JP2009501442A5 - - Google Patents

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JP2009501442A5
JP2009501442A5 JP2008520981A JP2008520981A JP2009501442A5 JP 2009501442 A5 JP2009501442 A5 JP 2009501442A5 JP 2008520981 A JP2008520981 A JP 2008520981A JP 2008520981 A JP2008520981 A JP 2008520981A JP 2009501442 A5 JP2009501442 A5 JP 2009501442A5
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metal
package
flexible substrate
mems device
layer
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JP2008520981A
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JP4853975B2 (ja
JP2009501442A (ja
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JP2008520981A 2005-07-15 2006-07-17 フレキシブル基材を用いたｍｅｍｓパッケージとその方法 Expired - Fee Related JP4853975B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/182,254 2005-07-15
US11/182,254 US7202552B2 (en) 2005-07-15 2005-07-15 MEMS package using flexible substrates, and method thereof
PCT/IB2006/001966 WO2007010361A2 (en) 2005-07-15 2006-07-17 A mems package using flexible substrates, and method thereof

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JP2009501442A JP2009501442A (ja) 2009-01-15
JP2009501442A5 true JP2009501442A5 (https=) 2009-09-10
JP4853975B2 JP4853975B2 (ja) 2012-01-11

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JP2008520981A Expired - Fee Related JP4853975B2 (ja) 2005-07-15 2006-07-17 フレキシブル基材を用いたｍｅｍｓパッケージとその方法

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US (2) US7202552B2 (https=)
JP (1) JP4853975B2 (https=)
KR (1) KR101295979B1 (https=)
WO (1) WO2007010361A2 (https=)

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