TW200806744A - Hydrophobic compositions for electronic applications - Google Patents

Hydrophobic compositions for electronic applications Download PDF

Info

Publication number
TW200806744A
TW200806744A TW096121525A TW96121525A TW200806744A TW 200806744 A TW200806744 A TW 200806744A TW 096121525 A TW096121525 A TW 096121525A TW 96121525 A TW96121525 A TW 96121525A TW 200806744 A TW200806744 A TW 200806744A
Authority
TW
Taiwan
Prior art keywords
composition
bis
diamine
encapsulant
capacitor
Prior art date
Application number
TW096121525A
Other languages
English (en)
Chinese (zh)
Inventor
Thomas E Dueber
John D Summers
Original Assignee
Du Pont
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Du Pont filed Critical Du Pont
Publication of TW200806744A publication Critical patent/TW200806744A/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1039—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors comprising halogen-containing substituents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
    • C08G73/1064—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing sulfur
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
    • C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/224—Housing; Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/08—Housing; Encapsulation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0187—Dielectric layers with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09763—Printed component having superposed conductors, but integrated in one circuit layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Manufacturing & Machinery (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW096121525A 2006-06-15 2007-06-14 Hydrophobic compositions for electronic applications TW200806744A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/453,388 US20070290379A1 (en) 2006-06-15 2006-06-15 Hydrophobic compositions for electronic applications

Publications (1)

Publication Number Publication Date
TW200806744A true TW200806744A (en) 2008-02-01

Family

ID=38729007

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096121525A TW200806744A (en) 2006-06-15 2007-06-14 Hydrophobic compositions for electronic applications

Country Status (7)

Country Link
US (1) US20070290379A1 (https=)
EP (1) EP2027184A2 (https=)
JP (1) JP2009540104A (https=)
KR (1) KR20090028769A (https=)
CN (1) CN101466773A (https=)
TW (1) TW200806744A (https=)
WO (1) WO2007146382A2 (https=)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2003292790A1 (en) * 2002-12-27 2004-07-29 I.S.T Corporation Polyimide precursor liquid composition and polyimide coating film
JP2010512449A (ja) * 2006-12-12 2010-04-22 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー 結晶性封入剤
US8357753B2 (en) 2007-07-18 2013-01-22 Cda Processing Limited Liability Company Screen-printable encapsulants based on polyhydroxyamides that thermally convert to polybenzoxazoles
US8270145B2 (en) * 2007-12-04 2012-09-18 Cda Processing Limited Liability Company Screen-printable encapsulants based on soluble polybenzoxazoles
US8829676B2 (en) * 2011-06-28 2014-09-09 Taiwan Semiconductor Manufacturing Company, Ltd. Interconnect structure for wafer level package
CN104245845B (zh) * 2012-04-27 2017-06-06 宇部兴产株式会社 聚酰胺酸溶液组合物及聚酰亚胺
US9368460B2 (en) 2013-03-15 2016-06-14 Taiwan Semiconductor Manufacturing Company, Ltd. Fan-out interconnect structure and method for forming same
EP3078964B1 (en) * 2015-04-09 2017-05-24 Honeywell International Inc. Relative humidity sensor and method
CN105001778B (zh) * 2015-07-10 2018-01-02 东华大学 一种含氟聚酰亚胺湿敏电容及其制备方法
CN105111439B (zh) * 2015-07-10 2018-05-15 东华大学 一种联苯型聚酰亚胺湿敏电容及其制备方法
TWI653715B (zh) * 2016-05-13 2019-03-11 Murata Manufacturing Co., Ltd. 晶圓級封裝及電容器
KR102299950B1 (ko) 2017-01-05 2021-09-08 주식회사 엘지에너지솔루션 소수성 표면처리를 이용한 배터리 모듈 및 제작방법
KR102648696B1 (ko) * 2018-12-21 2024-03-15 주식회사 엘지화학 폴리이미드 전구체 조성물, 이를 이용한 폴리이미드 제조 방법 및 폴리이미드 필름

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3668193A (en) * 1971-01-27 1972-06-06 Pennwalt Corp Vinylidene fluoride coating compositions containing polyimides
US4985377A (en) * 1987-12-14 1991-01-15 Matsushita Electric Industrial Co., Ltd. Glaze resistor
US5071997A (en) * 1989-07-20 1991-12-10 University Of Akron Polyimides comprising substituted benzidines
US5183534A (en) * 1990-03-09 1993-02-02 Amoco Corporation Wet-etch process and composition
US5750958A (en) * 1993-09-20 1998-05-12 Kyocera Corporation Ceramic glow plug
DE4335323A1 (de) * 1993-10-18 1995-04-20 Basf Lacke & Farben Lösungen von polyimidbildenden Substanzen und deren Verwendung
US5980785A (en) * 1997-10-02 1999-11-09 Ormet Corporation Metal-containing compositions and uses thereof, including preparation of resistor and thermistor elements
DE60016217T2 (de) * 1999-04-09 2005-04-07 Kaneka Corp. Polyimidharzzusammensetzung mit verbesserter feuchtigkeitsbeständigkeit, leimlösung, mehrlagiger klebefilm und verfahren zu deren herstellung
DE10126363B4 (de) * 2000-06-02 2011-08-11 Basf Se, 67063 Verfahren und Vorrichtung zur Herstellung von Aldehyden und/oder Alkoholen mit 6 bis 30 C-Atomen
WO2002082473A2 (en) * 2001-04-09 2002-10-17 Morgan Chemical Products, Inc. Thick film paste systems for circuits on diamonds substrates
US6860000B2 (en) 2002-02-15 2005-03-01 E.I. Du Pont De Nemours And Company Method to embed thick film components
US7038900B2 (en) * 2003-02-27 2006-05-02 Greatbatch-Sierra, Inc. EMI filter terminal assembly with wire bond pads for human implant applications
US7022402B2 (en) * 2003-07-14 2006-04-04 E. I. Du Pont De Nemours And Company Dielectric substrates comprising a polymide core layer and a high temperature fluoropolymer bonding layer, and methods relating thereto
JP2005154502A (ja) * 2003-11-21 2005-06-16 Hitachi Chem Co Ltd ポリイミド樹脂ペースト及び被膜形成材料
US20050154105A1 (en) 2004-01-09 2005-07-14 Summers John D. Compositions with polymers for advanced materials
US7348373B2 (en) * 2004-01-09 2008-03-25 E.I. Du Pont De Nemours And Company Polyimide compositions having resistance to water sorption, and methods relating thereto
CN100569857C (zh) * 2004-02-20 2009-12-16 宇部兴产株式会社 聚酰亚胺硅氧烷溶液组合物
JP2006077172A (ja) * 2004-09-10 2006-03-23 Sumitomo Bakelite Co Ltd 絶縁性樹脂組成物、その製造方法及び電子部品

Also Published As

Publication number Publication date
EP2027184A2 (en) 2009-02-25
CN101466773A (zh) 2009-06-24
US20070290379A1 (en) 2007-12-20
KR20090028769A (ko) 2009-03-19
WO2007146382A3 (en) 2008-02-07
WO2007146382A2 (en) 2007-12-21
JP2009540104A (ja) 2009-11-19

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