JP2005325332A - 水分収着耐性を有するポリイミド組成物およびそれに関連する方法 - Google Patents

水分収着耐性を有するポリイミド組成物およびそれに関連する方法 Download PDF

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Publication number
JP2005325332A
JP2005325332A JP2005002744A JP2005002744A JP2005325332A JP 2005325332 A JP2005325332 A JP 2005325332A JP 2005002744 A JP2005002744 A JP 2005002744A JP 2005002744 A JP2005002744 A JP 2005002744A JP 2005325332 A JP2005325332 A JP 2005325332A
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Prior art keywords
polyimide
bis
solution
paste
composition
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Japanese (ja)
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JP2005325332A5 (https=
Inventor
Thomas E Dueber
イー．デューバー トーマス
John D Summers
ディー．サマーズ ジョン
Xin Fang
ファン シン
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EIDP Inc
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EI Du Pont de Nemours and Co
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C08G73/1028—Preparatory processes from tetracarboxylic acids or derivatives and diamines characterised by the process itself, e.g. steps, continuous
    • C08G73/1032—Preparatory processes from tetracarboxylic acids or derivatives and diamines characterised by the process itself, e.g. steps, continuous characterised by the solvent(s) used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1039—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors comprising halogen-containing substituents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
    • C08G73/1064—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing sulfur
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Paints Or Removers (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Non-Adjustable Resistors (AREA)
JP2005002744A 2004-01-09 2005-01-07 水分収着耐性を有するポリイミド組成物およびそれに関連する方法 Withdrawn JP2005325332A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US53545304P 2004-01-09 2004-01-09

Publications (2)

Publication Number Publication Date
JP2005325332A true JP2005325332A (ja) 2005-11-24
JP2005325332A5 JP2005325332A5 (https=) 2008-02-07

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JP2005002744A Withdrawn JP2005325332A (ja) 2004-01-09 2005-01-07 水分収着耐性を有するポリイミド組成物およびそれに関連する方法

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US (1) US7348373B2 (https=)
EP (1) EP1553134B1 (https=)
JP (1) JP2005325332A (https=)
DE (1) DE602004024758D1 (https=)

Cited By (17)

* Cited by examiner, † Cited by third party
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WO2006080119A1 (ja) * 2005-01-28 2006-08-03 Sony Chemical & Information Device Corporation ポリイミド化合物及びフレキシブル配線板
JP2009540104A (ja) * 2006-06-15 2009-11-19 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー 電子用途用の疎水性組成物
JP2010155895A (ja) * 2008-12-26 2010-07-15 Asahi Kasei E-Materials Corp 組成物、組成物からなる塗膜、塗膜を含む積層体、及び積層体を組み込んだ電子機器
KR101455760B1 (ko) 2010-12-16 2014-10-28 주식회사 엘지화학 회로 기판용 금속 적층체 및 이의 제조 방법
JP2015504951A (ja) * 2012-01-09 2015-02-16 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニーＥ．Ｉ．Ｄｕ Ｐｏｎｔ Ｄｅ Ｎｅｍｏｕｒｓ Ａｎｄ Ｃｏｍｐａｎｙ バインダー溶液
WO2016129506A1 (ja) * 2015-02-12 2016-08-18 日産化学工業株式会社 液晶配向剤
JP2017510978A (ja) * 2014-02-07 2017-04-13 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニーＥ．Ｉ．Ｄｕ Ｐｏｎｔ Ｄｅ Ｎｅｍｏｕｒｓ Ａｎｄ Ｃｏｍｐａｎｙ 熱伝導性電子基板およびそれに関連する方法
JP2017115147A (ja) * 2015-12-22 2017-06-29 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニーＥ．Ｉ．Ｄｕ Ｐｏｎｔ Ｄｅ Ｎｅｍｏｕｒｓ Ａｎｄ Ｃｏｍｐａｎｙ ポリイミド系ポリマー厚膜組成物
JP2017538794A (ja) * 2014-10-10 2017-12-28 サビック グローバル テクノロジーズ ベスローテン フェンノートシャップ ポリエーテルイミドワニス組成物、その製造方法およびそれから製造される物品
WO2018062296A1 (ja) * 2016-09-30 2018-04-05 住友化学株式会社 ポリイミド系高分子ワニスの製造方法、ポリイミド系高分子フィルムの製造方法、及び、透明ポリイミド系高分子フィルム
KR20180060259A (ko) * 2016-11-28 2018-06-07 한국생산기술연구원 전하 이동 복합체를 이용한 자동차용 스크래치 자기치유 클리어코트 조성물, 이를 포함하는 클리어코트 및 이의 제조방법
JP2018525494A (ja) * 2015-08-12 2018-09-06 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニーＥ．Ｉ．Ｄｕ Ｐｏｎｔ Ｄｅ Ｎｅｍｏｕｒｓ Ａｎｄ Ｃｏｍｐａｎｙ はんだ付け可能なポリイミド系ポリマー厚膜導電体を形成するためのプロセス
JP2018525789A (ja) * 2015-08-13 2018-09-06 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニーＥ．Ｉ．Ｄｕ Ｐｏｎｔ Ｄｅ Ｎｅｍｏｕｒｓ Ａｎｄ Ｃｏｍｐａｎｙ ポリマー厚膜銅導体組成物の光焼結
JP2018529001A (ja) * 2015-08-13 2018-10-04 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニーＥ．Ｉ．Ｄｕ Ｐｏｎｔ Ｄｅ Ｎｅｍｏｕｒｓ Ａｎｄ Ｃｏｍｐａｎｙ はんだ付け可能ポリマー厚膜銅導体組成物の光焼結
JP2018529802A (ja) * 2015-08-12 2018-10-11 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニーＥ．Ｉ．Ｄｕ Ｐｏｎｔ Ｄｅ Ｎｅｍｏｕｒｓ Ａｎｄ Ｃｏｍｐａｎｙ はんだ付け可能なポリイミド系ポリマー厚膜導電体を形成するためのペースト及びプロセス
JP2018184595A (ja) * 2017-04-24 2018-11-22 味の素株式会社 樹脂組成物
KR20210018747A (ko) * 2019-08-08 2021-02-18 다싱 차이리아오 구펀요우시엔공쓰 임시 본딩 조성물, 임시 본딩 필름, 복합재 필름, 공작물을 임시 본딩하는 방법 및 반도체 웨이퍼 팩키징

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US7169330B2 (en) * 2004-02-25 2007-01-30 E. I. Du Pont De Nemours And Company Composition of conductive paste
US7745516B2 (en) * 2005-10-12 2010-06-29 E. I. Du Pont De Nemours And Company Composition of polyimide and sterically-hindered hydrophobic epoxy
US20080035567A1 (en) * 2006-08-08 2008-02-14 Sabottke Craig Y Enhanced membrane separation system
US7604754B2 (en) * 2006-11-17 2009-10-20 E. I. Du Pont De Nemours And Company Resistor compositions for electronic circuitry applications
JP2010512449A (ja) * 2006-12-12 2010-04-22 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー 結晶性封入剤
EP2092807B1 (en) 2006-12-12 2013-04-17 CDA Processing Limited Liability Company Composite organic encapsulants
US20090111948A1 (en) * 2007-10-25 2009-04-30 Thomas Eugene Dueber Compositions comprising polyimide and hydrophobic epoxy and phenolic resins, and methods relating thereto
CN102604584B (zh) * 2012-03-28 2013-08-21 黑龙江省科学院石油化学研究院 一种高剥离聚酰亚胺胶粘剂及其制备方法
TWI551652B (zh) * 2014-05-30 2016-10-01 Ｌｇ化學股份有限公司 聚醯亞胺系溶液和使用其製備的聚醯亞胺系膜及含聚醯亞胺系膜的顯示器基板與裝置
WO2016100629A1 (en) * 2014-12-17 2016-06-23 E. I. Du Pont De Nemours And Company High temperature conductive thick film pastes polyimide for heater
KR102339037B1 (ko) * 2015-06-26 2021-12-14 코오롱인더스트리 주식회사 폴리아마이드-이미드 전구체, 폴리아마이드-이미드 필름 및 이를 포함하는 표시소자
CN105001778B (zh) * 2015-07-10 2018-01-02 东华大学 一种含氟聚酰亚胺湿敏电容及其制备方法
CN105086424B (zh) * 2015-09-02 2018-06-22 东华大学 一种耐高温bahpfp型覆铜箔板及其制备方法
CN105111927B (zh) * 2015-09-02 2017-04-05 东华大学 一种耐高温bahpfp型漆包线漆及其制备方法
US20170121058A1 (en) * 2015-10-30 2017-05-04 Corning Incorporated Glass articles with mixed polymer and metal oxide coatings
CN105924649B (zh) * 2016-05-19 2019-06-18 航天材料及工艺研究所 一种聚酰亚胺泡沫材料及其制备方法
CN109417834B (zh) 2016-07-22 2022-04-12 E.I.内穆尔杜邦公司 薄膜加热装置
CN109561526B (zh) * 2017-09-26 2023-04-25 杜邦电子公司 加热元件和加热装置
CN114502659A (zh) * 2019-10-29 2022-05-13 东丽株式会社 树脂组合物、树脂片材、固化膜、固化膜的制造方法、半导体装置、有机el显示装置及显示装置
CN113322714B (zh) * 2020-02-28 2022-12-02 中国科学院成都有机化学有限公司 一种聚酰亚胺复配型抗高温老化助剂及其绝缘纸和制备方法
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WO2006080119A1 (ja) * 2005-01-28 2006-08-03 Sony Chemical & Information Device Corporation ポリイミド化合物及びフレキシブル配線板
JP2006206756A (ja) * 2005-01-28 2006-08-10 Sony Chem Corp ポリイミド化合物及びフレキシブル配線板
US7629091B2 (en) 2005-01-28 2009-12-08 Sony Corporation Polyimide compound and flexible wiring board
JP2009540104A (ja) * 2006-06-15 2009-11-19 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー 電子用途用の疎水性組成物
JP2010155895A (ja) * 2008-12-26 2010-07-15 Asahi Kasei E-Materials Corp 組成物、組成物からなる塗膜、塗膜を含む積層体、及び積層体を組み込んだ電子機器
KR101455760B1 (ko) 2010-12-16 2014-10-28 주식회사 엘지화학 회로 기판용 금속 적층체 및 이의 제조 방법
JP2015504951A (ja) * 2012-01-09 2015-02-16 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニーＥ．Ｉ．Ｄｕ Ｐｏｎｔ Ｄｅ Ｎｅｍｏｕｒｓ Ａｎｄ Ｃｏｍｐａｎｙ バインダー溶液
JP2016138292A (ja) * 2012-01-09 2016-08-04 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニーＥ．Ｉ．Ｄｕ Ｐｏｎｔ Ｄｅ Ｎｅｍｏｕｒｓ Ａｎｄ Ｃｏｍｐａｎｙ バインダー溶液
JP2017510978A (ja) * 2014-02-07 2017-04-13 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニーＥ．Ｉ．Ｄｕ Ｐｏｎｔ Ｄｅ Ｎｅｍｏｕｒｓ Ａｎｄ Ｃｏｍｐａｎｙ 熱伝導性電子基板およびそれに関連する方法
JP2017538794A (ja) * 2014-10-10 2017-12-28 サビック グローバル テクノロジーズ ベスローテン フェンノートシャップ ポリエーテルイミドワニス組成物、その製造方法およびそれから製造される物品
WO2016129506A1 (ja) * 2015-02-12 2016-08-18 日産化学工業株式会社 液晶配向剤
TWI699400B (zh) * 2015-02-12 2020-07-21 日商日產化學工業股份有限公司 液晶配向劑
JPWO2016129506A1 (ja) * 2015-02-12 2017-11-24 日産化学工業株式会社 液晶配向剤
JP2018529802A (ja) * 2015-08-12 2018-10-11 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニーＥ．Ｉ．Ｄｕ Ｐｏｎｔ Ｄｅ Ｎｅｍｏｕｒｓ Ａｎｄ Ｃｏｍｐａｎｙ はんだ付け可能なポリイミド系ポリマー厚膜導電体を形成するためのペースト及びプロセス
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US7348373B2 (en) 2008-03-25
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EP1553134A3 (en) 2005-09-21
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