CN102265715B - 柔性基板和电子器件 - Google Patents
柔性基板和电子器件 Download PDFInfo
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- CN102265715B CN102265715B CN200980152623.8A CN200980152623A CN102265715B CN 102265715 B CN102265715 B CN 102265715B CN 200980152623 A CN200980152623 A CN 200980152623A CN 102265715 B CN102265715 B CN 102265715B
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- Prior art keywords
- resin molding
- resin
- flexible base
- board
- acid
- Prior art date
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- 239000000758 substrate Substances 0.000 title abstract description 12
- 229920005989 resin Polymers 0.000 claims abstract description 228
- 239000011347 resin Substances 0.000 claims abstract description 228
- 230000004907 flux Effects 0.000 claims abstract description 37
- 238000000465 moulding Methods 0.000 claims description 154
- 230000000694 effects Effects 0.000 claims description 37
- 150000001875 compounds Chemical class 0.000 claims description 28
- 239000004020 conductor Substances 0.000 claims description 20
- 238000000034 method Methods 0.000 claims description 16
- 229920001721 polyimide Polymers 0.000 claims description 15
- 239000000155 melt Substances 0.000 claims description 14
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 11
- 238000004519 manufacturing process Methods 0.000 claims description 11
- 239000004642 Polyimide Substances 0.000 claims description 9
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 9
- 239000012634 fragment Substances 0.000 claims description 9
- 229920001187 thermosetting polymer Polymers 0.000 claims description 9
- 238000003475 lamination Methods 0.000 claims description 8
- 229920000106 Liquid crystal polymer Polymers 0.000 claims description 6
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 claims description 6
- 239000004952 Polyamide Substances 0.000 claims description 6
- 229920002647 polyamide Polymers 0.000 claims description 6
- 239000007864 aqueous solution Substances 0.000 claims description 5
- 230000009477 glass transition Effects 0.000 claims description 5
- 238000004448 titration Methods 0.000 claims description 5
- 239000002253 acid Substances 0.000 claims description 4
- 150000001412 amines Chemical class 0.000 claims description 4
- 229920001225 polyester resin Polymers 0.000 claims description 4
- 239000004645 polyester resin Substances 0.000 claims description 4
- 235000011121 sodium hydroxide Nutrition 0.000 claims description 4
- 238000005303 weighing Methods 0.000 claims description 4
- 238000000691 measurement method Methods 0.000 claims description 3
- KJFMBFZCATUALV-UHFFFAOYSA-N phenolphthalein Chemical compound C1=CC(O)=CC=C1C1(C=2C=CC(O)=CC=2)C2=CC=CC=C2C(=O)O1 KJFMBFZCATUALV-UHFFFAOYSA-N 0.000 claims 1
- 230000004913 activation Effects 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 description 56
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 27
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 25
- -1 diallyl bisphenol F Chemical compound 0.000 description 20
- 229920000647 polyepoxide Polymers 0.000 description 16
- 238000004806 packaging method and process Methods 0.000 description 13
- 238000009826 distribution Methods 0.000 description 12
- 239000003822 epoxy resin Substances 0.000 description 10
- 229920003986 novolac Polymers 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 9
- FFFPYJTVNSSLBQ-UHFFFAOYSA-N Phenolphthalin Chemical compound OC(=O)C1=CC=CC=C1C(C=1C=CC(O)=CC=1)C1=CC=C(O)C=C1 FFFPYJTVNSSLBQ-UHFFFAOYSA-N 0.000 description 8
- 229920001342 Bakelite® Polymers 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 7
- 229920006287 phenoxy resin Polymers 0.000 description 7
- 239000013034 phenoxy resin Substances 0.000 description 7
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 6
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 6
- 230000008859 change Effects 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 239000003795 chemical substances by application Substances 0.000 description 5
- UIAFKZKHHVMJGS-UHFFFAOYSA-N 2,4-dihydroxybenzoic acid Chemical compound OC(=O)C1=CC=C(O)C=C1O UIAFKZKHHVMJGS-UHFFFAOYSA-N 0.000 description 4
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 4
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 4
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- LNTHITQWFMADLM-UHFFFAOYSA-N gallic acid Chemical compound OC(=O)C1=CC(O)=C(O)C(O)=C1 LNTHITQWFMADLM-UHFFFAOYSA-N 0.000 description 4
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 4
- 239000009719 polyimide resin Substances 0.000 description 4
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- 239000004697 Polyetherimide Substances 0.000 description 3
- 239000004743 Polypropylene Substances 0.000 description 3
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 3
- 150000007933 aliphatic carboxylic acids Chemical class 0.000 description 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 230000001351 cycling effect Effects 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 3
- 229920002857 polybutadiene Polymers 0.000 description 3
- 229920001601 polyetherimide Polymers 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 229920006324 polyoxymethylene Polymers 0.000 description 3
- 229920001155 polypropylene Polymers 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 229920005992 thermoplastic resin Polymers 0.000 description 3
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 3
- WIAPFNDQWLOVKC-UHFFFAOYSA-N 1,3,5-trimethylcyclohexa-2,4-diene-1-carboxylic acid Chemical compound CC1=CC(C)=CC(C)(C(O)=O)C1 WIAPFNDQWLOVKC-UHFFFAOYSA-N 0.000 description 2
- VOJUXHHACRXLTD-UHFFFAOYSA-N 1,4-dihydroxy-2-naphthoic acid Chemical compound C1=CC=CC2=C(O)C(C(=O)O)=CC(O)=C21 VOJUXHHACRXLTD-UHFFFAOYSA-N 0.000 description 2
- GLDQAMYCGOIJDV-UHFFFAOYSA-N 2,3-dihydroxybenzoic acid Chemical compound OC(=O)C1=CC=CC(O)=C1O GLDQAMYCGOIJDV-UHFFFAOYSA-N 0.000 description 2
- WXTMDXOMEHJXQO-UHFFFAOYSA-N 2,5-dihydroxybenzoic acid Chemical compound OC(=O)C1=CC(O)=CC=C1O WXTMDXOMEHJXQO-UHFFFAOYSA-N 0.000 description 2
- AKEUNCKRJATALU-UHFFFAOYSA-N 2,6-dihydroxybenzoic acid Chemical compound OC(=O)C1=C(O)C=CC=C1O AKEUNCKRJATALU-UHFFFAOYSA-N 0.000 description 2
- UYEMGAFJOZZIFP-UHFFFAOYSA-N 3,5-dihydroxybenzoic acid Chemical compound OC(=O)C1=CC(O)=CC(O)=C1 UYEMGAFJOZZIFP-UHFFFAOYSA-N 0.000 description 2
- YELLAPKUWRTITI-UHFFFAOYSA-N 3,5-dihydroxynaphthalene-2-carboxylic acid Chemical compound C1=CC(O)=C2C=C(O)C(C(=O)O)=CC2=C1 YELLAPKUWRTITI-UHFFFAOYSA-N 0.000 description 2
- HMNKTRSOROOSPP-UHFFFAOYSA-N 3-Ethylphenol Chemical compound CCC1=CC=CC(O)=C1 HMNKTRSOROOSPP-UHFFFAOYSA-N 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 2
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Chemical compound CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- 239000004677 Nylon Substances 0.000 description 2
- 229920000305 Nylon 6,10 Polymers 0.000 description 2
- 239000004696 Poly ether ether ketone Substances 0.000 description 2
- 239000005062 Polybutadiene Substances 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000004734 Polyphenylene sulfide Substances 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 2
- 239000001361 adipic acid Substances 0.000 description 2
- 235000011037 adipic acid Nutrition 0.000 description 2
- 150000008064 anhydrides Chemical class 0.000 description 2
- QMKYBPDZANOJGF-UHFFFAOYSA-N benzene-1,3,5-tricarboxylic acid Chemical compound OC(=O)C1=CC(C(O)=O)=CC(C(O)=O)=C1 QMKYBPDZANOJGF-UHFFFAOYSA-N 0.000 description 2
- 229940114055 beta-resorcylic acid Drugs 0.000 description 2
- 229940106691 bisphenol a Drugs 0.000 description 2
- NTXGQCSETZTARF-UHFFFAOYSA-N buta-1,3-diene;prop-2-enenitrile Chemical compound C=CC=C.C=CC#N NTXGQCSETZTARF-UHFFFAOYSA-N 0.000 description 2
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 2
- TVIDDXQYHWJXFK-UHFFFAOYSA-N dodecanedioic acid Chemical compound OC(=O)CCCCCCCCCCC(O)=O TVIDDXQYHWJXFK-UHFFFAOYSA-N 0.000 description 2
- 230000004927 fusion Effects 0.000 description 2
- IPCSVZSSVZVIGE-UHFFFAOYSA-N hexadecanoic acid Chemical compound CCCCCCCCCCCCCCCC(O)=O IPCSVZSSVZVIGE-UHFFFAOYSA-N 0.000 description 2
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 2
- 150000004693 imidazolium salts Chemical class 0.000 description 2
- YDSWCNNOKPMOTP-UHFFFAOYSA-N mellitic acid Chemical compound OC(=O)C1=C(C(O)=O)C(C(O)=O)=C(C(O)=O)C(C(O)=O)=C1C(O)=O YDSWCNNOKPMOTP-UHFFFAOYSA-N 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229920001778 nylon Polymers 0.000 description 2
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 2
- WLJVNTCWHIRURA-UHFFFAOYSA-N pimelic acid Chemical compound OC(=O)CCCCCC(O)=O WLJVNTCWHIRURA-UHFFFAOYSA-N 0.000 description 2
- 229920002492 poly(sulfone) Polymers 0.000 description 2
- 229920001230 polyarylate Polymers 0.000 description 2
- 229920001707 polybutylene terephthalate Polymers 0.000 description 2
- 229920002530 polyetherether ketone Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000011342 resin composition Substances 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- YGSDEFSMJLZEOE-UHFFFAOYSA-N salicylic acid Chemical compound OC(=O)C1=CC=CC=C1O YGSDEFSMJLZEOE-UHFFFAOYSA-N 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- KDYFGRWQOYBRFD-UHFFFAOYSA-N succinic acid Chemical compound OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 2
- NQPDZGIKBAWPEJ-UHFFFAOYSA-N valeric acid Chemical compound CCCCC(O)=O NQPDZGIKBAWPEJ-UHFFFAOYSA-N 0.000 description 2
- 239000002966 varnish Substances 0.000 description 2
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 description 1
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 description 1
- WBYWAXJHAXSJNI-VOTSOKGWSA-M .beta-Phenylacrylic acid Natural products [O-]C(=O)\C=C\C1=CC=CC=C1 WBYWAXJHAXSJNI-VOTSOKGWSA-M 0.000 description 1
- DHKHKXVYLBGOIT-UHFFFAOYSA-N 1,1-Diethoxyethane Chemical compound CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 description 1
- BCMCBBGGLRIHSE-UHFFFAOYSA-N 1,3-benzoxazole Chemical compound C1=CC=C2OC=NC2=C1 BCMCBBGGLRIHSE-UHFFFAOYSA-N 0.000 description 1
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 description 1
- QFGCFKJIPBRJGM-UHFFFAOYSA-N 12-[(2-methylpropan-2-yl)oxy]-12-oxododecanoic acid Chemical compound CC(C)(C)OC(=O)CCCCCCCCCCC(O)=O QFGCFKJIPBRJGM-UHFFFAOYSA-N 0.000 description 1
- HDIJZFORGDBEKL-UHFFFAOYSA-N 2,3,4-trimethylbenzoic acid Chemical compound CC1=CC=C(C(O)=O)C(C)=C1C HDIJZFORGDBEKL-UHFFFAOYSA-N 0.000 description 1
- 229940082044 2,3-dihydroxybenzoic acid Drugs 0.000 description 1
- RIZUCYSQUWMQLX-UHFFFAOYSA-N 2,3-dimethylbenzoic acid Chemical compound CC1=CC=CC(C(O)=O)=C1C RIZUCYSQUWMQLX-UHFFFAOYSA-N 0.000 description 1
- 150000000341 2,3-xylenols Chemical class 0.000 description 1
- 150000000342 2,4-xylenols Chemical class 0.000 description 1
- 150000000343 2,5-xylenols Chemical class 0.000 description 1
- 150000000345 2,6-xylenols Chemical class 0.000 description 1
- JPSKCQCQZUGWNM-UHFFFAOYSA-N 2,7-Oxepanedione Chemical compound O=C1CCCCC(=O)O1 JPSKCQCQZUGWNM-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- IXQGCWUGDFDQMF-UHFFFAOYSA-N 2-Ethylphenol Chemical compound CCC1=CC=CC=C1O IXQGCWUGDFDQMF-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- JMMZCWZIJXAGKW-UHFFFAOYSA-N 2-methylpent-2-ene Chemical compound CCC=C(C)C JMMZCWZIJXAGKW-UHFFFAOYSA-N 0.000 description 1
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 description 1
- 150000000469 3,5-xylenols Chemical class 0.000 description 1
- OJVQNVMHJWSOSY-UHFFFAOYSA-N 3-methylbicyclo[2.2.1]hept-5-ene-2,3-dicarboxylic acid Chemical compound C1C2C=CC1C(C(O)=O)(C)C2C(O)=O OJVQNVMHJWSOSY-UHFFFAOYSA-N 0.000 description 1
- UITKHKNFVCYWNG-UHFFFAOYSA-N 4-(3,4-dicarboxybenzoyl)phthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1C(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 UITKHKNFVCYWNG-UHFFFAOYSA-N 0.000 description 1
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- QHPQWRBYOIRBIT-UHFFFAOYSA-N 4-tert-butylphenol Chemical compound CC(C)(C)C1=CC=C(O)C=C1 QHPQWRBYOIRBIT-UHFFFAOYSA-N 0.000 description 1
- XBWHBPMCIGBGTA-UHFFFAOYSA-N 5-methyl-2-oxaspiro[3.5]non-5-ene-1,3-dione Chemical compound CC1=CCCCC11C(=O)OC1=O XBWHBPMCIGBGTA-UHFFFAOYSA-N 0.000 description 1
- TYOXIFXYEIILLY-UHFFFAOYSA-N 5-methyl-2-phenyl-1h-imidazole Chemical compound N1C(C)=CN=C1C1=CC=CC=C1 TYOXIFXYEIILLY-UHFFFAOYSA-N 0.000 description 1
- MWSKJDNQKGCKPA-UHFFFAOYSA-N 6-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1CC(C)=CC2C(=O)OC(=O)C12 MWSKJDNQKGCKPA-UHFFFAOYSA-N 0.000 description 1
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- 239000005711 Benzoic acid Substances 0.000 description 1
- 229920002799 BoPET Polymers 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- WBYWAXJHAXSJNI-SREVYHEPSA-N Cinnamic acid Chemical compound OC(=O)\C=C/C1=CC=CC=C1 WBYWAXJHAXSJNI-SREVYHEPSA-N 0.000 description 1
- 239000004641 Diallyl-phthalate Substances 0.000 description 1
- VKOUCJUTMGHNOR-UHFFFAOYSA-N Diphenolic acid Chemical compound C=1C=C(O)C=CC=1C(CCC(O)=O)(C)C1=CC=C(O)C=C1 VKOUCJUTMGHNOR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 1
- 239000005041 Mylar™ Substances 0.000 description 1
- 239000005642 Oleic acid Substances 0.000 description 1
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 description 1
- 235000021314 Palmitic acid Nutrition 0.000 description 1
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 1
- 229920012266 Poly(ether sulfone) PES Polymers 0.000 description 1
- 229930182556 Polyacetal Natural products 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 229920002732 Polyanhydride Polymers 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- 239000004699 Ultra-high molecular weight polyethylene Substances 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000011354 acetal resin Substances 0.000 description 1
- 235000011054 acetic acid Nutrition 0.000 description 1
- 229920006243 acrylic copolymer Polymers 0.000 description 1
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 1
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 1
- 229920001893 acrylonitrile styrene Polymers 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 description 1
- 210000002469 basement membrane Anatomy 0.000 description 1
- GCAIEATUVJFSMC-UHFFFAOYSA-N benzene-1,2,3,4-tetracarboxylic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1C(O)=O GCAIEATUVJFSMC-UHFFFAOYSA-N 0.000 description 1
- NHDLVKOYPQPGNT-UHFFFAOYSA-N benzene-1,2,3,5-tetracarboxylic acid Chemical compound OC(=O)C1=CC(C(O)=O)=C(C(O)=O)C(C(O)=O)=C1 NHDLVKOYPQPGNT-UHFFFAOYSA-N 0.000 description 1
- 235000010233 benzoic acid Nutrition 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- YXVFYQXJAXKLAK-UHFFFAOYSA-N biphenyl-4-ol Chemical compound C1=CC(O)=CC=C1C1=CC=CC=C1 YXVFYQXJAXKLAK-UHFFFAOYSA-N 0.000 description 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
- ZFVMWEVVKGLCIJ-UHFFFAOYSA-N bisphenol AF Chemical compound C1=CC(O)=CC=C1C(C(F)(F)F)(C(F)(F)F)C1=CC=C(O)C=C1 ZFVMWEVVKGLCIJ-UHFFFAOYSA-N 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- FACXGONDLDSNOE-UHFFFAOYSA-N buta-1,3-diene;styrene Chemical compound C=CC=C.C=CC1=CC=CC=C1.C=CC1=CC=CC=C1 FACXGONDLDSNOE-UHFFFAOYSA-N 0.000 description 1
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 1
- 229920005549 butyl rubber Polymers 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 229930016911 cinnamic acid Natural products 0.000 description 1
- 235000013985 cinnamic acid Nutrition 0.000 description 1
- 230000004087 circulation Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 150000005690 diesters Chemical class 0.000 description 1
- POULHZVOKOAJMA-UHFFFAOYSA-M dodecanoate Chemical compound CCCCCCCCCCCC([O-])=O POULHZVOKOAJMA-UHFFFAOYSA-M 0.000 description 1
- 229920006351 engineering plastic Polymers 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 229940074391 gallic acid Drugs 0.000 description 1
- 235000004515 gallic acid Nutrition 0.000 description 1
- XOXYHGOIRWABTC-UHFFFAOYSA-N gentisin Chemical compound C1=C(O)C=C2C(=O)C3=C(O)C=C(OC)C=C3OC2=C1 XOXYHGOIRWABTC-UHFFFAOYSA-N 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- PYGSKMBEVAICCR-UHFFFAOYSA-N hexa-1,5-diene Chemical group C=CCCC=C PYGSKMBEVAICCR-UHFFFAOYSA-N 0.000 description 1
- 239000004021 humic acid Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 1
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 1
- 239000002648 laminated material Substances 0.000 description 1
- 229940070765 laurate Drugs 0.000 description 1
- RLSSMJSEOOYNOY-UHFFFAOYSA-N m-cresol Chemical compound CC1=CC=CC(O)=C1 RLSSMJSEOOYNOY-UHFFFAOYSA-N 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229940100630 metacresol Drugs 0.000 description 1
- 239000000113 methacrylic resin Substances 0.000 description 1
- WBYWAXJHAXSJNI-UHFFFAOYSA-N methyl p-hydroxycinnamate Natural products OC(=O)C=CC1=CC=CC=C1 WBYWAXJHAXSJNI-UHFFFAOYSA-N 0.000 description 1
- VYKXQOYUCMREIS-UHFFFAOYSA-N methylhexahydrophthalic anhydride Chemical compound C1CCCC2C(=O)OC(=O)C21C VYKXQOYUCMREIS-UHFFFAOYSA-N 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 210000004400 mucous membrane Anatomy 0.000 description 1
- WQEPLUUGTLDZJY-UHFFFAOYSA-N n-Pentadecanoic acid Natural products CCCCCCCCCCCCCCC(O)=O WQEPLUUGTLDZJY-UHFFFAOYSA-N 0.000 description 1
- 150000005209 naphthoic acids Chemical class 0.000 description 1
- ZWLPBLYKEWSWPD-UHFFFAOYSA-N o-toluic acid Chemical compound CC1=CC=CC=C1C(O)=O ZWLPBLYKEWSWPD-UHFFFAOYSA-N 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- AHHWIHXENZJRFG-UHFFFAOYSA-N oxetane Chemical compound C1COC1 AHHWIHXENZJRFG-UHFFFAOYSA-N 0.000 description 1
- IWDCLRJOBJJRNH-UHFFFAOYSA-N p-cresol Chemical compound CC1=CC=C(O)C=C1 IWDCLRJOBJJRNH-UHFFFAOYSA-N 0.000 description 1
- NRZWYNLTFLDQQX-UHFFFAOYSA-N p-tert-Amylphenol Chemical compound CCC(C)(C)C1=CC=C(O)C=C1 NRZWYNLTFLDQQX-UHFFFAOYSA-N 0.000 description 1
- FJKROLUGYXJWQN-UHFFFAOYSA-N papa-hydroxy-benzoic acid Natural products OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- PHEDXBVPIONUQT-RGYGYFBISA-N phorbol 13-acetate 12-myristate Chemical compound C([C@]1(O)C(=O)C(C)=C[C@H]1[C@@]1(O)[C@H](C)[C@H]2OC(=O)CCCCCCCCCCCCC)C(CO)=C[C@H]1[C@H]1[C@]2(OC(C)=O)C1(C)C PHEDXBVPIONUQT-RGYGYFBISA-N 0.000 description 1
- IUGYQRQAERSCNH-UHFFFAOYSA-N pivalic acid Chemical compound CC(C)(C)C(O)=O IUGYQRQAERSCNH-UHFFFAOYSA-N 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920001084 poly(chloroprene) Polymers 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920002577 polybenzoxazole Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 239000011118 polyvinyl acetate Substances 0.000 description 1
- 229920002689 polyvinyl acetate Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- SCUZVMOVTVSBLE-UHFFFAOYSA-N prop-2-enenitrile;styrene Chemical compound C=CC#N.C=CC1=CC=CC=C1 SCUZVMOVTVSBLE-UHFFFAOYSA-N 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- 229960004889 salicylic acid Drugs 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 229920000468 styrene butadiene styrene block copolymer Polymers 0.000 description 1
- 229920001935 styrene-ethylene-butadiene-styrene Polymers 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 229960005137 succinic acid Drugs 0.000 description 1
- RINCXYDBBGOEEQ-UHFFFAOYSA-N succinic anhydride Chemical compound O=C1CCC(=O)O1 RINCXYDBBGOEEQ-UHFFFAOYSA-N 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- TUNFSRHWOTWDNC-HKGQFRNVSA-N tetradecanoic acid Chemical compound CCCCCCCCCCCCC[14C](O)=O TUNFSRHWOTWDNC-HKGQFRNVSA-N 0.000 description 1
- 230000000930 thermomechanical effect Effects 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- QENJZWZWAWWESF-UHFFFAOYSA-N tri-methylbenzoic acid Natural products CC1=CC(C)=C(C(O)=O)C=C1C QENJZWZWAWWESF-UHFFFAOYSA-N 0.000 description 1
- ITMCEJHCFYSIIV-UHFFFAOYSA-N triflic acid Chemical compound OS(=O)(=O)C(F)(F)F ITMCEJHCFYSIIV-UHFFFAOYSA-N 0.000 description 1
- 229920000785 ultra high molecular weight polyethylene Polymers 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 229940005605 valeric acid Drugs 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/286—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polysulphones; polysulfides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/288—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyketones
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
- B32B27/302—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising aromatic vinyl (co)polymers, e.g. styrenic (co)polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
- B32B27/304—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising vinyl halide (co)polymers, e.g. PVC, PVDC, PVF, PVDF
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
- B32B27/308—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising acrylic (co)polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
- B32B27/365—Layered products comprising a layer of synthetic resin comprising polyesters comprising polycarbonates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/14—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by a layer differing constitutionally or physically in different parts, e.g. denser near its faces
- B32B5/142—Variation across the area of the layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/486—Via connections through the substrate with or without pins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
- H01L23/49894—Materials of the insulating layers or coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/306—Resistant to heat
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/546—Flexural strength; Flexion stiffness
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/548—Creep
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/714—Inert, i.e. inert to chemical degradation, corrosion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/724—Permeability to gases, adsorption
- B32B2307/7242—Non-permeable
- B32B2307/7246—Water vapor barrier
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
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Abstract
本发明的柔性基板10为包括具有焊剂活性的第一树脂膜1和层压至所述第一树脂膜1且不同于第一树脂膜的第二树脂膜2。所述柔性基板10的特征在于:通过使多个电子部件安装在所述第一树脂膜1的表面,然后使各电子部件在同一时间下与柔性基板10结合来使用所述柔性基板10。所述第一树脂膜1在230℃的胶凝时间为100秒至600秒。
Description
技术领域
本发明涉及柔性基板和电子器件。
背景技术
近年来,对于更轻、更薄、更短和更小的半导体封装件已有许多技术革新。已生产出具有各种结构的半导体封装件产品。对于这些半导体封装件产品,认为能够直接垂直连接的倒装芯片安装方法(而不是传统的引线框式接合方法)是特别重要的(例如,参见专利文件1)。
最近几年,随着便携式电话和移动式电子器件的普及,正在进行尺寸和厚度的减小(特别是对于半导体封装件),但是信息通讯量和储存信息量却在增加。因此,在此半导体封装件中的用于进行电子信息交换的配线正在朝着微细配线的方向发展。通常,通过连接由焊锡等形成的突起和进行配线加工的无机或有机刚性基板,使用倒装芯片型封装件来构造半导体器件。然而,为了实现要求极度薄型化和更微细配线的目标,在技术和经济方面还有很多限制。
因此,已知使用柔性基板代替刚性基板的技术。根据此技术,已知使用树脂膜使半导体部件与柔性基板结合。在这种情况下,通常将切割成片段的半导体芯片与柔性基板结合(参见专利文件2)。
相关文件
专利文件
专利文件1:日本专利申请特开平(1997)-246326
专利文件2:日本专利申请特开(2005)-116624
发明内容
然而,已要求比上述相关技术更高的产率的提高。
本发明的目的是提供柔性基板,所述柔性基板能够提供能够以高产率形成微细配线的电子器件。
此外,本发明的另一目的是提供电子器件,其能够以高产率形成微细配线。
本发明的这些目的通过在下述(1)至(13)中描述的内容来实现。
(1)柔性基板,其包括具有焊剂活性的第一树脂膜和层压至所述第一树脂膜且不同于所述第一树脂膜的第二树脂膜,其中通过以下方式使用所述柔性基板:使多个电子部件安装在所述第一树脂膜表面,然后使各电子部件在同一时间下与柔性基板结合,所述第一树脂膜在230℃的胶凝时间为100秒至600秒。
(2)根据(1)所述的柔性基板,其中根据等式1从在以下条件下测量的酸的量计算出的所述第一树脂膜的还原性保持率不低于15%。
[测量条件]
分别精确称量0.1g至0.2g在100℃进行热处理30分钟的所述第一树脂膜和未进行热处理的所述第一树脂膜,并溶解在100ml丙酮中,以根据用于计算每单位重量酸的摩尔量(mol/g)的电位差测量法,用氢氧化纳水溶液进行滴定,
[等式1]
还原性保持率(%)={(在100℃进行热处理30分钟的所述第一树脂膜中的酸的量)/(未进行热处理的所述第一树脂膜中的酸的量)}×100
(3)根据(1)或(2)所述的柔性基板,其中所述第一树脂膜由包含热固性树脂和具有焊剂活性的化合物的树脂组合物构成。
(4)根据(1)至(3)中任一项所述的柔性基板,其中所述第一树脂膜含有酚酞啉。
(5)根据(1)至(4)中任一项所述的柔性基板,其中所述第一树脂膜在120℃的熔融粘度为0.1至10,000Pa·s。
(6)根据(1)至(5)中任一项所述的柔性基板,其中所述第一树脂膜在120℃的熔融粘度为1至10,000Pa·s。
(7)根据(1)至(6)中任一项所述的柔性基板,其中所述第二树脂膜设置有贯通孔,所述贯通孔各自填充有导体构件。
(8)根据(1)至(7)中任一项所述的柔性基板,其中在所述第二树脂膜的一个表面上形成导体层,并在其另一个表面上形成突起电极(bumpelectrodes)以覆盖所述导体构件。
(9)根据(1)至(8)中任一项所述的柔性基板,其中所述第二树脂膜由选自如下树脂中的至少一种构成:聚酰亚胺型树脂、聚酯型树脂、聚酰胺型树脂和液晶聚合物。
(10)根据(1)至(9)中任一项所述的柔性基板,其中所述第二树脂膜在室温(23℃)至第二树脂膜的玻璃化转变温度之间的热膨胀系数不超过15ppm。
(11)根据(1)至(10)中任一项所述的柔性基板,其中所述第二树脂膜在室温(23℃)至第二树脂膜的玻璃化转变温度之间的热膨胀系数为3ppm至8ppm。
(12)电子器件,其包括根据(1)至(11)中任一项所述的柔性基板。
(13)用于生产电子器件的方法,该方法包括在柔性基板的所述第一树脂膜表面上安装多个电子部件,所述柔性基板通过将具有焊剂活性的第一树脂膜与不同于第一树脂膜的第二树脂膜层压而获得,然后使各电子部件在同一时间下与柔性基板结合,在结合步骤后,将多个电子部件与柔性基板一起切割成片段,其中所述柔性基板为(1)至(11)中任一项所述的柔性基板。
根据本发明,可获得柔性基板,所述柔性基板能够提供能够以高产率形成微细配线的电子器件。
此外,根据本发明,可获得电子器件,所述电子器件能够以高产率形成微细配线。
附图说明
通过以下结合附图的优选实施方案的详细说明,上述和其它目的、特征和优点将变得明显。
图1为说明柔性基板的一个实施例的横断面视图。
图2为说明用于生产半导体器件的方法的横断面视图。
图3为说明用于生产半导体器件的方法的横断面视图。
具体实施方式
以下,将描述本发明的柔性基板和电子器件。
本发明的柔性基板为通过层压具有焊剂活性的第一树脂膜和不同于第一树脂膜的第二树脂膜而获得的柔性基板。所述柔性基板通过以下方式来使用:使多个电子部件安装在第一树脂膜的表面,然后使各电子部件在同一时间下与柔性基板结合。
第一树脂膜在230℃的胶凝时间为100秒至600秒。
此外,本发明的电子器件具有如上所述的柔性基板。
首先,将参考适当的附图来描述所述柔性基板。
图1为说明柔性基板的一个实施例的横断面视图。
如图1中所示,柔性基板10为具有焊剂活性的第一树脂膜和不同于第一树脂膜的第二树脂膜的层压体(laminate)。
在第二树脂膜2上形成贯通孔(未示出),且所述贯通孔中各自填充有导体构件21。
此外,使导体层22形成于第二树脂膜2的一个表面(图1中的下表面)。
另外,使突起电极23形成于第二树脂膜2的另一表面,以便覆盖所述导体构件21(图1中的上表面)。
将第一树脂膜1层压在第二树脂膜2上,以便覆盖所述突起电极23。
第一树脂膜
例如,此第一树脂膜由包含热塑性树脂和具有焊剂活性的树脂的树脂组合物或包含热固性树脂、具有焊剂活性的化合物和成膜树脂的树脂组合物等构成。其中,第一树脂膜优选由包含热固性树脂、具有焊剂活性的化合物和成膜树脂的树脂组合物构成。由此,第一树脂膜在诸如焊锡回流等的热处理中表现出优异的耐热性。
热固性树脂的实例包括:环氧树脂、氧杂环丁烷树脂、酚醛树脂、(甲基)丙烯酸酯树脂、未饱和聚酯树脂、邻苯二甲酸二烯丙酯树脂、马来酰亚胺树脂等。在这些树脂中,优选使用环氧树脂。考虑到优良的固化性和储存稳定性,以及固化产物的优良的耐热性、耐湿性和耐化学药品性,环氧树脂适合作为热固性树脂。
基于前述树脂组合物的总量,热固化树脂的含量优选为20至80重量%,特别优选为30至70重量%。当所述含量在上述范围内时,可以实现优良的固化性,还可以设计优良的熔融行为。
前述具有焊剂活性的化合物能够减少在熔融所述树脂组合物时在焊锡突起表面上形成的氧化膜,由此增强组成所述焊锡突起的焊锡组分的可润湿性,并降低在半导体芯片中对向内部电极之间的连接抵抗值(connection resistancevalue)。
焊剂活性化合物(flux activating compound)的实例包括具有酚羟基、羧基等的化合物。
具有酚羟基的化合物的实例包括:各自具有酚羟基的单体,例如苯酚、邻甲酚、2,6-二甲苯酚、对甲酚、间甲酚、邻乙基苯酚、2,4-二甲苯酚、2,5-二甲苯酚、间乙基苯酚、2,3-二甲苯酚、2,4,6-三甲苯酚、3,5-二甲苯酚、对叔丁基苯酚、邻苯二酚、对叔戊基苯酚、间苯二酚、对辛基苯酚、对苯基苯酚、双酚A、双酚F、双酚AF、双苯酚(biphenol)、二烯丙基双苯酚F(diallylbisphenol F)、二烯丙基双苯酚A、三苯酚、四苯酚等;苯酚酚醛清漆树脂(phenol novolak resin);邻甲酚酚醛清漆树脂(o-cresol novolak resin);双酚F酚醛清漆树脂(bisphenol F novolak resin);双酚A酚醛清漆树脂等。
所述具有羧基的化合物的实例包括:脂肪族酸酐、脂环族酸酐、芳香族酸酐、脂肪族羧酸、芳香族羧酸、苯酚等。
此处,脂肪族酸酐的实例包括:琥珀酸酐、聚己二酸酐、聚壬二酸酐、聚癸二酸酐等。
所述脂环族酸酐的实例包括:甲基四氢邻苯二甲酸酐、甲基六氢邻苯二甲酸酐、甲基腐植酸酐(methyl himic acid anhydride)、六氢邻苯二甲酸酐、四氢邻苯二甲酸酐、三烃基四氢邻苯二甲酸酐、甲基环己烯二甲酸酐等。
芳香族酸酐的实例包括:邻苯二甲酸酐、偏苯三酸酐、均苯四酸酐、二苯甲酮四甲酸酐、乙二醇双偏苯三酸酐、甘油偏苯三酸酐等。
所述脂肪族羧酸的实例包括:甲酸、乙酸、丙酸、丁酸、戊酸、新戊酸、己酸、辛酸、月桂酸、肉豆蔻酸、棕榈酸、硬脂酸、丙烯酸、甲基丙烯酸、巴豆酸、油酸、富马酸、马来酸、草酸、丙二酸、琥珀酸、戊二酸、己二酸、癸二酸、十二烷二酸、庚二酸等。其中,适合使用的为由HOOC-(CH2)n-COOH(n为0至20的整数)表示的脂肪族羧酸,且优选使用的是己二酸、癸二酸、十二烷二酸。
芳香族羧酸的实例包括:苯甲酸、邻苯二甲酸、间苯二甲酸、对苯二甲酸、苯连三酸、偏苯三酸、苯均三酸、苯偏四甲酸、连苯四酸、均苯四酸、苯六甲酸、三氟甲磺酸、二甲苯甲酸、2,3-二甲基苯甲酸、3,5-二甲基苯甲酸、2,3,4-三甲基苯甲酸、甲苯甲酸、肉桂酸、水杨酸、2,3-二羟基苯甲酸、2,4-二羟基苯甲酸、龙胆酸(2,5-二羟基苯甲酸)、2,6-二羟基苯甲酸、3,5-二羟基苯甲酸、没食子酸(3,4,5-三羟基苯甲酸)、萘甲酸衍生物(如1,4-二羟基-2-萘甲酸、3,5-二羟基-2-萘甲酸、3,5-二羟基-2-萘甲酸等);酚酞啉;双酚酸等。
在这些焊剂活性化合物中,优选使用能够作为前述热固性树脂的固化剂的化合物(具有焊剂活性的固化剂)。即,前述焊剂活性化合物具有以下作用:减少在焊锡突起表面上形成氧化膜,减少的程度为使能够将电连接部(electrical connections)与导体构件结合,且优选焊剂活性化合物为具有与树脂组分结合的官能团的化合物(具有焊剂活性的固化剂)。例如,当树脂组分包含环氧树脂时,具有焊剂活性的固化剂可具有羧基和与环氧基反应的基团(例如,羧基、羟基、氨基等)。
此具有焊剂活性的固化剂在焊锡连接过程中显示如下作用:减少在焊锡突起表面形成氧化膜,减少的程度为使能够将电连接部与所述导体构件键合,且在随后的固化反应过程中被掺入到树脂骨架中。由此,可省略用于去除焊剂的清洁步骤。
前述成膜树脂的实例包括:(甲基)丙烯酸树脂、苯氧树脂、聚酯树脂、聚氨酯树脂、聚酰亚胺树脂、硅氧烷改性的聚酰亚胺树脂、聚丁二烯、聚丙烯、苯乙烯丁二烯苯乙烯共聚物、苯乙烯乙烯丁二烯苯乙烯共聚物、聚缩醛树脂、聚乙烯醇缩丁醛树脂、聚乙烯醇缩醛树脂、丁基橡胶、氯丁橡胶、聚酰胺树脂、丙烯腈丁二烯共聚物、丙烯腈丁二烯丙烯酸共聚物、丙烯腈丁二烯苯乙烯共聚物、聚乙酸乙烯酯、尼龙等。这些可以单独使用或两种以上组合使用。尤其是,优选使用选自(甲基)丙烯酸树脂、苯氧树脂和聚酰亚胺树脂中的至少一种。
对于前述成膜树脂的重均分子量没有特别限定,但优选不低于100,000,更优选150,000至1,000,000,进一步优选250,000至900,000。当重均分子量在上述范围时,可以进一步提高成膜性能。
对于前述成膜树脂的含量没有特别限定,但基于前述树脂组合物的总量,含量优选为10至50重量%,更优选为15至40重量%且特别优选为20至35重量%。当含量在上述范围内时,可抑制在粘合膜熔融前所述树脂组合物的流动性,且使粘合膜的操作变得容易。
此外,当第一树脂膜由包含热塑性树脂和具有焊剂活性的化合物的树脂组合物组成时,所述热塑性树脂的实例包括:通用树脂如聚乙烯(PE)、聚苯乙烯(PS)、聚丙烯(PP)、丙烯腈苯乙烯树脂(AS树脂)、丙烯腈丁二烯树脂(AB树脂)、丙烯腈丁二烯苯乙烯树脂(ABS树脂)、聚丁二烯、甲基丙烯酸树脂、氯乙烯树脂等;通用工程塑料如聚酰胺、聚缩醛、聚对苯二甲酸乙二酯(PET)、超高分子量聚乙烯、聚对苯二甲酸丁二酯(PBT)、甲基戊烯、聚苯并噁唑、聚邻苯二甲酸乙二酯、聚酯、聚碳酸酯等;高耐热超级工程树脂如聚酰亚胺(PI)、聚苯硫醚(PPS)、聚醚醚酮(PEEK)、液晶聚合物(LCP)、聚四氟乙烯(PTFE)、聚醚酰亚胺(PEI)、聚芳酯(PAR)、聚砜(PSF)、聚醚砜(PES)、聚酰胺酰亚胺(PAI)、尼龙树脂等。
此外,具有焊剂活性的化合物的实例与上述那些相同。
除了前述热固性树脂、成膜树脂和焊剂活性化合物之外,前述树脂组合物可进一步包含添加剂,如偶联剂、固化促进剂、填料、表面活性剂等。
第一树脂膜例如,可通过将前述树脂组合物涂布至基材上并将其干燥而获得。
对于第一树脂膜1的厚度没有特别限定,但优选为1至80μm,特别优选5至50μm。当厚度在上述范围内时,缝隙填充性(使在由半导体部件电极构成的待连接物之间形成缝隙,且没有任何空腔或空气截留)和在半导体部件上的蠕变性(在连接过程中,由于树脂膜的流动而使树脂膜过多地流入半导体部件,因此污染连接装置)两者都优良。
第一树脂膜1在120℃的熔融粘度优选为0.1至10,000Pa·s,更优选1至10,000Pa·s,特别优选1至100Pa·s。当所述熔融粘度在上述范围内时,特别是,半导体部件的电极的连接性(焊锡连接性)为优良。
此外,所述熔融粘度例如,可通过使用流变仪(Haake Co.,Ltd.的产品)在10℃/分钟的升温速率下来测定。
第一树脂膜1在230℃的胶凝时间的下限优选为不低于100秒,特别优选不低于120秒。另外,其上限优选为不超过600秒,特别优选不超过500秒。因此,所述胶凝时间最优选120至500秒。
以下,将说明将第一树脂膜1的胶凝时间限定至上述范围的技术意义。当将半导体部件分别结柔性基板上时,为了提高生产性,需要缩短胶凝时间。然而,当将多个半导体部件结合至柔性基板上时,伴随其中一个半导体部件的临时连接的热量还会被热传导至其它相邻的临时连接的半导体部件的结合部分。当第一树脂膜的胶凝时间短时,在临时连接过程中发生第一树脂膜的固化。因此,存在在结合期间第一树脂膜1的流动性恶化以及发生电极连接失败的问题。另一方面,当胶凝时间在上述范围内时,在临时连接期间,不发生第一树脂膜的固化。因此,几乎不发生电极连接失败,且能够获得在连接可靠性方面表现优异的半导体器件。
此外,前述胶凝时间例如,可通过使用设定至180℃的热平板测量直到无粘合性剩余的时间周期来测定。具体地,其可以根据JIS C2161 7.5.2来测量。
第一树脂膜1的还原性保持率优选不低于15%,更优选不低于30%,特别优选不低于50%。对于其上限没有特别限定,但优选不超过98%。所述还原性保持率可以从在以下测量条件下测量的酸的量通过等式1来计算。
[测量条件]
分别精确称量0.1g至0.2g在100℃进行热处理30分钟的前述第一树脂膜和未进行热处理的第一树脂膜,并溶解在100ml丙酮中,以根据用于计算每单位重量酸的摩尔量(mol/g)的电位差测量法,用氢氧化钠水溶液进行滴定。
[等式1]
还原性保持率(%)={(在100℃进行热处理30分钟的第一树脂膜中的酸的量)/(未进行热处理的第一树脂膜中的酸的量)}×100
所述还原性保持率例如,通过以下计算:使用自动电位滴定仪(型号:AT-500N,京都电子工业(株)的产品)用0.05mol/l的氢氧化钠水溶液滴定来算出每单位重量的酸(H+)的摩尔量,然后将其代入上述等式1中。
为了提高所述还原性保持率,优选选择其中源自焊剂活性化合物的羧基或酚式羟基的质子几乎不解离的化合物。具体地,优选选择pKa值比2,4-二羟基羧酸的高的化合物。作为具有焊剂活性的化合物,例如,可以选择酚酞啉或2,5-二羟基苯甲酸。
以下,将描述将还原性保持率限定至上述范围的技术意义。当将多个半导体部件与常规柔性基板键合时,存在在焊锡连接步骤中发生结合失败的问题。虽然不清楚其原因,但使人想到,如上所述,伴随其中一个半导体部件的临时连接的热量还会被热传导至其它相邻的临时连接的半导体部件的结合部分,由此,使具有焊剂活性的化合物与第一树脂膜中的树脂反应并恶化所述焊剂活性。
于是,第一树脂膜具有如上所述的还原性保持率,由此能够降低在临时连接步骤中焊剂活性的恶化且焊锡能够很好地连接。
第二树脂膜
使导体层22形成于第二树脂膜2的一个表面(图1中的下表面)。
在第二树脂膜2上,通过使用激光等形成贯通孔,且通过电镀、导电糊膏等使所述贯通孔填充有导体构件21。由此,可通过导体构件21将第二树脂膜2的一个表面电连接至另一表面。
另外,通过使用焊锡等使突起电极23形成于第二树脂膜的另一表面以便覆盖所述导体构件21(图1中的上表面)。
第二树脂膜2由以下组成:聚酰亚胺型树脂,如聚酰亚胺树脂、聚醚酰亚胺树脂、聚酰胺酰亚胺树脂等;聚酰胺型树脂;聚酯型树脂;或诸如液晶聚合物等的树脂。在这些树脂中,第二树脂膜优选由选自以下树脂中的至少一种构成:聚酰亚胺型树脂、聚酯型树脂、聚酰胺型树脂和液晶聚合物。第二树脂膜特别优选由聚酰亚胺型树脂构成。由此,可以增强耐热性。除了构成所谓的柔性回路基板的此树脂之外,还可以将所谓的积层材料(build-upmaterials)如附加有载体的树脂膜等用作第二树脂膜2,只要其通过与第一树脂膜1层压显示柔性即可。
对于第二树脂膜2在膜面内方向的热膨胀系数没有特别限定,但在室温(23℃)至第二树脂膜2的玻璃化转变温度的范围内,其优选不超过15ppm,更优选不超过10ppm,最优选3至8ppm。当所述热膨胀系数在上述范围内时,能够减小在所述电子部件和所述第二树脂膜2之间的热膨胀系数差,以便减少在所得的半导体器件中的翘曲。
此外,所述热膨胀系数能够通过使用热机械分析装置(TMA,SS6100,Seiko Instruments Inc.的产品),在张应力方法中升温速率为10℃/分钟的条件下来测定。
对于第二树脂膜2的厚度没有特别限定,但优选为10至200μm,特别优选为20至100μm。当所述厚度在上述范围内时,柔性和可加工性优良。
柔性基板10能够通过层压第一树脂膜1和第二树脂膜2来获得。
对于柔性基板10的厚度没有特别限定,但优选为30至300μm,特别优选为40至100μm。当所述厚度在上述范围内时,封装件的薄型化优良。
此外,在柔性基板10中,第二树脂膜2的厚度t2与第一树脂膜1的厚度t1的比例(t2/t1)不受特别限定,但优选为0.1至10,特别优选为0.5至1。当所述厚度比例在上述范围内时,在层压后的翘曲特性特别优良。
对于柔性基板10的介电常数(测量频率:1GHz)没有特别限定,但优选2至5,特别优选2.5至4.5。当所述介电常数在上述范围内时,电特性如电信号传送效率的提高是特别优良的。
用于生产电子部件(半导体器件)的方法
接着,基于参考图2和3的优选实施方案,将描述用于生产作为电子部件的一个实例的半导体器件的方法。此外,在以下描述和附图中,将以相同的附图标记标记相同或相应的部件,且将不再对其作重复说明。
首先,在第二树脂膜2的一个表面(图2中的下表面)上形成导体层22以及阻焊膜24以便覆盖导体层22(图2(a))。
另外,去除部分阻焊膜24以露出导体层22,并且在所述去除阻焊膜的部分安装焊盘25(图2(a))。
在第二树脂膜2上形成贯通孔,且所述贯通孔各自被由导电糊膏构成的导体构件21填充(图2(a))。
另外,通过使用焊锡在第二树脂膜2的另一表面(图2中的上表面)上形成突起电极23以便覆盖导体构件21(图2(a))。
通过在第二树脂膜2的突起电极23形成的一侧层压所述第一树脂膜1来获得柔性基板(层压体)10(图2(b))。
此外,在该实施方案中,描述了其中第二树脂膜2具有贯通孔的情况,但本发明不限于此,例如,可将其用于电配线仅在一个表面上形成的单面配线基板。
接着,使用倒装式焊接器5将具有突起电极31的半导体芯片3对齐并安装在层压体10中的第一树脂膜1的表面(图2(c))。由此,使在第二树脂膜2上形成的突起电极23与在半导体芯片3中的突起电极31接触用于临时连接。在图2中所示的用于生产半导体器件的方法中,使两个半导体芯片3临时连接。
此处,对于用于临时连接的条件没有特别限定,但压力优选为0.001至3Mpa,温度优选为20至200℃,时间周期优选为0.1至120秒,且所述压力特别优选为0.02至1Mpa,所述温度特别优选为50至100℃,所述时间周期特别优选为0.3至60秒。由此,可以将半导体部件和柔性基板临时性地可靠地附着,且不损坏半导体芯片3,并同时抑制第一树脂膜1的固化。
接着,将临时连接有多个半导体芯片3的柔性基板10加热,从而使在第二树脂膜2上形成的突起电极23和在半导体芯片3中的突起电极31同时电连接(焊锡连接)(图2(d))。由此,使多个半导体芯片3与第二树脂膜2同时电连接。
对于加热条件没有特别限定,只要所述条件允许焊锡连接即可,但所述条件依赖于使用的焊锡的种类而不同。温度优选比实际温度的焊锡熔融点高1℃至50℃,时间周期优选1至120秒,且所述温度特别优选比焊锡熔融点高5℃至15℃,所述时间周期特别优选5至60秒。
在焊锡连接之后,将前述第一树脂膜1热固化(后固化)。这样,能够增强所述半导体芯片3和所述柔性基板10之间的粘合性,由此能够增强可靠性。另外,在热固化之后,第一树脂膜1能够用作焊锡连接部分之间的包封材料,以便能够进一步增强可靠性。
对于用于热固化的条件没有特别限定,但温度优选100至200℃,时间周期优选10至180分钟,且所述温度特别优选120至185℃,所述时间周期特别优选30至90分钟。
随后,通过使用划片刀6在半导体芯片3之间进行切割且将部件切割成片段而获得半导体器件100(图3(a)和(b))。
在此实施方案中,将多个半导体芯片3同时结合,但本发明不限于此。在将主要的半导体芯片3同时结合后,可以安装其它部件。
由于能够通过使用在通过使用激光等形成贯通孔方面表现优良的柔性基板10获得半导体器件,因此可获得能够形成微细配线的电子器件。
此外,由于柔性基板10由具有焊剂活性的热固性树脂的第一树脂膜构成,因此焊锡连接性和粘合性两者都优良。
同时,使多个半导体部件在同一时间下进行安装和结合,因此生产性优良。
实施例
下面将参考实施例和对比例详细说明本发明。然而,本发明不限于这些实施例。
实施例1
1.柔性基板的生产
将45重量%的环氧树脂EPICLON 840-S(DIC公司的产品)、24.9重量%的苯氧树脂YX6954(Japan Epoxy Resin Co.,Ltd.的产品)、15重量%的具有焊剂活性的化合物,酚酞啉(东京化成工业社的产品)、15重量%的苯酚酚醛清漆树脂PR-53647(Sumitomo Bakelite Co.,Ltd.的产品)和0.1重量%的固化促进剂2P4MZ(2-苯基-4-甲基咪唑,四国化成社的产品)预先混合作为第一树脂膜,将所述混合物涂布至聚对苯二甲酸乙二酯基膜以给出所得材料。在温度为120℃、压力为2kg/cm2以及层压速度为0.3m/分钟的条件下使用真空层压机层压所得材料和用作第二树脂膜的具有两层结构的覆铜聚酰亚胺膜(通过将厚度为12μm的铜箔热压结合至聚酰亚胺基材(UPISEL-N,型号:SE1310,宇部兴产社的产品,厚度:25μm,热膨胀系数:11ppm)而获得),由此获得柔性基板(厚度:70μm)。另外,所述第一树脂膜在230℃的胶凝时间为140秒,在120℃的熔融粘度为50Pa·s,还原性保持率为90%。
2.同时结合的4个半导体器件的生产
在温度为120℃,周期为10秒以及压力为0.1MPa的条件下,将总共4个半导体芯片(尺寸10mm×10mm×0.2mm)中的每一个(其具有高25μm且节距为70μm的焊锡突起)安装在获得的柔性基板中的第一树脂膜的表面上。接着,将半导体部件在230℃加热30秒以进行焊锡连接,然后将其放入烘箱在180℃加热60分钟以热固化所述树脂膜。最终,通过在4个半导体部件之间进行切割获得4个半导体器件。
3.切割成片段的4个半导体器件的生产
将获得的附着有第一树脂膜的柔性基板切成4片段(切割成片段),并随后在温度为120、周期为10秒以及压力为0.1MPa的条件下,将具有高25μm且节距为70μm的焊锡突起的半导体芯片(尺寸10mm×10mm×0.2mm)各自安装在第一树脂膜的表面上,用于临时连接。接着,使其中将半导体组件临时连接至第一树脂膜表面的所述柔性基板各自在230℃加热30秒,以进行焊锡连接。然后,使其中焊锡连接有半导体部件的所述柔性基板在180℃加热60分钟,以热固化第一树脂膜,由此获得4个半导体器件。
实施例2
以与实施例1相同的方式进行相同的操作,不同的是将45重量%的环氧树脂EPICLON 840-S(DIC公司的产品)、24.97重量的%苯氧树脂YX6954(JapanEpoxy Resin Co.,Ltd.的产品)、15重量%的具有焊剂活性的化合物,酚酞啉(东京化成工业社的产品)、15重量%的苯酚酚醛清漆树脂PR-53647(SumitomoBakelite Co.,Ltd.的产品)和0.03重量%的固化促进剂2P4MZ(四国化成社的产品)预先混合作为第一树脂膜,且所述第一树脂膜在230℃的胶凝时间改为100秒。另外,所述第一树脂膜在120℃的熔融粘度为5Pa·s,所述还原性保持率为50%。
实施例3
以与实施例1相同的方式进行相同的操作,不同的是使用PIBO(聚酰亚胺苯并噁唑,东洋纺社的产品,热膨胀系数:2.5ppm,厚度:25μm)作为第二树脂膜,并使用具有双层结构的覆铜衬聚酰亚胺膜(其具有在PIBO上形成的9μm厚的铜层)。
实施例4
以与实施例1相同的方式进行相同的操作,不同的是将49.9重量%的环氧树脂EPICLON 840-S(DIC公司的产品)、20重量%的苯氧树脂YX6954(JapanEpoxy Resin Co.,Ltd.的产品)、14重量%的具有焊剂活性的化合物,酚酞啉(东京化成工业社的产品)、16重量%的苯酚酚醛清漆树脂PR-53647(SumitomoBakelite Co.,Ltd.的产品)和0.1重量%的固化促进剂2P4MZ(四国化成社的产品)预先混合作为第一树脂膜,且所述第一树脂膜在230℃的胶凝时间改为150秒。另外,所述第一树脂膜在120℃的熔融粘度为0.5Pa·s,所述还原性保持率为85%。
对比例1
以与实施例1相同的方式进行相同的操作,不同的是将刚性基板BT基板(型号:HL832HS-TypeHS,Mitsubishi Gas Chemical Company,Inc.的产品,热膨胀系数:15ppm,厚度:50μm)用作第二树脂膜,由此未获得与如上所述的焊锡突起对应的具有微细配线的半导体器件。
对比例2
以与实施例1相同的方式进行相同的操作,不同的是使用以下无焊剂活性的第一树脂膜。
使用含有预先混合的55重量%的环氧树脂EPICLON 840-S(DIC公司的产品)、30重量%的YX6954(Japan Epoxy Resin Co.,Ltd.的产品)、14.9重量%的PR-53647(Sumitomo Bakelite Co.,Ltd.的产品)和0.1重量%的2P4MZ(四国化成社的产品)且不含有酚酞啉的第一树脂膜。所述第一树脂膜在230℃的胶凝时间为140秒,在120℃的熔融粘度为30Pa·s。
对比例3
以与实施例1相同的方式进行相同的操作,不同的是仅将所述第二树脂膜和半导体部件通过使用底填料(型号:CRP-4160E,Sumitomo Bakelite Co.,Ltd.的产品)来连接。然而,由于所述半导体部件和柔性基板之间的缝隙很窄,底填料的注入不充分。
对比例4
以与实施例1相同的方式进行相同的操作,不同的是将45重量%的环氧树脂EPICLON 840-S(DIC公司的产品)、24.9重量%的苯氧树脂YX6954(JapanEpoxy Resin Co.,Ltd.的产品)、15重量%的具有焊剂活性的化合物,酚酞啉(东京化成工业社的产品)、15重量%的苯酚酚醛清漆树脂PR-53647(SumitomoBakelite Co.,Ltd.的产品)和0.1重量%的咪唑化合物2MZ(四国化成社的产品)预先混合作为第一树脂膜,且所述第一树脂膜在230℃的胶凝时间改为60秒。另外,所述第一树脂膜在120℃的熔融粘度为5Pa·s,还原性保持率为80%。
对比例5
以与实施例1相同的方式进行相同的操作,不同的是将54.9重量%的环氧树脂EPICLON 840-S(DIC公司的产品)、24重量%的苯氧基树脂YX6954(JapanEpoxy Resin Co.,Ltd.的产品)、5重量%的具有焊剂活性的化合物,2,4-二羟基苯甲酸(东京化成工业社的产品)、16重量%的苯酚酚醛清漆树脂PR-53647(Sumitomo Bakelite Co.,Ltd.的产品)和0.1重量%的咪唑化合物2P4MZ(四国化成社的产品)预先混合作为第一树脂膜,且所述第一树脂膜在230℃的胶凝时间改为120秒。另外,所述第一树脂膜在120℃的熔融粘度为5Pa·s,还原性保持率为10%。
以如下方式评价在各个实施例和对比例中获得的第一树脂膜和半导体器件。评价项目和内容一起说明。所得结果示于表1中。另外,在表1中,柔性是指柔性基板,刚性是指刚性基板。
1.连接性
对于连接性评价,将连接的封装件进行横断面研磨,将具有突起的封装件中之一中出现连接失败的确定为NG。以其中不发生连接失败的封装件的数量对4个封装件进行评价。
2.耐回流性
对于耐回流性评价,在30℃和60%下吸湿处理96小时后,在通过3次具有最大温度为260℃的回流之后,用扫描声学显微镜确定剥离的发生。以其中不发生剥离的封装件的数量对4个封装件进行评价。
3.耐温度循环测试
对于耐温度循环测试,在-40℃和125℃(30分钟保持时间)的条件下经过500次用于温度循环测试的循环之后,检测连接抵抗性(connectionresistance)。将与初始抵抗值相比增加了15%的连接抵抗性评价为异常抵抗性。以其中初始抵抗值未增加15%的封装件的数量对4个封装件进行评价。
4.生产性
粗略地估计从每一个构件的制备到封装件的生产所涉及的加工步骤和时间周期,从而评价生产性。各自的标记如下所示:
○:表现优良的生产性。
×:表现低生产性。
5.第一树脂膜在120℃的熔融粘度
使用流变仪(RheoStress RS150,Haake Co.,Ltd.的产品)在平行平板20mm缝隙0.05mm,频率0.1Hz和升温速率10℃/分钟的条件下,测量粘膜的熔融粘度。测量在120℃的熔融粘度。
6.第一树脂膜的还原性保持率
分别精确称量0.1g至0.2g在100℃进行热处理30分钟的所述第一树脂膜和未进行热处理的所述第一树脂膜,并溶解在100ml丙酮以制备测量样品。随后,通过使用自动电位滴定仪(型号:AT-500N,京都电子工业(株)的产品)用0.05mol/l的氢氧化钠水溶液在室温(23℃)进行滴定,来计算每单位重量的酸的摩尔量(还原性,单位:mol/g)。
此外,根据以下等式1来计算所述还原性保持率。
[等式1]
还原性保持率(%)={(在100℃进行热处理30分钟的所述第一树脂膜中的酸的量)/(未进行热处理的所述第一树脂膜中的酸的量)}×100
7.胶凝时间
根据JIS C2161 7.5.2进行测量。
如表1所示,在实施例1至4中,能够形成微细配线且连接性优良。
另外,在实施例1至4中,耐回流性和耐温度循环性也优良。
在实施例1至4中,生产性也优良。
在其中第一树脂膜在230℃的胶凝时间为60秒的对比例4中,所述切割成片段的连接性优良,然而同时结合的4个封装件的连接性差。另外,在其中第一树脂膜的还原性保持率为10%的对比例5中,所述切割成片段的连接性优良,然而同时结合的4个封装件的连接性差。
如上所述,已描述本发明的实施方案,但这些实施方案为本发明的示例,且还可以采用其它构成。
Claims (11)
1.柔性基板,其包括具有焊剂活性的第一树脂膜和层压至所述第一树脂膜且不同于所述第一树脂膜的第二树脂膜,
其中,所述柔性基板通过以下方式来使用:使多个电子部件安装在所述第一树脂膜的表面,然后使各电子部件在同一时间下与柔性基板结合,且
所述第一树脂膜由包含热固性树脂和具有焊剂活性的化合物的树脂组合物构成,
其中所述第一树脂膜在230℃的胶凝时间为100秒至600秒,且
其中,根据等式1从在以下条件下测量的酸的量计算出的所述第一树脂膜的还原性保持率不低于15%,
[测量条件]
分别精确称量0.1g至0.2g在100℃进行热处理30分钟的所述第一树脂膜和未进行热处理的所述第一树脂膜,并溶解在100ml丙酮中,以根据用于计算每单位重量酸的摩尔量mol/g的电位差测量法,用氢氧化钠水溶液进行滴定,
[等式1]
还原性保持率(%)={(在100℃进行热处理30分钟的所述第一树脂膜中的酸的量)/(未进行热处理的所述第一树脂膜中的酸的量)}×100。
2.根据权利要求1所述的柔性基板,其中所述第一树脂膜含有酚酞啉。
3.根据权利要求1所述的柔性基板,其中所述第一树脂膜在120℃的熔融粘度为0.1至10,000Pa·s。
4.根据权利要求1所述的柔性基板,其中所述第一树脂膜在120℃的熔融粘度为1至10,000Pa·s。
5.根据权利要求1所述的柔性基板,其中所述第二树脂膜设置有贯通孔,且所述贯通孔各自填充有导体构件。
6.根据权利要求5所述的柔性基板,其中在所述第二树脂膜的一个表面上形成导体层,并在其另一个表面上形成突起电极以覆盖所述导体构件。
7.根据权利要求1所述的柔性基板,其中所述第二树脂膜由选自如下树脂中的至少一种构成:聚酰亚胺型树脂、聚酯型树脂、聚酰胺型树脂和液晶聚合物。
8.根据权利要求1所述的柔性基板,其中所述第二树脂膜在23℃至所述第二树脂膜的玻璃化转变温度之间的热膨胀系数不超过15ppm。
9.根据权利要求1所述的柔性基板,其中所述第二树脂膜在23℃至所述第二树脂膜的玻璃化转变温度之间的热膨胀系数为3ppm至8ppm。
10.电子器件,其包括权利要求1至9中任一项所述的柔性基板。
11.用于生产电子器件的方法,其包括在通过层压具有焊剂活性的所述第一树脂膜和不同于所述第一树脂膜的第二树脂膜获得的柔性基板的第一树脂膜表面上安装多个电子部件,然后使各电子部件在同一时间下与柔性基板结合,和
在结合后,将所述多个电子部件与所述柔性基板一起切割成片段,
其中所述柔性基板为权利要求1至9中任一项所述的柔性基板。
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Also Published As
Publication number | Publication date |
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EP2375879A1 (en) | 2011-10-12 |
TW201034144A (en) | 2010-09-16 |
JP5482666B2 (ja) | 2014-05-07 |
CN102265715A (zh) | 2011-11-30 |
JP2013093598A (ja) | 2013-05-16 |
KR20110104078A (ko) | 2011-09-21 |
CA2748245A1 (en) | 2010-07-01 |
WO2010073639A1 (ja) | 2010-07-01 |
SG172375A1 (en) | 2011-07-28 |
JP5569582B2 (ja) | 2014-08-13 |
US20110262697A1 (en) | 2011-10-27 |
JPWO2010073639A1 (ja) | 2012-06-07 |
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