JP5749468B2 - 回路装置およびその製造方法 - Google Patents
回路装置およびその製造方法 Download PDFInfo
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- JP5749468B2 JP5749468B2 JP2010213693A JP2010213693A JP5749468B2 JP 5749468 B2 JP5749468 B2 JP 5749468B2 JP 2010213693 A JP2010213693 A JP 2010213693A JP 2010213693 A JP2010213693 A JP 2010213693A JP 5749468 B2 JP5749468 B2 JP 5749468B2
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Description
12 回路基板
14 制御基板
16 封止樹脂
18 リード
18A、18B、18C、18D、18E、18F リード
18G、18H、18I、18J リード
20 リード
20A、20B、20C、20D、20E、20F リード
20G、20H、20I、20J、20K、20L リード
22 トランジスタ
24 ダイオード
26 金属細線
28 アイランド部
28D、28E、28F、28J アイランド部
30 傾斜部
32 リード部
34 ボンディング部
34C、34D、34E、34F ボンディング部
36 ボンディング部
38 支持部
39 支持部
40 導電パターン
42 制御素子
44 絶縁層
45 抵抗
46 導電パターン
48 固着材
50 導電パターン
50A、50B、50C、50D パッド
52 導電パターン
54 貫通電極
56 インバータ回路
58 リードフレーム
60 ユニット
62 タイバー
64 外枠
68 上金型
70 下金型
72 キャビティ
Q1、Q2、Q3、Q4、Q5、Q6 IGBT
D1、D2、D3、D4、D5、D6 ダイオード
Claims (10)
- 第1基板と、
外部に露出するリード部と前記第1基板の上面に固着されたアイランド部とを有するリードと、
前記リードの前記アイランド部に実装された第1回路素子と、
前記第1回路素子と電気的に接続される第2回路素子が実装されると共に、前記第1基板と重畳する位置で前記リードに接続された第2基板と、
前記第1基板、前記第2基板、前記第1回路素子および前記第2回路素子を被覆する封止樹脂と、
を備え、
前記リードの内側の端部は、前記第1回路素子と接続されるボンディング部と、前記第2基板を支持する支持部とに枝分かれすることを特徴とする回路装置。 - 前記リードには、前記第1基板の第1側辺に沿って配置されて前記アイランド部が設けられた複数の第1リードと、前記第1基板の他の側辺である第2側辺に沿って配置された複数の第2リードと、が含まれ、
前記第1リードの前記アイランド部に前記第1回路素子が実装され、
前記第2リードは接続手段を経由して前記第1回路素子と接続されることを特徴とする請求項1に記載の回路装置。 - 前記第1リードの前記リード部と前記アイランド部との間に、前記第1基板の主面から離間して前記第1回路素子と接続手段を経由して接続される第1ボンディング部が設けられることを特徴とする請求項2に記載の回路装置。
- 前記第ボンディング部は、前記第1基板の主面から離間して配置されることを特徴とする請求項1に記載の回路装置。
- 隣接する一方の前記第1リードの前記アイランド部に実装された前記第1回路素子と、隣接する他方の前記第1リードの前記第1ボンディング部とを、接続手段を経由して電気的に接続することを特徴とする請求項3に記載の回路装置。
- 前記第1基板の下面は前記封止樹脂から外部に露出することを特徴とする請求項1から請求項5の何れかに記載の回路装置。
- 前記第1回路素子は、インバータ回路を構成するトランジスタであり、
前記第2回路素子は、前記トランジスタのスイッチングを制御する制御素子であることを特徴とする請求項1から請求項6の何れかに記載の回路装置。 - 複数のリードから成るリードフレームを用意する工程と、
前記リードの一部に設けたアイランド部の上面に第1回路素子を実装し、前記アイランド部の下面を第1基板の上面に固着すると共に、第2回路素子が実装された第2基板を前記リードで支持する工程と、
前記第1基板、前記第1回路素子、前記第2基板および前記第2回路素子を封止する工程と、
を備え、
第2基板を前記リードで支持する工程では、内側の端部で枝分かれする前記リードの一方側であるボンディング部と前記第1回路素子とを接続し、内側の端部で枝分かれする前記リードの他方側である支持部で前記第2基板を支持することを特徴とする回路装置の製造方法。 - 前記第1基板は、前記リードの前記アイランド部に固着されることにより、前記リードフレームに固定されることを特徴とする請求項8に記載の回路装置の製造方法。
- 前記リードは、外部に露出するリード部と、前記第1回路素子と接続手段を経由して接続されるボンディング部と、前記アイランド部とを有し、
前記リードの前記アイランド部と前記ボンディング部との間に傾斜部が形成されることにより、前記ボンディング部を前記アイランド部よりも上方に配置することを特徴とする請求項8または請求項9に記載の回路装置の製造方法。
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JP2010213693A JP5749468B2 (ja) | 2010-09-24 | 2010-09-24 | 回路装置およびその製造方法 |
US13/240,870 US8450837B2 (en) | 2010-09-24 | 2011-09-22 | Circuit device having an improved heat dissipitation, and the method of manufacturing the same |
CN201110285320.2A CN102420223B (zh) | 2010-09-24 | 2011-09-23 | 电路装置及其制造方法 |
KR1020110096143A KR101300954B1 (ko) | 2010-09-24 | 2011-09-23 | 회로 장치 및 그 제조 방법 |
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CN103435001B (zh) * | 2013-08-05 | 2016-03-02 | 天水华天微电子股份有限公司 | 混合集成电路装置及封装方法 |
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JP6623958B2 (ja) * | 2016-07-12 | 2019-12-25 | 株式会社デンソー | 駆動対象スイッチの駆動回路 |
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CN110235244B (zh) * | 2017-02-06 | 2023-06-27 | 三菱电机株式会社 | 功率半导体模块以及电力转换装置 |
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JP2009081325A (ja) * | 2007-09-27 | 2009-04-16 | Sanyo Electric Co Ltd | 回路装置 |
JP4934559B2 (ja) * | 2007-09-27 | 2012-05-16 | オンセミコンダクター・トレーディング・リミテッド | 回路装置およびその製造方法 |
TW200915970A (en) * | 2007-09-27 | 2009-04-01 | Sanyo Electric Co | Circuit device, circuit module and outdoor equipment |
JP5550225B2 (ja) * | 2008-09-29 | 2014-07-16 | セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー | 回路装置 |
JP5563918B2 (ja) * | 2010-07-22 | 2014-07-30 | セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー | 回路装置の製造方法 |
JP2012069764A (ja) * | 2010-09-24 | 2012-04-05 | On Semiconductor Trading Ltd | 回路装置およびその製造方法 |
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JP2012069763A (ja) | 2012-04-05 |
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US8450837B2 (en) | 2013-05-28 |
CN102420223B (zh) | 2014-07-30 |
KR20120031454A (ko) | 2012-04-03 |
KR101300954B1 (ko) | 2013-08-27 |
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