JP2005325332A5 - - Google Patents
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- Publication number
- JP2005325332A5 JP2005325332A5 JP2005002744A JP2005002744A JP2005325332A5 JP 2005325332 A5 JP2005325332 A5 JP 2005325332A5 JP 2005002744 A JP2005002744 A JP 2005002744A JP 2005002744 A JP2005002744 A JP 2005002744A JP 2005325332 A5 JP2005325332 A5 JP 2005325332A5
- Authority
- JP
- Japan
- Prior art keywords
- polyimide
- bis
- composition
- formula
- group
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000004642 Polyimide Substances 0.000 claims description 30
- 229920001721 polyimide Polymers 0.000 claims description 30
- 239000000203 mixture Substances 0.000 claims description 23
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 claims description 18
- LJGHYPLBDBRCRZ-UHFFFAOYSA-N 3-(3-aminophenyl)sulfonylaniline Chemical compound NC1=CC=CC(S(=O)(=O)C=2C=C(N)C=CC=2)=C1 LJGHYPLBDBRCRZ-UHFFFAOYSA-N 0.000 claims description 18
- UTDAGHZGKXPRQI-UHFFFAOYSA-N 4-[4-[4-(4-aminophenoxy)phenyl]sulfonylphenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=C(S(=O)(=O)C=2C=CC(OC=3C=CC(N)=CC=3)=CC=2)C=C1 UTDAGHZGKXPRQI-UHFFFAOYSA-N 0.000 claims description 18
- 229940018564 m-phenylenediamine Drugs 0.000 claims description 18
- NIHNNTQXNPWCJQ-UHFFFAOYSA-N fluorene Chemical compound C1=CC=C2CC3=CC=CC=C3C2=C1 NIHNNTQXNPWCJQ-UHFFFAOYSA-N 0.000 claims description 12
- 239000003960 organic solvent Substances 0.000 claims description 11
- 239000007788 liquid Substances 0.000 claims description 7
- ZBMISJGHVWNWTE-UHFFFAOYSA-N 3-(4-aminophenoxy)aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=CC(N)=C1 ZBMISJGHVWNWTE-UHFFFAOYSA-N 0.000 claims description 6
- NVKGJHAQGWCWDI-UHFFFAOYSA-N 4-[4-amino-2-(trifluoromethyl)phenyl]-3-(trifluoromethyl)aniline Chemical group FC(F)(F)C1=CC(N)=CC=C1C1=CC=C(N)C=C1C(F)(F)F NVKGJHAQGWCWDI-UHFFFAOYSA-N 0.000 claims description 6
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 6
- 239000003990 capacitor Substances 0.000 claims description 5
- 150000004985 diamines Chemical class 0.000 claims description 5
- UKJLNMAFNRKWGR-UHFFFAOYSA-N cyclohexatrienamine Chemical group NC1=CC=C=C[CH]1 UKJLNMAFNRKWGR-UHFFFAOYSA-N 0.000 claims description 4
- 229920000642 polymer Polymers 0.000 claims description 4
- -1 (4-amino) Phenyl Chemical group 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 3
- PCAXITAPTVOLGL-UHFFFAOYSA-N 2,3-diaminophenol Chemical compound NC1=CC=CC(O)=C1N PCAXITAPTVOLGL-UHFFFAOYSA-N 0.000 claims description 2
- KUBDPQJOLOUJRM-UHFFFAOYSA-N 2-(chloromethyl)oxirane;4-[2-(4-hydroxyphenyl)propan-2-yl]phenol Chemical compound ClCC1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 KUBDPQJOLOUJRM-UHFFFAOYSA-N 0.000 claims description 2
- HDGLPTVARHLGMV-UHFFFAOYSA-N 2-amino-4-(1,1,1,3,3,3-hexafluoropropan-2-yl)phenol Chemical compound NC1=CC(C(C(F)(F)F)C(F)(F)F)=CC=C1O HDGLPTVARHLGMV-UHFFFAOYSA-N 0.000 claims description 2
- ZGDMDBHLKNQPSD-UHFFFAOYSA-N 2-amino-5-(4-amino-3-hydroxyphenyl)phenol Chemical group C1=C(O)C(N)=CC=C1C1=CC=C(N)C(O)=C1 ZGDMDBHLKNQPSD-UHFFFAOYSA-N 0.000 claims description 2
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 claims description 2
- XIWMTQIUUWJNRP-UHFFFAOYSA-N amidol Chemical compound NC1=CC=C(O)C(N)=C1 XIWMTQIUUWJNRP-UHFFFAOYSA-N 0.000 claims description 2
- 238000009835 boiling Methods 0.000 claims description 2
- 239000000872 buffer Substances 0.000 claims description 2
- 239000003822 epoxy resin Substances 0.000 claims description 2
- 229920000647 polyepoxide Polymers 0.000 claims description 2
- 229920005596 polymer binder Polymers 0.000 claims description 2
- 239000002491 polymer binding agent Substances 0.000 claims description 2
- 230000001681 protective effect Effects 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims 3
- 239000003795 chemical substances by application Substances 0.000 claims 2
- 229910044991 metal oxide Inorganic materials 0.000 claims 2
- 150000004706 metal oxides Chemical class 0.000 claims 2
- KZLDGFZCFRXUIB-UHFFFAOYSA-N 2-amino-4-(3-amino-4-hydroxyphenyl)phenol Chemical group C1=C(O)C(N)=CC(C=2C=C(N)C(O)=CC=2)=C1 KZLDGFZCFRXUIB-UHFFFAOYSA-N 0.000 claims 1
- 229930185605 Bisphenol Natural products 0.000 claims 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims 1
- 239000004952 Polyamide Substances 0.000 claims 1
- 239000004962 Polyamide-imide Substances 0.000 claims 1
- 239000004693 Polybenzimidazole Substances 0.000 claims 1
- 239000004697 Polyetherimide Substances 0.000 claims 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims 1
- 239000007983 Tris buffer Substances 0.000 claims 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 claims 1
- 229920001577 copolymer Polymers 0.000 claims 1
- 239000003431 cross linking reagent Substances 0.000 claims 1
- 239000008393 encapsulating agent Substances 0.000 claims 1
- SLGWESQGEUXWJQ-UHFFFAOYSA-N formaldehyde;phenol Chemical compound O=C.OC1=CC=CC=C1 SLGWESQGEUXWJQ-UHFFFAOYSA-N 0.000 claims 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims 1
- 238000004806 packaging method and process Methods 0.000 claims 1
- 229920001568 phenolic resin Polymers 0.000 claims 1
- 229920002647 polyamide Polymers 0.000 claims 1
- 229920002312 polyamide-imide Polymers 0.000 claims 1
- 229920002480 polybenzimidazole Polymers 0.000 claims 1
- 229920001601 polyetherimide Polymers 0.000 claims 1
- 229910000077 silane Inorganic materials 0.000 claims 1
- 239000000463 material Substances 0.000 description 11
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 0 C*N(C(c1ccc(*c(cc2C(N3C)=O)ccc2C3=O)cc11)=O)C1=O Chemical compound C*N(C(c1ccc(*c(cc2C(N3C)=O)ccc2C3=O)cc11)=O)C1=O 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 2
- 230000009477 glass transition Effects 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- YHMYGUUIMTVXNW-UHFFFAOYSA-N 1,3-dihydrobenzimidazole-2-thione Chemical compound C1=CC=C2NC(S)=NC2=C1 YHMYGUUIMTVXNW-UHFFFAOYSA-N 0.000 description 1
- FPZWZCWUIYYYBU-UHFFFAOYSA-N 2-(2-ethoxyethoxy)ethyl acetate Chemical compound CCOCCOCCOC(C)=O FPZWZCWUIYYYBU-UHFFFAOYSA-N 0.000 description 1
- QCDWFXQBSFUVSP-UHFFFAOYSA-N 2-phenoxyethanol Chemical compound OCCOC1=CC=CC=C1 QCDWFXQBSFUVSP-UHFFFAOYSA-N 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- OWHHQVRJFBKZSS-UHFFFAOYSA-N acetic acid;oxolane-2-carbaldehyde Chemical compound CC(O)=O.O=CC1CCCO1 OWHHQVRJFBKZSS-UHFFFAOYSA-N 0.000 description 1
- 239000002318 adhesion promoter Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- XXHRVGVASCXZLC-UHFFFAOYSA-N bismuth gadolinium Chemical compound [Gd].[Bi] XXHRVGVASCXZLC-UHFFFAOYSA-N 0.000 description 1
- 239000002775 capsule Substances 0.000 description 1
- 239000007809 chemical reaction catalyst Substances 0.000 description 1
- 239000011231 conductive filler Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 229910021485 fumed silica Inorganic materials 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000013034 phenoxy resin Substances 0.000 description 1
- 229920006287 phenoxy resin Polymers 0.000 description 1
- 229960005323 phenoxyethanol Drugs 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000004034 viscosity adjusting agent Substances 0.000 description 1
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US53545304P | 2004-01-09 | 2004-01-09 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2005325332A JP2005325332A (ja) | 2005-11-24 |
| JP2005325332A5 true JP2005325332A5 (https=) | 2008-02-07 |
Family
ID=35471921
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005002744A Withdrawn JP2005325332A (ja) | 2004-01-09 | 2005-01-07 | 水分収着耐性を有するポリイミド組成物およびそれに関連する方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US7348373B2 (https=) |
| EP (1) | EP1553134B1 (https=) |
| JP (1) | JP2005325332A (https=) |
| DE (1) | DE602004024758D1 (https=) |
Families Citing this family (40)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7169330B2 (en) * | 2004-02-25 | 2007-01-30 | E. I. Du Pont De Nemours And Company | Composition of conductive paste |
| JP2006206756A (ja) | 2005-01-28 | 2006-08-10 | Sony Chem Corp | ポリイミド化合物及びフレキシブル配線板 |
| US7745516B2 (en) * | 2005-10-12 | 2010-06-29 | E. I. Du Pont De Nemours And Company | Composition of polyimide and sterically-hindered hydrophobic epoxy |
| US20070290379A1 (en) * | 2006-06-15 | 2007-12-20 | Dueber Thomas E | Hydrophobic compositions for electronic applications |
| US20080035567A1 (en) * | 2006-08-08 | 2008-02-14 | Sabottke Craig Y | Enhanced membrane separation system |
| US7604754B2 (en) * | 2006-11-17 | 2009-10-20 | E. I. Du Pont De Nemours And Company | Resistor compositions for electronic circuitry applications |
| JP2010512449A (ja) * | 2006-12-12 | 2010-04-22 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー | 結晶性封入剤 |
| EP2092807B1 (en) | 2006-12-12 | 2013-04-17 | CDA Processing Limited Liability Company | Composite organic encapsulants |
| US20090111948A1 (en) * | 2007-10-25 | 2009-04-30 | Thomas Eugene Dueber | Compositions comprising polyimide and hydrophobic epoxy and phenolic resins, and methods relating thereto |
| JP5256018B2 (ja) * | 2008-12-26 | 2013-08-07 | 旭化成イーマテリアルズ株式会社 | 組成物、組成物からなる塗膜、塗膜を含む積層体、及び積層体を組み込んだ電子機器 |
| KR101455760B1 (ko) | 2010-12-16 | 2014-10-28 | 주식회사 엘지화학 | 회로 기판용 금속 적층체 및 이의 제조 방법 |
| MX2014008364A (es) * | 2012-01-09 | 2015-04-16 | Du Pont | Soluciones aglomerantes. |
| CN102604584B (zh) * | 2012-03-28 | 2013-08-21 | 黑龙江省科学院石油化学研究院 | 一种高剥离聚酰亚胺胶粘剂及其制备方法 |
| US20150228374A1 (en) * | 2014-02-07 | 2015-08-13 | E I Du Pont De Nemours And Company | Thermally conductive electronic substrates and methods relating thereto |
| TWI551652B (zh) * | 2014-05-30 | 2016-10-01 | Ｌｇ化學股份有限公司 | 聚醯亞胺系溶液和使用其製備的聚醯亞胺系膜及含聚醯亞胺系膜的顯示器基板與裝置 |
| US10822499B2 (en) | 2014-10-10 | 2020-11-03 | Sabic Global Technologies B.V. | Polyetherimide varnish compositions, methods of manufacture, and articles prepared therefrom |
| WO2016100629A1 (en) * | 2014-12-17 | 2016-06-23 | E. I. Du Pont De Nemours And Company | High temperature conductive thick film pastes polyimide for heater |
| JP6597645B2 (ja) * | 2015-02-12 | 2019-10-30 | 日産化学株式会社 | 液晶配向剤 |
| KR102339037B1 (ko) * | 2015-06-26 | 2021-12-14 | 코오롱인더스트리 주식회사 | 폴리아마이드-이미드 전구체, 폴리아마이드-이미드 필름 및 이를 포함하는 표시소자 |
| CN105001778B (zh) * | 2015-07-10 | 2018-01-02 | 东华大学 | 一种含氟聚酰亚胺湿敏电容及其制备方法 |
| US20170044382A1 (en) * | 2015-08-12 | 2017-02-16 | E I Du Pont De Nemours And Company | Process for forming a solderable polyimide-based polymer thick film conductor |
| US9649730B2 (en) * | 2015-08-12 | 2017-05-16 | E I Du Pont De Nemours And Company | Paste and process for forming a solderable polyimide-based polymer thick film conductor |
| US9637648B2 (en) * | 2015-08-13 | 2017-05-02 | E I Du Pont De Nemours And Company | Photonic sintering of a solderable polymer thick film copper conductor composition |
| US9637647B2 (en) * | 2015-08-13 | 2017-05-02 | E I Du Pont De Nemours And Company | Photonic sintering of a polymer thick film copper conductor composition |
| CN105086424B (zh) * | 2015-09-02 | 2018-06-22 | 东华大学 | 一种耐高温bahpfp型覆铜箔板及其制备方法 |
| CN105111927B (zh) * | 2015-09-02 | 2017-04-05 | 东华大学 | 一种耐高温bahpfp型漆包线漆及其制备方法 |
| US20170121058A1 (en) * | 2015-10-30 | 2017-05-04 | Corning Incorporated | Glass articles with mixed polymer and metal oxide coatings |
| US10189950B2 (en) * | 2015-12-22 | 2019-01-29 | E I Du Pont De Nemours And Company | Polyimide-based polymer thick film compositions |
| CN105924649B (zh) * | 2016-05-19 | 2019-06-18 | 航天材料及工艺研究所 | 一种聚酰亚胺泡沫材料及其制备方法 |
| CN109417834B (zh) | 2016-07-22 | 2022-04-12 | E.I.内穆尔杜邦公司 | 薄膜加热装置 |
| KR102494637B1 (ko) * | 2016-09-30 | 2023-02-02 | 스미또모 가가꾸 가부시키가이샤 | 폴리이미드계 고분자 바니시의 제조방법, 폴리이미드계 고분자 필름의 제조방법, 및, 투명 폴리이미드계 고분자 필름 |
| KR20180060259A (ko) * | 2016-11-28 | 2018-06-07 | 한국생산기술연구원 | 전하 이동 복합체를 이용한 자동차용 스크래치 자기치유 클리어코트 조성물, 이를 포함하는 클리어코트 및 이의 제조방법 |
| TWI773745B (zh) * | 2017-04-24 | 2022-08-11 | 日商味之素股份有限公司 | 樹脂組成物 |
| CN109561526B (zh) * | 2017-09-26 | 2023-04-25 | 杜邦电子公司 | 加热元件和加热装置 |
| TWI749351B (zh) * | 2019-08-08 | 2021-12-11 | 達興材料股份有限公司 | 暫時黏著組成物、暫時黏著膜、複合膜、暫時黏著被加工物之方法以及半導體晶圓封裝 |
| CN114502659A (zh) * | 2019-10-29 | 2022-05-13 | 东丽株式会社 | 树脂组合物、树脂片材、固化膜、固化膜的制造方法、半导体装置、有机el显示装置及显示装置 |
| CN113322714B (zh) * | 2020-02-28 | 2022-12-02 | 中国科学院成都有机化学有限公司 | 一种聚酰亚胺复配型抗高温老化助剂及其绝缘纸和制备方法 |
| CN111849399A (zh) * | 2020-06-16 | 2020-10-30 | 廖铁仙 | 一种半导体装置的散热组合物及其制备方法 |
| WO2022051645A2 (en) | 2020-09-04 | 2022-03-10 | Corning Incorporated | Ultraviolet light-blocking coated pharmaceutical packages |
| WO2022261654A1 (en) * | 2021-06-10 | 2022-12-15 | Zymergen Inc. | Optically transparent polyimide |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0337412B1 (en) | 1988-04-15 | 1995-07-05 | E.I. Du Pont De Nemours And Company | Encapsulant composition |
| US5093036A (en) | 1988-09-20 | 1992-03-03 | Raychem Corporation | Conductive polymer composition |
| US5302412A (en) * | 1989-02-03 | 1994-04-12 | The Boc Group, Inc. | Single atmosphere for firing compatible thick film material |
| US5071997A (en) | 1989-07-20 | 1991-12-10 | University Of Akron | Polyimides comprising substituted benzidines |
| JPH03129701A (ja) | 1989-09-19 | 1991-06-03 | Mitsubishi Electric Corp | 抵抗体装置 |
| JPH0461703A (ja) | 1990-06-27 | 1992-02-27 | Haisoole Kk | 印刷用導電性ペースト |
| US5202412A (en) * | 1990-10-02 | 1993-04-13 | E. I. Du Pont De Nemours And Company | Polyimide copolymer precursors |
| US5275750A (en) | 1991-07-18 | 1994-01-04 | Matsushita Electric Industrial Co., Ltd. | Method of manufacturing a solid polymer electrolyte |
| US5268497A (en) * | 1992-02-24 | 1993-12-07 | The Boc Group, Inc. | Process for the production of nitriles |
| AU2466092A (en) | 1992-07-22 | 1994-02-14 | Michael F. Lucey | Highly filled polymeric compositions |
| DE69305942T2 (de) | 1992-09-15 | 1997-03-13 | Du Pont | Zusammensetzung für einen Polymer-Dickschichtwiderstand |
| DE4335323A1 (de) | 1993-10-18 | 1995-04-20 | Basf Lacke & Farben | Lösungen von polyimidbildenden Substanzen und deren Verwendung |
| JP3117175B2 (ja) | 1994-02-09 | 2000-12-11 | アルプス電気株式会社 | 抵抗体 |
| US5426071A (en) | 1994-03-04 | 1995-06-20 | E. I. Du Pont De Nemours And Company | Polyimide copolymer film for lift-off metallization |
| JPH09118825A (ja) * | 1995-10-24 | 1997-05-06 | Shin Etsu Chem Co Ltd | ポリイミド樹脂組成物 |
| EP0875906B1 (en) * | 1997-04-30 | 2004-04-07 | JSR Corporation | Electronic part and process for manufacturing the same |
| US5993698A (en) | 1997-11-06 | 1999-11-30 | Acheson Industries, Inc. | Electrical device containing positive temperature coefficient resistor composition and method of manufacturing the device |
| JP2000164403A (ja) | 1998-11-24 | 2000-06-16 | Matsushita Electric Ind Co Ltd | 耐熱抵抗体ペーストおよび耐熱抵抗体と耐熱抵抗体の製造方法 |
| US6030553A (en) | 1999-04-01 | 2000-02-29 | Industrial Technology Research Institute | Polymer thick film resistor pastes |
| US7018776B2 (en) * | 2002-12-12 | 2006-03-28 | Arch Specialty Chemicals, Inc. | Stable non-photosensitive polyimide precursor compositions for use in bilayer imaging systems |
-
2004
- 2004-02-19 US US10/782,326 patent/US7348373B2/en not_active Expired - Fee Related
- 2004-11-15 DE DE602004024758T patent/DE602004024758D1/de not_active Expired - Lifetime
- 2004-11-15 EP EP04027061A patent/EP1553134B1/en not_active Expired - Lifetime
-
2005
- 2005-01-07 JP JP2005002744A patent/JP2005325332A/ja not_active Withdrawn
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