JP2009081328A - 回路装置およびその製造方法 - Google Patents
回路装置およびその製造方法 Download PDFInfo
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- 238000007789 sealing Methods 0.000 claims abstract description 79
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- 239000007787 solid Substances 0.000 claims description 2
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- 229910052751 metal Inorganic materials 0.000 description 13
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- 229910052782 aluminium Inorganic materials 0.000 description 9
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 9
- 239000000853 adhesive Substances 0.000 description 5
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- 239000010949 copper Substances 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
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- 239000004065 semiconductor Substances 0.000 description 3
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 239000002826 coolant Substances 0.000 description 2
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- 229910001111 Fine metal Inorganic materials 0.000 description 1
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
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- 239000010703 silicon Substances 0.000 description 1
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- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
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- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
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- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
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- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
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- H01L2924/13—Discrete devices, e.g. 3 terminal devices
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- H01L2924/13—Discrete devices, e.g. 3 terminal devices
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- H01L2924/1305—Bipolar Junction Transistor [BJT]
- H01L2924/13055—Insulated gate bipolar transistor [IGBT]
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- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
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- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
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Abstract
【解決手段】混成集積回路装置10には、ケース材12に重畳した第1回路基板18および第2回路基板20が組み込まれている。そして、第1回路基板18の上面には第1回路素子22が配置され、第2回路基板20の上面には第2回路素子が配置されている。更に、ケース材12の側壁部に開口部15が設けてあり、この開口部15によりケース材12の内部空間と外部とが連通されている。従って、樹脂封止の工程に於いては、この開口部15を経由してケース材12の内部空間に封止樹脂11を外部から注入することができる。
【選択図】図1
Description
11 封止樹脂
12 ケース材
12A 第1側壁部
12B 第2側壁部
12C 第3側壁部
12D 第4側壁部
13 露出部
14 第1封止樹脂
15 開口部
16 第2封止樹脂
17 傾斜面
18 第1回路基板
20 第2回路基板
21 導電パターン
22 第1回路素子
24 第2回路素子
26 中空部
28 第1リード
30 第2リード
32 実装基板
34 絶縁基板
36 絶縁層
38 導電パターン
40 絶縁層
41 整流回路
42 金属細線
43 平滑回路
44 ドライバIC
45 スイッチング回路
46 モーター
48 室外機
50 筐体
52 圧縮機
54 凝縮機
56 ファン
58 ヒートシンク
60 実装基板
Claims (8)
- ケース材と、
前記ケース材に組み込まれると共に、重畳して配置された第1回路基板および第2回路基板と、
前記第1回路基板の主面に固着された第1回路素子と、
前記第2回路基板の主面に固着された第2回路素子と、
少なくとも前記第1回路基板の前記主面および前記第1回路素子を被覆する封止樹脂と、を具備し、
前記封止樹脂が前記ケース材の内部空間に注入されるための開口部を前記ケース材に設けたことを特徴とする回路装置。 - 前記開口部に面する前記ケース材の側壁は傾斜面であることを特徴とする請求項1記載の回路装置。
- 前記封止樹脂は、前記内部空間に充填されると共に、前記第2回路基板の主面および前記第2回路素子も被覆する様に形成されることを特徴とする請求項1記載の回路装置。
- 前記ケース材の前記内部空間には、前記封止樹脂により充填されない中空部が設けられることを特徴とする請求項1記載の回路装置。
- 主面に第1回路素子が固着された第1回路基板をケース材に組み込む工程と、
主面に第2回路素子が固着された第2回路基板を前記ケース材に組み込む工程と、
前記ケース材、前記第1回路基板および前記第2回路基板に囲まれる内部空間に封止樹脂を注入して、前記第1回路基板の主面および前記第1回路素子を封止する工程と、を具備し、
前記封止する工程では、前記ケース材に設けた開口部から前記内部空間に前記封止樹脂を注入することを特徴とする回路装置の製造方法。 - 前記封止する工程では、前記ケース材の前記内部空間を前記封止樹脂により充填すると共に、前記第2回路基板の上面および前記第2回路素子を前記封止樹脂により一体的に被覆することを特徴とする請求項5記載の回路装置の製造方法。
- 前記封止する工程では、前記第1回路基板の上面および前記第1回路素子を前記封止樹脂により被覆すると共に、前記ケース材の前記内部空間に前記封止樹脂が充填されない中空部を形成することを特徴とする請求項5記載の回路装置の製造方法。
- 前記封止する工程では、前記ケース材の内壁に設けた傾斜部に上方から、液状または半固形状の前記封止樹脂を注入することを特徴とする請求項5記載の回路装置の製造方法。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007250486A JP4934559B2 (ja) | 2007-09-27 | 2007-09-27 | 回路装置およびその製造方法 |
CN2008101683310A CN101399259B (zh) | 2007-09-27 | 2008-09-26 | 电路装置及其制造方法 |
US12/239,256 US8107255B2 (en) | 2007-09-27 | 2008-09-26 | Circuit device and method of manufacturing the same |
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JP2007250486A JP4934559B2 (ja) | 2007-09-27 | 2007-09-27 | 回路装置およびその製造方法 |
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JP2009081328A true JP2009081328A (ja) | 2009-04-16 |
JP4934559B2 JP4934559B2 (ja) | 2012-05-16 |
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JP2007250486A Active JP4934559B2 (ja) | 2007-09-27 | 2007-09-27 | 回路装置およびその製造方法 |
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Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011096927A (ja) * | 2009-10-30 | 2011-05-12 | Panasonic Corp | 回路基板、コネクタおよび電子機器 |
JP2011211107A (ja) * | 2010-03-30 | 2011-10-20 | Toshiba Corp | 実装基板の樹脂封止方法 |
JP2016082110A (ja) * | 2014-10-20 | 2016-05-16 | ローム株式会社 | ゲートドライバユニットおよびパワーモジュール |
JP2017028020A (ja) * | 2015-07-17 | 2017-02-02 | Tdk株式会社 | コンバータ装置およびコンバータ装置製造方法 |
JP2018509780A (ja) * | 2015-03-23 | 2018-04-05 | 広東美的制冷設備有限公司Gd Midea Air−Conditioning Equipment Co.,Ltd. | インテリジェントパワーモジュール及びその製造方法 |
JP2018181959A (ja) * | 2017-04-06 | 2018-11-15 | 三菱電機株式会社 | 電力用半導体装置およびその製造方法、ならびに電力変換装置 |
JP2019115164A (ja) * | 2017-12-22 | 2019-07-11 | 株式会社デンソー | 電子装置、及び電子装置を備えたモータ装置 |
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Also Published As
Publication number | Publication date |
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US20090103276A1 (en) | 2009-04-23 |
US8107255B2 (en) | 2012-01-31 |
CN101399259A (zh) | 2009-04-01 |
JP4934559B2 (ja) | 2012-05-16 |
CN101399259B (zh) | 2011-08-24 |
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