JP2009152569A - 光電変換装置の製造方法 - Google Patents
光電変換装置の製造方法 Download PDFInfo
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- JP2009152569A JP2009152569A JP2008295951A JP2008295951A JP2009152569A JP 2009152569 A JP2009152569 A JP 2009152569A JP 2008295951 A JP2008295951 A JP 2008295951A JP 2008295951 A JP2008295951 A JP 2008295951A JP 2009152569 A JP2009152569 A JP 2009152569A
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- Prior art keywords
- semiconductor layer
- single crystal
- crystal semiconductor
- photoelectric conversion
- layer
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- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/06—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers
- H01L31/072—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers the potential barriers being only of the PN heterojunction type
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- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/186—Particular post-treatment for the devices, e.g. annealing, impurity gettering, short-circuit elimination, recrystallisation
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- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0256—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by the material
- H01L31/0264—Inorganic materials
- H01L31/028—Inorganic materials including, apart from doping material or other impurities, only elements of Group IV of the Periodic Table
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Abstract
【解決手段】支持基板に接合させた単結晶半導体層の表面にパルスレーザビームを照射して、該単結晶半導体層の表面を凹凸化させることを要旨とする。支持基板に接合した単結晶半導体層に、窒素等の不活性気体と酸素を含む雰囲気中でパルスレーザビームを照射して単結晶半導体層の表面を凹凸化する。結晶半導体層の表面に凹凸構造があることにより光の反射が押さえられ、入射した光を閉じ込める効果を奏する。それにより、単結晶半導体層の厚さが、0.1μm〜10μm以下であっても入射光の光路長が実質的に増大し、光の吸収量を増やすことができる。
【選択図】図2
Description
単結晶半導体基板から薄い単結晶半導体層を分離して、絶縁表面を有する基板若しくは絶縁性の支持基板に該単結晶半導体層を転置して光電変換装置を製造する方法について図面を参照して説明する。
次に、実施の形態1において示す図1のA−B切断線に対応する断面構造として、図2の場合を前提として光電変換装置10の製造方法について説明する。
H2+e− → H2 ++2e− −Q (Q=15.39eV) (1)
H2 ++H2 → H3 ++H +Q (Q=1.49eV) (2)
本形態は、実施形態2と異なる製造工程を図11に示す。図11において、(A)保護膜116を形成して第1不純物半導体層107を半導体基板115の一面に形成した後、(B)保護膜116をそのまま残して損傷層117を形成する。その後、(C)保護膜116を除去して第1電極103を形成する。本形態の工程によれば保護膜116を有効に利用することができる。すなわち、保護膜116を損傷層117形成後に除去することで、半導体基板115の表面の接合表面を平坦なものとすることができる。保護膜116は50nmから200nmの厚さで設けることが好ましい。また、第1不純物半導体層107を通して水素のクラスターイオンが打ち込まれる損傷層117を形成することにより、第1不純物半導体層107の水素化を兼ねることができる。
本形態は、実施形態2と異なる製造工程を図12に示す。図12において、(A)半導体基板115の一面に第1電極103を形成し、(B)第1電極103を通して一導電型の不純物元素を添加して第1不純物半導体層107を形成する。そして、(C)第1電極103を通して水素のクラスターイオンを打ち込み損傷層117を形成する。本工程では、第1電極103の形成後にイオンドーピングを行うことにより、第1電極103をイオンドーピングにおける損傷防止層として利用することができる。それによりイオンドーピングのために保護膜を形成する工程を省略することができる。
本形態は、実施形態2と異なる製造工程を図13に示す。図13において、(A)半導体基板115の一面に第1電極103を形成し、(B)第1電極103を通して水素のクラスターイオンを打ち込み損傷層117を形成する。そして、(C)第1電極103を通して一導電型の不純物元素を添加して第1不純物半導体層107を形成する。本工程では、第1電極103を最初に形成することにより、第1電極103をイオンドーピングにおける損傷防止層として利用することができる。本形態では、イオンドーピングのために保護膜を形成する工程を省略することができる。
本形態は、実施形態2と異なる製造工程を図14に示す。図14において、(A)保護膜116を形成して水素のクラスターイオンを半導体基板115の一面に打ち込んで損傷層117を形成し、(B)保護膜116をそのまま残して第1不純物半導体層107を形成する。そして、(C)保護膜116を除去して第1電極103を形成する。本工程は保護膜116をイオンドーピング時の損傷防止膜として、さらに第1不純物半導体層107を形成するときのドーピング深さを調節する膜として有効に利用している。また、損傷層117を形成した後に、第1不純物半導体層107を形成することにより、該第1不純物半導体層107の不純物濃度を高濃度化することができ、浅い接合を形成することができる。それにより、裏面電界(BSF:Back Surface Field)効果を発現させ、光生成キャリアの収集効率を高めることができる。
本形態は、実施形態2と異なる製造工程を図15に示す。図15において、(A)保護膜116を形成して水素のクラスターイオンを打ち込み損傷層117を形成し、(B)保護膜116を除去して第1電極103を形成する。そして、(C)第1電極103を通して一導電型の不純物元素を添加して第1不純物半導体層107を形成する。第1電極103を通して第1不純物半導体層107を形成することにより、第1不純物半導体層107の厚さを制御することが容易となる。
本形態は、実施形態2と異なる製造工程を図16に示す。支持基板101上に単結晶半導体層106を接着し(図6(B))、図16(A)で示すように結晶欠陥の残留する単結晶半導体層106の修復と、表面に凹凸構造を形成するレーザ処理を行う。そして図16(B)で示すように、単結晶半導体層106に第1不純物半導体層107とは逆の導電型の不純物元素を添加して第2不純物半導体層108を形成する。その後、図16(C)に示すように第2不純物半導体層108上に反射防止膜119を形成する。
本形態は、実施形態2と異なる製造工程を図18に示す。支持基板101上に単結晶半導体層106を接着した後(図6(B))、図18(A)において示すように、結晶欠陥の残留する単結晶半導体層106の修復と、表面に凹凸構造を形成するレーザ処理を行う。その後、図18(B)で示すように反射防止膜119を形成し、図18(C)で示すように第2不純物半導体層108を形成する。本形態によれば、第2不純物半導体層108の形成前にレーザ処理を行うので、レーザビームの照射による溶融領域を単結晶半導体層106の内部まで広げることができ、再単結晶化による欠陥修復の効果をより高めることができる。
本形態は、実施形態2と異なる製造工程を図19に示す。支持基板101上の単結晶半導体層106にレーザ処理を行い、再単結晶化と表面に凹凸構造を形成する。そして図19(A)で示すように、単結晶半導体層106を覆うように絶縁層120を形成する。そして、図19(B)で示すように、絶縁層120に開口部を形成して単結晶半導体層106を露出させ、その開口部に第2不純物半導体層108を形成する。その後、図19(C)で示すように、絶縁層120と単結晶半導体層106を貫通し第1電極103に達する開口部を形成し、第1補助電極113及び第2補助電極114を形成する。さらに反射防止膜119を形成する。本形態のように、単結晶半導体層106の内側に開口部を形成して第1電極103と導通する第1補助電極113を形成することにより、光電変換装置の小型化を図ることができる。
実施形態1〜10により製造される光電変換装置を用いた太陽光発電モジュールの一例を図20(A)に示す。この太陽光発電モジュール30は、支持基板101に設けられた単結晶半導体層106により光電変換装置10が構成されている。単結晶半導体層106には光電変換機能を発現させる第1不純物半導体層、第2不純物半導体層などが形成されている。
図21は太陽光発電モジュール30を用いた太陽光発電システムの一例を示す。一又は複数の太陽光発電モジュール30の出力電力は、充電制御回路123により蓄電池124を充電する。蓄電池124の充電量が多い場合には、負荷125に直接出力される場合もある。
20 タンデム型光電変換装置
30 太陽光発電モジュール
101 支持基板
102 絶縁層
103 第1電極
104 第1ユニットセル
105 第2ユニットセル
106 単結晶半導体層
107 第1不純物半導体層
108 第2不純物半導体層
109 非単結晶半導体層
110 第3不純物半導体層
111 第4不純物半導体層
112 第2電極
113 第1補助電極
114 第2補助電極
115 半導体基板
116 保護膜
117 損傷層
118 バリア層
119 反射防止膜
120 絶縁層
121 第1裏面電極
122 第2裏面電極
123 充電制御回路
124 蓄電池
125 負荷
200 イオン源
201 フィラメント
202 フィラメント電源
203 電源制御部
204 ガス供給部
205 引出し電極系
206 載置台
207 質量分析管
208 質量分析計
210 レーザ発振器
211 光学系
212 ガス噴射筒
213 ガス供給部
214 流量制御部
215 ガス加熱部
216 ガス供給部
217 シリンドリカルレンズアレイ
218 シリンドリカルレンズ
219 ミラー
220 ダブレットシリンドリカルレンズ
221 光導入窓
222 基板ステージ
223 ガイドレール
224 スライダ
Claims (6)
- 一面に一導電型の第1不純物半導体層、前記第1不純物半導体層に接する電極、及び質量が水素分子よりも重い水素のクラスターイオンを70%以上含むイオンビームを一面から注入することによって形成される損傷層を有する単結晶半導体基板と、絶縁表面を有する支持基板と、を接合層を介して接着し、
熱処理を行うことにより、前記損傷層を劈開させ、前記単結晶半導体基板から単結晶半導体層を分離し、前記支持基板上に前記単結晶半導体層を残存させたまま前記単結晶半導体基板を除去し、
不活性気体及び酸素を含む雰囲気中で、前記単結晶半導体層の劈開面にパルスレーザビームを照射して、前記単結晶半導体層の表面を凹凸化し、
前記単結晶半導体層の劈開面側に、前記一導電型とは逆の導電型の第2不純物半導体層を形成すること
を特徴とする光電変換装置の製造方法。 - 請求項1において、
前記第2不純物半導体層の上に、前記一導電型の第3不純物半導体層、非単結晶半導体層、及び前記一導電型とは逆の導電型の第4不純物半導体層を堆積すること
を特徴とする光電変換装置の製造方法。 - 請求項1又は2において、
前記不活性気体及び酸素を含む雰囲気における酸素濃度は、0.1体積%乃至25体積%であること
を特徴とする光電変換装置の製造方法。 - 請求項1乃至3のいずれか一項において、前記パルスレーザビームの照射時に照射領域の前記単結晶半導体層が、250℃から600℃の温度に加熱されていること
を特徴とする光電変換装置の製造方法。 - 請求項1乃至4のいずれか一項において、前記クラスターイオンが、H3 +であること
を特徴とする光電変換装置の製造方法。 - 請求項1乃至5のいずれか一項において、前記損傷層は、前記単結晶半導体基板の表面から10μm未満の深さに形成されること
を特徴とする光電変換装置の製造方法。
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Also Published As
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US7871849B2 (en) | 2011-01-18 |
US7674647B2 (en) | 2010-03-09 |
US20100136735A1 (en) | 2010-06-03 |
EP2065942A2 (en) | 2009-06-03 |
US20090142874A1 (en) | 2009-06-04 |
JP5286046B2 (ja) | 2013-09-11 |
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