CN102420223A - 电路装置及其制造方法 - Google Patents

电路装置及其制造方法 Download PDF

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Publication number
CN102420223A
CN102420223A CN2011102853202A CN201110285320A CN102420223A CN 102420223 A CN102420223 A CN 102420223A CN 2011102853202 A CN2011102853202 A CN 2011102853202A CN 201110285320 A CN201110285320 A CN 201110285320A CN 102420223 A CN102420223 A CN 102420223A
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Prior art keywords
lead
wire
substrate
circuit
circuit element
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CN102420223B (zh
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真下茂明
堀内文夫
工藤清昭
樱井章
稻垣裕纪
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Semiconductor Components Industries LLC
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On Semiconductor Trading Ltd
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    • H—ELECTRICITY
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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Abstract

本发明公开了一种电路装置及其制造方法。该电路装置是具有良好的散热性的小型的装置。在混合集成电路装置(10)中，重叠设置固定安装有引线(18)的岛部(28)的电路基板(12)和安装有控制元件(42)等的控制基板(14)，电路基板(12)及控制基板(14)被密封树脂(16)一体地树脂密封。而且，设置在电路基板(12)的上面的晶体管(22)、安装在控制基板(14)的上面的控制元件(42)也被密封树脂覆盖。由此提供逆变电路和控制电路一体地被树脂密封的模块。

Description

电路装置及其制造方法
技术领域
本发明涉及一种电路装置及其制造方法，尤其涉及内置有对大电流进行开关的功率型半导体元件和对该半导体元件进行控制的控制元件的电路装置及其制造方法。
背景技术
下面，参照图9对现有的混合集成电路装置100的结构进行说明(参照下述的专利文献1)。在矩形基板101的表面上，隔着绝缘层102形成有导电图案103，在该导电图案103上固定安装有电路元件，从而形成规定的电路。在此，半导体元件105A和芯片元件105B作为电路元件与导电图案103相连接。引线104和形成在基板101的周边部的由导电图案103构成的焊盘109相连接，并且具有作为外部端子的功能。密封树脂108具有密封形成于基板101表面的电路的功能。
半导体元件105A是导通例如数安培～数百安培左右的大电流的功率型元件，发热量非常大。因此，半导体元件105A载置于在导电图案103上载置的散热片110的上部。散热片110由例如高×宽×厚＝10mm×10mm×1mm左右的铜等金属片构成。
专利文献1：(日本)特开平5-102645号公报
在具有上述结构的混合集成电路装置100中，内置有例如随着工作而发热量较多的逆变电路。即使在逆变电路中将大电流的直流电变换为交流电而产生大量的热量，也能够使产生的热量经由基板101很好地向外部散热。
但是，在这种结构的混合集成电路装置100中，需要另外准备控制半导体元件105A的开关的控制元件，这样会使成本提高。而且，在电路基板101的上面能够同时安装半导体元件105A和控制元件，但是，如果这样安装，则半导体元件105A产生的热量经由具有良好的导热性的基板101传递至控制元件，控制元件处于过热状态，从而有可能导致控制元件的误动作。
另外，如果在基板101的上面形成对逆变电路等的大电流进行变换的电路，则需要使导电图案103的宽度变宽来确保电流容量，这样会影响到混合集成电路装置100的小型化。
发明内容
鉴于以上问题，本发明主要目的是提供一种具有良好的散热性的小型电路装置及其制造方法。
本发明的电路装置的特征在于，具有：第一基板；引线，其具有向外部露出的引线部和固定安装在所述第一基板的上面的岛部；第一电路元件，其安装于所述引线的所述岛部；第二基板，其安装有和所述第一电路元件电连接的第二电路元件，并且在和所述第一基板重叠的位置与所述引线相连接；密封树脂，其覆盖所述第一基板、所述第二基板、所述第一电路元件及所述第二电路元件。
本发明的电路装置的制造方法的特征在于，具有：准备由多条引线构成的引线框架的工序；在设置于一部分所述引线的岛部的上面安装第一电路元件，将所述岛部的下面固定安装于第一基板的上面，并且以所述引线支承安装有第二电路元件的第二基板的工序；将所述第一基板、所述第一电路元件、所述第二基板及所述第二电路元件密封的工序。
根据本发明，例如将进行大电流的开关的晶体管即第一电路元件安装在第一基板上，将安装有控制该半导体元件的第二电路元件的第二基板设置为和第一电路元件重叠。由此，能够将发热量大的第一电路元件和控制该第一电路元件的第二电路元件内置在一个电路装置中。
而且，根据本发明，在由一部分引线构成的岛部的上面安装第一电路元件，该岛部的下面固定安装于第一基板的上面。由此，能够将通过第一电路元件的大电流不经由以往的导电图案直接向外部引出。因此，较宽的导电图案从第一基板的上面被排除，从而装置整体得以小型化。
附图说明
图1是表示本发明的电路装置的视图，(A)是立体图，(B)是剖面图。
图2是表示本发明的电路装置的俯视图，(A)是表示引线的结构的俯视图，(B)是表示控制基板的俯视图。
图3(A)、(B)是表示本发明的电路装置的一部分的剖面图。
图4(A)、(B)是表示本发明的电路装置的一部分的剖面图。
图5是表示本发明的电路装置的视图，(A)是表示要安装的逆变电路的电路图，(B)是表示引出引线的俯视图，(C)是表示引线的剖面图。
图6是表示本发明的电路装置的制造方法的视图，(A)是俯视图，(B)是剖面图。
图7是表示本发明的电路装置的制造方法的视图，(A)是俯视图，(B)是剖面图。
图8是表示本发明的电路装置的制造方法的视图，(A)是剖面图，(B)是俯视图。
图9是表示背景技术的混合集成电路装置的剖面图。
附图标记说明
10混合集成电路装置；12电路基板；14控制基板；16密封树脂；18引线；18A、18B、18C、18D、18E、18F、18G、18H、18I、18J引线；20引线；20A、20B、20C、20D、20E、20F、20G、20H、20I、20J、20K、20L  引线；22晶体管；24二极管；26金属细线；28岛部；28D、28E、28F、28J岛部；30倾斜部；32引线部；34接合部；34C、34D、34E、34F接合部；36接合部；38支承部；39支承部；40导电图案；42控制元件；44绝缘层；45电阻；46导电图案；48固定安装材料；50导电图案；50A、50B、50C、50D焊盘；52导电图案；54贯通电极；56逆变电路；58引线框架；60单元；62连接杆；64外框；68上模；70下模；72型腔；Q1、Q2、Q3、Q4、Q5、Q6IGBT；D1、D2、D3、D4、D5、D6二极管。
具体实施方式
首先，参照图1至图5，对作为电路装置的一个例子的混合集成电路装置10的结构进行说明。
下面，参照图1，对本实施方式的混合集成电路装置10的结构进行说明。图1(A)是从斜上方看混合集成电路装置10的立体图。图1(B)是混合集成电路装置10的剖面图。
参照图1(A)及图1(B)，在混合集成电路装置10中，重叠设置有电路基板12(第一基板)和控制基板(第二基板)，其中，在电路基板12上配置有晶体管22等电路元件(第一电路元件)，而在控制基板上安装有控制晶体管22的控制元件42等(第二电路元件)，电路基板12及控制基板14被密封树脂16一体地树脂密封。而且，设置在电路基板12的上面的晶体管22、安装在控制基板14的上面的控制元件42也被密封树脂覆盖。另外，设置在电路基板12以及控制基板14上的各电路元件经由引线18、20和外部连接。
电路基板12是以铝(Al)或铜(Cu)等金属为主要材料的金属基板。电路基板12的具体大小为例如高×宽×厚＝30mm×15mm×1.5mm左右。在采用由铝构成的基板作为电路基板12的情况下，电路基板12的两个主面被进行氧化铝膜处理。电路基板12的上面及侧面被密封树脂16覆盖，而下面向外部露出。由此，能够使散热片与露出的电路基板12的下面抵接，从而提高散热性。而且，为了确保耐湿性及绝缘耐压性，也可以通过密封树脂16覆盖电路基板12的下面。
控制基板14是由玻璃环氧基板等廉价的绝缘材料构成的基板，在其上面或者两个主面上形成有厚度为50μm左右的导电图案。在控制基板14上，设置有控制设置在电路基板12上的晶体管22的控制元件42、芯片电阻、芯片电容器等无源元件。这些元件在工作时发热很小，所以，即使是由散热性较差的材料构成的控制基板14也足以应付。在图1(B)中，作为控制元件42的LSI以被树脂密封的封装的状态安装于控制基板14的上面，但也可以以裸芯片的状态安装于控制基板14的上面。
参照图1(B)，在纸面左侧设置有引线18，而右侧设置有引线20。这些引线18、20不仅具有作为装置的外部端子的功能，而且还具有在制造工序中机械地支承电路基板12及控制基板14的功能。而且，引线20还作为电连接设置在电路基板12的上面的晶体管22等和设置在控制基板14的上面的控制元件42的路径的一部分发挥功能。在此，引线从密封树脂16的相向的两个侧面向外部引出，但是也可以使多条引线从一个侧面或者四个侧边向外部引出。
沿着电路基板12的一侧边设置有多条引线18。该引线18包含机械地支承控制基板14的引线和安装晶体管22等电路元件的引线。参照图1(B)，引线18构成为从内侧开始具有岛部28、倾斜部30、接合部34及引线部32。在岛部28的上面通过焊锡等导电性固定安装剂固定安装有晶体管22及二极管24。而岛部28的下面固定安装于电路基板12的上面。由此，晶体管22及二极管24在工作时产生的热量经由岛部28及电路基板12很好地向外部散热。而且，通过在引线18的中间部设置倾斜部30，将电路基板12的左上部的端部和引线18分开，防止两者之间发生短路。另外，接合部34是经由金属细线26(例如，直径为20μm～500μm的铝线)和晶体管22及二极管24连接的部位。关于通过金属细线26进行连接的结构，将在后面参照图5(B)进行说明。
而且，在一部分的引线18中，内侧的端部被加工成向上方弯曲。控制基板14被经过这样加工的引线18的端部支承。该部位的详细结构和后面参照图4说明的结构相同。
在与引线18相向的位置上设置有多条引线20。设置在引线20的内侧的接合部36与安装在引线18的岛部28上的晶体管22电连接。而且，引线20的内侧的端部被分支，向上方弯曲并机械地支承控制基板14。
引线18和引线20的功能不同。具体来说，在图1(B)中设置在左侧的引线18上安装有晶体管22和二极管24。通过由这些元件构成的逆变电路进行变换的直流电流和变换后得到的交流电流流经引线18。而在纸面右侧的引线20具有连接设置在电路基板12的上面的晶体管22的控制电极和安装在控制基板14上的控制元件42的功能。
下面，参照图2(A)对引线18、20的结构进行说明。参照该图，引线1gA～18J和引线20A～20L被设置为相互相向。
在引线1gA～18J中，设置在端部的引线1gA、18J是用于机械地支承如图1(B)所示的控制基板14的引线，这些引线的纸面的上方端部与控制基板14的下面接触。引线18B是用于从外部供给直流电流的引线，用于检测电流值的电阻45设置在引线18B和引线18C之间。
在引线18D～18I各自的上面安装有构成三相逆变电路的晶体管及二极管。关于这方面内容，将在后面参照图5进行说明。
在引线20A～20L中设置于端部的引线20A、20L是用于机械地支承控制基板14的引线。而且，引线20C、20D经由金属细线26分别和引线18B、18C相连接，用于检测电流值。
引线20F～20J和安装在引线18D～18I上的晶体管的控制电极相连接。例如，引线20E的内侧的端部分支成接合部36和支承部38。接合部36经由金属细线26和安装在引线18D上的晶体管的控制电极相连接。支承部38和控制基板14相连接(参照图1(B))。由此，安装在引线18D上的晶体管和安装在控制基板14上的控制元件42经由引线20E电连接。关于引线20E的支承部38和控制基板14相连接的结构，将在后面参照图4进行说明。
图2(B)是表示设置在上述引线的上方的控制基板14的俯视图。参照该图，在控制基板14的上面形成有规定形状的导电图案50，在该导电图案50上连接有控制元件42和芯片元件等无源元件。
沿着控制基板14的纸面上侧侧边设置有多个焊盘。在这些焊盘中，设置在端部背面的焊盘50A、50B是用于固定安装图2所示的引线20A、20L的焊盘。焊盘50A、50B用于和引线固定安装，是电信号不通过的虚拟焊盘。而且，设置在中间部的焊盘和图2(A)所示的引线20B～20J相连接，作为使控制信号通过的焊盘发挥功能。
在控制基板14的纸面下侧侧边的两端设置有焊盘50C、50D。这些焊盘与图2(A)所示的引线18A、18J的端部固定安装，是用于机械地支承控制基板14的焊盘。
关于在上述各焊盘上固定安装引线的结构，将在后面参照图4进行说明。
下面参照图3(A)及图3(B)的剖面图，对引线的岛部28固定安装在电路基板12的上面的结构进行说明。
参照图3(A)，由铝等金属构成的电路基板12的上面覆盖有绝缘层44。绝缘层44由充填有高浓度例如60重量％～80重量％左右的Al2O3等填充物的环氧树脂等构成。在绝缘层44的上面形成有由厚度为50μm左右的铜等金属构成的导电图案46，在该导电图案46的上面通过焊锡等固定安装材料48固定安装引线的岛部28。由此，晶体管22工作时所产生的热量经由岛部28、固定安装材料48、导电图案46及电路基板12向外部散热。
在图3(B)中，在绝缘层44的上面没有形成导电图案，岛部28的下面通过导电性或者绝缘性的固定安装材料48固定安装在绝缘层44的上面。
下面参照图4(A)对引线20和控制基板14相连接的结构进行说明。引线20的内侧的前端部分支为支承部38和接合部36，支承部38加工成向上方弯曲，而接合部36加工成向下方弯曲。接合部36经由金属细线26和晶体管22的控制电极相连接，支承部38和控制基板14相连接。
具体来说，在由玻璃环氧树脂等绝缘材料构成的基材的上面形成有导电图案50，在下面也形成有焊盘状的导电图案52。而且，位于上面的导电图案50和位于下面的导电图案52通过贯通控制基板14的贯通电极54相连接。设置在控制基板14的下面的导电图案52通过导电性固定安装材料和支承部38相连接。由此，设置在电路基板12的上面的晶体管22通过引线20和安装在控制基板14的上面的控制元件42相连接。因此，晶体管22基于由控制元件42提供的控制信号进行开关动作。
参照图4(B)，引线20的支撑部38和控制基板14还可以通过金属细线26进行连接。具体来说，金属细线26的一端和设置在控制基板14的上面的导电图案50相连接，而另一端和支承部38的上面相连接。此时，在控制基板14的背面不需要设置导电图案，进而不需要贯通控制基板14的贯通电极。
下面参照图5，说明在混合集成电路装置10中安装三相逆变电路时的结构。图5(A)是逆变电路的电路图，图5(B)是表示引线结构的俯视图，图5(C)是引线18的剖面图。
参照图5(A)，逆变电路56由六个IGBT(Q1～Q6)和六个二极管(D1～D6)构成，Q1～Q3是高电位侧的晶体管，Q4～Q6是低电位侧的晶体管。在各IGBT(Q1～Q6)的集电极电极和发射极电极上反向并联连接有续流二极管(D1～D6)。这样，通过使续流二极管反向并联连接在IGBT，可以保护IGBT不受电感性负载所产生反电动势的过电压破坏。
通过这样的结构，输入到逆变电路56的直流电变换成三相(U、V、W)交流电，通过该交流电使作为负载的电动机M驱动旋转。
而且，IGBT(Q1)和IGBT(Q4)串联连接，排他性地对IGBT(Q1)和IGBT(Q4)进行开关控制，使得U相的交流电从两元件的中间点经由引线向外部输出。另外，IGBT(Q2)和IGBT(Q5)串联连接，排他性地对IGBT(Q2)和IGBT(Q5)进行开关控制，使得V相的交流电从两元件的中间点向外部输出。进而，排他性地对串联连接的IGBT(Q3)和IGBT(Q6)进行开关控制，使得W相的交流电从两元件的中间点向外部输出。各IGBT的开关由图1(B)所示的控制元件42进行控制。
参照图5(B)，在引线18D～18J所具有的各岛部28D～28J的上面，通过焊锡等导电性固定安装剂固定安装有IGBT及二极管。具体来说，在引线18D的岛部28D上安装有IGBT(Q1)和二极管D1，在引线18E的岛部28E上安装有IGBT(Q2)和二极管D2，在引线18F的岛部28F上安装有IGBT(Q3)和二极管D3，在引线18J的岛部28J上安装有三个IGBT(Q4～Q6)和三个二极管D4～D6。在此，设置在各IGBT的背面的集电极电极及二极管的阳极电极通过焊锡等导电性固定安装剂连接在各岛部的上面。
为了构成逆变电路，安装在各岛部上的晶体管及二极管经由金属细线相连接。在本实施方式中，安装在各引线的岛部上的晶体管及二极管经由金属细线和邻接的引线的接合部相连接。
具体来说，安装在引线18D的岛部28D上的IGBT(Q1)的发射极电极及二极管D1的阴极电极经由金属细线26和引线18C的接合部34C相连接。安装在引线18E的岛部28E上的IGBT(Q2)的发射极电极及二极管D2的阴极电极经由金属细线26和引线18D的接合部34D相连接。安装在引线18F的岛部28F上的IGBT(Q3)的发射极电极及二极管D3的阴极电极经由金属细线26和引线18E的接合部34E相连接。
而且，安装于和直流电源负极侧相连接的岛部28J的IGBT(Q4～Q6)及二极管D4～D6与引线18D～18F的接合部34D～34F相连接。具体来说，IGBT(Q4)的发射极电极及二极管D4的阴极电极经由金属细线26和引线18D的接合部34D相连接。IGBT(Q5)的发射极电极及二极管D5的阴极电极经由金属细线26和引线18E的接合部34E相连接。IGBT(Q6)的发射极电极及二极管D6的阴极电极经由金属细线26和引线18F的接合部34F相连接。
在本实施方式中，以上述方式通过金属细线对邻接的引线彼此进行连接。而且，将IGBT(Q4)及二极管D4和引线18D的接合部34D连接的金属细线26形成为跨越引线18E、18F的上方。如果引线18C～18J整体处于平坦的状态，则这样复杂地形成的金属细线26之间可能会接触而引起短路。在本实施方式中，如图5(C)所示，连接有金属细线的接合部34经由倾斜部30位于岛部28的上方。由此，即使为了构成逆变电路而使金属细线形成为复杂的形状，也能够防止因金属细线彼此接触而引起短路。
而且，在本实施方式中，如图1(B)所示，在电路基板12的上面没有形成导电图案，在载置于电路基板12的上面的引线18的岛部28上安装有晶体管22和二极管24。即，本实施方式的引线18不仅具有外部输出端子的功能，而且还具有背景技术中的导电图案的功能。引线18的岛部28的厚度为例如500μm左右，比背景技术中形成在电路基板的上面的导电图案的厚度(50μm)厚。因此，与以前的通过将较宽的薄的导电图案来应对数十安培左右的大电流的情况相比，本实施方式的厚的引线18本身具有较宽的截面面积，所以能够使引线18所占的面积比现有的导电图案小。这有助于装置整体的小型化。
另外，参照图1(B)，在本实施方式中，将对设置在电路基板12上的晶体管22的动作进行控制的控制元件42，设置在和电路基板12分体的控制基板14上。由此，能够将在使用状态下温度高的晶体管22和控制元件42隔热地分离。而且，在本实施方式中，如上所述，将晶体管22产生的热量经由由金属构成的电路基板12良好地向外部散热。因此，防止了控制元件42因晶体管22发热而过热。
下面，参照图6～图8对具有上述结构的混合集成电路装置10的制造方法进行说明。
参照图6，首先准备设置有多条引线18、20的引线框架58。图6(A)是表示设置在引线框架58上的一个单元60的俯视图，图6(B)是表示单元60的剖面图。
参照图6(A)，单元60由构成一个混合集成电路装置的多条引线18、20构成，各引线18、20的一端位于载置有电路基板12的区域内。引线18设置在纸面中单元60内部的左侧，如上所述，引线18上设置有用于安装晶体管和二极管的岛部28。引线20设置在纸面的右侧，其具有作为外部连接端子的功能的同时，还具有连接晶体管的控制电极以及机械地支承控制基板的作用。
在引线框架58中，多个具有上述结构的单元60设置在画框状的外框64的内部，以下的工序对各单元60一同进行。
如图6(B)所示，引线20的中途部分是进行了弯曲加工的倾斜部，向上方弯曲后用于支承控制基板的支承部38设置于内侧的端部。而且，与之后安装的晶体管的控制电极相连接的接合部36也设置于引线20的端部。另外，在纸面左侧的引线18的中途部分也设置有经过冲压加工被弯曲的倾斜部30。在倾斜部30和引线部32之间设置有用于引线接合的接合部34。
参照图7，然后将电路元件及各基板固定安装在引线上。图7(A)是表示本工序的俯视图，图7(B)是剖面图。在图7(A)中，用虚线表示设置有电路基板12以及控制基板14的区域。
具体来说，首先，通过焊锡等导电性固定安装材料将晶体管22的背面电极固定安装在引线18的岛部28上。同样地，将二极管24的背面电极固定安装在引线18的岛部28上。然后，经由金属细线26将晶体管22的电极和设置在引线18的中间部的接合部34相连接。同样地，经由金属细线26将晶体管22的控制电极(栅极电极)和引线20的接合部36相连接。
参照图7(B)，将引线18的岛部28固定安装在电路基板12的上面。岛部28的下面的固定安装在电路基板12的上面的结构也可以如图3(A)所示那样固定安装在形成于电路基板12的上面的导电图案46上，还可以如图3(B)所示那样直接固定安装在覆盖电路基板12的上面的绝缘层44的上面。
在引线18的支承部39及引线20的支承部38上固定安装控制基板14。而且，将引线20的支承部38和设置在控制基板14的主面上的导电图案电连接。支承部38和控制基板14相连接的结构如图4所示。通过这样的结构，将电路基板12及控制基板14固定安装在引线框架58上。
参照图8，接着形成密封树脂以覆盖电路基板12以及控制基板14。图8(A)是表示使用模具模制电路基板12的工序的剖面图，图8(B)是表示模制后的引线框架58的俯视图。
参照图8(A)，首先，将电路基板12及控制基板14以固定在引线框架上的状态收纳在由上模68及下模70形成的型腔72中。在此，通过由上模68及下模70夹持引线18、20来固定型腔72内部的电路基板12及控制基板14的位置。然后，从设置在模具上的浇口向型腔72注入树脂，密封电路基板12、控制基板14及各电路元件等。在本工序中采用使用热硬化性树脂的传递模塑法或者使用热可塑性树脂的注入模塑法。对电路基板12进行密封的结构不限于树脂密封，还可以使用浇注、壳体材料进行密封。
参照图8(B)，在上述模制工序完成之后，通过冲压加工使引线18、20从引线框架58分离。具体来说，在设置有连接杆62的位置将引线18、20分离成个体，从而将如图1所示的混合集成电路装置从引线框架58分离。

Claims (11)

1.一种电路装置，其特征在于，具有：
第一基板；
引线，具有向外部露出的引线部和固定安装在所述第一基板的上面的岛部；
第一电路元件，安装于所述引线的所述岛部；
第二基板，安装有和所述第一电路元件电连接的第二电路元件，并且在和所述第一基板重叠的位置与所述引线相连接；
密封树脂，覆盖所述第一基板、所述第二基板、所述第一电路元件及所述第二电路元件。
2.如权利要求1所述的电路装置，其特征在于，所述引线包括：
多条第一引线，沿着所述第一基板的第一侧边设置并且设置有所述岛部；以及
多条第二引线，沿着所述第一基板的其他侧边即第二侧边设置；
在所述第一引线的所述岛部安装有所述第一电路元件；
所述第二引线经由连接装置和所述第一电路元件相连接。
3.如权利要求2所述的电路装置，其特征在于，在所述第一引线的所述引线部和所述岛部之间设置有第一接合部，所述第一接合部从所述第一基板的主面离开并且经由连接装置和所述第一电路元件相连接。
4.如权利要求2或3所述的电路装置，其特征在于，所述第二引线的内侧的端部分支成与所述第一电路元件相连接的第二接合部和支承所述第二基板的支承部。
5.如权利要求4所述的电路装置，其特征在于，所述第二接合部被设置为从所述第一基板的主面离开。
6.如权利要求3至5中任一项所述的电路装置，其特征在于，安装于邻接的一条所述第一引线的所述岛部的所述第一电路元件和邻接的另一条所述第一引线的所述第一接合部经由连接装置电连接。
7.如权利要求1至6中任一项所述的电路装置，其特征在于，所述第一基板的下面从所述密封树脂向外部露出。
8.如权利要求1至7中任一项所述的电路装置，其特征在于，所述第一电路元件是构成逆变电路的晶体管，所述第二电路元件是控制所述晶体管的开关的控制元件。
9.一种电路装置的制造方法，其特征在于，具有：
准备由多条引线构成的引线框架的工序；
在设置于所述引线的一部分上的岛部的上面安装第一电路元件，将所述岛部的下面固定安装于第一基板的上面，并且通过所述引线支承安装有第二电路元件的第二基板的工序；
将所述第一基板、所述第一电路元件、所述第二基板及所述第二电路元件密封的工序。
10.如权利要求9所述的电路装置的制造方法，其特征在于，所述第一基板通过固定安装在所述引线的所述岛部而固定在所述引线框架上。
11.如权利要求9或10所述的电路装置的制造方法，其特征在于，所述引线具有：向外部露出的引线部、经由连接装置和所述第一电路元件相连接的接合部、所述岛部，
在所述引线的所述岛部和所述接合部之间形成倾斜部，从而将所述接合部设置在所述岛部的上方。
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