KR20090028769A - 전자 적용을 위한 소수성 조성물 - Google Patents

전자 적용을 위한 소수성 조성물 Download PDF

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Publication number
KR20090028769A
KR20090028769A KR1020097000844A KR20097000844A KR20090028769A KR 20090028769 A KR20090028769 A KR 20090028769A KR 1020097000844 A KR1020097000844 A KR 1020097000844A KR 20097000844 A KR20097000844 A KR 20097000844A KR 20090028769 A KR20090028769 A KR 20090028769A
Authority
KR
South Korea
Prior art keywords
bis
composition
encapsulant
dianhydride
diamine
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020097000844A
Other languages
English (en)
Korean (ko)
Inventor
토마스 이. 듀버
존 디. 서머스
Original Assignee
이 아이 듀폰 디 네모아 앤드 캄파니
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 이 아이 듀폰 디 네모아 앤드 캄파니 filed Critical 이 아이 듀폰 디 네모아 앤드 캄파니
Publication of KR20090028769A publication Critical patent/KR20090028769A/ko
Ceased legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1039—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors comprising halogen-containing substituents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
    • C08G73/1064—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing sulfur
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
    • C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/224—Housing; Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/08—Housing; Encapsulation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0187—Dielectric layers with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09763—Printed component having superposed conductors, but integrated in one circuit layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Manufacturing & Machinery (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
KR1020097000844A 2006-06-15 2007-06-13 전자 적용을 위한 소수성 조성물 Ceased KR20090028769A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/453,388 2006-06-15
US11/453,388 US20070290379A1 (en) 2006-06-15 2006-06-15 Hydrophobic compositions for electronic applications

Publications (1)

Publication Number Publication Date
KR20090028769A true KR20090028769A (ko) 2009-03-19

Family

ID=38729007

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020097000844A Ceased KR20090028769A (ko) 2006-06-15 2007-06-13 전자 적용을 위한 소수성 조성물

Country Status (7)

Country Link
US (1) US20070290379A1 (https=)
EP (1) EP2027184A2 (https=)
JP (1) JP2009540104A (https=)
KR (1) KR20090028769A (https=)
CN (1) CN101466773A (https=)
TW (1) TW200806744A (https=)
WO (1) WO2007146382A2 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020130437A1 (ko) * 2018-12-21 2020-06-25 주식회사 엘지화학 폴리이미드 전구체 조성물, 이를 이용한 폴리이미드 제조 방법 및 폴리이미드 필름

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2003292790A1 (en) * 2002-12-27 2004-07-29 I.S.T Corporation Polyimide precursor liquid composition and polyimide coating film
JP2010512449A (ja) * 2006-12-12 2010-04-22 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー 結晶性封入剤
US8357753B2 (en) 2007-07-18 2013-01-22 Cda Processing Limited Liability Company Screen-printable encapsulants based on polyhydroxyamides that thermally convert to polybenzoxazoles
US8270145B2 (en) * 2007-12-04 2012-09-18 Cda Processing Limited Liability Company Screen-printable encapsulants based on soluble polybenzoxazoles
US8829676B2 (en) * 2011-06-28 2014-09-09 Taiwan Semiconductor Manufacturing Company, Ltd. Interconnect structure for wafer level package
CN104245845B (zh) * 2012-04-27 2017-06-06 宇部兴产株式会社 聚酰胺酸溶液组合物及聚酰亚胺
US9368460B2 (en) 2013-03-15 2016-06-14 Taiwan Semiconductor Manufacturing Company, Ltd. Fan-out interconnect structure and method for forming same
EP3078964B1 (en) * 2015-04-09 2017-05-24 Honeywell International Inc. Relative humidity sensor and method
CN105001778B (zh) * 2015-07-10 2018-01-02 东华大学 一种含氟聚酰亚胺湿敏电容及其制备方法
CN105111439B (zh) * 2015-07-10 2018-05-15 东华大学 一种联苯型聚酰亚胺湿敏电容及其制备方法
TWI653715B (zh) * 2016-05-13 2019-03-11 Murata Manufacturing Co., Ltd. 晶圓級封裝及電容器
KR102299950B1 (ko) 2017-01-05 2021-09-08 주식회사 엘지에너지솔루션 소수성 표면처리를 이용한 배터리 모듈 및 제작방법

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3668193A (en) * 1971-01-27 1972-06-06 Pennwalt Corp Vinylidene fluoride coating compositions containing polyimides
US4985377A (en) * 1987-12-14 1991-01-15 Matsushita Electric Industrial Co., Ltd. Glaze resistor
US5071997A (en) * 1989-07-20 1991-12-10 University Of Akron Polyimides comprising substituted benzidines
US5183534A (en) * 1990-03-09 1993-02-02 Amoco Corporation Wet-etch process and composition
US5750958A (en) * 1993-09-20 1998-05-12 Kyocera Corporation Ceramic glow plug
DE4335323A1 (de) * 1993-10-18 1995-04-20 Basf Lacke & Farben Lösungen von polyimidbildenden Substanzen und deren Verwendung
US5980785A (en) * 1997-10-02 1999-11-09 Ormet Corporation Metal-containing compositions and uses thereof, including preparation of resistor and thermistor elements
DE60016217T2 (de) * 1999-04-09 2005-04-07 Kaneka Corp. Polyimidharzzusammensetzung mit verbesserter feuchtigkeitsbeständigkeit, leimlösung, mehrlagiger klebefilm und verfahren zu deren herstellung
DE10126363B4 (de) * 2000-06-02 2011-08-11 Basf Se, 67063 Verfahren und Vorrichtung zur Herstellung von Aldehyden und/oder Alkoholen mit 6 bis 30 C-Atomen
WO2002082473A2 (en) * 2001-04-09 2002-10-17 Morgan Chemical Products, Inc. Thick film paste systems for circuits on diamonds substrates
US6860000B2 (en) 2002-02-15 2005-03-01 E.I. Du Pont De Nemours And Company Method to embed thick film components
US7038900B2 (en) * 2003-02-27 2006-05-02 Greatbatch-Sierra, Inc. EMI filter terminal assembly with wire bond pads for human implant applications
US7022402B2 (en) * 2003-07-14 2006-04-04 E. I. Du Pont De Nemours And Company Dielectric substrates comprising a polymide core layer and a high temperature fluoropolymer bonding layer, and methods relating thereto
JP2005154502A (ja) * 2003-11-21 2005-06-16 Hitachi Chem Co Ltd ポリイミド樹脂ペースト及び被膜形成材料
US20050154105A1 (en) 2004-01-09 2005-07-14 Summers John D. Compositions with polymers for advanced materials
US7348373B2 (en) * 2004-01-09 2008-03-25 E.I. Du Pont De Nemours And Company Polyimide compositions having resistance to water sorption, and methods relating thereto
CN100569857C (zh) * 2004-02-20 2009-12-16 宇部兴产株式会社 聚酰亚胺硅氧烷溶液组合物
JP2006077172A (ja) * 2004-09-10 2006-03-23 Sumitomo Bakelite Co Ltd 絶縁性樹脂組成物、その製造方法及び電子部品

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020130437A1 (ko) * 2018-12-21 2020-06-25 주식회사 엘지화학 폴리이미드 전구체 조성물, 이를 이용한 폴리이미드 제조 방법 및 폴리이미드 필름
KR20200078142A (ko) * 2018-12-21 2020-07-01 주식회사 엘지화학 폴리이미드 전구체 조성물, 이를 이용한 폴리이미드 제조 방법 및 폴리이미드 필름

Also Published As

Publication number Publication date
EP2027184A2 (en) 2009-02-25
CN101466773A (zh) 2009-06-24
TW200806744A (en) 2008-02-01
US20070290379A1 (en) 2007-12-20
WO2007146382A3 (en) 2008-02-07
WO2007146382A2 (en) 2007-12-21
JP2009540104A (ja) 2009-11-19

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