilende Epoxidharze für die Herstellung von elektrischen Isolierungen
EP1568733A1 (de) * 2004-02-20 2005-08-31 Abb Research Ltd. Füllstoff bestehend aus mit Organopolysiloxan beschichteten porösen anorganischen Füllstoffteilchen zur Verwendung in härtbaren Vergussmassen
DE102004008772A1 (de) 2004-02-23 2005-09-08 Institut für Neue Materialien Gemeinnützige GmbH Abriebbeständige und alkalibeständige Beschichtungen oder Formkörper mit Niedrigenergieoberfläche
JP4572661B2 (ja) * 2004-11-05 2010-11-04 日立化成工業株式会社 樹脂組成物、それを用いたプリプレグ、積層板および印刷配線板
WO2007010025A1 (fr) 2005-07-20 2007-01-25 Areva T & D Sa Isolateur electrique et procede de fabrication.
US7745516B2 (en) * 2005-10-12 2010-06-29 E. I. Du Pont De Nemours And Company Composition of polyimide and sterically-hindered hydrophobic epoxy
JP2008037921A (ja) * 2006-08-02 2008-02-21 Meidensha Corp 絶縁性高分子材料組成物
KR100834351B1 (ko) * 2006-11-24 2008-06-02 제일모직주식회사 멀티칩 패키지　밀봉용 에폭시 수지 조성물　및 이를이용한 멀티칩 패키지
RU2466471C2 (ru) * 2008-02-12 2012-11-10 Абб Рисерч Лтд Поверхностно-модифицированная электроизоляционная система
WO2009100757A1 (en) * 2008-02-12 2009-08-20 Abb Research Ltd Surface modified electrical insulation system
JP4893720B2 (ja) * 2008-09-25 2012-03-07 パナソニック電工株式会社 熱硬化性樹脂組成物及びその製造方法
CN101445396B (zh) * 2008-12-09 2011-08-31 西安交通大学 一种瓷绝缘子表面超疏水性涂层的制备方法
EP2230267B1 (en) * 2009-03-20 2014-08-13 ABB Research Ltd. Method of producing a curable epoxy resin composition
JP5325742B2 (ja) * 2009-10-29 2013-10-23 日本ペイント株式会社 天然油脂を原料とする有機無機複合コーティング組成物
CN102884131A (zh) * 2010-05-07 2013-01-16 住友电木株式会社 电路基板用环氧树脂组合物、预成型料、层叠板、树脂片、印刷线路板用层叠基材、印刷线路板及半导体装置
SG187208A1 (en) * 2010-08-31 2013-02-28 Mitsubishi Gas Chemical Co Resin composition, prepreg, and laminated sheet
JP5965485B2 (ja) * 2011-08-31 2016-08-03 ハンツマン・アドヴァンスト・マテリアルズ・（スイッツランド）・ゲーエムベーハー 計器用トランスフォーマーを封止するための疎水性エポキシ樹脂システムの使用
CN108350150B (zh) * 2015-06-16 2021-09-10 亨斯迈先进材料许可(瑞士)有限公司 环氧树脂组合物
CN108752749A (zh) * 2018-06-29 2018-11-06 合肥帧讯低温科技有限公司 一种拉伸强度疏水性相协调的薄膜及其制备方法
CN110722652B (zh) * 2019-10-25 2021-05-28 福建省顺昌县升升木业有限公司 一种杉木疏水改性处理方法
CN112341756B (zh) * 2020-10-12 2022-05-24 北京国电富通科技发展有限责任公司 用于机器人绝缘衣的有机硅改性环氧树脂及其制备方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4609692A (en) * 1984-11-28 1986-09-02 E. I. Du Pont De Nemours And Company Low temperature curing maintenance coatings comprising (a) epoxy resin (b) polyamine curing agent (c) polymer containing pendant aminoester groups and (d) organic solvent
JPS63309515A (ja) * 1987-06-12 1988-12-16 Toshiba Corp エポキシ樹脂組成物及び樹脂封止型半導体装置
JP2927817B2 (ja) * 1989-05-19 1999-07-28 日東電工株式会社 半導体装置
JP3321858B2 (ja) * 1992-11-25 2002-09-09 ジェイエスアール株式会社 熱硬化性樹脂組成物
DE19523897C2 (de) * 1995-06-30 2002-10-24 Bosch Gmbh Robert Verwendung von Silicon-modifizierten Epoxidharzen als Vergußmassen für elektrotechnische oder elektronische Bauteile
JP3592825B2 (ja) * 1996-02-07 2004-11-24 東レ・ダウコーニング・シリコーン株式会社 硬化性エポキシ樹脂組成物および電子部品
US5757541A (en) * 1997-01-15 1998-05-26 Litton Systems, Inc. Method and apparatus for an optical fiber amplifier
ES2237832T3 (es) * 1997-08-27 2005-08-01 Huntsman Advanced Materials (Switzerland) Gmbh Sistema de resina epoxi hidrofoba.

Also Published As

Publication number Publication date
EP1141127A1 (de) 2001-10-10
WO2000034388A1 (de) 2000-06-15
CZ20012031A3 (cs) 2001-11-14
HUP0200220A2 (en) 2002-05-29
CN1329642A (zh) 2002-01-02
AU767776B2 (en) 2003-11-27
ES2190277T3 (es) 2003-07-16
BR9916010A (pt) 2001-09-04
DE59904252D1 (de) 2003-03-13
KR100659220B1 (ko) 2006-12-20
AU1656000A (en) 2000-06-26
ATE232224T1 (de) 2003-02-15
JP4823419B2 (ja) 2011-11-24
ZA200104729B (en) 2002-05-03
KR20010101078A (ko) 2001-11-14
CN1121447C (zh) 2003-09-17
EP1141127B1 (de) 2003-02-05
HK1039627A1 (en) 2002-05-03
CA2351333A1 (en) 2000-06-15
JP2002531672A (ja) 2002-09-24

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Legal Events

Date Code Title Description
PF Patent in force
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20061129