JP2008501531A - アブレーション方法及び装置 - Google Patents

アブレーション方法及び装置 Download PDF

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Publication number
JP2008501531A
JP2008501531A JP2007520873A JP2007520873A JP2008501531A JP 2008501531 A JP2008501531 A JP 2008501531A JP 2007520873 A JP2007520873 A JP 2007520873A JP 2007520873 A JP2007520873 A JP 2007520873A JP 2008501531 A JP2008501531 A JP 2008501531A
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Japan
Prior art keywords
dem
flow
substrate
region
debris
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Pending
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JP2007520873A
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English (en)
Japanese (ja)
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JP2008501531A5 (enExample
Inventor
ネイル サイクス，
良成 佐々木
英寿 村瀬
尚樹 山田
幸成 阿蘇
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Exitech Ltd
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Exitech Ltd
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Publication date
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Publication of JP2008501531A publication Critical patent/JP2008501531A/ja
Publication of JP2008501531A5 publication Critical patent/JP2008501531A5/ja
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/142—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor for the removal of by-products
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
    • B23K26/127—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in an enclosure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/146—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor the fluid stream containing a liquid

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
JP2007520873A 2004-06-11 2005-06-13 アブレーション方法及び装置 Pending JP2008501531A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB0413029A GB2414954B (en) 2004-06-11 2004-06-11 Process and apparatus for ablation
PCT/GB2005/002326 WO2005120763A2 (en) 2004-06-11 2005-06-13 Process and apparatus for ablation

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2012180204A Division JP5389236B2 (ja) 2004-06-11 2012-08-15 アブレーション方法及び装置

Publications (2)

Publication Number Publication Date
JP2008501531A true JP2008501531A (ja) 2008-01-24
JP2008501531A5 JP2008501531A5 (enExample) 2008-07-31

Family

ID=32732303

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2007520873A Pending JP2008501531A (ja) 2004-06-11 2005-06-13 アブレーション方法及び装置
JP2012180204A Expired - Fee Related JP5389236B2 (ja) 2004-06-11 2012-08-15 アブレーション方法及び装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2012180204A Expired - Fee Related JP5389236B2 (ja) 2004-06-11 2012-08-15 アブレーション方法及び装置

Country Status (6)

Country Link
US (2) US8344285B2 (enExample)
JP (2) JP2008501531A (enExample)
KR (1) KR100890295B1 (enExample)
CN (1) CN101018639B (enExample)
GB (1) GB2414954B (enExample)
WO (1) WO2005120763A2 (enExample)

Cited By (11)

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JP2010000500A (ja) * 2008-06-23 2010-01-07 Commiss Energ Atom フレキシブルキャリア上に堆積された金属膜から彫刻欠陥を除去する方法
WO2009155202A3 (en) * 2008-06-18 2010-05-06 Electro Scientific Industries, Inc Debris capture and removal for laser micromachining
JP2011125871A (ja) * 2009-12-15 2011-06-30 Disco Abrasive Syst Ltd レーザ加工装置
JP2011251322A (ja) * 2010-06-03 2011-12-15 Disco Corp レーザ加工装置
JP2012101230A (ja) * 2010-11-08 2012-05-31 Disco Corp レーザ加工装置
JP2013252532A (ja) * 2012-06-06 2013-12-19 Disco Corp レーザー加工装置
JP2014024117A (ja) * 2012-07-26 2014-02-06 Electro Scientific Industries Inc 物質捕集方法及び物質捕集装置
JP2015134364A (ja) * 2014-01-16 2015-07-27 株式会社デンソー レーザ加工装置およびレーザ加工方法
JP2017534461A (ja) * 2014-09-30 2017-11-24 エム−ソルヴ・リミテッド ベルヌーイプロセスヘッド
JP2019076911A (ja) * 2017-10-20 2019-05-23 株式会社Ihi レーザ溶接装置及びレーザ溶接方法
US10847759B2 (en) 2018-12-10 2020-11-24 Samsung Display Co., Ltd. Method of manufacturing display apparatus

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US20050064137A1 (en) * 2003-01-29 2005-03-24 Hunt Alan J. Method for forming nanoscale features and structures produced thereby
EP1657020A1 (de) * 2004-11-10 2006-05-17 Synova S.A. Verfahren und Vorrichtung zur Optimierung der Kohärenz eines Flüssigkeitsstrahls für eine Materialbearbeitung und Flüssigkeitsdüse für eine solche Vorrichtung
CN100536046C (zh) * 2005-02-25 2009-09-02 京瓷株式会社 复合生片的加工方法
US7863542B2 (en) 2005-12-22 2011-01-04 Sony Corporation Laser processing apparatus and laser processing method as well as debris extraction mechanism and debris extraction method
GB2438527B (en) * 2006-03-07 2008-04-23 Sony Corp Laser processing apparatus, laser processing head and laser processing method
JP5165203B2 (ja) * 2006-03-07 2013-03-21 ソニー株式会社 レーザ加工装置及びレーザ加工方法
SE530592C2 (sv) * 2007-01-16 2008-07-15 Tetra Laval Holdings & Finance Anordning för laserbearbetning av en förpackningsmaterialbana
CN101518854B (zh) * 2008-02-29 2011-08-31 深圳市大族激光科技股份有限公司 透镜的吸尘保护装置
JP5094535B2 (ja) * 2008-05-07 2012-12-12 富士フイルム株式会社 凹部形成方法、凹凸製品の製造方法、発光素子の製造方法および光学素子の製造方法
US8288678B2 (en) * 2008-12-18 2012-10-16 Ppg Industries Ohio, Inc. Device for and method of maintaining a constant distance between a cutting edge and a reference surface
FR2940154B1 (fr) * 2008-12-23 2011-02-25 Commissariat Energie Atomique Avaloir d'aspiration de particules fines et dispositif d'ablation laser d'une couche superficielle d'une paroi comprenant un tel avaloir
KR101135499B1 (ko) * 2010-05-28 2012-04-13 삼성에스디아이 주식회사 전지용 전극 탭의 레이저 세정 장치 및 이를 이용한 레이저 세정 방법
GB2481190B (en) * 2010-06-04 2015-01-14 Plastic Logic Ltd Laser ablation
KR101256430B1 (ko) * 2011-03-15 2013-04-18 삼성에스디아이 주식회사 레이저 용접 장치
DE102011001322A1 (de) * 2011-03-16 2012-09-20 Ipg Laser Gmbh Maschine und Verfahren zur Materialbearbeitung von Werkstücken mit einem Laserstrahl
DE102011107982A1 (de) * 2011-07-20 2013-01-24 Rena Gmbh Werkzeugkopf (LCP-Kopf)
WO2013029038A2 (en) 2011-08-25 2013-02-28 Preco, Inc. Method and apparatus for making a clean cut with a laser
DE102012202330B4 (de) * 2012-02-16 2017-08-17 Trumpf Laser Gmbh Laserbearbeitungsvorrichtung mit einem relativ zu einer Spannpratze beweglichen Laserbearbeitungskopf
CN102642085A (zh) * 2012-04-01 2012-08-22 上海交通大学 激光焊接等离子体侧吸负压装置
CN102692447B (zh) * 2012-06-11 2014-04-02 燕山大学 小型化强脉冲单轨放电烧蚀装置
JP5663776B1 (ja) * 2014-03-27 2015-02-04 福井県 吸引方法及び吸引装置並びにレーザ加工方法及びレーザ加工装置
EP2944413A1 (de) * 2014-05-12 2015-11-18 Boegli-Gravures S.A. Vorrichtung zur Maskenprojektion von Femtosekunden- und Pikosekunden- Laserstrahlen mit einer Blende, einer Maske und Linsensystemen
JP7071118B2 (ja) * 2014-08-19 2022-05-18 ルミレッズ ホールディング ベーフェー ダイレベルのレーザリフトオフ中の機械的損傷を減少させるサファイアコレクタ
CN105458495B (zh) * 2014-09-11 2017-03-22 大族激光科技产业集团股份有限公司 一种用于激光精密加工的配套系统
US10335899B2 (en) * 2014-10-31 2019-07-02 Prima Power Laserdyne Cross jet laser welding nozzle
CN104625404B (zh) * 2014-12-12 2016-08-17 南通富士通微电子股份有限公司 一种用于激光打标工艺中的清理装置
CN105772942B (zh) * 2014-12-25 2018-07-03 大族激光科技产业集团股份有限公司 一种激光焊缝同轴吹气保护装置及应用方法
EP3295479B1 (en) * 2015-05-13 2018-09-26 Lumileds Holding B.V. Sapphire collector for reducing mechanical damage during die level laser lift-off
KR102698971B1 (ko) 2015-08-26 2024-08-27 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 기체 흐름에 대한 레이저 스캔 시퀀싱 및 방향
EP3167998B1 (en) * 2015-11-16 2021-01-06 Preco, Inc. Galvo cooling air bypass to reduce contamination
CN105499804B (zh) * 2016-01-18 2018-01-02 华中科技大学 一种激光焊接过程中焊缝内部孔洞的控制方法及控制装置
KR101739839B1 (ko) 2016-02-02 2017-05-25 한동대학교 산학협력단 표면개질용 빔균질기
JP6999264B2 (ja) * 2016-08-04 2022-01-18 株式会社日本製鋼所 レーザ剥離装置、レーザ剥離方法、及び有機ｅｌディスプレイの製造方法
CN108098155B (zh) * 2016-11-17 2020-10-09 宁德新能源科技有限公司 除尘装置
JP6450784B2 (ja) * 2017-01-19 2019-01-09 ファナック株式会社 レーザ加工機
JP6450783B2 (ja) 2017-01-19 2019-01-09 ファナック株式会社 レーザ加工ヘッド用ノズル
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JP6508549B2 (ja) * 2017-05-12 2019-05-08 パナソニックＩｐマネジメント株式会社 レーザ加工装置
KR102759919B1 (ko) * 2018-03-20 2025-01-23 오르보테크 엘티디. 광학 처리 시스템 내에서 기판으로부터 파편을 제거하기 위한 시스템
WO2020003421A1 (ja) 2018-06-27 2020-01-02 ギガフォトン株式会社 レーザ加工装置、レーザ加工システム、及びレーザ加工方法
JP6852031B2 (ja) * 2018-09-26 2021-03-31 株式会社東芝 溶接装置及びノズル装置
CN109623140B (zh) * 2018-12-11 2021-07-27 中国科学院宁波材料技术与工程研究所 光纤与水导激光耦合加工装置及系统
KR102677888B1 (ko) * 2019-01-28 2024-06-26 삼성디스플레이 주식회사 석션 장치 및 그것을 포함하는 패널 가공 장치
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JP7306860B2 (ja) * 2019-04-11 2023-07-11 Ｊｓｗアクティナシステム株式会社 レーザ処理装置
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JP7081050B2 (ja) * 2019-06-28 2022-06-06 三菱重工業株式会社 レーザー加工装置
BR102019025418B1 (pt) * 2019-11-29 2022-05-03 Petróleo Brasileiro S.A. – Petrobras Arranjo de uma radiação a laser para catálise em reações de complexação
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WO2009155202A3 (en) * 2008-06-18 2010-05-06 Electro Scientific Industries, Inc Debris capture and removal for laser micromachining
US8207472B2 (en) 2008-06-18 2012-06-26 Electro Scientific Industries, Inc. Debris capture and removal for laser micromachining
JP2010000500A (ja) * 2008-06-23 2010-01-07 Commiss Energ Atom フレキシブルキャリア上に堆積された金属膜から彫刻欠陥を除去する方法
JP2011125871A (ja) * 2009-12-15 2011-06-30 Disco Abrasive Syst Ltd レーザ加工装置
JP2011251322A (ja) * 2010-06-03 2011-12-15 Disco Corp レーザ加工装置
JP2012101230A (ja) * 2010-11-08 2012-05-31 Disco Corp レーザ加工装置
JP2013252532A (ja) * 2012-06-06 2013-12-19 Disco Corp レーザー加工装置
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WO2005120763A3 (en) 2006-02-23
GB2414954A (en) 2005-12-14
CN101018639A (zh) 2007-08-15
US20080041832A1 (en) 2008-02-21
WO2005120763A2 (en) 2005-12-22
KR20070039493A (ko) 2007-04-12
GB0413029D0 (en) 2004-07-14
JP5389236B2 (ja) 2014-01-15
KR100890295B1 (ko) 2009-03-26
CN101018639B (zh) 2010-04-21
US8809732B2 (en) 2014-08-19
US20130140287A1 (en) 2013-06-06
JP2012254482A (ja) 2012-12-27
US8344285B2 (en) 2013-01-01
GB2414954B (en) 2008-02-06

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