KR20080066033A - 폴리이미드 및 소수성 에폭시를 포함하는 조성물, 및 그와관련된 방법 - Google Patents

폴리이미드 및 소수성 에폭시를 포함하는 조성물, 및 그와관련된 방법 Download PDF

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Publication number
KR20080066033A
KR20080066033A KR1020087011252A KR20087011252A KR20080066033A KR 20080066033 A KR20080066033 A KR 20080066033A KR 1020087011252 A KR1020087011252 A KR 1020087011252A KR 20087011252 A KR20087011252 A KR 20087011252A KR 20080066033 A KR20080066033 A KR 20080066033A
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KR
South Korea
Prior art keywords
composition
polyimide
bis
epoxy
paste
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020087011252A
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English (en)
Korean (ko)
Inventor
토마스 이. 듀버
존 디. 서머스
브라이언 씨. 오우만
무니르팔람 에이. 수브라마니안
니리사 에스. 로가도
Original Assignee
이 아이 듀폰 디 네모아 앤드 캄파니
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Publication of KR20080066033A publication Critical patent/KR20080066033A/ko
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/68—Organic materials, e.g. photoresists
    • H10P14/683—Organic materials, e.g. photoresists carbon-based polymeric organic materials, e.g. polyimides, poly cyclobutene or PVC
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0387—Polyamides or polyimides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/63—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
    • H10P14/6326—Deposition processes
    • H10P14/6342—Liquid deposition, e.g. spin-coating, sol-gel techniques or spray coating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y10T428/31522—Next to metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
KR1020087011252A 2005-10-12 2006-10-12 폴리이미드 및 소수성 에폭시를 포함하는 조성물, 및 그와관련된 방법 Withdrawn KR20080066033A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/248,803 US7745516B2 (en) 2005-10-12 2005-10-12 Composition of polyimide and sterically-hindered hydrophobic epoxy
US11/248,803 2005-10-12

Publications (1)

Publication Number Publication Date
KR20080066033A true KR20080066033A (ko) 2008-07-15

Family

ID=37672407

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020087011252A Withdrawn KR20080066033A (ko) 2005-10-12 2006-10-12 폴리이미드 및 소수성 에폭시를 포함하는 조성물, 및 그와관련된 방법

Country Status (6)

Country Link
US (2) US7745516B2 (https=)
EP (1) EP1943311A1 (https=)
JP (1) JP2009511717A (https=)
KR (1) KR20080066033A (https=)
CN (1) CN101283048A (https=)
WO (1) WO2007047384A1 (https=)

Cited By (6)

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KR100983219B1 (ko) * 2008-12-05 2010-09-20 조근호 직접인쇄방식에 의한 인쇄회로기판의 제조방법 및 이에 의하여 제조된 인쇄회로기판
KR101050370B1 (ko) * 2009-08-18 2011-07-20 한국화학연구원 폴리이미드를 포함하는 유기절연체 형성용 조성물, 및 이를 이용한 유기절연체 및 유기박막트랜지스터
KR101350490B1 (ko) * 2010-07-05 2014-01-15 조근호 직접인쇄방법에 의하여 회로가 형성되는 인쇄회로기판
KR20140124833A (ko) * 2012-02-13 2014-10-27 닛산 가가쿠 고교 가부시키 가이샤 액정 배향제, 액정 배향막 및 액정 표시 소자
KR20140128228A (ko) * 2013-04-26 2014-11-05 제이에스알 가부시끼가이샤 액정 배향제, 액정 배향막 및 액정 표시 소자
KR102222571B1 (ko) * 2019-10-28 2021-03-05 피아이첨단소재 주식회사 그라파이트 시트용 폴리이미드 필름 및 이로부터 제조된 그라파이트 시트

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JP2010512449A (ja) * 2006-12-12 2010-04-22 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー 結晶性封入剤
US20090111948A1 (en) * 2007-10-25 2009-04-30 Thomas Eugene Dueber Compositions comprising polyimide and hydrophobic epoxy and phenolic resins, and methods relating thereto
KR100932765B1 (ko) * 2008-02-28 2009-12-21 한양대학교 산학협력단 폴리이미드-폴리벤조옥사졸 공중합체, 이의 제조방법, 및이를 포함하는 기체 분리막
JP5077583B2 (ja) * 2008-03-26 2012-11-21 Ｊｓｒ株式会社 液晶配向剤および液晶表示素子
JP5019064B2 (ja) * 2008-03-26 2012-09-05 Ｊｓｒ株式会社 液晶配向剤および液晶表示素子
TWI518458B (zh) * 2008-03-28 2016-01-21 富士軟片股份有限公司 正型感光性樹脂組成物及使用它的硬化膜形成方法
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JP7745399B2 (ja) * 2020-09-30 2025-09-29 日鉄ケミカル＆マテリアル株式会社 樹脂組成物、樹脂フィルム、積層体、カバーレイフィルム、樹脂付き銅箔、金属張積層板及び回路基板
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US12009226B2 (en) * 2021-08-27 2024-06-11 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor device and method of forming same
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TW202540280A (zh) * 2023-12-11 2025-10-16 美商富士軟片電子材料美國股份有限公司 包括新穎的茚烷雙－鄰－胺基酚之聚醯亞胺、光敏性組成物、介電膜及包含其之緩衝塗層
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CN101283048A (zh) 2008-10-08
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WO2007047384A1 (en) 2007-04-26
US7745516B2 (en) 2010-06-29
EP1943311A1 (en) 2008-07-16
US20070083016A1 (en) 2007-04-12

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