JP5261635B2 - 回路装置 - Google Patents
回路装置 Download PDFInfo
- Publication number
- JP5261635B2 JP5261635B2 JP2007284349A JP2007284349A JP5261635B2 JP 5261635 B2 JP5261635 B2 JP 5261635B2 JP 2007284349 A JP2007284349 A JP 2007284349A JP 2007284349 A JP2007284349 A JP 2007284349A JP 5261635 B2 JP5261635 B2 JP 5261635B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit
- circuit board
- case material
- sealing resin
- circuit element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
- H01L2924/13055—Insulated gate bipolar transistor [IGBT]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
12 ケース材
12A 第1側壁部
12B 第2側壁部
12C 第3側壁部
12D 第4側壁部
13 露出部
14 第1封止樹脂
15 開口部
16 第2封止樹脂
17 傾斜面
18 第1回路基板
20 第2回路基板
21 導電パターン
22 第1回路素子
24 第2回路素子
26 中空部
28 第1リード
30 第2リード
32 実装基板
34 絶縁基板
36 絶縁層
38 導電パターン
40 絶縁層
41 整流回路
42 金属細線
43 平滑回路
44 ドライバIC
45 スイッチング回路
46 モーター
48 室外機
50 筐体
52 圧縮機
54 凝縮機
56 ファン
58 ヒートシンク
60 実装基板
Claims (3)
- ケース材と、
前記ケース材に組み込まれると共に、重畳して配置された第1回路基板および第2回路基板と、
前記第1回路基板の主面に固着された第1回路素子と、
前記第2回路基板の主面に固着された第2回路素子と、
前記ケース材、前記第1回路基板および前記第2回路基板により囲まれる内部空間と外部とを連通させる複数の開口部と、
前記第1回路基板の前記主面および前記第1回路素子を被覆する封止樹脂と、
前記開口部を経由して外部と連通し、前記ケース材の前記内部空間にて前記封止樹脂が充填されない中空部と、を具備し、
前記開口部が設けられた箇所の前記ケース材の内壁は傾斜面であり、
前記封止樹脂は前記傾斜面に至るまで前記ケース材の内部に充填されることを特徴とする回路装置。 - 前記開口部は、前記ケース材の上面であって、一方の端部と他方の端部に配置されることを特徴とする請求項1に記載の回路装置。
- 前記開口部は、前記第2回路基板と前記ケース材との間隙から成ることを特徴とする請求項1または請求項2に記載の回路装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007284349A JP5261635B2 (ja) | 2007-10-31 | 2007-10-31 | 回路装置 |
TW097136413A TW200915970A (en) | 2007-09-27 | 2008-09-23 | Circuit device, circuit module and outdoor equipment |
US12/239,286 US7751194B2 (en) | 2007-09-27 | 2008-09-26 | Circuit device, circuit module, and outdoor unit |
CN200810169517.8A CN101404278B (zh) | 2007-09-27 | 2008-09-27 | 电路装置、电路模块及室外机 |
EP08016971.7A EP2043417B1 (en) | 2007-09-27 | 2008-09-29 | Circuit device, circuit module, and outdoor unit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007284349A JP5261635B2 (ja) | 2007-10-31 | 2007-10-31 | 回路装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009111289A JP2009111289A (ja) | 2009-05-21 |
JP5261635B2 true JP5261635B2 (ja) | 2013-08-14 |
Family
ID=40779437
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007284349A Expired - Fee Related JP5261635B2 (ja) | 2007-09-27 | 2007-10-31 | 回路装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5261635B2 (ja) |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62222659A (ja) * | 1986-03-24 | 1987-09-30 | Sharp Corp | 電力半導体装置 |
JP3201187B2 (ja) * | 1994-12-08 | 2001-08-20 | 富士電機株式会社 | 半導体装置 |
JPH11354955A (ja) * | 1998-06-11 | 1999-12-24 | Mitsubishi Electric Corp | 電子機器の冷却構造 |
-
2007
- 2007-10-31 JP JP2007284349A patent/JP5261635B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2009111289A (ja) | 2009-05-21 |
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