JP4934558B2 - 回路装置 - Google Patents
回路装置 Download PDFInfo
- Publication number
- JP4934558B2 JP4934558B2 JP2007250484A JP2007250484A JP4934558B2 JP 4934558 B2 JP4934558 B2 JP 4934558B2 JP 2007250484 A JP2007250484 A JP 2007250484A JP 2007250484 A JP2007250484 A JP 2007250484A JP 4934558 B2 JP4934558 B2 JP 4934558B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit
- circuit board
- circuit element
- case material
- sealing resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
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- 238000004891 communication Methods 0.000 claims description 31
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- 229920005989 resin Polymers 0.000 description 56
- 239000011347 resin Substances 0.000 description 56
- 238000007789 sealing Methods 0.000 description 48
- 229910052751 metal Inorganic materials 0.000 description 13
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- 229910052782 aluminium Inorganic materials 0.000 description 12
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 12
- 239000003990 capacitor Substances 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
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- 239000003507 refrigerant Substances 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 3
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- 229910001111 Fine metal Inorganic materials 0.000 description 2
- 239000002826 coolant Substances 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
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- 150000002739 metals Chemical class 0.000 description 1
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- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
- H01L2924/13055—Insulated gate bipolar transistor [IGBT]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
12 ケース材
12A 第1側壁部
12B 第2側壁部
12C 第3側壁部
12D 第4側壁部
13 露出部
14 第1封止樹脂
15A、15B、15C、15D 連通口
16 第2封止樹脂
18 第1回路基板
20 第2回路基板
21 導電パターン
22 第1回路素子
24 第2回路素子
26 中空部
28 第1リード
30 第2リード
32 実装基板
34 絶縁基板
36 絶縁層
38 導電パターン
40 絶縁層
41 整流回路
42 金属細線
43 平滑回路
44 ドライバIC
45 スイッチング回路
46 モーター
48 室外機
50 筐体
52 圧縮機
54 凝縮機
56 ファン
58 ヒートシンク
60 実装基板
Claims (5)
- ケース材と、
前記ケース材に組み込まれた第1回路基板と、
前記ケース材に前記第1回路基板と重畳して組み込まれ、平面視で前記第1回路基板よりも大きい第2回路基板と、
前記第1回路基板の主面に固着された第1回路素子と、
前記第2回路基板の主面に固着され、前記第1回路素子よりも動作温度が低い第2回路素子と、
前記ケース材の内部空間と外部とを連通させる連通口と、を具備し、
前記連通口を、前記第1回路基板の側方で前記第2回路基板と重畳する位置に設けることを特徴とする回路装置。 - 前記連通口を、前記第1回路基板を挟む位置に複数設けることを特徴とする請求項1に記載の回路装置。
- 前記連通口は前記ケース材の側壁に囲まれることを特徴とする請求項1または請求項2に記載の回路装置。
- 前記ケース材の側壁部を部分的に開口した他の連通口を更に具備することを特徴とする請求項1から請求項3の何れかに記載の回路装置。
- 前記他の連通口は、前記ケース材の対向する2つの側壁に設けられることを特徴とする請求項4に記載の回路装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007250484A JP4934558B2 (ja) | 2007-09-27 | 2007-09-27 | 回路装置 |
TW097136413A TW200915970A (en) | 2007-09-27 | 2008-09-23 | Circuit device, circuit module and outdoor equipment |
US12/239,286 US7751194B2 (en) | 2007-09-27 | 2008-09-26 | Circuit device, circuit module, and outdoor unit |
CN200810169517.8A CN101404278B (zh) | 2007-09-27 | 2008-09-27 | 电路装置、电路模块及室外机 |
EP08016971.7A EP2043417B1 (en) | 2007-09-27 | 2008-09-29 | Circuit device, circuit module, and outdoor unit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007250484A JP4934558B2 (ja) | 2007-09-27 | 2007-09-27 | 回路装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009081326A JP2009081326A (ja) | 2009-04-16 |
JP4934558B2 true JP4934558B2 (ja) | 2012-05-16 |
Family
ID=40655847
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007250484A Expired - Fee Related JP4934558B2 (ja) | 2007-09-27 | 2007-09-27 | 回路装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4934558B2 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101246650B1 (ko) | 2011-04-13 | 2013-03-25 | 서울특별시도시철도공사 | 전동차 추진제어를 위한 전력변환장치에 사용되는 스위칭 소자용 구동 보드 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62222659A (ja) * | 1986-03-24 | 1987-09-30 | Sharp Corp | 電力半導体装置 |
JP3201187B2 (ja) * | 1994-12-08 | 2001-08-20 | 富士電機株式会社 | 半導体装置 |
JPH11354955A (ja) * | 1998-06-11 | 1999-12-24 | Mitsubishi Electric Corp | 電子機器の冷却構造 |
JP3547333B2 (ja) * | 1999-02-22 | 2004-07-28 | 株式会社日立産機システム | 電力変換装置 |
JP3785126B2 (ja) * | 2002-09-10 | 2006-06-14 | 新電元工業株式会社 | 半導体装置 |
-
2007
- 2007-09-27 JP JP2007250484A patent/JP4934558B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2009081326A (ja) | 2009-04-16 |
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