JP2009540104A5 - - Google Patents

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Publication number
JP2009540104A5
JP2009540104A5 JP2009515491A JP2009515491A JP2009540104A5 JP 2009540104 A5 JP2009540104 A5 JP 2009540104A5 JP 2009515491 A JP2009515491 A JP 2009515491A JP 2009515491 A JP2009515491 A JP 2009515491A JP 2009540104 A5 JP2009540104 A5 JP 2009540104A5
Authority
JP
Japan
Prior art keywords
bis
trifluoromethyl
composition
phenyl
diamino
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2009515491A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009540104A (ja
Filing date
Publication date
Priority claimed from US11/453,388 external-priority patent/US20070290379A1/en
Application filed filed Critical
Publication of JP2009540104A publication Critical patent/JP2009540104A/ja
Publication of JP2009540104A5 publication Critical patent/JP2009540104A5/ja
Pending legal-status Critical Current

Links

JP2009515491A 2006-06-15 2007-06-13 電子用途用の疎水性組成物 Pending JP2009540104A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/453,388 US20070290379A1 (en) 2006-06-15 2006-06-15 Hydrophobic compositions for electronic applications
PCT/US2007/013965 WO2007146382A2 (en) 2006-06-15 2007-06-13 Hydrophobic compositions for electronic applications

Publications (2)

Publication Number Publication Date
JP2009540104A JP2009540104A (ja) 2009-11-19
JP2009540104A5 true JP2009540104A5 (https=) 2010-07-29

Family

ID=38729007

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009515491A Pending JP2009540104A (ja) 2006-06-15 2007-06-13 電子用途用の疎水性組成物

Country Status (7)

Country Link
US (1) US20070290379A1 (https=)
EP (1) EP2027184A2 (https=)
JP (1) JP2009540104A (https=)
KR (1) KR20090028769A (https=)
CN (1) CN101466773A (https=)
TW (1) TW200806744A (https=)
WO (1) WO2007146382A2 (https=)

Families Citing this family (13)

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AU2003292790A1 (en) * 2002-12-27 2004-07-29 I.S.T Corporation Polyimide precursor liquid composition and polyimide coating film
JP2010512449A (ja) * 2006-12-12 2010-04-22 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー 結晶性封入剤
US8357753B2 (en) 2007-07-18 2013-01-22 Cda Processing Limited Liability Company Screen-printable encapsulants based on polyhydroxyamides that thermally convert to polybenzoxazoles
US8270145B2 (en) * 2007-12-04 2012-09-18 Cda Processing Limited Liability Company Screen-printable encapsulants based on soluble polybenzoxazoles
US8829676B2 (en) * 2011-06-28 2014-09-09 Taiwan Semiconductor Manufacturing Company, Ltd. Interconnect structure for wafer level package
CN104245845B (zh) * 2012-04-27 2017-06-06 宇部兴产株式会社 聚酰胺酸溶液组合物及聚酰亚胺
US9368460B2 (en) 2013-03-15 2016-06-14 Taiwan Semiconductor Manufacturing Company, Ltd. Fan-out interconnect structure and method for forming same
EP3078964B1 (en) * 2015-04-09 2017-05-24 Honeywell International Inc. Relative humidity sensor and method
CN105001778B (zh) * 2015-07-10 2018-01-02 东华大学 一种含氟聚酰亚胺湿敏电容及其制备方法
CN105111439B (zh) * 2015-07-10 2018-05-15 东华大学 一种联苯型聚酰亚胺湿敏电容及其制备方法
TWI653715B (zh) * 2016-05-13 2019-03-11 Murata Manufacturing Co., Ltd. 晶圓級封裝及電容器
KR102299950B1 (ko) 2017-01-05 2021-09-08 주식회사 엘지에너지솔루션 소수성 표면처리를 이용한 배터리 모듈 및 제작방법
KR102648696B1 (ko) * 2018-12-21 2024-03-15 주식회사 엘지화학 폴리이미드 전구체 조성물, 이를 이용한 폴리이미드 제조 방법 및 폴리이미드 필름

Family Cites Families (18)

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Publication number Priority date Publication date Assignee Title
US3668193A (en) * 1971-01-27 1972-06-06 Pennwalt Corp Vinylidene fluoride coating compositions containing polyimides
US4985377A (en) * 1987-12-14 1991-01-15 Matsushita Electric Industrial Co., Ltd. Glaze resistor
US5071997A (en) * 1989-07-20 1991-12-10 University Of Akron Polyimides comprising substituted benzidines
US5183534A (en) * 1990-03-09 1993-02-02 Amoco Corporation Wet-etch process and composition
US5750958A (en) * 1993-09-20 1998-05-12 Kyocera Corporation Ceramic glow plug
DE4335323A1 (de) * 1993-10-18 1995-04-20 Basf Lacke & Farben Lösungen von polyimidbildenden Substanzen und deren Verwendung
US5980785A (en) * 1997-10-02 1999-11-09 Ormet Corporation Metal-containing compositions and uses thereof, including preparation of resistor and thermistor elements
DE60016217T2 (de) * 1999-04-09 2005-04-07 Kaneka Corp. Polyimidharzzusammensetzung mit verbesserter feuchtigkeitsbeständigkeit, leimlösung, mehrlagiger klebefilm und verfahren zu deren herstellung
DE10126363B4 (de) * 2000-06-02 2011-08-11 Basf Se, 67063 Verfahren und Vorrichtung zur Herstellung von Aldehyden und/oder Alkoholen mit 6 bis 30 C-Atomen
WO2002082473A2 (en) * 2001-04-09 2002-10-17 Morgan Chemical Products, Inc. Thick film paste systems for circuits on diamonds substrates
US6860000B2 (en) 2002-02-15 2005-03-01 E.I. Du Pont De Nemours And Company Method to embed thick film components
US7038900B2 (en) * 2003-02-27 2006-05-02 Greatbatch-Sierra, Inc. EMI filter terminal assembly with wire bond pads for human implant applications
US7022402B2 (en) * 2003-07-14 2006-04-04 E. I. Du Pont De Nemours And Company Dielectric substrates comprising a polymide core layer and a high temperature fluoropolymer bonding layer, and methods relating thereto
JP2005154502A (ja) * 2003-11-21 2005-06-16 Hitachi Chem Co Ltd ポリイミド樹脂ペースト及び被膜形成材料
US20050154105A1 (en) 2004-01-09 2005-07-14 Summers John D. Compositions with polymers for advanced materials
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