KR101295979B1 - Ｍｅｍｓ 패키지 및 ｍｅｍｓ 패키지 제조 방법 - Google Patents

Ｍｅｍｓ 패키지 및 ｍｅｍｓ 패키지 제조 방법 Download PDF

Info

Publication number
KR101295979B1
KR101295979B1 KR1020087003563A KR20087003563A KR101295979B1 KR 101295979 B1 KR101295979 B1 KR 101295979B1 KR 1020087003563 A KR1020087003563 A KR 1020087003563A KR 20087003563 A KR20087003563 A KR 20087003563A KR 101295979 B1 KR101295979 B1 KR 101295979B1
Authority
KR
South Korea
Prior art keywords
metal
flexible substrate
mems
mems package
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020087003563A
Other languages
English (en)
Korean (ko)
Other versions
KR20080039417A (ko
Inventor
제 왕
유보 미아오
Original Assignee
산동 겟탑 어쿠스틱 캄파니 리미티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 산동 겟탑 어쿠스틱 캄파니 리미티드 filed Critical 산동 겟탑 어쿠스틱 캄파니 리미티드
Publication of KR20080039417A publication Critical patent/KR20080039417A/ko
Application granted granted Critical
Publication of KR101295979B1 publication Critical patent/KR101295979B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/157—Containers comprising an insulating or insulated base having interconnections parallel to the insulating or insulated base
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00222—Integrating an electronic processing unit with a micromechanical structure
    • B81C1/0023—Packaging together an electronic processing unit die and a micromechanical structure die
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00309—Processes for packaging MEMS devices suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/688—Flexible insulating substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0257—Microphones or microspeakers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/681—Shapes or dispositions thereof comprising holes not having chips therein, e.g. for outgassing, underfilling or bond wire passage
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07554—Controlling the environment, e.g. atmosphere composition or temperature changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Micromachines (AREA)
  • Gyroscopes (AREA)
  • Structure Of Printed Boards (AREA)
KR1020087003563A 2005-07-15 2006-07-17 Ｍｅｍｓ 패키지 및 ｍｅｍｓ 패키지 제조 방법 Active KR101295979B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/182,254 2005-07-15
US11/182,254 US7202552B2 (en) 2005-07-15 2005-07-15 MEMS package using flexible substrates, and method thereof
PCT/IB2006/001966 WO2007010361A2 (en) 2005-07-15 2006-07-17 A mems package using flexible substrates, and method thereof

Publications (2)

Publication Number Publication Date
KR20080039417A KR20080039417A (ko) 2008-05-07
KR101295979B1 true KR101295979B1 (ko) 2013-08-13

Family

ID=37660929

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020087003563A Active KR101295979B1 (ko) 2005-07-15 2006-07-17 Ｍｅｍｓ 패키지 및 ｍｅｍｓ 패키지 제조 방법

Country Status (4)

Country Link
US (2) US7202552B2 (https=)
JP (1) JP4853975B2 (https=)
KR (1) KR101295979B1 (https=)
WO (1) WO2007010361A2 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025063422A1 (ko) * 2023-09-22 2025-03-27 엘지이노텍 주식회사 멤스 마이크로폰

Families Citing this family (182)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100544283B1 (ko) * 2004-01-20 2006-01-24 주식회사 비에스이 표면실장을 위한 평행육면체형 콘덴서 마이크로폰
DE102005008512B4 (de) 2005-02-24 2016-06-23 Epcos Ag Elektrisches Modul mit einem MEMS-Mikrofon
DE102005008511B4 (de) * 2005-02-24 2019-09-12 Tdk Corporation MEMS-Mikrofon
DE102005008514B4 (de) * 2005-02-24 2019-05-16 Tdk Corporation Mikrofonmembran und Mikrofon mit der Mikrofonmembran
US7825484B2 (en) 2005-04-25 2010-11-02 Analog Devices, Inc. Micromachined microphone and multisensor and method for producing same
US20070071268A1 (en) * 2005-08-16 2007-03-29 Analog Devices, Inc. Packaged microphone with electrically coupled lid
US7885423B2 (en) 2005-04-25 2011-02-08 Analog Devices, Inc. Support apparatus for microphone diaphragm
SG130158A1 (en) * 2005-08-20 2007-03-20 Bse Co Ltd Silicon based condenser microphone and packaging method for the same
JP4939873B2 (ja) * 2005-09-06 2012-05-30 株式会社半導体エネルギー研究所 微小電気機械式装置の作製方法
US7767543B2 (en) 2005-09-06 2010-08-03 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing a micro-electro-mechanical device with a folded substrate
SG131039A1 (en) * 2005-09-14 2007-04-26 Bse Co Ltd Condenser microphone and packaging method for the same
TWI307154B (en) * 2005-09-30 2009-03-01 Advanced Semiconductor Eng Package method and structure for preventing chips from being interfered
TWI284407B (en) * 2005-11-03 2007-07-21 Cyntec Co Ltd Package device with electromagnetic interference shield
DE102005053765B4 (de) * 2005-11-10 2016-04-14 Epcos Ag MEMS-Package und Verfahren zur Herstellung
DE102005053767B4 (de) * 2005-11-10 2014-10-30 Epcos Ag MEMS-Mikrofon, Verfahren zur Herstellung und Verfahren zum Einbau
EP1795496A2 (en) * 2005-12-08 2007-06-13 Yamaha Corporation Semiconductor device for detecting pressure variations
US20070178666A1 (en) * 2006-01-31 2007-08-02 Stats Chippac Ltd. Integrated circuit system with waferscale spacer system
US7414310B2 (en) * 2006-02-02 2008-08-19 Stats Chippac Ltd. Waferscale package system
US7436054B2 (en) * 2006-03-03 2008-10-14 Silicon Matrix, Pte. Ltd. MEMS microphone with a stacked PCB package and method of producing the same
US20070243662A1 (en) * 2006-03-17 2007-10-18 Johnson Donald W Packaging of MEMS devices
EP1837303A1 (en) * 2006-03-24 2007-09-26 Infineon Technologies SensoNor AS Integrated pedestal mount for mems structure
US20080083958A1 (en) * 2006-10-05 2008-04-10 Wen-Chieh Wei Micro-electromechanical system package
WO2008067294A2 (en) * 2006-11-27 2008-06-05 University Of Florida Research Foundation, Inc. Microfabrication methods for forming robust isolation and packaging
US20080175425A1 (en) * 2006-11-30 2008-07-24 Analog Devices, Inc. Microphone System with Silicon Microphone Secured to Package Lid
US7781852B1 (en) * 2006-12-05 2010-08-24 Amkor Technology, Inc. Membrane die attach circuit element package and method therefor
US8138588B2 (en) * 2006-12-21 2012-03-20 Texas Instruments Incorporated Package stiffener and a packaged device using the same
US7550828B2 (en) * 2007-01-03 2009-06-23 Stats Chippac, Inc. Leadframe package for MEMS microphone assembly
US8250921B2 (en) * 2007-07-06 2012-08-28 Invensense, Inc. Integrated motion processing unit (MPU) with MEMS inertial sensing and embedded digital electronics
US20080217709A1 (en) * 2007-03-07 2008-09-11 Knowles Electronics, Llc Mems package having at least one port and manufacturing method thereof
TWI370101B (en) 2007-05-15 2012-08-11 Ind Tech Res Inst Package and packaging assembly of microelectromechanical sysyem microphone
TWI323242B (en) * 2007-05-15 2010-04-11 Ind Tech Res Inst Package and packageing assembly of microelectromechanical system microphone
CN101316462B (zh) * 2007-06-01 2012-11-28 财团法人工业技术研究院 微机电系统麦克风封装体及其封装组件
US20100164026A1 (en) * 2007-06-15 2010-07-01 Erich Ilich Premold housing having integrated vibration isolation
US7939932B2 (en) * 2007-06-20 2011-05-10 Analog Devices, Inc. Packaged chip devices with atomic layer deposition protective films
US8493748B2 (en) * 2007-06-27 2013-07-23 Stats Chippac Ltd. Packaging system with hollow package and method for the same
GB2451909B (en) * 2007-08-17 2012-07-11 Wolfson Microelectronics Plc Mems process and device
JP2009044600A (ja) * 2007-08-10 2009-02-26 Panasonic Corp マイクロホン装置およびその製造方法
TWI328563B (en) * 2007-08-28 2010-08-11 Ind Tech Res Inst A stacked package structure for reducing package volume of an acoustic microsensor
US7651889B2 (en) 2007-09-13 2010-01-26 Freescale Semiconductor, Inc. Electromagnetic shield formation for integrated circuit die package
US7843021B2 (en) * 2008-02-28 2010-11-30 Shandong Gettop Acoustic Co. Ltd. Double-side mountable MEMS package
US7829366B2 (en) * 2008-02-29 2010-11-09 Freescale Semiconductor, Inc. Microelectromechanical systems component and method of making same
US8269308B2 (en) * 2008-03-19 2012-09-18 Stats Chippac, Ltd. Semiconductor device with cross-talk isolation using M-cap and method thereof
JP5012612B2 (ja) * 2008-03-26 2012-08-29 日本電気株式会社 半導体デバイスの実装構造体及び実装構造体を用いた電子機器
CN101282594B (zh) * 2008-04-10 2013-06-05 苏州敏芯微电子技术有限公司 具有双面贴装电极的微机电传声器的封装结构
US8130506B2 (en) 2008-06-19 2012-03-06 Infineon Technologies Ag Sensor module
US8330236B2 (en) * 2008-06-20 2012-12-11 Garmin Switzerland Gmbh Isolation channel improving measurement accuracy of MEMS devices
CN101613073B (zh) * 2008-06-26 2012-08-29 鸿富锦精密工业（深圳）有限公司 微机电系统
DE102008032319B4 (de) * 2008-07-09 2012-06-06 Epcos Ag Verfahren zur Herstellung eines MST Bauteils
US7797817B2 (en) * 2008-09-18 2010-09-21 Toyota Motor Engineering & Manufacturing North America, Inc. Microwave component and method for making the same
CN201274566Y (zh) * 2008-09-26 2009-07-15 瑞声声学科技(深圳)有限公司 Mems麦克风
US20100086146A1 (en) * 2008-10-02 2010-04-08 Fortemedia, Inc. Silicon-based microphone package
US8102015B2 (en) * 2008-10-02 2012-01-24 Fortemedia, Inc. Microphone package with minimum footprint size and thickness
US8013404B2 (en) * 2008-10-09 2011-09-06 Shandong Gettop Acoustic Co. Ltd. Folded lead-frame packages for MEMS devices
TWI361170B (en) * 2008-10-30 2012-04-01 Unimicron Technology Corp Cover component of micro-mechanical device and fabrication method thereof
US8351635B2 (en) * 2008-11-05 2013-01-08 Fortemedia, Inc. Silicon-based microphone structure with electromagnetic interference shielding means
CN101734607B (zh) * 2008-11-20 2012-01-25 纬拓科技股份有限公司 微机电系统的封装结构
US7915715B2 (en) * 2008-11-25 2011-03-29 Amkor Technology, Inc. System and method to provide RF shielding for a MEMS microphone package
US20100165581A1 (en) * 2008-12-24 2010-07-01 Stmicroelectronics S.R.L. Package for micro-electro-mechanical systems of the mems type and corresponding manufacturing process
US8030722B1 (en) * 2009-03-04 2011-10-04 Amkor Technology, Inc. Reversible top/bottom MEMS package
US8115283B1 (en) 2009-07-14 2012-02-14 Amkor Technology, Inc. Reversible top/bottom MEMS package
CN101692441B (zh) * 2009-04-16 2012-04-11 旭丽电子(广州)有限公司 一种印刷电路板封装结构
JP5375311B2 (ja) 2009-04-28 2013-12-25 オムロン株式会社 電子部品実装装置及びその製造方法
US8158492B2 (en) * 2009-04-29 2012-04-17 Freescale Semiconductor, Inc. MEMS microphone with cavity and method therefor
US8330239B2 (en) * 2009-04-29 2012-12-11 Freescale Semiconductor, Inc. Shielding for a micro electro-mechanical device and method therefor
US8571249B2 (en) * 2009-05-29 2013-10-29 General Mems Corporation Silicon microphone package
US7790492B1 (en) * 2009-06-13 2010-09-07 Mwm Acoustics, Llc Method for fabricating a transducer package with the transducer die unsupported by a substrate
US20100320595A1 (en) * 2009-06-22 2010-12-23 Honeywell International Inc. Hybrid hermetic interface chip
US10334370B2 (en) * 2009-07-25 2019-06-25 Eargo, Inc. Apparatus, system and method for reducing acoustic feedback interference signals
US8710599B2 (en) * 2009-08-04 2014-04-29 Fairchild Semiconductor Corporation Micromachined devices and fabricating the same
US8987030B2 (en) * 2009-08-13 2015-03-24 Knowles Electronics, Llc MEMS package and a method for manufacturing the same
US9399574B2 (en) 2009-08-13 2016-07-26 Knowles Electronics Llc MEMS package and a method for manufacturing the same
US8670588B2 (en) * 2009-09-08 2014-03-11 Apple Inc. Handheld device assembly
US8264848B2 (en) 2009-10-30 2012-09-11 Research In Motion Limited Electrical assembly having impedance controlled signal traces
US8421168B2 (en) * 2009-11-17 2013-04-16 Fairchild Semiconductor Corporation Microelectromechanical systems microphone packaging systems
JP5302867B2 (ja) * 2009-12-07 2013-10-02 ホシデン株式会社 マイクロホン
DE102010001711A1 (de) * 2010-02-09 2011-08-11 Robert Bosch GmbH, 70469 Halbleiter-Bauelement und entsprechendes Herstellungsverfahren
US8809974B2 (en) * 2010-02-26 2014-08-19 Ubotic Intellectual Property Company Limited Semiconductor package for MEMS device and method of manufacturing same
US9013890B2 (en) * 2010-03-26 2015-04-21 Infineon Technologies Ag Semiconductor packages and methods for producing the same
WO2011134167A1 (en) * 2010-04-30 2011-11-03 Ubotic Intellectual Property Co., Ltd. Air cavity package configured to electrically couple to a printed circuit board and method of providing same
US8354747B1 (en) * 2010-06-01 2013-01-15 Amkor Technology, Inc Conductive polymer lid for a sensor package and method therefor
KR101362398B1 (ko) 2012-07-10 2014-02-13 앰코 테크놀로지 코리아 주식회사 반도체 패키지 및 그 제조 방법
US8227879B2 (en) * 2010-07-29 2012-07-24 Honeywell International Inc. Systems and methods for mounting inertial sensors
EP2616389B1 (en) 2010-09-18 2017-04-05 Fairchild Semiconductor Corporation Multi-die mems package
US9278845B2 (en) 2010-09-18 2016-03-08 Fairchild Semiconductor Corporation MEMS multi-axis gyroscope Z-axis electrode structure
KR20130057485A (ko) 2010-09-18 2013-05-31 페어차일드 세미컨덕터 코포레이션 미세 전자 기계 시스템에 미치는 응력을 감소시키기 위한 패키징
KR101443730B1 (ko) 2010-09-18 2014-09-23 페어차일드 세미컨덕터 코포레이션 미세기계화 다이, 및 직교 오차가 작은 서스펜션을 제조하는 방법
EP2616822B1 (en) 2010-09-18 2015-07-01 Fairchild Semiconductor Corporation Micromachined 3-axis accelerometer with a single proof-mass
EP2616771B8 (en) 2010-09-18 2018-12-19 Fairchild Semiconductor Corporation Micromachined monolithic 6-axis inertial sensor
KR101311966B1 (ko) 2010-09-20 2013-10-14 페어차일드 세미컨덕터 코포레이션 감소된 션트 커패시턴스를 갖는 관통 실리콘 비아
WO2012040211A2 (en) 2010-09-20 2012-03-29 Fairchild Semiconductor Corporation Microelectromechanical pressure sensor including reference capacitor
KR101099586B1 (ko) * 2010-11-12 2011-12-28 앰코 테크놀로지 코리아 주식회사 수직 실장형 반도체 패키지
US8421203B2 (en) * 2010-11-17 2013-04-16 Stats Chippac Ltd. Integrated circuit packaging system with foldable substrate and method of manufacture thereof
WO2012074775A1 (en) 2010-11-19 2012-06-07 Analog Devices, Inc. Packaged integrated device with electrically conductive lid
US8625832B2 (en) 2011-04-04 2014-01-07 Invensense, Inc. Packages and methods for packaging microphone devices
US8476087B2 (en) 2011-04-21 2013-07-02 Freescale Semiconductor, Inc. Methods for fabricating sensor device package using a sealing structure
US8384168B2 (en) * 2011-04-21 2013-02-26 Freescale Semiconductor, Inc. Sensor device with sealing structure
US20120287587A1 (en) * 2011-05-09 2012-11-15 Research In Motion Limited Surface mountable navigation device with tactile response
CN102862945A (zh) * 2011-07-01 2013-01-09 英属维尔京群岛商杰群科技有限公司 塑封内空封装的结构
KR101300572B1 (ko) * 2011-09-09 2013-08-27 앰코 테크놀로지 코리아 주식회사 마이크로-전자 기계적 시스템을 갖는 반도체 패키지
WO2013052676A1 (en) 2011-10-07 2013-04-11 Analog Devices, Inc. Systems and methods for air release in cavity packages
US9029962B1 (en) 2011-10-12 2015-05-12 Amkor Technology, Inc. Molded cavity substrate MEMS package fabrication method and structure
KR101511946B1 (ko) 2011-11-17 2015-04-14 인벤센스, 인크. 사운드 파이프를 갖춘 마이크로폰 모듈
TWI504279B (zh) 2011-12-01 2015-10-11 財團法人工業技術研究院 Ｍｅｍｓ音波感測器及其製造方法
US9062972B2 (en) 2012-01-31 2015-06-23 Fairchild Semiconductor Corporation MEMS multi-axis accelerometer electrode structure
US8978475B2 (en) 2012-02-01 2015-03-17 Fairchild Semiconductor Corporation MEMS proof mass with split z-axis portions
US8889451B2 (en) 2012-02-21 2014-11-18 Freescale Semiconductor, Inc. MEMS pressure transducer assembly and method of packaging same
WO2013134511A2 (en) * 2012-03-07 2013-09-12 Deka Products Limited Partnership Volumetric measurement device, system and method
US8779535B2 (en) * 2012-03-14 2014-07-15 Analog Devices, Inc. Packaged integrated device die between an external and internal housing
US8836132B2 (en) 2012-04-03 2014-09-16 Analog Devices, Inc. Vertical mount package and wafer level packaging therefor
US8754694B2 (en) 2012-04-03 2014-06-17 Fairchild Semiconductor Corporation Accurate ninety-degree phase shifter
US8742964B2 (en) 2012-04-04 2014-06-03 Fairchild Semiconductor Corporation Noise reduction method with chopping for a merged MEMS accelerometer sensor
US9488693B2 (en) 2012-04-04 2016-11-08 Fairchild Semiconductor Corporation Self test of MEMS accelerometer with ASICS integrated capacitors
US9069006B2 (en) 2012-04-05 2015-06-30 Fairchild Semiconductor Corporation Self test of MEMS gyroscope with ASICs integrated capacitors
EP2647952B1 (en) 2012-04-05 2017-11-15 Fairchild Semiconductor Corporation Mems device automatic-gain control loop for mechanical amplitude drive
EP2647955B8 (en) 2012-04-05 2018-12-19 Fairchild Semiconductor Corporation MEMS device quadrature phase shift cancellation
EP2648334B1 (en) 2012-04-05 2020-06-10 Fairchild Semiconductor Corporation Mems device front-end charge amplifier
US9094027B2 (en) 2012-04-12 2015-07-28 Fairchild Semiconductor Corporation Micro-electro-mechanical-system (MEMS) driver
US9625272B2 (en) 2012-04-12 2017-04-18 Fairchild Semiconductor Corporation MEMS quadrature cancellation and signal demodulation
US9046546B2 (en) 2012-04-27 2015-06-02 Freescale Semiconductor Inc. Sensor device and related fabrication methods
US9078063B2 (en) * 2012-08-10 2015-07-07 Knowles Electronics, Llc Microphone assembly with barrier to prevent contaminant infiltration
DE102013014881B4 (de) 2012-09-12 2023-05-04 Fairchild Semiconductor Corporation Verbesserte Silizium-Durchkontaktierung mit einer Füllung aus mehreren Materialien
US8841738B2 (en) 2012-10-01 2014-09-23 Invensense, Inc. MEMS microphone system for harsh environments
US9156680B2 (en) 2012-10-26 2015-10-13 Analog Devices, Inc. Packages and methods for packaging
US9475694B2 (en) 2013-01-14 2016-10-25 Analog Devices Global Two-axis vertical mount package assembly
US9409765B1 (en) * 2013-02-01 2016-08-09 Maxim Integrated Products, Inc. Method and apparatus for an isolating structure
US10315220B2 (en) 2014-02-11 2019-06-11 Vibrant Composites Inc. Complex mass trajectories for improved haptic effect
WO2014130967A2 (en) * 2013-02-22 2014-08-28 Pratheev Sreetharan Layered assemblies
US10349543B2 (en) 2013-02-22 2019-07-09 Vibrant Composites Inc. Layered assemblies
US10913653B2 (en) * 2013-03-07 2021-02-09 MCube Inc. Method of fabricating MEMS devices using plasma etching and device therefor
US9419667B2 (en) 2013-04-16 2016-08-16 Skyworks Solutions, Inc. Apparatus and methods related to conformal coating implemented with surface mount devices
JP6237982B2 (ja) * 2013-04-23 2017-11-29 セイコーエプソン株式会社 物理量センサー、電子機器及び移動体
KR101374147B1 (ko) * 2013-06-13 2014-03-14 앰코 테크놀로지 코리아 주식회사 멤스 디바이스 및 이의 제조 방법
DE102013106353B4 (de) * 2013-06-18 2018-06-28 Tdk Corporation Verfahren zum Aufbringen einer strukturierten Beschichtung auf ein Bauelement
US9249010B2 (en) * 2013-06-25 2016-02-02 Analog Devices, Inc. Electrical shielding in a MEMS leadframe package
US9986354B2 (en) * 2013-06-26 2018-05-29 Infineon Technologies Ag Pre-mold for a microphone assembly and method of producing the same
US9521499B2 (en) * 2013-06-26 2016-12-13 Infineon Technologies Ag Electronic device with large back volume for electromechanical transducer
US10154330B2 (en) * 2013-07-03 2018-12-11 Harman International Industries, Incorporated Gradient micro-electro-mechanical systems (MEMS) microphone
US9296607B2 (en) * 2013-07-22 2016-03-29 Invensense, Inc. Apparatus and method for reduced strain on MEMS devices
US9212052B2 (en) * 2013-08-07 2015-12-15 Invensense, Inc. Packaged microphone with multiple mounting orientations
US9520036B1 (en) 2013-09-18 2016-12-13 Amazon Technologies, Inc. Haptic output generation with dynamic feedback control
CN103745959A (zh) * 2014-01-09 2014-04-23 华进半导体封装先导技术研发中心有限公司 基于刚柔结合印刷电路板的三维系统封装结构
DE102014005637A1 (de) * 2014-04-16 2015-10-22 Hydac Electronic Gmbh Fluid-Arbeitsgerätschaft
WO2015174158A1 (ja) * 2014-05-15 2015-11-19 富士電機株式会社 パワー半導体モジュールおよび複合モジュール
KR102251001B1 (ko) 2014-06-26 2021-05-12 삼성전자주식회사 반도체 패키지
TWI533715B (zh) * 2014-08-19 2016-05-11 菱生精密工業股份有限公司 Packaging Method of Stacked Micro - Electromechanical Microphone
TWI532388B (zh) * 2014-08-19 2016-05-01 菱生精密工業股份有限公司 Microelectromechanical Microphone Packaging
US20150001649A1 (en) * 2014-09-18 2015-01-01 Brandon Harrington MEMS Apparatus On a Lid With Flexible Substrate
US9521752B2 (en) 2014-09-19 2016-12-13 Harris Corporation Method of making an electronic device having a thin film resistor formed on an LCP solder mask and related devices
US9360318B1 (en) * 2014-12-23 2016-06-07 Compass Technology Company Limited Gyro MEMS sensor package
US9728510B2 (en) 2015-04-10 2017-08-08 Analog Devices, Inc. Cavity package with composite substrate
CN104779213B (zh) * 2015-04-16 2017-12-15 歌尔股份有限公司 集成传感器的封装结构和封装方法
US9758367B2 (en) * 2015-12-09 2017-09-12 Analog Devices, Inc. Metallizing MEMS devices
KR102497577B1 (ko) 2015-12-18 2023-02-10 삼성전자주식회사 반도체 패키지의 제조방법
US10388636B2 (en) * 2015-12-21 2019-08-20 Intel Corporation Integrating system in package (SIP) with input/output (IO) board for platform miniaturization
US20170240418A1 (en) * 2016-02-18 2017-08-24 Knowles Electronics, Llc Low-cost miniature mems vibration sensor
WO2017221762A1 (ja) * 2016-06-23 2017-12-28 株式会社村田製作所 電気音響変換装置
DE102017114085B4 (de) 2016-06-28 2023-05-04 Analog Devices, Inc. Selektive leitfähige Beschichtung für MEMS-Sensoren
US11647678B2 (en) 2016-08-23 2023-05-09 Analog Devices International Unlimited Company Compact integrated device packages
CN106375924B (zh) * 2016-08-31 2019-02-01 歌尔股份有限公司 提升mems麦克风封装成品率的方法、装置及系统
US10085097B2 (en) * 2016-10-04 2018-09-25 Starkey Laboratories, Inc. Hearing assistance device incorporating system in package module
US10629574B2 (en) 2016-10-27 2020-04-21 Analog Devices, Inc. Compact integrated device packages
US10697800B2 (en) 2016-11-04 2020-06-30 Analog Devices Global Multi-dimensional measurement using magnetic sensors and related systems, methods, and integrated circuits
US9932221B1 (en) 2017-03-02 2018-04-03 Amkor Technology, Inc. Semiconductor package with multiple compartments
US10497650B2 (en) 2017-04-13 2019-12-03 Amkor Technology, Inc. Semiconductor device and manufacturing method thereof
US10782315B2 (en) 2017-04-17 2020-09-22 Rosemount Aerospace Inc. Apparatus and method for packaging, handling or testing of sensors
US20180331049A1 (en) * 2017-05-15 2018-11-15 Novatek Microelectronics Corp. Chip on film package
US12117415B2 (en) 2017-05-15 2024-10-15 Analog Devices International Unlimited Company Integrated ion sensing apparatus and methods
CN109524360B (zh) * 2017-09-20 2020-06-26 永恒光实业股份有限公司 挠性衬底结构及其制造方法
TWI649440B (zh) * 2017-09-20 2019-02-01 永恒光實業股份有限公司 可撓式基板結構及其製造方法
EP3520695A3 (en) 2018-01-31 2019-11-06 Analog Devices, Inc. Electronic devices
DE102018203098B3 (de) * 2018-03-01 2019-06-19 Infineon Technologies Ag MEMS-Sensor
US10777474B1 (en) 2019-03-06 2020-09-15 Infineon Technologies Ag Pressure sensors on flexible substrates for stress decoupling
WO2020208481A1 (en) * 2019-04-12 2020-10-15 Cochlear Limited Electromagnetic interference shielding of mems microphone via printed circuit board
JP7162567B2 (ja) * 2019-05-23 2022-10-28 ホシデン株式会社 基板、マイクユニット
US11587839B2 (en) 2019-06-27 2023-02-21 Analog Devices, Inc. Device with chemical reaction chamber
US12474290B2 (en) 2019-11-20 2025-11-18 Analog Devices International Unlimited Company Electrochemical device
US11787690B1 (en) 2020-04-03 2023-10-17 Knowles Electronics, Llc. MEMS assembly substrates including a bond layer
US11945714B2 (en) * 2020-07-30 2024-04-02 Stmicroelectronics S.R.L. Electronic device and corresponding method
US12205857B2 (en) * 2020-10-07 2025-01-21 Murata Manufacturing Co., Ltd. Electronic component with metallic cap
CN114466512B (zh) * 2021-12-24 2023-08-22 江苏普诺威电子股份有限公司 Mems埋容埋阻封装载板及其制作工艺
CN114368726B (zh) * 2021-12-24 2024-05-10 江苏普诺威电子股份有限公司 Mems内置芯片封装载板及其制作工艺
KR20250176719A (ko) * 2024-06-13 2025-12-22 엘지이노텍 주식회사 멤스 마이크로폰

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100374075B1 (ko) 1999-03-04 2003-03-03 미쓰이 긴조꾸 고교 가부시키가이샤 전자부품 실장용 필름캐리어 테이프 및 그 제조방법
JP2004009357A (ja) 2002-06-04 2004-01-15 Toyo Metallizing Co Ltd 金属蒸着／金属メッキ積層フィルム及びこれを用いた電子部品
JP2006150588A (ja) 2004-11-30 2006-06-15 Wen-Chang Dong 分離できるインターフェースを形成する方法及びこの方法でマイクロマシン薄膜を製造する方法及びその製品
KR20070057992A (ko) * 2004-10-22 2007-06-07 폼팩터, 인코포레이티드 다른 표면에 이송 가능한 맨드릴 상에서 제작되는 전기주조스프링

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB8906146D0 (en) * 1989-03-17 1989-05-04 Hamilton Sheila Circuit protection apparatus
US5888845A (en) * 1996-05-02 1999-03-30 National Semiconductor Corporation Method of making high sensitivity micro-machined pressure sensors and acoustic transducers
US6225688B1 (en) * 1997-12-11 2001-05-01 Tessera, Inc. Stacked microelectronic assembly and method therefor
US6300679B1 (en) * 1998-06-01 2001-10-09 Semiconductor Components Industries, Llc Flexible substrate for packaging a semiconductor component
US6239485B1 (en) * 1998-11-13 2001-05-29 Fujitsu Limited Reduced cross-talk noise high density signal interposer with power and ground wrap
US6324907B1 (en) 1999-11-29 2001-12-04 Microtronic A/S Flexible substrate transducer assembly
JP4532782B2 (ja) * 2000-07-04 2010-08-25 キヤノン株式会社 放射線撮像装置及びシステム
US7434305B2 (en) 2000-11-28 2008-10-14 Knowles Electronics, Llc. Method of manufacturing a microphone
US7166910B2 (en) 2000-11-28 2007-01-23 Knowles Electronics Llc Miniature silicon condenser microphone
US6912078B2 (en) 2001-03-16 2005-06-28 Corning Incorporated Electrostatically actuated micro-electro-mechanical devices and method of manufacture
EP1245528A1 (en) * 2001-03-27 2002-10-02 Delta Danish Electronics, Light & Acoustics A unitary flexible microsystem and a method for producing same
JP4085788B2 (ja) * 2002-08-30 2008-05-14 日本電気株式会社 半導体装置及びその製造方法、回路基板、電子機器
US7294928B2 (en) * 2002-09-06 2007-11-13 Tessera, Inc. Components, methods and assemblies for stacked packages
US6781231B2 (en) * 2002-09-10 2004-08-24 Knowles Electronics Llc Microelectromechanical system package with environmental and interference shield
WO2004093506A2 (en) * 2003-04-15 2004-10-28 Wavezero, Inc. Electomagnetic interference shielding for a printed circuit board
US20050135727A1 (en) 2003-12-18 2005-06-23 Sioptical, Inc. EMI-EMC shield for silicon-based optical transceiver
US20050189622A1 (en) * 2004-03-01 2005-09-01 Tessera, Inc. Packaged acoustic and electromagnetic transducer chips
US7154175B2 (en) * 2004-06-21 2006-12-26 Intel Corporation Ground plane for integrated circuit package
JP2006073683A (ja) * 2004-08-31 2006-03-16 Sony Corp 回路デバイス及び回路デバイスの製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100374075B1 (ko) 1999-03-04 2003-03-03 미쓰이 긴조꾸 고교 가부시키가이샤 전자부품 실장용 필름캐리어 테이프 및 그 제조방법
JP2004009357A (ja) 2002-06-04 2004-01-15 Toyo Metallizing Co Ltd 金属蒸着／金属メッキ積層フィルム及びこれを用いた電子部品
KR20070057992A (ko) * 2004-10-22 2007-06-07 폼팩터, 인코포레이티드 다른 표면에 이송 가능한 맨드릴 상에서 제작되는 전기주조스프링
JP2006150588A (ja) 2004-11-30 2006-06-15 Wen-Chang Dong 分離できるインターフェースを形成する方法及びこの方法でマイクロマシン薄膜を製造する方法及びその製品

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025063422A1 (ko) * 2023-09-22 2025-03-27 엘지이노텍 주식회사 멤스 마이크로폰

Also Published As

Publication number Publication date
JP4853975B2 (ja) 2012-01-11
US7692288B2 (en) 2010-04-06
KR20080039417A (ko) 2008-05-07
WO2007010361A2 (en) 2007-01-25
JP2009501442A (ja) 2009-01-15
US7202552B2 (en) 2007-04-10
US20070013052A1 (en) 2007-01-18
WO2007010361A3 (en) 2007-08-23
WO2007010361A8 (en) 2008-03-06
US20070013036A1 (en) 2007-01-18

Similar Documents

Publication Publication Date Title
KR101295979B1 (ko) Ｍｅｍｓ 패키지 및 ｍｅｍｓ 패키지 제조 방법
US7419853B2 (en) Method of fabrication for chip scale package for a micro component
US6953985B2 (en) Wafer level MEMS packaging
US7843021B2 (en) Double-side mountable MEMS package
KR102295990B1 (ko) 임베딩된 반도체 디바이스 패키지 및 그 제조 방법
US11309304B2 (en) Stackable electronic package and method of fabricating same
US7436054B2 (en) MEMS microphone with a stacked PCB package and method of producing the same
WO2008023465A1 (fr) Dispositif de mécanisme de machine microélectronique et son procédé de fabrication
WO2004051744A2 (en) Mems control chip integration
JP4971158B2 (ja) 支持体基板を備えた構成素子装置
WO2006085825A1 (en) A packaging method for mems devices, and mems packages produced using the method
US7849594B2 (en) Manufacturing method for integrating passive component within substrate
KR20060095092A (ko) 고주파 모듈 부품 및 그 제조 방법
JP4292383B2 (ja) 光デバイスの製造方法
JP5045952B2 (ja) 光デバイス、光モジュール及び電子機器
JP2013539253A (ja) モジュール及びその製造方法
JP2009194132A (ja) 半導体チップ、光電変換チップおよび半導体チップの製造方法

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

N231 Notification of change of applicant
PN2301 Change of applicant

St.27 status event code: A-3-3-R10-R13-asn-PN2301

St.27 status event code: A-3-3-R10-R11-asn-PN2301

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

A201 Request for examination
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

FPAY Annual fee payment

Payment date: 20160720

Year of fee payment: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

FPAY Annual fee payment

Payment date: 20170719

Year of fee payment: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 9

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 10

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 11

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 12

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 13

U11 Full renewal or maintenance fee paid

Free format text: ST27 STATUS EVENT CODE: A-4-4-U10-U11-OTH-PR1001 (AS PROVIDED BY THE NATIONAL OFFICE)

Year of fee payment: 13

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000