JP5378683B2 - 回路装置およびその製造方法 - Google Patents
回路装置およびその製造方法 Download PDFInfo
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- JP5378683B2 JP5378683B2 JP2007533379A JP2007533379A JP5378683B2 JP 5378683 B2 JP5378683 B2 JP 5378683B2 JP 2007533379 A JP2007533379 A JP 2007533379A JP 2007533379 A JP2007533379 A JP 2007533379A JP 5378683 B2 JP5378683 B2 JP 5378683B2
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Description
<第2の実施の形態>
11A〜11B 回路基板
12 絶縁層
13A〜13C 導電パターン
14 封止樹脂
15A〜15C 回路素子
17 金属細線
18A〜18C パッド
19A 接続部
20 モーター
21 電源
22A 上金型
22B 下金型
23 キャビティ
24 制御回路
25 リード
40 リードフレーム
41 外枠
46 ユニット
Claims (9)
- 回路基板と、
前記回路基板の上面に形成された導電パターンおよび回路素子から成る電気回路と、
前記電気回路と電気的に接続されて外部に導出するリードとを具備し、
複数個の独立した前記回路基板が設けられ、
前記回路基板の各々に前記導電パターン、前記回路素子および前記リードが設けられ、
前記各回路基板の上面、側面および下面が封止樹脂により一体に被覆され、
前記回路素子は、制御素子と、前記制御素子に制御されるスイッチング素子とを含み、
前記制御素子と前記スイッチング素子とは異なる前記回路基板に実装され、
前記スイッチング素子が実装された前記回路基板は、前記制御素子が実装された前記回路基板を挟む位置に配置されることを特徴とする回路装置。 - 異なる前記回路基板に形成された前記電気回路は、接続手段を介して電気的に接続されることを特徴とする請求項1に記載の回路装置。
- 前記接続手段は金属細線であることを特徴とする請求項2に記載の回路装置。
- 少なくとも1つの前記回路基板には、前記導電パターンと前記回路基板とを接続する接続部が設けられることを特徴とする請求項1から請求項3の何れかに記載の回路装置。
- 前記回路基板は、同一平面上に複数個が配置されることを特徴とする請求項1から請求項4の何れかに記載の回路装置。
- 内蔵される前記回路基板は、互いに離間して配置されることを特徴とする請求項1から請求項5の何れかに記載の回路装置。
- 多数個のリードから成るユニットを有するリードフレームを用意する工程と、
回路基板の上面に導電パターンおよび回路素子から成る電気回路を構成する工程と、
1つの前記ユニットの前記リードに複数個の回路基板を接続して、前記回路基板を前記リードフレームに機械的に保持させる工程と、
前記複数の回路基板の上面、側面および下面を封止樹脂にて一体に被覆する工程と、
を具備し、
前記回路素子は、制御素子と、前記制御素子に制御されるスイッチング素子とを含み、前記制御素子と前記スイッチング素子とは異なる前記回路基板に実装され、
前記回路基板を前記リードフレームに機械的に保持させる工程では、前記スイッチング素子が実装された前記回路基板は、前記制御素子が実装された前記回路基板を挟む位置に配置されることを特徴とする回路装置の製造方法。 - 前記回路基板の表面には導電パターンから成るパッドが形成され、
前記リードを固着材を介して前記パッドに固着することにより、前記回路基板を前記リードフレームに固定することを特徴とする請求項7に記載の回路装置の製造方法。 - 金属細線を介して、異なる前記回路基板上に形成された前記電気回路を接続することを特徴とする請求項7または請求項8に記載の回路装置の製造方法。
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JP5749468B2 (ja) * | 2010-09-24 | 2015-07-15 | セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー | 回路装置およびその製造方法 |
JP5796956B2 (ja) * | 2010-12-24 | 2015-10-21 | セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー | 回路装置およびその製造方法 |
JP5743922B2 (ja) * | 2012-02-21 | 2015-07-01 | 日立オートモティブシステムズ株式会社 | 熱式空気流量測定装置 |
US10629521B2 (en) * | 2014-04-08 | 2020-04-21 | Mitsubishi Electric Corporation | Molded module |
US9397017B2 (en) | 2014-11-06 | 2016-07-19 | Semiconductor Components Industries, Llc | Substrate structures and methods of manufacture |
US9408301B2 (en) | 2014-11-06 | 2016-08-02 | Semiconductor Components Industries, Llc | Substrate structures and methods of manufacture |
US11437304B2 (en) | 2014-11-06 | 2022-09-06 | Semiconductor Components Industries, Llc | Substrate structures and methods of manufacture |
CN108000798B (zh) * | 2017-12-13 | 2020-11-06 | 陕西宝成航空仪表有限责任公司 | 适用于电沉积工艺制造的微型导电环环体成型方法 |
TWI730604B (zh) * | 2019-01-22 | 2021-06-11 | 美商莫仕有限公司 | 使用專用電子封裝製造工藝的智能連接器及其製造方法 |
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KR20080031449A (ko) | 2008-04-08 |
JPWO2007026945A1 (ja) | 2009-03-12 |
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